E2E0037-27-Y3 in im el Pr This version: MSM64169 Jan. 1998 Previous version: Mar. 1996 Built-in Dual-slope type A/D Converter and LCD Driver 4-Bit Microcontroller GENERAL DESCRIPTION The MSM64169 is a low-power 4-bit microcontroller that incorporates OKI's nX-4/30 CPU core. The MSM64169 has a minimum instruction execution time of 4.3 ms (@ 700 kHz). The device contains 8160 bytes of program memory, a 1024-nibble data memory, a dual-slopetype A/D converter with a 4-channel input, LCD drivers that can drive up to 240 segments, a synchronous/ asynchronous selectable serial port, a 16-bit timer, and a buzzer output port. Applications include high resolution thermometers with low power consumption, barometers, and hygrometers. FEATURES • Operating range Operating frequencies (dual clock) Operating voltage Operating temperature • Memory space Internal program memory Internal data memory • Minimum instruction execution time • Dual-slope type A/D converter • LCD drivers (1) At 1/4 duty, 1/3 bias (2) At 1/3 duty, 1/3 bias (3) At 1/2 duty, 1/2 bias • Buzzer driver • Timer Auto-reload mode Capture mode Clock frequency measuring mode • Watchdog timer • Clock CPU clock Time base clock • Power supply voltage • I/O port • Output only port • Serial port Synchronous mode Asynchronous mode • Interrupts : 32 kHz, 700 kHz : 2.6 V to 3.6 V : –40°C to +85°C : 8160 bytes : 1024 nibbles : 4.3 ms (@ 700 kHz) 91.6 ms (@ 32.768 kHz) : 1; 4-channel input : 64; duty ratio switchable by software : 240 segments (max.) : 183 segments (max.) : 124 segments (max.) : 1; four modes for controlling buzzer output ON/OFF : 16-bit ¥ 1 : 32.768 kHz quartz oscillator and 700 kHz RC oscillator (with an external resistor) : 32.768 kHz/700 kHz (selectable by software) : 32.768 kHz : 3 V low power : 3 ports ¥ 4 bits : 2 ports ¥ 4 bits (8 out of 64 LCD drivers can be used as output-only ports via mask programming) : Synchronous/asynchronous mode support : 32.768 kHz/external clock : 9600 bps/4800 bps/2400 bps/1200 bps : 10 sources (2 external, 8 internal) 1/25 y ar ¡ Semiconductor MSM64169 ¡ Semiconductor ¡ Semiconductor MSM64169 • Capture circuit : 2 channels • Package: 128-pin plastic QFP (QFP128-P-1420-0.50-K) : (Product name: MSM64169-xxxGS-K) Chip : (Product name: MSM64169-xxx) xxx indicates the code number. • OTP version (under development) : (Product name: MSM64P169) Note: The MSM64P169 is diffrent from the MSM64169 in the polarity of the power supply voltage and the operating voltage.Refer to the MSM64P169 user's manual for details. 2/25 TR0 ROM 8160B TR1 HALT A11- A8 ALU C A7 - A0 H (4) A (4) MIEF B L X LCD PORT ADDRESS (4) PCH PCM PCL L63 VSS P0 P1 RAM 1024N Y L0 L1 ¡ Semiconductor BSR TR2 BLOCK DIAGRAM BIAS VDD VSS1 VSS2 VSS3 C1 C2 P0.0 P0.1 P1.3 DB7- DB0 INT (8) INT OSC2 OSC1 XT XT SP TBC 3 P2 ROMR SIOP 2 INT (8) IR RSTG TIMING CONTROLLER IR DECODER RESET 2CLK VSS INT VSS INT TST1 TST2 TST VSSL VR DB7- DB0 WDT INTC TM CAPR BD ADC RCM VG CZ2 CI CZ1 RI RA AIN3 AIN2 AIN1 AIN0 VrA VDDA BD 3/25 is the CPU core (nX-4/30). INT MSM64169 VSSA OPP1 OPN1 OPO1 OPP0 OPN0 OPO0 VOF PORT ADDRESS INT P2.0 P2.1 P2.2 P2.3 ¡ Semiconductor MSM64169 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103 VDDA VG CZ2 CI CZ1 RCM RI RA AIN3 AIN2 AIN1 (NC) AIN0 VOF (NC) (NC) (NC) (NC) (NC) VrA VSSL RESET TST2 TST1 BD VSS1 PIN CONFIGURATION (TOP VIEW) 