FEATURES - HIGH RELIABILITY FOR LOW COST / CHEAPEST AVAILABLE CRYSTAL - 3 PAD PACKAGE FOR GROUNDIG - LOW PROFILE - 3.2, 3.0 AND 2.5 MM PACKAGE HEIGHTS AVAILABLE - EXTENDED TEMPERATURE RANGE TO -40/+125°C AVAILABLE - EXCELLENT CLOCK SIGNAL GENERATOR FOR CPU'S - VERY SMALL FREQU'ENCY TOLERANCES AVAILABLE - QUALIFIED FOR QUOTMOTIVE APPLICATIONS HC-49/US-SMD 4.2 mm max. 3.2 mm max. / 2.5 mm max. 2 = standard package NUMBER OF LEADS 3 = optional 3rd pad for package grounding FREQUENCY 3.4875 ~ 40.0 MHz 24.0 ~ 40.5504 MHz 24.0 ~ 75.0 MHz MODE OF VIBRATION AT-FUNDAMENTAL BT-FUNDAMENTAL 3rd OVERTONE 150 ~ 25 Ω max. 30 ~ 40 Ω max. 120 ~ 60 Ω max. RESONANCE RESISTANCE +-5 ppm ~ +-50 ppm FREQUENCY TOLERANCE AT 25°C 0/+50°C ~ -40/+125°C TEMPERATURE RANGE 0/+50°C +-3 ppm 0/+50°C / -10/+60°C +-5 ppm TEMPERATURE +-10 ppm 0+50°C / -10/+60°C / 0/+70°C / -20+70°C STABILITY +-15 ppm 0+50°C / -10/+60°C / 0/+70°C / -20/+70°C / -40+85°C OVER +-20 ppm 0+50°C / -10/+60°C / 0/+70°C / -20/+70°C / -40/+85°C TEMPERATURE 0+50°C / -10/+60°C / 0/+70°C / -20/+70°C / -40/+85°C +-30 ppm RANGE 0+50°C / -10/+60°C / 0/+70°C / -20/+70°C / -40/+85°C / -40/+125°C +-50 ppm 0+50°C / -10/+60°C / 0/+70°C / -20/+70°C / -40/+85°C / -40/+125°C +-100 ppm 5 ~ 50 pF or series LOAD CAPACITANCE 7 pF max. SHUNT CAPACITANCE 100 µW typical (0.01 mW ~ 1 mW possible) DRIVE LEVEL +-3 ~ +-5 ppm per year (+-2 ppm available as option) AGING >500 MΩ DC/100V +-10% INSULATION RESISTANCE -55/+125°C STORAGE TEMPERATURE Tape & Reel (1.000 pcs per reel) PACKAGE OTHER PARAMETERS ARE AVAILABLE ON REQUEST / CREATE HERE YOUR SPECIFICATION SMD CRYSTAL IN METAL PACKAGE STANDARD PACKAGE HEIGHT OPTION PART NUMBERING SYSTEM HC-49/US-SMD 3.2 27.000 MHz 30/50/-40+125/20pF EXAMPLE TYPE PACKAGE HEIGHT FREQUENCY FREQUENCY TOLERANCE AT 25°C TEMPERATURE STABILITY TEMPERATURE RANGE LOAD CAPACITANCE HC-49/US-SMD = 2 pad standard package HC-49/US-GSMD = 3 pad for optional grounding function BLANK FOR 4.2 mm 3.2 or 2.5 mm IN MHZ REQUIRED VALUE REQUIRED VALUE REQUIRED VALUE REQUIRED VALUE REV. 03 / April 2009 http://www.petermann-technik.com | [email protected] OUTLINE DRAWING OF HC-49/US-SMD (2 pad standard package) 3.81max 4.65max 10.21max H 0.7nom 11.05max 4.7+0.2 12.3+0.5 11.4+0.2 - INSULATOR 4.7+0.2 0.65+0.15 - 0.5min 4.88+0.2 - H = 4.2 standard LEAD Unit:mm 4.45+0.25 - RECOMMENDED PAD LAYOUT (2 pad standard package) 2.0 4.4 6.0 6.0 Unit:mm http://www.petermann-technik.com | [email protected] OUTLINE DRAWING OF HC-49/US-GSMD (middle pad for grounding) REEL SPECIFICATION 0.4+0.05 1.55+0.0 5 - 4+0.2 - 2+0.2 - 11.5+0.1 - 100+- 1.0 +0. 5 13.0 -0.2 30+0.5 - 1.5+0.1 - 12+0.1 - +0.5 -0.2 15+0.1 - 13.0 33 0max 4.35 (JYSD1) 3.5 (JYSD2) 5+0.1 - 25+0.5 Unit: mm REFLOW SOLDER PROFILE 260°C TEMPERAT URE 24+0.3 - 10.75+0.1 - 1 .75+0.1 - 5 2.0 +0. -0. 2 REF LOW 1 to 5°C/s 1TO5°C /s COOLING PREHEAT IN G 10s max 150°C 1 to 9°C/s 25°C 60 200 TIME (Seconds) Crystals can be soldered according to the norm JEDEC J-STD-020C. http://www.petermann-technik.com | [email protected]