TI UC3823QTR

PACKAGE OPTION ADDENDUM
www.ti.com
5-Dec-2011
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
(Requires Login)
5962-89905012A
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Call TI
5962-8990501EA
ACTIVE
CDIP
J
16
1
TBD
Call TI
Call TI
UC1823J
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
UC1823J883B
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
UC1823L
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE N / A for Pkg Type
UC1823L883B
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE N / A for Pkg Type
UC2823DW
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
UC2823DWG4
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
UC2823DWTR
ACTIVE
SOIC
DW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
UC2823DWTRG4
ACTIVE
SOIC
DW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
UC2823N
ACTIVE
PDIP
N
16
25
Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type
UC2823NG4
ACTIVE
PDIP
N
16
25
Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type
UC2823QTR
ACTIVE
PLCC
FN
20
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
UC2823QTRG3
ACTIVE
PLCC
FN
20
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
UC3823DW
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
UC3823DWG4
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
UC3823DWTR
ACTIVE
SOIC
DW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
UC3823DWTRG4
ACTIVE
SOIC
DW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
UC3823N
ACTIVE
PDIP
N
16
25
Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
5-Dec-2011
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
UC3823NG4
ACTIVE
PDIP
N
16
25
Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type
UC3823Q
ACTIVE
PLCC
FN
20
46
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
UC3823QG3
ACTIVE
PLCC
FN
20
46
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
UC3823QTR
ACTIVE
PLCC
FN
20
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
UC3823QTRG3
ACTIVE
PLCC
FN
20
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF UC1823, UC3823 :
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
5-Dec-2011
• Catalog: UC3823
• Military: UC1823
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Military - QML certified for Military and Defense Applications
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Aug-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
UC2823DWTR
SOIC
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
DW
16
2000
330.0
16.4
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
10.85
10.8
2.7
12.0
16.0
Q1
UC2823QTR
PLCC
FN
20
1000
330.0
16.4
10.3
10.3
4.9
12.0
16.0
Q1
UC3823DWTR
SOIC
DW
16
2000
330.0
16.4
10.85
10.8
2.7
12.0
16.0
Q1
UC3823QTR
PLCC
FN
20
1000
330.0
16.4
10.3
10.3
4.9
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Aug-2009
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
UC2823DWTR
SOIC
DW
16
2000
346.0
346.0
33.0
UC2823QTR
PLCC
FN
20
1000
346.0
346.0
33.0
UC3823DWTR
SOIC
DW
16
2000
346.0
346.0
33.0
UC3823QTR
PLCC
FN
20
1000
346.0
346.0
33.0
Pack Materials-Page 2
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