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 VSS3 C1 C2 VSS2 XT XT VDD OSC1 OSC2 L63 L62 L61 L60 L59 L58 L57 L56 (NC) L55 L54 L53 (NC) L52 L51 L50 L49 (NC) L48 L47 L46 L45 L44 L43 L42 L41 L40 L39 L38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 L12 L13 L14 L15 L16 L17 L18 L19 L20 L21 L22 L23 L24 L25 L26 L27 L28 L29 L30 L31 L32 L33 L34 L35 L36 L37 OPO0 OPN0 OPP0 OP01 OPN1 OPP1 VSSA VSS P0.0 P0.1 (NC) P0.2 (NC) P0.3 (NC) P1.0 P1.1 (NC) P1.2 (NC) P1.3 P2.0 (NC) P2.1 P2.2 P2.3 L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 L10 L11 NC: No-connection pin 128-Pin Plastic QFP 4/25 ¡ Semiconductor MSM64169 PIN DESCRIPTIONS Basic Functions Function Power Supply Pin Pad Symbol Type Description 96 86 VDD — 0V power supply 103 93 VSS1 — Bias output for LCD drive (–1.5V) 99 89 VSS2 — Negative power supply: bias output for LCD drive (–3.0V) 102 92 VSS3 — Bias output for LCD drive (–4.5V) 8 7 VSS — Negative power supply for input/output port interface 101 91 C1 — Capacitor connection for LCD-drive bias generation 100 90 C2 — 108 98 VSSL — Negative power supply pin for internal logic (internally generated constant voltage) 7 6 VSSA — Negative power supply for A/D converter: externally connects to VSS2. Oscillation Test 0V power supply for A/D converter: externally connects to VDD. 128 112 VDDA — 98 88 XT I Low speed clock oscillation input pin: connects to the crystal 97 87 XT O oscillator (32.768kHz). 95 85 OSC1 I High speed clock pins: connects to the oscillation resistor (ROS). 94 84 OSC2 O 105 95 TST1 I 106 96 TST2 I Input pins for test: pulled up to VDD internally. System reset input: when this pin is asserted to "H" after being pulled to "L", the microcontroller's internal state is initialized and Reset 107 97 RESET I instruction execution starts from address 000H. This pin is pulled up to VDD internally. 5/25 ¡ Semiconductor MSM64169 Basic Functions (Continued) Function Pin Ports Buzzer A/D Converter Pad Symbol Type Description 8 P0.0 I/O 4-bit I/O port (P0): each bit can be configured to be an 10 9 P0.1 I/O input/output, pull-up/pull-down resistor input/high impedance 12 10 P0.2 I/O input, or NMOS open drain output/CMOS output by port 0 control 14 11 P0.3 I/O 16 12 P1.0 I/O 4-bit I/O port (P1): each bit can be configured to be an 17 13 P1.1 I/O input/output, pull-up/pull-down resistor input/high impedance 19 14 P1.2 I/O input, or NMOS open drain output/CMOS output by port 1 control 21 15 P1.3 I/O 22 16 P2.0 I/O 4-bit I/O port (P2): each bit can be configured to be an 24 17 P2.1 I/O input/output, pull-up/pull-down resistor input/high impedance 25 18 P2.2 I/O input, or NMOS open drain output/CMOS output by port 2 control 26 19 P2.3 I/O 9 registers 0-3 (P00CON-P03CON). An external interrupt function is assigned to each pin. registers 0-3 (P10CON-P13CON). An external interrupt function is assigned to each pin. registers 0-3 (P20CON-P23CON). An external interrupt function is assigned to each pin. 104 94 BD O Output pin of buzzer driver 116 101 AIN0 I/O Analog voltage input pins. Each of these pins can be switched to 118 102 AIN1 I/O provide a constant current output by AD control register 0 119 103 AIN2 I/O (ADCON0). 