TLV5614IYZ www.ti.com SBAS401 – DECEMBER 2006 12-Bit, Quad Channel, 2.7V to 5.5V, DAC in Bumped Die (Wafer Chip Scale) Package—Pb-Free/Green FEATURES APPLICATIONS • Four 12-Bit D/A Converters • Programmable Settling Time of Either 3µs or 9µs Typ • TMS320™DSP Family, (Q)SPI™, and Microwire™ Compatible Serial Interface • Internal Power-On Reset • Low Power Consumption: – 8mW, Slow Mode; 5V Supply – 3.6mW, Slow Mode; 3V Supply • Reference Input Buffer • Voltage Output Range . . . 2x Reference Input Voltage • Monotonic Over Temperature • Dual 2.7V to 5.5V Supply (Separate Digital and Analog Supplies) • Hardware Power-Down (10nA) • Software Power-Down (10nA) • Simultaneous Update • • • • • • Battery-Powered Test Instruments Digital Offset and Gain Adjustment Industrial Process Controls Machine and Motion Control Devices Communications Arbitrary Waveform Generation BUMPED DIE (BOTTOM VIEW) OUTA OUTB REFINAB AV DD 14 13 15 OUTC OUTD 12 11 10 16 DVDD 1 PD 2 34 LDAC 5 DIN SCLK REFINCD 9 AGND 8 DGND 7 FS 6 CS DESCRIPTION The TLV5614IYZ is a quadruple, 12-bit, voltage output digital-to-analog converter (DAC) with a flexible 4-wire serial interface. The serial interface allows glueless interface to TMS320, SPI, QSPI, and Microwire serial ports. The TLV5614IYZ is programmed with a 16-bit serial word comprised of a DAC address, individual DAC control bits, and a 12-bit DAC value. The device has provision for two supplies: one digital supply for the serial interface (via pins DVDD and DGND), and one for the DACs, reference buffers, and output buffers (via pins AVDD and AGND). Each supply is independent of the other, and can be any value between 2.7V and 5.5V. The dual supplies allow a typical application where the DAC is controlled via a microprocessor operating on a 3V supply (also used on pins DVDD and DGND) with the DACs operating on a 5V supply. Of course, the digital and analog supplies can also be tied together. The resistor string output voltage is buffered by a 2x gain rail-to-rail output buffer. The buffer features a Class-AB output stage to improve stability and reduce settling time. A rail-to-rail output stage and a power-down mode makes it ideal for single voltage, battery-based applications. The DAC settling time is programmable, allowing the designer to optimize speed versus power dissipation. Settling time is chosen by the control bits within the 16-bit serial input string. A high-impedance buffer is integrated on the REFINAB and REFINCD terminals to reduce the need for a low source impedance drive to the terminal. REFINAB and REFINCD allow DACs A and B to have a different reference voltage than DACs C and D. The TLV5614IYZ is built with a CMOS process and is available in a 16-terminal bumped die (wafer chip scale) package. It is characterized for operation from –40°C to +85°C in a wire-bonded, small outline (SOIC) package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. TMS320 is a trademark of Texas Instruments, Inc. SPI is a trademark of Motorola, Inc. Microwire is a trademark of National Semiconductor Corporation. MCS is a registered trademark of National Semiconductor Corporation. All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2006, Texas Instruments Incorporated TLV5614IYZ www.ti.com SBAS401 – DECEMBER 2006 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. ABSOLUTE MAXIMUM RATINGS Over operating free-air temperature range (unless otherwise noted) (1) UNIT Supply voltage, (DVDD, AVDD to GND) 7V Supply voltage difference, (AVDD to DVDD) –2.8V to 2.8V Digital input voltage range –0.3V to DVDD + 0.3V Reference input voltage range –0.3V to AVDD + 0.3V Operating free-air temperature range, TA (1) –40°C to +85°C Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS Over operating free-air temperature range (unless otherwise noted) Supply voltage, AVDD, DVDD High-level digital input voltage, VIH Low-level digital input voltage, VIL Reference voltage, VREF to REFINAB, REFINCD terminal MIN NOM MAX 5V supply 4.5 5 5.5 3V supply 2.7 3 3.3 DVDD = 2.7V 2 DVDD = 5.5V 2.4 0.6 DVDD = 5.5V 1 supply (1) 0 2.048 VDD – 1.5 3V supply (1) 0 1.024 VDD – 1.5 2 10 Load resistance, RL Load capacitance, CL Serial clock rate, SCLK Operating free-air temperature (1) 2 TLV5614IYZ Voltages greater than AVDD/2 cause output saturation for upper DAC codes. Submit Documentation Feedback –40 V V DVDD = 2.7V 5V UNIT V V kΩ 100 pF 20 MHz +85 °C TLV5614IYZ www.ti.com SBAS401 – DECEMBER 2006 ELECTRICAL CHARACTERISTICS Over operating free-air temperature range, supply voltages, and reference voltages (unless otherwise noted). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT STATIC DAC SPECIFICATIONS Resolution EZS EG PSRR 12 bits Integral nonlinearity (INL), end point adjusted See (1) ±1.5 ±4 LSB Differential nonlinearity (DNL) See (2) ±0.5 ±1 LSB Zero-scale error (offset error at zero scale) See (3) Zero-scale error temperature coefficient See (4) Gain error See (5) Gain error temperature coefficient See (6) Power supply rejection ratio Zero scale Full scale ±12 10 ±0.6 See (7) (8) mV ppm/°C % of FS voltage 10 ppm/°C –80 dB –80 dB INDIVIDUAL DAC OUTPUT SPECIFICATIONS VO Voltage output range Output load regulation accuracy RL = 10kΩ 0 RL = 2kΩ vs 10kΩ 0.1 AVDD – 0.4 V 0.25 % of FS voltage REFERENCE INPUTS (REFINAB, REFINCD) VI Input voltage range RI Input resistance CI Input capacitance See (9) 0 AVDD – 1.5 10 Reference feedthrough REFIN = 1VPP at 1kHz + 1.024VDC (see (10)) Reference input bandwidth REFIN = 0.2VPP + 1.024VDC large signal V MΩ 5 pF –75 dB Slow 0.5 Fast 1 MHz DIGITAL INPUTS (DIN, CS, LDAC, PD) IIH High-level digital input current VI = VDD ±1 µA IIL Low-level digital input current VI = 0V ±1 µA CI Input capacitance 3 pF POWER SUPPLY IDD 5V supply, no load, clock running. All inputs 0V or VDD Slow 1.6 2.4 Fast 3.8 5.6 3V supply, no load, clock running. All inputs 0V or DVDD Slow 1.2 1.8 Fast 3.2 4.8 Power supply current Power down supply current (see Figure 12) 10 mA mA nA (1) The relative accuracy or integral nonlinearity (INL), sometimes referred to as linearity error, is the maximum deviation of the output from the line between zero and full-scale excluding the effects of zero code and full-scale errors. (2) The differential nonlinearity (DNL), sometimes referred to as differential error, is the difference between the measured and ideal 1 LSB amplitude change of any two adjacent codes. Monotonic means the output voltage changes in the same direction (or remains constant) as a change in the digital input code. (3) Zero-scale error is the deviation from zero voltage output when the digital input code is zero. (4) Zero-scale error temperature coefficient is given by: EZS TC = [EZS (TMAX) – EZS (TMIN)]/VREF × 106/(TMAX – TMIN). (5) Gain error is the deviation from the ideal output (2VREF – 1 LSB) with an output load of 10 kΩ excluding the effects of the zero error. (6) Gain temperature coefficient is given by: EG TC = [EG(TMAX) – EG (TMIN)]/VREF × 106/(TMAX – TMIN). (7) Zero-scale error rejection ratio (EZS–RR) is measured by varying the AVDD from 5V ± 0.5V and 3V ± 0.3VDC, and measuring the proportion of this signal imposed on the zero-code output voltage. (8) Full-scale rejection ratio (EG–RR) is measured by varying the AVDD from 5V ± 0.5V and 3V ± 0.3VDC and measuring the proportion of this signal imposed on the full-scale output voltage after subtracting the zero scale change. (9) Reference input voltages greater than VDD/2 cause output saturation for upper DAC codes. (10) Reference feedthrough is measured at the DAC output with an input code = 000hex and VREF (REFINAB or REFINCD) input = 1.024VDC + 1VPP at 1kHz. Submit Documentation Feedback 3 TLV5614IYZ www.ti.com SBAS401 – DECEMBER 2006 ELECTRICAL CHARACTERISTICS (continued) Over operating free-air temperature range, supply voltages, and reference voltages (unless otherwise noted). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT ANALOG OUTPUT DYNAMIC PERFORMANCE SR CL = 100pF, RL = 10kΩ, VO = 10% to 90%, VREF = 2.048V, 1024V Output slew rate ts Output settling time To ± 0.5 LSB, CL = 100pF, RL = 10kΩ, see ts(c) Output settling time, code to code To ± 0.5 LSB, CL = 100pF, RL = 10kΩ, see Glitch energy Code transition from 7FF to 800 (11) (12) SNR Signal-to-noise ratio SINAD Signal to noise + distortion THD Total harmonic distortion SFDR Spurious-free dynamic range (13) Fast 5 Slow 1 Fast 3 5.5 Slow 9 20 Fast 1 Slow 2 10 V/µs V/µs µs µs nV–s 74 Sinewave generated by DAC, Reference voltage = 1.024 at 3V and 2.048 at 5V, fS = 400KSPS, fOUT = 1.1kHz sinewave, CL = 100pF, RL = 10kΩ, BW = 20kHz 66 –68 dB 70 DIGITAL INPUT TIMING REQUIREMENTS tsu(CS–FS) Setup time, CS low before FS↓ 10 ns tsu(FS–CK) Setup time, FS low before first negative SCLK edge 8 ns tsu(C16–FS) Setup time. 16th negative SCLK edge after FS low on which bit D0 is sampled before rising edge of FS 10 ns tsu(C16–CS) Setup time. The first positive SCLK edge after D0 is sampled before CS rising edge. If FS is used instead of the SCLK positive edge to update the DAC, then the setup time is between the FS rising edge and CS rising edge. 10 ns twH Pulse duration, SCLK high 25 ns twL Pulse duration, SCLK low 25 ns tsu(D) Setup time, data ready before SCLK falling edge 8 ns th(D) Hold time, data held valid after SCLK falling edge 5 ns twH(FS) Pulse duration, FS high 20 ns (11) Settling time is the time for the output signal to remain within ±0.5 LSB of the final measured value for a digital input code change of FFFhex to 080hex for 080hex to FFFhex. (12) Limits are ensured by design and characterization, but are not production tested. (13) Settling time is the time for the output signal to remain within ±0.5 LSB of the final measured value for a digital input code change of one count. t SCLK 1 t DIN t wL 2 3 wH 4 5 15 16 th(D) su(D) D15 D14 D13 D12 tsu(FS-CK) D1 D0 tsu(C16-CS) tsu(CS-FS) CS twH(FS) tsu(C16-FS) FS Figure 1. Timing Diagram 4 Submit Documentation Feedback TLV5614IYZ www.ti.com SBAS401 – DECEMBER 2006 FUNCTIONAL BLOCK DIAGRAM AVDD REFINAB 15 DVDD 16 1 DAC A + _ Power-On Reset DIN 4 Serial Input Register 14 + _ 14-Bit Data and Control Register 12 12-Bit DAC Latch 2 2-Bit Control Data Latch 14 OUTA 10 2 2 Power-Down/ Speed Control 2 7 FS SCLK CS REFINCD 5 6 DAC Select/ Control Logic 13 DAC B DAC C 12 DAC D 11 OUTB OUTC 10 3 9 AGND OUTD 2 8 DGND LDAC Submit Documentation Feedback PD 5 TLV5614IYZ www.ti.com SBAS401 – DECEMBER 2006 Table 1. TERMINAL FUNCTIONS TERMINAL NAME 6 NO. I/O AGND 9 — Analog ground DESCRIPTION AVDD 16 — Analog supply CS 6 I DGND 8 — DIN 4 I DVDD 1 — FS 7 PD 2 Chip select. This terminal is active low. Digital ground Serial data input Digital supply I Frame sync input. The falling edge of the frame sync pulse indicates the start of a serial data frame shifted out to the TLV5614IYZ. I Power-down pin. Powers down all DACs (overriding the individual power down settings), and all output stages. This terminal is active low. I Load DAC. When the LDAC signal is high, no DAC output updates occur when the input digital data is read into the serial interface. The DAC outputs are only updated when LDAC is low. LDAC 3 REFINAB 15 I Voltage reference