NELLSEMI NKC250

NKD250/NKJ250/NKC250 Series
SEMICONDUCTOR
RoHS
RoHS
Nell Semiconductors
Standard Diodes, 250 A
( MAGN-A-PAK Power Modules)
23.5
2.8x0.8+0.1
25+1
53+1
35
38+1
22.5
3-M8 SCREWS
80
4-Ø6.5
92
MAGN A-PAK
• High surge capability
60+3
39+1
37+1
• UL approved file E320098
• High current capability
25+1
52+1
FEATURES
47+1
115+3
• High voltage ratings up to 2000 V
• 3000 VRMS isolating voltage with non-toxic substrate
All dimensions in millimeters
• Industrial standard package
• Compliant to RoHS
APPLICATIONS
~
+
-
NKD
-
+
+
NKJ
+
-
-
NKC
• Rectifying bridge for large motor drives
• Rectifying bridge for large UPS
• Rectifying power supplier
• Frequency converters
PRODUCT SUMMARY
IF(AV)
250 A
Type
Modules - Diode, High Voltage
MAJOR RATINGS AND CHARACTERISTICS
SYMBOL
IF(AV)
IF(RMS)
IFSM
I2t
CHARACTERISTICS
TC
TC
VALUES
UNITS
250
A
100
°C
392
A
100
°C
50 Hz
11000
60 Hz
11600
50 Hz
605
60 Hz
552
A
I2√t
2s
kA
6050
kA2√t
VRRM
Range
800 to 2000
V
TStg, TJ
Range
- 40 to 150
°C
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Page 1 of 3
NKD250/NKJ250/NKC250 Series
SEMICONDUCTOR
RoHS
RoHS
Nell Semiconductors
ELECTRICAL SPECIFICATIONS
VOLTAGE RATINGS
TYPE NUMBER
VOLTAGE
CODE
VRRM , MAXIMUM REPETITIVE
PEAK REVERSE VOLTAGE
V
VRSM , MAXIMUM NON-REPETITIVE
PEAK REVERSE VOLTAGE
V
08
800
900
12
1200
1300
16
1600
1700
20
2000
2100
NKD250
NKJ250
IRRM MAXIMUM
AT T J MAXIMUM
mA
20
NKC250
FORWARD CONDUCTION
PARAMETER
SYMBOL
Maximum average forward current
at case temperature
Maximum RMS forward current
Maximum peak, one-cycle forward,
non-repetitive surge current
IF(AV)
I F(RMS)
IFSM
TEST CONDITIONS
180° conduction, half sine wave
180° conduction, half sine wave at TC = 100 °C
t = 10 ms
t = 8.3 ms
t = 10 ms
Maximum I2 t for fusing
I 2t
t = 8.3 ms
UNITS
250
A
100
°C
392
A
11.0
No voltage
reapplied
t = 8.3 ms
t = 10 ms
VALUES
100 % V RRM
reapplied
kA
11.6
605
Sinusoidal half wave,
initial TJ = TJ maximum
552
424
kA2s
390
Maximum I2√t for fusing
I2√t
t = 0.1ms to 10 ms, no voltage reapplied
6050
kA2√t
Maximum forward voltage drop
V FM
Ipk = 1000 A, TJ = 25 °C,
= 10t pms sine pulse
1.40
V
BLOCKING
PARAMETER
SYMBOL
RMS insulation voltage
VINS
Maximum peak reverse and
off-state leakage current
IRRM
TEST CONDITIONS
VALUES
UNITS
3000
V
TJ = TJ maximum, rated V RRM applied
20
mA
TJ = 25 °C
20
µA
VALUES
UNITS
- 40 to 150
°C
t=1s
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
Maximum junction operating and storage
temperature range
TJ, TStg
Maximum thermal resistance,
junction to ca se per junction
RthJC
Maximum thermal resistance,
case to heatsink
RthC-hs
Mounting torque
± 10 %
SMAP to heatsink, M6
busbar to MAP, M8
TEST CONDITIONS
DC operation
K/W
0.044
A mounting compound is recommended and the torque
should be rechecked after a period of 3 hours to allow
for the spread of the compound.
Approximate weight
Case style
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0.14
4
900
See dimensions - link at the end of datasheet
Page 2 of 3
Nm
12
g
MAGN-A-PAK
NKD250/NKJ250/NKC250 Series
SEMICONDUCTOR
RoHS
RoHS
Nell Semiconductors
Fig.1 On-state current vs. voltage characteristic
Fig.2 Transient thermal impedance(junction-case)
0.15
Transient thermal impedance (°C/W)
On-state peak voltage (V)
3.5
3
2.5
2
1.5
1
0.5
0.09
0.06
0.03
0
10000
1000
100
0.12
00.1
0.001
0.1
Time (s)
On-state current (A)
Fig.4 Case temperature vs. on-state average current
Fig.3 Power consumption vs. average current
160
140
400
180
Conduction Angle
60°
Case temperature (°C)
Maximum power consumption (W)
500
90°120°
180°
30°
300
200
100
180
Conduction Angle
120
100
30°
60°
90° 120°180°
80
60
40
0
0
50
100
150
200
250
300
0
50
100
150
200
250
300
On-state average current (A)
On-state average current (A)
Fig.6 I 2 t Characteristic
Fig.5 On-state surge current vs. cycles
12
650
10
550
I 2 t ( 10³A²S )
On-state surge current (KA)
10
1
8
6
450
350
250
4
2
150
1
10
100
Timet (ms)
Cycles @50Hz
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10
1
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