120 104 AIN3 I/O 121 105 RA — Current-adjusting resistor connection pin 122 106 RI — Pin for connecting resistor for integration 123 107 RCM — 124 108 CZ1 — Pin for connecting capacitor 1 for offset compensation 125 109 CI — Pin for connecting capacitor for integration 126 110 CZ2 — Pin for connecting capacitor 2 for offset compensation 127 111 VG — 109 99 VrA I 115 100 VOF I 3 2 OPP0 I 6 5 OPP1 I Common connection pin for resistor for integration, capacitor 1 for offset compensation, and capacitor for integration. Reference voltage for A/D conversion (internally generated constant voltage) Pin for connecting resistor for voltage amplification circuit offset adjustment Analog micro-voltage input pin 2 1 OPN0 I Pin for connecting resistor for voltage amplification factor 5 4 OPN1 I adjustment 1 113 OPO0 O 4 3 OPO1 O 6/25 ¡ Semiconductor MSM64169 Basic Functions (Continued) Function LCD Drivers Pin Pad Symbol Type Description 27 20 L0/P3.0 O LCD segment/common signal output pins. These pins can also be 28 21 L1/P3.1 O mask-programmed to provide an output port. 29 22 L2/P3.2 O 30 23 L3/P3.3 O 31 24 L4/P4.0 O 32 25 L5/P4.1 O 33 26 L6/P4.2 O 34 27 L7/P4.3 O 35 28 L8 O 36 29 L9 O 37 30 L10 O 38 31 L11 O 39 32 L12 O 40 33 L13 O 41 34 L14 O 42 35 L15 O 43 36 L16 O 44 37 L17 O 45 38 L18 O 46 39 L19 O 47 40 L20 O 48 41 L21 O 49 42 L22 O 50 43 L23 O 51 44 L24 O 52 45 L25 O 53 46 L26 O 54 47 L27 O 55 48 L28 O 56 49 L29 O 57 50 L30 O LCD segment/common signal output pins 7/25 ¡ Semiconductor MSM64169 Basic Functions (Continued) Function LCD Drivers Pin Pad Symbol Type 58 51 L31 O 59 52 L32 O 60 53 L33 O 61 54 L34 O 62 55 L35 O 63 56 L36 O 64 57 L37 O 65 58 L38 O 66 59 L39 O 67 60 L40 O 68 61 L41 O 69 62 L42 O 70 63 L43 O 71 64 L44 O 72 65 L45 O 73 66 L46 O 74 67 L47 O 75 68 L48 O 77 69 L49 O 78 70 L50 O 79 71 L51 O 80 72 L52 O 82 73 L53 O 83 74 L54 O 84 75 L55 O 86 76 L56 O 87 77 L57 O 88 78 L58 O 89 79 L59 O 90 80 L60 O 91 81 L61 O 92 82 L62 O 93 83 L63 O Description LCD segment/common signal output pins 8/25 ¡ Semiconductor MSM64169 Secondary Functions Function Pin 9 Pad Symbol Type 8 P0.0 10 9 P0.1 12 10 P0.2 14 11 P0.3 Description External level-sensitive interrupt input pins 16 12 P1.0 External 17 13 P1.1 Interrupts 19 14 P1.2 21 15 P1.3 22 16 P2.0 24 17 P2.1 25 18 P2.2 26 19 P2.3 Capture 16 12 P1.0 I trigger 17 13 P1.1 I 10 9 P0.1 I 22 16 P2.0 I/O Transmit clock input/output pin (TXT) of serial port 24 17 P2.1 I/O Receive clock output pin (RXC) of serial port 25 18 P2.2 O Transmit data output pin (TXD) of serial port 9 8 P0.0 I Capture trigger input pin of timer 12 10 P0.2 I External clock input pin (TMC) of timer 26 19 P2.3 O Timer overflow flag output pin (TMO) of timer Serial Port Timer I Trigger input pin of the capture circuit Receive data input pin (RXD) of serial port 9/25 ¡ Semiconductor MSM64169 MEMORY MAPS Program Memory Test program area ,,,,,,,,,,,,, ,,,,,,,,,,,,, ,,,,,,,,,,,,, ,,,,,,,,,,,,, ,,,,,,,,,,,,, 1FFFH 1FE0H 1FDFH 32 bytes 8160 bytes 03EH Interrupt area 03BH Watchdog interrupt 038H External interrupt (0) 035H Serial port receive interrupt 032H Serial port transmit interrupt 02FH External interrupt (1) 02CH Timer interrupt 029H ADC interrupt 026H 32 Hz interrupt 023H 16 Hz interrupt 020H 1 Hz interrupt 020H CZP area 010H 000H Start address 8 bits Address 000H is the start address of the instruction execution at system reset. The "CZP" area from address 010H to 01FH is the start address for the CZP subroutine of onebyte call instruction. The interrupt area from address 020H to 3DH is assigned the start address of interrupt subroutines. 