OKI MSM6586JS

E2D0031-39-21
¡ Semiconductor
MSM6586
¡ Semiconductor
This version: Feb.
1999
MSM6586
Previous version: May. 1997
262,144-Word x 1-Bit Serial Register
GENERAL DESCRIPTION
The MSM6586 is a serial register in 262,144 words x 1 bit configuration featuring medium speed
operation with low power consumption.
The MSM6586 has a built-in internal address generator circuit allowing continuous serial read/write
operation by external clock input. The internal address is automatically incremented or decremented
by one by read/write operation. Address increment or decrement can be selected by external input.
Address designation in units of 1024 words in the direction of words is possible by an external serial
address input.
A refresh timer and refresh counter are built in to eliminate the need of the external refresh circuit
and to realize low power consumption.
18-pin plastic QFJ (PLCC) is used as the package and the operating temperature range is between
0°C and 70°C.
The MSM6586 is suitable for storing large capacity data with battery backup. A solid state recording
and playback system can easily be constructed in combination with OKI’s voice synthesizer ICs.
FEATURES
• Configuration
: 262,144 x 1 bit
• Serial access operation
Serial access time
: 1.5 ms (3.0 ms)
Serial read/write cycle time
: 2.0 ms (4.0 ms)
Fast mode read/write cycle time
: 0.4 ms (0.4 ms)
Times in parentheses indicate ones in self-refresh mode.
• Low current consumption
: 100 mA max.
(for data holding, VCC = 4.0 V)
• Wide operating supply voltage range
: Single 3.5 to 5.5 V
• Auto-refresh/self-refresh changeable
• Package:
18-pin plastic QFJ (PLCC) (QFJ18-P-R290-1.27) (Product name : MSM6586JS)
1/13
¡ Semiconductor
MSM6586
BLOCK DIAGRAM
TEST
VCC
SAD
Sin
Address
Counter
Pout
VSS
Address Multiplexer
AU/D
VBB
Generator
U/D
X-address
Counter
Clock
SAS
FAM (TEST)
RWCK
262,144
Data Register
DIN
I/O
Controller
DOUT
Y-decoder/sense Amp
Refresh
Counter
Timing
Generator
TEST
RFSH (TEST)
Load
Clock
X-decoder/
Driver
CS
U/D
Y-address Counter
Reset Clock
Write
Clock
Generator
WE
Clock
Refresh
Timer
RS/A (TEST)
TAS
PIN CONFIGURATION (TOP VIEW)
WE DIN VSS DOUT
2
1
18 17
TEST 3
16 TEST
CS 4
15 AU/D
NC 5
14 NC
SAD 6
13 RWCK
SAS 7
12 FAM (TEST)
8
9
10
11
TAS VCC RS/A RFSH
(TEST) (TEST)
NC : No connection
18-Pin Plastic QFJ
2/13
¡ Semiconductor
MSM6586
PIN DESCRIPTIONS
Pin
Symbol
1
DIN
Data input
Write enable
Description
2
WE
3, 16
TEST
Test input
4
CS
Chip select
6
SAD
Serial address data
7
SAS
TAS
Serial address strobe
Power supply (+5V)
8
Transfer address strobe
9
VCC
10
RS/A (TEST)
Self-refresh/auto-refresh select (Test input)
11
RFSH (TEST)
Refresh clock input (Test input)
12
FAM (TEST)
Fast access mode select (Test input)
13
RWCK
Read/write clock
15
AU/D
Address up/down select
17
DOUT
Data output
18
VSS
Ground (0V)
3/13
¡ Semiconductor
MSM6586
ABSOLUTE MAXIMUM RATINGS
Symbol
Condition
Rating
Unit
Terminal Voltage
Parameter
VT
Ta = 25°C, relative to VSS
–1.0 to +7.0
V
Output Short-Circuit Current
IOS
Ta = 25°C
50
mA
Power Dissipation
PD
Ta = 25°C
1
W
Operating Temperature
Top
—
0 to 70
°C
Storage Temperature
TSTG
—
–55 to +150
°C
RECOMMENDED OPERATING CONDITIONS
(Ta = 0 to 70°C)
Parameter
Symbol
Min.