input for DACs A and B. REFINCD 10 I Voltage reference input for DACs C and D. SCLK 5 I Serial clock inputinput OUTA 14 O DACA output OUTB 13 O DACB output OUTC 12 O DACC output OUTD 11 O DACD output Submit Documentation Feedback TLV5614IYZ www.ti.com SBAS401 – DECEMBER 2006 TYPICAL CHARACTERISTICS LOAD REGULATION LOAD REGULATION 0.20 0.35 VDD = 3V VREF = 1V VO = Full Scale 0.18 0.16 0.30 0.25 3V Slow Mode, Sink 5V Slow Mode, Sink 0.12 0.10 VO, Output (V) VO, Output (V) 0.14 VDD = 5V VREF = 2V VO = Full Scale 3V Fast Mode, Sink 0.08 0.06 0.20 5V Fast Mode, Sink 0.15 0.10 0.04 0.05 0.02 0 0 0 0.01 0.02 0.05 0.1 0.2 0.5 0.8 1 2 0 Load Current (mA) LOAD REGULATION 0.02 0.04 0.1 0.2 0.4 0.8 Load Current (mA) 1 2 4 LOAD REGULATION 2.0015 4.010 5V Slow Mode, Source 3V Slow Mode, Source 2.0010 4.005 2.0005 2.0000 VO, Output (V) VO, Output (V) 3V Fast Mode, Source 4.000 5V Fast Mode, Source 3.995 1.9995 1.9990 1.9985 1.9980 VDD = 3V VREF = 1V VO = Full Scale 1.9975 3.990 VDD = 5V VREF = 2V VO = Full Scale 3.985 0 0.02 0.04 0.1 0.2 0.4 0.8 Load Current (mA) 1 2 1.9970 1.9965 4 0 Submit Documentation Feedback 0.01 0.02 0.05 0.1 0.2 0.5 Load Current (mA) 0.8 1 2 7 TLV5614IYZ www.ti.com SBAS401 – DECEMBER 2006 TYPICAL CHARACTERISTICS (continued) SUPPLY CURRENT vs TEMPERATURE SUPPLY CURRENT vs TEMPERATURE 4.0 4.0 VDD = 3V VREF = 1.024V VO Full Scale (Worst Case For IDD) 3.5 Fast Mode 3.0 IDD, Supply Current (mA) IDD, Supply Current (mA) 3.5 2.5 2.0 1.5 1.0 Slow Mode 0.5 -40 -20 0 20 Fast Mode 3.0 VDD = 5V VREF = 1.024V VO Full Scale (Worst Case For IDD) 2.5 2.0 1.5 Slow Mode 1.0 40 60 80 0.5 -40 100 -20 Temperature (°C) TOTAL HARMONIC DISTORTION vs FREQUENCY 100 -20 -30 -40 -50 -60 VREF = 1VDC + 1VPP Sinewave, Output Full Scale -10 THD, Total Harmonic Distortion (dB) THD, Total Harmonic Distortion (dB) 80 0 VREF = 1VDC + 1VPP Sinewave, Output Full Scale -10 Fast Mode -20 -30 -40 -50 -60 Slow Mode -70 -70 0 5 10 20 30 50 100 -80 0 Frequency (kHz) 8 20 40 60 Temperature (°C) TOTAL HARMONIC DISTORTION vs FREQUENCY 0 -80 0 5 10 20 Frequency (Hz) Submit Documentation Feedback 30 50 100 TLV5614IYZ www.ti.com SBAS401 – DECEMBER 2006 TYPICAL CHARACTERISTICS (continued) TOTAL HARMONIC DISTORTION AND NOISE vs FREQUENCY TOTAL HARMONIC DISTORTION AND NOISE vs FREQUENCY 0 -10 THD, Total Harmonic Distortion And Noise (dB) VREF = 1VDC + 1VPP Sinewave, Output Full Scale -20 -30 -40 -50 Fast Mode -60 -70 -80 0 5 10 20 30 50 -20 -30 -40 -50 Slow Mode -60 -70 -80 100 VREF = 1VDC + 1VPP Sinewave, Output Full Scale -10 0 5 10 20 30 50 100 Frequency (kHz) Frequency (kHz) SUPPLY CURRENT vs TIME (Entering Power-Down Mode) 4000 3500 3000 IDD, Supply Current (mA) THD, Total Harmonic Distortion And Noise (dB) 0 2500 2000 1500 1000 500 0 0 200 400 600 800 1000 Time (ns) Submit Documentation Feedback 9 TLV5614IYZ www.ti.com SBAS401 – DECEMBER 2006 TYPICAL CHARACTERISTICS (continued) DNL (LSB) DIFFERENTIAL NONLINEARITY CODE 0.30 0.25 0.20 0.15 0.10 0.05 0 -0.05 -0.10 -0.15 -0.20 -0.25 -0.30 VCC = 5V, VREF = 2V, SCLK = 1MHz 0 256 512 768 1024 1280 1536 1792 2048 2304 2560 2816 3072 3328 3584 3840 4096 Code Figure 13. INTEGRAL NONLINEARITY CODE 1.0 VCC = 5V, VREF = 2V, SCLK = 1MHz INL (LSB) 0.5 0 -0.5 -1.0 -1.5 0 256 512 768 1024 1280 1536 1792 2048 2304 2560 2816 3072 3328 3584 3840 4096 Code Figure 14. 