8160 bytes from address 000H to 1FDFH are available for users. The test program area cannot be used as a program memory area. 10/25 ¡ Semiconductor MSM64169 Data Memory The data memory area consists of eight banks and each bank has 256 nibbles (256 ¥ 4 bits). The data RAM is assigned to BANK 4 through BANK 7 and Special Function Registers (SFRs) are assigned to BANK 0. 7FFH 700H 6FFH 600H 5FFH 500H 4FFH 400H BANK 7 Stack area (256 nibbles)(also serves as data memory area) BANK 6 BANK 5 Data RAM area BANK 4 Contents of 000H to 0FFH 0FFH Inaccessible area SFR area 100H 0FFH BANK 0 000H 000H 4 bits Quarter the data RAM area (256 nibbles) also serves as the stack area. The stack is a memory starting from address 7FFH toward the lower-order addresses where 4 nibbles are used by subroutine call instruction and 8 nibbles are used by an interrupt. It has no access to the area from BANK 1 to BANK 3. 11/25 ¡ Semiconductor MSM64169 ABSOLUTE MAXIMUM RATINGS Parameter (VDD=VDDA=0 V) Unit Symbol Condition Rating Power Supply Voltage 1 VSS1 Ta=25°C –2.0 to +0.3 V Power Supply Voltage 2 VSS2 Ta=25°C –4.0 to +0.3 V Power Supply Voltage 3 VSS3 Ta=25°C –5.5 to +0.3 V Power Supply Voltage 4 VSSL Ta=25°C –4.0 to +0.3 V Power Supply Voltage 5 VSS Ta=25°C –5.5 to +0.3 V Power Supply Voltage 6 VSSA Ta=25°C –4.0 to +0.3 V Input Voltage 1 VIN1 VSS2 input, Ta=25°C VSS2–0.3 to +0.3 V Input Voltage 2 VIN2 VSS input, Ta=25°C VSS–0.3 to +0.3 V Input Voltage 3 VIN3 VSS1 input, Ta=25°C VSS1–0.3 to +0.3 V Input Voltage 4 VIN4 VSSA input, Ta=25°C VSSA–0.3 to +0.3 V Output Voltage 1 VOUT1 VSS2 output, Ta=25°C VSS2–0.3 to +0.3 V Output Voltage 2 VOUT2 VSS3 output, Ta=25°C VSS3–0.3 to +0.3 V Output Voltage 3 VOUT3 VSS output, Ta=25°C VSS–0.3 to +0.3 V Output Voltage 4 VOUT4 VSS1 output, Ta=25°C VSS1–0.3 to +0.3 V Output Voltage 5 VOUT5 VSSA output, Ta=25°C VSSA–0.3 to +0.3 V Storage Tempertaure TSTG — –55 to +125 °C RECOMMENDED OPERATING CONDITIONS (VDD=VDDA=0 V) Parameter Symbol Condition Range Unit Operating Temperature Top — –40 to +85 °C Operating Voltage VSS2 VSS2=VSSA –3.6 to –2.6 V VSSA VSS — 700 kHz OSC External Resistor ROS — 90 to 300 kW Crystal Oscillator Frequency fXT — 30 to 66 kHz * –5.25 to (0.8 • VSS2, –2.6 max) (*) V Indicates that the value of VSS is 80% of VSS2 and should not exceed –2.6 V. 12/25 ¡ Semiconductor MSM64169 ELECTRICAL CHARACTERISTICS DC Characteristics (VDD=VDDA=0 V, VSS2=VSS= –3.0 V, Ta= –40 to +85°C unless otherwise specified) Parameter Symbol Condition VSS1 Voltage VSS1 Ca, Cb, C12=0.1 mF VSS3 Voltage VSS3 Ca, Cb, C12=0.1 mF VSSL Voltage VSSL XTOSC Oscillation Start Voltage VSTA XTOSC Oscillation Hold Voltage VHOLD XTOSC Stop Detection Time TSTOP XTOSC Internal Capacitance CG XTOSC External Capacitance CGEX XTOSC Internal Capacitance CD 700kOSC Internal Capacitance COS 700kOSC Oscillation Frequeney fOSC POR Generation Voltage VPOR1 POR Non-generation Voltage VPOR2 Notes: 1. 2. 3. 