Typ.
Max.
Unit
Supply Voltage
VCC
3.5
5.0
5.5
V
Supply Voltage
VSS
0
0
0
V
"H" Input Voltage
VIH
VCC – 0.5
VCC
VCC + 0.5
V
"L" Input Voltage
VIL
–0.5
0
+0.5
V
ELECTRICAL CHARACTERISTICS
DC Characteristics
(VCC = 3.5V to 5.5V, Ta = 0 to 70°C)
Symbol
Condition
Min.
Max.
Unit
"H" Output Voltage
Parameter
VOH
IOH = –0.5mA
VCC – 0.5
—
V
"L" Output Voltage
VOL
IOL = 0.5mA
—
0.4
V
Input Leakage Current
ILI
VI = 0V to VCC
–1
+1
mA
Output Leakage Current
ILO
VO = 0V to VCC
–1
+1
mA
Supply Current (in operating state)
ICC1
VCC = 4V, tRWC = 2µs
—
5
mA
Supply Current (in standby state)
ICC2
VCC = 4V
—
100
mA
Supply Current (FAM)
ICC3
VCC = 4V, tRWC = 0.4ms
—
15
mA
4/13
¡ Semiconductor
MSM6586
AC Characteristics
(VCC = 3.5V to 5.5V, Ta = 0 to 70°C)
Parameter
Symbol
MSM6586-SELF
Min.
Max.
MSM6586-AUTO
Min.
Max.
Unit
Refresh Cycle
tREF
—
—
—
100
ms
Read/Write Cycle Time
tRWC
4,000
—
2,000
—
ns
Access Time
tACC
—
3,000
—
1500
ns
Output Turn-off Delay Time
tOFF
0
50
0
50
ns
Input Signal Rise/Fall Time
tT
3
50
3
50
ns
RWCK Precharge Time
tRWP
1,000
—
500
—
ns
RWCK Pulse Width
tRW
3,000
10,000
1,500
10,000
ns
SAS Cycle Time
tSSC
100
—
100
—
ns
SAS Pulse Width
tSAS
50
—
50
—
ns
SAS Precharge Time
tSAP
50
—
50
—
ns
Address Setup Time
tAS
0
—
0
—
ns
Address Hold Time
tAH
50
—
50
—
ns
TAS Setup Time
tATS
50
—
50
—
ns
TAS to RWCK Setup Time
tTRS
50
—
50
—
ns
TAS Pulse Width
tTAS
50
—
50
—
ns
Read Command Setup Time
tRRS
0
—
0
—
ns
Read Command Hold Time
tRRH
250
—
250
—
ns
Write Command Setup Time
tWRS
0
—
0
—
ns
Write Command Hold Time
tWRH
50
—
50
—
ns
Write Command Pulse Width
tWP
50
—
50
—
ns
WE to RWCK Lead Time
tRWL
50
—
50
—
ns
tDS
0
—
0
—
ns
Data Setup Time
Data Hold Time
tDH
50
—
50
—
ns
RWCK to WE Delay Time
tRWD
100
—
100
—
ns
AU/D Setup Time
tUDS
0
—
0
—
ns
AU/D Hold Time
tUDH
50
—
50
—
ns
AU/D to TAS Setup Time
tUDTS
0
—
0
—
ns
RFSH Setup Time
tRFS
—
—
500
—
ns
RFSH Precharge Time
tRFP
—
—
500
—
ns
RFSH Pulse Width
tRF
—
—
1,500
10,000
ns
RFSH RWCK Precharge Time
tRRP
—
—
500
—
ns
Fast RWCK Mode Cycle
tFC
400
—
400
—
ns
Fast Mode Access Time
tFAC
—
300
—
300
ns
Fast RWCK Precharge Time
tFCP
100
—
100
—
ns
Fast Mode RWCK Pulse Width
tFR
300
—
300
—
ns
Fast Mode Setup Time
tFS
0
—
0
—
ns
Fast Mode Hold Time
tFH
50
—
50
—
ns
5/13
¡ Semiconductor
MSM6586
AC Characteristics (Continued)
Parameter
Fast Mode Width
Symbol
tFCC
MSM6586-SELF
MSM6586-AUTO
Unit
Min.