10 Submit Documentation Feedback TLV5614IYZ www.ti.com SBAS401 – DECEMBER 2006 APPLICATION INFORMATION GENERAL FUNCTION The TLV5614IYZ is a 12-bit, single-supply DAC based on a resistor string architecture. The device consists of a serial interface, speed and power-down control logic, a reference input buffer, a resistor string, and a rail-to-rail output buffer. The output voltage (full-scale determined by external reference) is given by: 2 REF CODE [V] 2n where REF is the reference voltage and CODE is the digital input value within the range of 010 to (2n – 1), where n = 12 (bits). The 16-bit data word, consisting of control bits and the new DAC value, is described in the data format section. A power-on reset initially resets the internal latches to a defined state (all bits '0'). SERIAL INTERFACE Data transfer occurs in this manner: First, the device must be enabled with CS set low. Then, a falling edge of FS starts shifting the data bit-per-bit (starting with the MSB) to the internal register on the falling edges of SCLK. After 16 bits have been transferred or FS rises, the content of the shift register is moved to the DAC latch, which then updates the voltage output to the new level. The serial interface of the TLV5614IYZ can be used in two basic modes: • Four-wire (with chip-select) • Three-wire (without chip-select) Using chip-select (four-wire mode), it is possible to have more than one device connected to the serial port of the data source (a DSP or microcontroller). The interface is compatible with the TMS320 DSP family. Figure 15 shows an example with two TLV5614IYZs connected directly to a TMS320 DSP. TLV5614IYZ-1 TLV5614IYZ-2 CS FS DIN SCLK CS FS DIN SCLK TMS320 DSP XF0 XF1 FSX DX CLKX Figure 15. TMS320 Interface If there is no need to have more than one device on the serial bus, then CS can be tied low. Figure 16 shows an example of how to connect the TLV5614IYZ to a TMS320, SPI, or Microwire port using only three pins. TMS320 DSP FSX DX CLKX TLV5614IYZ FS DIN SCLK CS TLV5614IYZ SPI SS MOSI SCLK FS DIN SCLK CS Microwire I/O SO SK TLV5614IYZ FS DIN SCLK CS Figure 16. Three-Wire Interface Submit Documentation Feedback 11 TLV5614IYZ www.ti.com SBAS401 – DECEMBER 2006 APPLICATION INFORMATION (continued) Notes on SPI and Microwire connections: Before the controller starts the data transfer, the software must generate a falling edge on the I/O pin connected to FS. If the word width is eight bits (SPI and Microwire), two write operations must be performed to program the TLV5614IYZ. After the write operation(s), the DAC output is updated automatically on the next positive clock edge following the 16th falling clock edge. SERIAL CLOCK FREQUENCY AND UPDATE RATE The maximum serial clock frequency is given by: 1 fSCLKmax = = 20 MHz twH(min) + twL(min) The maximum update rate is: 1 fUPDATEmax = = 1.25 MHz 16 (twH(min) + twL(min)) Note that the maximum update rate is a theoretical value for the serial interface, because the settling time of the TLV5614IYZ must also be considered. DATA FORMAT The 16-bit data word for the TLV5614IYZ consists of two parts: • Control bits (D15 . . . D12) • New DAC value (D11 . . . D0) D15 D14 D13 D12 A3 A2 A1 A0 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 New DAC value (12 bits) X: don't care SPD: Speed control bit. 1→fast mode, 0→slow mode PWR: Power control bit. 1→power down, 0→normal operation In power-down mode, all amplifiers within the TLV5614IYZ are disabled. A particular DAC (A, B, C, D) of the TLV5614IYZ is selected by A1 and A0 within the input word. 12 A1 A0 DAC 0 0 A 0 1 B 1 0 C 1 1 D Submit Documentation Feedback TLV5614IYZ www.ti.com SBAS401 – DECEMBER 2006 TLV5614IYZ INTERFACED TO TMS320C203 DSP Hardware Interfacing Figure 17 shows an example of how to connect the TLV5614IYZ to a TMS320C203 DSP. The serial port is configured in burst mode, with FSX generated by the TMS320C203 to provide the frame sync (FS) input to the TLV5614IYZ. Data is transmitted on the DX line, with the serial clock input on the CLKX line. The general-purpose input/output port bits IO0 and IO1 are used to generate the chip select (CS) and