4. Min. Typ. Max. Unit +100% –50% +100% –50% — Within 5 seconds after oscillation –1.7 –1.5 –1.3 V –4.7 –4.5 –4.3 V –2.1 –1.5 –0.6 V — — –2.6 V — — — –2.6 V — 0.1 — 1000 ms — 10 15 20 pF 10 — 30 pF — 10 15 20 pF — 8 12 16 pF 520 700 910 kHz starts When CG external option is used External resistor ROS=100 kW, VSS2=–2.6 to –3.6 V POR generated when VSS2 is between VPOR1 and –3.0 V No POR generated when VSS2 is between VPOR2 and –3.0 V –0.7 — 0 V –3 — –2 V Measuring Circuit 1 "XTOSC" means a 32 kHz oscillation circuit. "700kOSC" means 700 kHz RC oscillation circuit. "POR" means Power-On Reset. "TSTOP" means that system reset will occur if XTOSC stops oscillation over this time. 13/25 ¡ Semiconductor MSM64169 DC Characteristics (Continued) (VDD=VDDA=0 V, VSS2=VSS= –3.0 V, Ta= –40 to +85°C unless otherwise specified) Parameter Current Consumption 1 Symbol IDD1 Condition CPU in HALT state Min. Typ. Max. Unit — 1.2 4.5 mA — 5 15 mA — 400 800 mA — 200 300 mA — 400 600 mA Measuring Circuit (700kOSC stop) Current Consumption 2 IDD2 CPU in operation (700kOSC stop) Current Consumption 3 IDD3 CPU in operation (700kOSC in operation) Current Consumption 4 IDD4 A/D converter Voltage in operation, amplification CPU in HALT circuit stop state Voltage 1 (700kOSC stop) amplification circuit in operation 14/25 ¡ Semiconductor MSM64169 DC Characteristics (Continued) (VDD=VDDA=0 V, VSS1=VSSL= –1.5 V, VSS2=VSS=VSSA= –3.0 V, VSS3= –4.5 V, Ta= –40 to +85°C unless otherwise specified) Parameter Symbol Condition Min. Typ. Max. Unit Output Current 1 IOH1 VOH1=–0.5 V –6 –2 –0.7 mA (P0.0 to P0.3) IOL1 VOL1=VSS+0.5 V 0.7 2 6 mA (P1.0 to P1.3) IOH1S VSS=–5 V, VOH1S=–0.5 V –9 –3 –1 mA (P2.0 to P2.3) IOL1S VSS=–5 V, VOL1S=VSS+0.5 V 1 3 9 mA Output Current 2 IOH2 VOH2=–0.7 V –6 –2 –0.7 mA (BD) IOL2 VOL2=VSS2+0.7 V 0.7 2 6 mA Output Current 3 IOH3 VOH3=–0.5 V –3.0 –1.2 –0.2 mA (RI, CI, OPO0, OPO1) IOL3 VOL3=VSS+0.5 V 15 30 100 mA Output Current 4 IOH4 VOH4=–0.5 V –1.5 –0.6 –0.15 mA (When L0 to L7 are IOL4 VOL4=VSS+0.5 V 0.15 0.6 1.5 mA output ports) IOH4S VSS=–5 V, VOH4=–0.5 V –2 –0.7 –0.2 mA IOL4S VSS=–5 V, VOL4S=VSS+0.5 V 0.2 0.7 2.0 mA IOH5 VOH5=–0.5 V –6 –2 –0.7 mA (OSC2) IOL5 VOL5=VSSL+0.5 V 0.7 2 6 mA Output Current 6 IOH6 VOH6=–0.2 V (VDD level) — — –4 mA Output Current 5 (L0 to L30) IOMH6 VOMH6=VSS1+0.2 V (VSS1 level) 4 — — mA IOMH6S VOMH6S=VSS1–0.2 V (VSS1 level) — — –4 mA IOML6 VOML6=VSS2+0.2 V (VSS2 level) 4 — — mA IOML6S VOML6S=VSS2–0.2 V (VSS2 level) — — –4 mA IOL6 VOL6=VSS3+0.2 V (VSS3 level) 4 — — mA Output Leakage IOOH VOH=VDD — — 0.3 mA (P0.0 to P0.3) IOOL VOL=VSS2 –0.3 — — mA Measuring Circuit 2 (P1.0 to P1.3) (P1.0 to P1.3) 15/25 ¡ Semiconductor MSM64169 DC Characteristics (Continued) (VDD=VDDA=0 V, VSS1=VSSL= –1.5 V, VSS2=VSS=VSSA= –3.0 V, VSS3= –4.5 V, Ta= –40 to +85°C unless otherwise specified) Parameter Symbol Condition Min. 30 IIH1 VIH1=VDD (When pulled down) Input Current 1 IIL1 VIL1=VSS (P0.0 to P0.3) IIH1S VIH1=VDD, VSS=–5 V 80 Unit 90 300 mA –90 –30 mA 250 800 mA IIL1S VIL1=VSS=–5 V(When pulled up) –800 –250 –80 mA IIH1Z VIH1=VDD (At high impedance) 0 — 1 mA IIL1Z VIL1=VSS (At high impedance) –1 — 0 mA –90 –30 mA — 1 mA — 0 mA –250 –125 mA (When pulled up) –300 Input Current 2 IIL2 VIL2=VSSA (OPP0, OPP1, OPN0, IIH2Z VIH2=VDD (At high impedance) 0 –1 OPN1, VOF) IIL2Z VIL2=VSSA (At high impedance) Input Current 3 IIL3 VIL3=VSSA (VrA) IIH3 VIH3=VrA+30 mV Input Current 4 IIL4 VIL4=VSS2 (OSC1) IIH4Z VIH4=VDD (At high impedance) IIL4Z VIL4=VSS2 (At high impedance) Input Current 5 IIH5 VIH5=VDD 0 — 1 mA (RESET, TST1, TST2) IIL5 VIL5=VSS2 –3 –1.5 –0.75 mA Input Current 6 IIH6Z VIH6=VDD (At high impedance) 0 — 1 mA IIL6Z (At high impedance) –1 — 0 mA (RCM, CZ1, CZ2 