Max.
Min.
Max.
4,000
100,000
2,000
100,000
ns
Slow Mode Setup Time
tSS
0
—
0
—
ns
Slow Mode Hold Time
tSH
50
—
50
—
ns
Note: 1. Up/down switching for internal addresses is not available in fast mode.
2. Switching to the fast mode should be made satisfying the timings of tFS and tSS at the "L"
level of RWCK.
6/13
tRW
RWCK
tSSC
tUDS
tRWF
tRW
tUDH
tUDTS
tSAS
tTRS
tSAP
SAS
tAS
SAD
(Note)
¡ Semiconductor
tRWC
TIMING DIAGRAMS
AU/D
Read/Write/Read Modify Write Cycle
,
,
,,
,
,,,
CS
tAH
A0
A1
A2
A9
tATS
tTAS
tRWL
TAS
tRWD
tRRS
tWP
tWRH
tWRS
tRRH
WE
tDH
tDS
DIN
DY1
tACC
DY0
tOFF
XnY0
XnY1
High-Z
7/13
Note: Out of ten bits from A0 to A9, only the eight bits from A0 to A7 are effective. Fix A8 and A9 to "L".
MSM6586
DOUT
tDH
tDS
¡ Semiconductor
SAS
Address Up/Down Select Mode
CS
SAD
TAS
AU/D
RWCK
DOUT
XnY0
XnY1 XnY1023 Xn+1Y0 Xn+1Y1
XmY1023 XmY1022 XmY1 XmY0 Xm-1Y1023
MSM6586
8/13
¡ Semiconductor
Auto-Refresh Mode
CS
TAS
RS/A
RWCK
tRFS
tRRP
WE
DIN
DOUT
XnY0
XnY1
XnY2
XnY4
XnY5
XnY6
XnY7
RFSH
tRFP
9/13
MSM6586
tRF
¡ Semiconductor
Fast Access Mode
CS
,
SAS
SAD
TAS
AU/D
tFR
tFCP
RWCK
tFS
tFCC
tSS
tSH
FAM
tFAC
DOUT
XnY0
XnYn Yn+1 Yn+3 Ym+1
Ym+3 Ym+4 Y1021 Y1023 Xn+1Y0 Y2 Y3 Y4
Yn+2
Ym+2
Ym+5 Y1022
Y1
Xn+1Y3 Xn+1Y2
MSM6586
10/13
¡ Semiconductor
MSM6586
FUNCTIONAL DESCRIPTION
Serial Address Input (SAD)
Pin for inputting the read/write starting address. Designation in units of 1024 words is possible.
The 512 address data can be input as 10-bit (A0-A9) serial from the SAD pin. (A0-A7 has enable
address, A8 and A9 keep "L".)
Serial Address Strobe (SAS)
Pin for the clock used to store the serial address data into the internal register.
Address Transfer Strobe (TAS)
Input pin for setting the serial address data stored in the address register to the internal address
counter.
When the TAS falls, and the Y address is set to address 0 in the increment mode or to address 1023
in the decrement mode.
Read/Write Clock (RWCK)
Input pin for the data register information read/write clock.
Internal operation starts at the falling edge of RWCK. The information in the data register is output
to the DOUT pin in the read mode, and the information at the DIN pin is written into the data register
in the write mode. The internal address counter is automatically incremented or decremented also
when RWCK falls.
Write Enable (WE)
Input pin for selecting the read mode, write mode or read modify write mode.
The read mode is set when WE is "H", and the write mode is set when WE is "L". When WE falls from
"H" to "L" while RWCK is active, the read modify write mode is set.
Data Input (DIN)
Input pin for write data.
The information at the data input pin is stored at the falling edge of RWCK in the write mode, and
at the falling edge of WE in the modify write mode.
Data Output (DOUT)
The data output pin is always kept in the high impedance state when RWCK or CS is kept at "H".
When "H" or "L" information is read in the read operation, the output pin is set to "H" or "L" and holds
the read information until RWCK is again set to "H". In the early write mode the output pin maintains
the high impedance state, so I/O common operation by connecting DIN and DOUT is possible.
