TI 54F38DM

54F38,74F38
54F38 74F38 Quad Two-Input NAND Buffer (Open Collector)
Literature Number: SNOS194A
54F/74F38
Quad Two-Input NAND Buffer
(Open Collector)
General Description
This device contains four independent gates, each of which
performs the logic NAND function. The open-collector outputs require external pull-up resistors for proper logical operation.
Military
Package
Number
74F38PC
Package Description
N14E
14-Lead (0.300× Wide) Molded Dual-In-Line
J14A
14-Lead Ceramic Dual-In-Line
et
54F38DM (Note 2)
e
Commercial
74F38SC (Note 1)
M14A
14-Lead (0.150× Wide) Molded Small Outline, JEDEC
74F38SJ (Note 1)
M14D
14-Lead (0.300× Wide) Molded Small Outline, EIAJ
54F38FM (Note 2)
W14B
14-Lead Cerpack
54F38LM (Note 2)
E20A
20-Lead Ceramic Leadless Chip Carrier, Type C
bs
ol
Note 1: Devices also available in 13× reel. Use suffix e SCX and SJX.
Note 2: Military grade device with environmental and burn-in processing. Use suffix e DMQB, FMQB and LMQB.
Logic Symbol
Connection Diagrams
Pin Assignment
for DIP, SOIC and Flatpak
O
IEEE/IEC
TL/F/9465–3
Pin Assignment
for LCC
TL/F/9465 – 1
TL/F/9465 – 2
TRI-STATEÉ is a registered trademark of National Semiconductor Corporation.
C1995 National Semiconductor Corporation
TL/F/9465
RRD-B30M75/Printed in U. S. A.
54F/74F38 Quad Two-Input NAND Buffer (Open Collector)
December 1994
Unit Loading/Fan Out
54F/74F
Pin Names
Description
An, Bn
On
Inputs
Outputs
U.L.
HIGH/LOW
Input IIH/IIL
Output IOH/IOL
1.0/2.0
OC*/106.6 (80)
20 mA/b1.2 mA
OC*/64 mA (48 mA)
*OC e Open Collector
Function Table
Inputs
Output
A
B
O
L
L
H
H
L
H
L
H
H
H
H
L
e
H e HIGH Voltage Level
O
bs
ol
et
L e LOW Voltage Level
2
Absolute Maximum Ratings (Note 1)
Recommended Operating
Conditions
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
Storage Temperature
b 65§ C to a 150§ C
Ambient Temperature under Bias
Junction Temperature under Bias
Plastic
b 55§ C to a 125§ C
Free Air Ambient Temperature
Military
Commercial
b 55§ C to a 125§ C
0§ C to a 70§ C
Supply Voltage
Military
Commercial
b 55§ C to a 175§ C
b 55§ C to a 150§ C
a 4.5V to a 5.5V
a 4.5V to a 5.5V
VCC Pin Potential to
Ground Pin
b 0.5V to a 7.0V
b 0.5V to a 7.0V
Input Voltage (Note 2)
b 30 mA to a 5.0 mA
Input Current (Note 2)
Voltage Applied to Output
in HIGH State (with VCC e 0V)
b 0.5V to VCC
Standard Output
b 0.5V to a 5.5V
TRI-STATEÉ Output
Current Applied to Output
in LOW State (Max)
twice the rated IOL (mA)
e
Note 1: Absolute maximum ratings are values beyond which the device may
be damaged or have its useful life impaired. Functional operation under
these conditions is not implied.
DC Electrical Characteristics
Symbol
Parameter
et
Note 2: Either voltage limit or current limit is sufficient to protect inputs.