Measuring Circuit (When pulled down) (P1.0 to P1.3) (P2.0 to P2.3) (When pulled up) –300 Typ. Max. VIL6=VSSA (ENADC=0) –375 (ENADC=1) 1 8 — mA –110 –10 mA 0 — 1 mA –1 — 0 mA (When pulled up) –300 3 AIN0 to 3, RA) Input Voltage 1 VIH1 –0.6 — 0 V (P0.0 to P0.3) VIL1 –3.0 — –2.4 V (P1.0 to P1.3) VIH1S VSS=–5 V –1 — 0 V (P2.0 to P2.3) VIL1S VSS=–5 V –5 — –4 V Input Voltage 2 VIH2 –0.6 — 0 V (OSC1, RESET, TST1, TST2) VIL2 –3.0 — –2.4 V 4 16/25 ¡ Semiconductor MSM64169 DC Characteristics (Continued) (VDD=VDDA=0 V, VSS1=VSSL= –1.5 V, VSS2=VSS=VSSA= –3.0 V, VSS3= –4.5 V, Ta= –40 to +85°C unless otherwise specified) Parameter Hysteresis Width (P0.0 to P0.3) (P1.0 to P1.3) (P2.0 to P2.3) Hysteresis Width (RESET, TST1, TST2) Symbol Condition Min. DVT1 — 0.2 0.5 1 V 0.25 1.0 1.5 V DVT1S VSS=–5 V Typ. Max. Unit DVT2 — 0.2 0.5 1 V CIN — — — 5 pF Measuring Circuit 4 Input Capacitance (P0.0 to P0.3) (P1.0 to P1.3) 1 (P2.0 to P2.3) 17/25 ¡ Semiconductor MSM64169 A/D Converter Characteristics (VDD=VDDA=0 V, VSS2=VSS=VSSA= –3 V, Ta= –40 to +85°C, VrA=–1.2 V, at execution of 12-bit A/D conversion, unless otherwise specified) Parameter Symbol Condition Min. VAIN — –1.2 — –0.4 V VOPP — –1.6 — –0.4 V Resolution — — — — 12+S* bits Linearity Error — — –1 — +1 LSB Zero Scale Error — — –2 — +2 LSB –16 — +16 LSB (Pin Name) Analog Input Voltage Range (AIN0 to AIN3) Analog Input Voltage Range (OPP0, OPP1) (VOF) * Typ. Max. Unit Full Scale Error — — VrA Voltage (VrA) VrA Ta=25°C VrA Temperature Coefficient — — –8 — 2 mV/°C VG Voltage (VG) VG Ta=25°C –867 –800 –733 mV RA Voltage (RA) VRA Ta=25°C –440 –400 –360 mV –1300 –1200 –1100 Measuring Circuit 5 mV "S" indicates a sign bit. Voltage Amplification Circuit Characteristics (VDD=VDDA=0 V, VSS2=VSS=VSSA= –3 V, Ta= –40 to +85°C unless otherwise specified) Parameter (Pin Name) Symbol Condition (*1) Min. Typ. Max. –3.0 –1.5 Unit Measuring Circuit VOPP1–VOPP0=10 mA, Gain=40 Amplifier Gain Error *1 Level Shift Error *1 Eg (*2) EI (VOPO1–VOPO0)/(VOPP1–VOPP0) –1 Eg= Gain (VAIN3–VVOF) –1 EI= (VOPO1–VOPO0) 0 % 5 –4 — +4 % *1 Errors caused by offset voltage are excluded. *2 Errors decrease in proportion to gain. 18/25 ¡ Semiconductor MSM64169 Measuring Circuit 1 Rs1 Rs0 RI CZ1 CI CZ2 CN VDD AIN0 VrA RCM RI CZ1 CI CZ2 VG XT XTAL OSC1 OSC2 C1 VSSL VDDA C2 VDD VSSA VSS2 A CL XT MSM64169 ROS V VSS1 VSS3 Ca VSS Cb V C12 V Ca, Cb, C12, CL ROS XTAL RI CI, CZ1, CZ2 CN Rs1 Rs0 : 0.1 mF : 100 kW : 32.768 kHz : 750 kW : 0.1 mF : 1000 pF : 100 kW : 10 kW Measuring Circuit 2 (*1) MSM64169 Output VIH Input (*2) A VIL VDDA VDD VSS1 VSS2 VSS3 VSSL VSS VSSA 19/25 ¡ Semiconductor MSM64169 Measuring Circuit 3 (*3) VDD Output Input A MSM64169 VDDA VSS1 VSS2 VSS3 VSSL VSS VSSA VSSL VSS VSSA Output (*3) Input VIH MSM64169 Waveform Check Measuring Circuit 4 VIL VDDA VDD VSS1 VSS2 VSS3 *1 Input logic selects specified state. *2 Repeated for each specified output pin. *3 Repeated for each specified input pin. 20/25 ¡ Semiconductor MSM64169 Measuring Circuit 5 RA RV0F RS RI CZ1 CI CZ2 CN VDD AIN0 VOF VrA RA RCM RI CZ1 CI CZ2 OPO0 R0 XTAL OPN0 Rg XT OPN1 R1 CL VG XT OPO1 C1 VSSL VDDA C2 VDD VSSA VSS2 VSS1 Ca VSS3 Cb C12 VSS Ca, Cb, C12, CL XTAL RI CI, CZ1, CZ2 CN RA RVOF RS R0, R1 Rg : 0.1 mF : 32.768 kHz : 750 kW : 0.1 mF : 1000 pF : 10 kW : 10 kW max : 10 kW max : 270 kW : 100 kW max 21/25 ¡ Semiconductor MSM64169 