Low Profile Miniature Glass Passivated Single-Phase Surface Mount Bridge Rectifier MB05F thru M B10F VOLTAGE - 50 TO 1000 VOLTS CURRENT - 0.5 AMPERES μ MBF FEATURES ● ● ● ● ● ● ● ● Low profile space Ideal for automated placement Glass passivated chip junction Low forward voltage drop Low leakage current High forward surge capability High temperature soldering： 260℃/10 seconds at terminals Component in accordance to RoHS 2002/95/1 and WEEE 2002/96/EC MECHANICAL DATA ● ● ● Case: MBF Molded plastic over glass passivated chip Terminals: Solder plated, solderable per J-STD-002B and JESD22-B102D Polarity: Polarity symbols marked on body MAXIMUM RATIXGS AND ELECTRICAL CHARACTERISTICS (TA = 25 C unless otherwise noted) ° Symbol MB05F MB1F MB2F MB4F MB6F MB8F MB10F UNIT Maximum repetitive peak reverse voltage VRRM 50 100 200 400 600 800 1000 V Maximum RMS voltage VRMS 35 70 700 V Maximum DC blocking voltage Maximum average forward output rectified current at TA=30℃ -on glass-epoxy P.C.B(NOTE 1) -on aluminum substrate(NOTE 2) Peak forward surge current 8.3 ms single half sine-wave superimposed on rated load(JEDEC Method) Maximum instantaneous forwad voltage drop per leg at 0.4A Maximum DC reverse current at TA = 25 ℃ rated DC blocking voltage per leg TA = 125℃ Typical junction capacitance per leg at 4.0 V ,1MHz VDC 50 100 200 400 600 800 1000 V IF(AV) 0.5 0.8 A IFSM 35 A VF 1 V IR 5.0 100 μA CJ 13 pF (NOTE 2) RθJA RθJA ℃/ W (NOTE 1) RθJL 85 70 20 (NOTE 1) Thermal resistance per leg 140 280 420 560 TJ, TSTG Operating junction and storage temperature range –55 to +150 NOTE1:On glass epoxy P.C.B. mounted on 0.05×0.05″(1.3×1.3mm) pads NOTE2:On aluminum substrate P.C.B. with an area of 0.8″×0.8″(20×20mm) mounted on 0.05×0.05″(1.3×1.3mm) solder pad Web Site: WWW.PS-PFS.COM ℃ Low Profile Miniature Glass Passivated Single-Phase Surface Mount Bridge Rectifier MB05F thru M B10F VOLTAGE - 50 TO 1000 VOLTS Characteristic Curves (TA=25 ℃ unless otherwise noted) Web Site: WWW.PS-PFS.COM CURRENT - 0.5 AMPERES