54F/74F
Min
Input HIGH Voltage
VIL
Input LOW Voltage
VCD
VOL
IIH
IBVI
VID
IOD
IIL
2.0
0.8
VCC
Conditions
V
Recognized as a HIGH Signal
V
Recognized as a LOW Signal
Input Clamp Diode Voltage
b 1.2
V
Min
IIN e b18 mA
Output LOW
Voltage
54F 10% VCC
74F 10% VCC
0.55
0.55
V
Min
IOL e 48 mA
IOL e 64 mA
Input HIGH
Current
54F
74F
20.0
5.0
mA
Max
VIN e 2.7V
Input HIGH Current
Breakdown Test
54F
74F
100
7.0
mA
Max
VIN e 7.0V
Input Leakage
Test
74F
V
0.0
IID e 1.9 mA
All Other Pins Grounded
Output Leakage
Circuit Current
74F
3.75
mA
0.0
VIOD e 150 mV
All Other Pins Grounded
b 1.2
mA
Max
VIN e 0.5V
4.75
Input LOW Current
Open Collector, Output
OFF Leakage Test
O
IOHC
Units
Max
bs
ol
VIH
Typ
250
mA
Min
VOUT e VCC
ICCH
Power Supply Current
2.1
7.0
mA
Max
VO e HIGH
ICCL
Power Supply Current
26.0
30.0
mA
Max
VO e LOW
3
AC Electrical Characteristics
Symbol
tPLH
tPHL
Parameter
Propagation Delay
An, Bn to On
74F
54F
74F
TA e a 25§ C
VCC e a 5.0V
CL e 50 pF
TA, VCC e Mil
CL e 50 pF
TA, VCC e Com
CL e 50 pF
Min
Typ
Max
Min
Max
Min
Max
6.5
1.5
9.7
2.1
12.5
5.0
6.5
1.0
14.5
5.5
6.5
1.5
13.0
5.5
Units
ns
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows:
74F
38
S
Special Variations
QB e Military grade device with
environmental and burn-in
processing
X e Devices shipped in 13× reels
Device Type
et
Temperature Range
C e Commercial (0§ C to a 70§ C)
M e Military (b55§ C to a 125§ C)
O
bs
ol
Package Code
P e Plastic DIP
D e Ceramic DIP
F e Flatpak
L e Leadless Chip Carrier (LCC)
S e Small Outline SOIC JEDEC
SJ e Small Outline SOIC EIAJ
X
e
Temperature Range Family
74F e Commercial
54F e Military
C
4
et
e
Physical Dimensions inches (millimeters)
O
bs
ol
20-Lead Ceramic Leadless Chip Carrier (L)
NS Package Number E20A
5
e
Physical Dimensions inches (millimeters) (Continued)
O
bs
ol
et
14-Lead Ceramic Dual-In-Line Package (D)
NS Package Number J14A
14-Lead (0.150× Wide) Molded Small Outline Package, JEDEC (S)
NS Package Number M14A
6
et
e
Physical Dimensions inches (millimeters) (Continued)
O
bs
ol
14-Lead (0.300× Wide) Molded Small Outline Package, EIAJ (SJ)
NS Package Number M14D
14-Lead (0.300× Wide) Molded Dual-In-Line Package (P)
NS Package Number N14A
7
e
et
14-Lead Ceramic Flatpak (F)
NS Package Number W14B
bs
ol
54F/74F38 Quad Two-Input NAND Buffer (Open Collector)
Physical Dimensions inches (millimeters) (Continued)
LIFE SUPPORT POLICY
O
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and whose
failure to perform, when properly used in accordance
with instructions for use provided in the labeling, can
be reasonably expected to result in a significant injury
to the user.
National Semiconductor
Corporation
2900 Semiconductor Drive
P.O. Box 58090
Santa Clara, CA 95052-8090
Tel: 1(800) 272-9959
TWX: (910) 339-9240
National Semiconductor
GmbH
Livry-Gargan-Str. 10
D-82256 F4urstenfeldbruck
Germany
Tel: (81-41) 35-0
Telex: 527649
Fax: (81-41) 35-1
National Semiconductor
Japan Ltd.
Sumitomo Chemical
Engineering Center
Bldg. 7F
1-7-1, Nakase, Mihama-Ku
Chiba-City,
Ciba Prefecture 261
Tel: (043) 299-2300
Fax: (043) 299-2500
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
National Semiconductor
Hong Kong Ltd.
13th Floor, Straight Block,
Ocean Centre, 5 Canton Rd.
Tsimshatsui, Kowloon
Hong Kong
Tel: (852) 2737-1600
Fax: (852) 2736-9960
National Semiconductores
Do Brazil Ltda.
Rue Deputado Lacorda Franco
120-3A
Sao Paulo-SP
Brazil 05418-000
Tel: (55-11) 212-5066
Telex: 391-1131931 NSBR BR
Fax: (55-11) 212-1181
National Semiconductor
(Australia) Pty, Ltd.
Building 16
Business Park Drive
Monash Business Park
Nottinghill, Melbourne
Victoria 3168 Australia
Tel: (3) 558-9999
Fax: (3) 558-9998
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
www.ti.com/audio
Communications and Telecom www.ti.com/communications
Amplifiers
amplifier.ti.com
Computers and Peripherals
www.ti.com/computers
Data Converters
dataconverter.ti.com
Consumer Electronics
www.ti.com/consumer-apps
DLP® Products
www.dlp.com
Energy and Lighting
www.ti.com/energy
DSP
dsp.ti.com
Industrial
www.ti.com/industrial
Clocks and Timers
www.ti.com/clocks
Medical
www.ti.com/medical
Interface
interface.ti.com
Security
www.ti.com/security
Logic
logic.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Power Mgmt
power.ti.com
Transportation and Automotive www.ti.com/automotive
Microcontrollers
microcontroller.ti.com
Video and Imaging
RFID
www.ti-rfid.com
OMAP Mobile Processors
www.ti.com/omap
Wireless Connectivity
www.ti.com/wirelessconnectivity
TI E2E Community Home Page
www.ti.com/video
e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2011, Texas Instruments Incorporated