FUNCTIONAL DESCRIPTION CPU Peripheral Function • A/D converter (ADC) The MSM64169 has a 4-channel input dual slope A/D converter. In dual slope A/D conversion, the relationship between integral voltage and time is given by: Vin/Vr = t1/t2 where, t1 = given time for which an analog input voltage is integrated Vr = reference voltage Vin = voltage resulted from charging for t1 t2 = time required to discharge the voltage, from Vr to Vin From the above equation, Vin is found. The range of Vin is –0.8 ±0.4 V. The A/D converter resolution time is programmable. The A/ D converter has a preamplifier for amplifying a microvoltage. It is suited to applications such as thermometer, pressure gauge, and hygrometer. • LCD driver (LCD) The MSM64169 has a built-in LCD driver for 64 outputs. The LCD driver consists of 64 ¥ 4-bit display registers (64 nibbles out of DSPR0 to 127), a display control register (DSPCON), a 63-output LCD driver circuit, and a bias generation circuit (BIAS). There are three types of driving methods: 1/4 duty, 1/3 duty and 1/2 duty. A mask option can select either a common driver or a segment driver for each LCD driver pin. A mask option can also specify the assignment of each bit of the display register to each segment. L0 to L7 of the LCD driver can become output ports via a mask option. The relationship between the duty, the bias method and the maximum segment number follows: 1/4 duty 1/3 bias method ......... 240 segments 1/3 duty 1/3 bias method ......... 184 segments 1/2 duty 1/2 bias method ......... 124 segments • Port (P0, P1, P2) The MSM64169 has three input-output ports (P0, P1, P2) with 4 bits each. Each bit of the ports can be configured to be an input or output, pull-up/pull-down resistor input or high impedance input, or NMOS open drain output or CMOS output. A change in the input level of each pin of P0 and P1 generates an external interrupt 0 request, and a change in the input level of each pin of P2 generates an external interrupt 1 request. The serial port function and the timer function area assigned as the secondary funciton. • Buzzer driver (BD) The MSM64169 has a built-in buzzer driver with two buzzer output frequencies and four buzzer output modes. Each buzzer output is selected by the Buzzer Control Register (BDCON) and the Buzzer Frequency Control Register (BFCON). • Serial port (SIOP) The MSM64169 has a serial port (SIOP). The serial port is a synchronous/asynchronous selectable serial communication port. The transmit section and the receive section are independent of each other, which allows simultaneous operation of transmission and receiving. 22/25 ¡ Semiconductor MSM64169 • Watchdog timer (WDT) The MSM64169 has a built-in watchdog timer to detect CPU run-away. The watchdog timer consists of a 6-bit watchdog timer counter (WDTC), which counts the 16 Hz output of the time base counter, and a watchdog timer control register (WDTCON) to reset WDTC. • Capture circuit (CAP) The MSM64169 captures a 32 Hz to 256 Hz output of the time base counter at the falling edge of Port 1.0 or 1.1 (P1.0 or P1.1) when the pull-up resistor input is chosen, or at the rising edge when the pull-down resistor input is chosen. The capture circuit is composed of the Capture Control Register (CAPCON) and the Capture Registers (CAPR0, CAPR1) that fetch output from the time base counter. •Timer (TM) The MSM64169 has a 16-bit timer (TM). The timer has three operation modes: auto-reload mode, capture mode, and clock frequency measuring mode. It counts at 32.768 kHz or 700 kHz or by an external clock. The timer is used for pulse generation, time measurement, etc., and is also used as an A/D conversion counter at A/D conversion and as a baud rate generator at serial communication. • Clock generation circuit (2CLK) The MSM64169 has a clock generation circuit (2CLK) that generates clocks of two types: lowspeed and high-speed. The circuit consists of a 32.768 kHz crystal oscillation circuit, a 700 kHz RC oscillation cricuit, and a clock control section. This circuit generates the system clock (CLK), crystal oscillation clock (32.768 kHz), and RC oscillation clock (700 kHz). The system clock is the basic operation clock of the CPU, and the crystal oscillation clock is the basic operation clock of the time-base counter and the buzzer driver. The crystal oscillation clock and RC oscillation clock are supplied to the timer to become a timer clock. The system clock frequency is switched between 32.768 kHz (output of the crystal oscillation circuit) and 700 kHz (output of the RC oscillation circuit) based on the contents of the frequency control register (FCON). Note: The oscillation frequency of the RC oscillation circuit varies depending on the value of external resistor (ROS), operating voltage (VSS2), and ambient temperature (Ta). • Time base counter (TBC) The MSM64169 has a built-in time base counter (TBC) that generates clocks to be supplied to internal peripheral circuits. The time base counter is composed of 15 binary counters. The count clock of the time base is supplied by the oscillation clock (32.768 kHz) of the crystal oscillation circuit. Output of the time base counter is used for buzzer driver, system reset circuit, watchdog timer, time base interrupt, sampling clocks for each port, and LCD driver. • Interrupt (INTC) The MSM64169 has ten interrupt sources (ten vector addresses) of which two are external interrupts from ports and eight are internal interrupts. Of the ten interrupt sources, only the watchdog interrupt cannot be disabled (non-maskable interrupt). The other nine interrupts are controlled by the master interrupt enable flag (MI) and the interrupt enable registers (IE0, IE1 and IE2). When an interrupt condition is met, the program branches to a vector address corresponding to the interrupt source, and then control is passed to the interrupt routine. 23/25 ROS OSC2 OSC1 RESET VDD XT XT 32.768 kHz L0 L63 VDD C2 C1 C12 VSS3 C3 VSS2 VSS VSS1 VSSL TST2 TST1 BD CGEX P1.0 P1.1 P1.2 P1.3 P0.0 P0.2 P0.3 P2.1 Switch Matrix (4 ¥ 4) TxD RxD P2.0 P0.1 VG CZ2 RI RCM CZI CI VSSA AIN2 AIN1 VrA VOF AIN3 OPP0 OPP1 AIN0 RA VDDA OPO0 OPN0 OPN1 OPO1 Asynchronous serial communication MSM64169-XXX RI CZ2 CN CS 3V 5V C1 CL • 5 V interface • Pressure measurement by pressure sensor (AIN0, 3) • Temperature measurement by thermistor (AIN1) • Detection of low voltage (AIN2) • CGEX for crystal oscillation circuit : external fixing 24/25 MSM64169 Pressure sensor CI CZ C2 ¡ Semiconductor APPLICATION CIRCUIT LCD ¡ Semiconductor MSM64169 PACKAGE DIMENSIONS (Unit : mm) QFP128-P-1420-0.50-K Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 1.19 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 25/25