11/13
¡ Semiconductor
MSM6586
Address Up/Down Select (AU/D)
Input pin for selecting the direction of automatic address updating.
When the TAS signal is input with the AU/D pin set to "H", the internal address counters are set to
the externally set address for X and to address 0 for Y. Then the address is incremented by 1 every
time RWCK is input.
When the TAS signal is input with the AU/D pin set to "L", the internal address counters are set to
the externally set address in the same way for X but set to address 1023 for Y.
Then the address is decremented by 1 every time RWCK is input. In either case, the X address is
automatically incremented or decremented by 1 when read/write operation for 1024 words ends.
The AU/D pin setting change is possible in any read/write cycle so long as the timing specifications
for tUDS, tUDH are satisfied.
Chip Select (CS)
Input pin for disabling all input and output pins. This pin enables parallel use of multiple MSM6586s
by connecting the data input and output pins.
Self/Auto Refresh Select (RS/A (TEST))
Pin for selecting a refresh mode in order to retain memory cell data.
If the RS/A pin is set to "L" level, the self-refresh mode is selected and no external refresh control is
required. If the RS/A pin is set to "H" level, the auto-refresh mode is selected and refresh operation
is required to retain memory cell data.
Refresh Clock Input (RFSH (TEST))
Input pin for controlling the external refresh when the auto refresh mode is selected.
When the auto-refresh mode is selected, 1024 refresh operations are required within 100ms via the
RFSH pin while the RWCK is at "H" level.
Fast Access Mode Select (FAM (TEST))
Pin for fast read/write operations.
Fast read/write is possible by keeping the FAM pin at "L" level. The fast access mode is set or released
by inputting "L" level or "H" level to the FAM pin when the RWCK pin is at "L" level, and when tFS
and tSS are satisfied.
When 1024-word data access is complete, be sure to insert a normal cycle in order to increment or
decrement the X address.
When the fast access mode is set, the address increment/decrement switching with the AU/D pin
is not available.
Test (TEST, TEST)
The TEST pin is fixed to "L" level.
The TEST pin is fixed to "H" level.
12/13
¡ Semiconductor
MSM6586
PACKAGE DIMENSIONS
(Unit : mm)
QFJ18-P-R290-1.27
Spherical surface
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.50 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type
packages, which are very susceptible to heat in reflow mounting and humidity absorbed in
storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person
on the product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
13/13
E2Y0002-29-11
NOTICE
1.
The information contained herein can change without notice owing to product and/or
technical improvements. Before using the product, please make sure that the information
being referred to is up-to-date.
2.
The outline of action and examples for application circuits described herein have been
chosen as an explanation for the standard action and performance of the product. When
planning to use the product, please ensure that the external conditions are reflected in the
actual circuit, assembly, and program designs.
3.
When designing your product, please use our product below the specified maximum
ratings and within the specified operating ranges including, but not limited to, operating
voltage, power dissipation, and operating temperature.
4.
Oki assumes no responsibility or liability whatsoever for any failure or unusual or
unexpected operation resulting from misuse, neglect, improper installation, repair, alteration
or accident, improper handling, or unusual physical or electrical stress including, but not
limited to, exposure to parameters beyond the specified maximum ratings or operation
outside the specified operating range.
5.
Neither indemnity against nor license of a third party’s industrial and intellectual property
right, etc. is granted by us in connection with the use of the product and/or the information
and drawings contained herein. No responsibility is assumed by us for any infringement
of a third party’s right which may result from the use thereof.
6.
The products listed in this document are intended for use in general electronics equipment
for commercial applications (e.g., office automation, communication equipment,
measurement equipment, consumer electronics, etc.). These products are not authorized
for use in any system or application that requires special or enhanced quality and reliability
characteristics nor in any system or application where the failure of such system or
application may result in the loss or damage of property, or death or injury to humans.
Such applications include, but are not limited to, traffic and automotive equipment, safety
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systems.
7.
Certain products in this document may need government approval before they can be
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own expense for these.
8.
No part of the contents cotained herein may be reprinted or reproduced without our prior
permission.
9.
MS-DOS is a registered trademark of Microsoft Corporation.
Copyright 1999 Oki Electric Industry Co., Ltd.
Printed in Japan