DAC latch update (LDAC) inputs to the TLV5614IYZ. The active low power-down (PD) is pulled high all the time to ensure the DACs are enabled. TMS320C203 TLV5614IYZ DX SDIN CLKX SCLK FSX FS I/O 0 CS I/O 1 LDAC VDD PD VOUTA VOUTB REF REFINAB VOUTC REFINCD VOUTD VSS Figure 17. TLV5614IYZ Interfaced With TMS320C203 Software The application example outputs a differential in-phase (sine) signal between the VOUTA and VOUTB pins, and its quadrature (cosine) signal as the differential signal between VOUTC and VOUTD. The on-chip timer is used to generate interrupts at a fixed frequency. The related interrupt service routine pulses LDAC low to update all four DACs simultaneously, then fetches and writes the next sample to all four DACs. The samples are stored in a look-up table that describes two full periods of a sine wave. The synchronous serial port of the DSP is used in burst mode. In this mode, the processor generates an FS pulse preceding the MSB of every data word. If multiple, contiguous words are transmitted, a violation of the tsu(C16–FS) timing requirement occurs. To avoid this violation, the program waits until the transmission of the previous word has been completed. ;....................................................................................... ; Processor: TMS320C203 runnning at 40 MHz ; ; Description: ; ; This program generates a differential in-phase (sine) on (OUTA-OUTB) and its quadrature (cosine) as a differential signal on (OUTC-OUTD). ; ; The DAC codes for the signal samples are stored as a table of 64 12-bit values, describing ; 2 periods of a sine function. A rolling pointer is used to address the table location in ; the first period of this waveform, from which the DAC A samples are read. The samples for ; the other 3 DACs are read at an offset to this rolling pointer ; DAC Function Offset from rolling pointer ; A sine 0 ; B inverse sine 16 ; C cosine 8 ; D inverse cosine24 ; ; The on-chip timer is used to generate interrupts at a fixed rate. The interrupt service ; routine first pulses LDAC low to update all DACs simultaneously with the values which ; were written to them in the previous interrupt. Then all 4 DAC values are fetched and ; written out through the synchronous serial interface. Finally, the rolling pointer is ; incremented to address the next sample, ready for the next interrupt. Submit Documentation Feedback 13 TLV5614IYZ www.ti.com SBAS401 – DECEMBER 2006 ; © 1998, Texas Instruments Inc. ;....................................................................................... ;------------------------------ I/O and memory mapped regs ----------------------------.include "regs.asm" ;-------jump vectors ------------------------------------------------------------------.ps 0h b start b int1 b int23 b timer_isr; ----------- variables -----------------------------------------------------------------temp .equ 0060h r_ptr .equ 0061h iosr_stat .equ 0062h DACa_ptr .equ 0063h DACb_ptr .equ 0064h DACc_ptr .equ 0065h DACd_ptr .equ 0066h ;-----------constants-----------------------------------------------------------------; DAC control bits to be OR’ed onto data ; all fast mode DACa_control .equ 01000h DACb_control .equ 05000h DACc_control .equ 09000h DACd_control .equ 0d000h ;----------- tables -------------------------------.ds 02000h sinevals .word 00800h .word 0097Ch .word 00AE9h .word 00C3Ah .word 00D61h .word 00E53h .word 00F07h .word 00F76h .word 00F9Ch .word 00F76h .word 00F07h .word 00E53h .word 00D61h .word 00C3Ah .word 00AE9h .word 0097Ch .word 00800h .word 00684h .word 00517h .word 003C6h .word 0029Fh .word 001ADh .word 000F9h .word 0008Ah .word 00064h .word 0008Ah .word 000F9h .word 001ADh .word 0029Fh .word 003C6h .word 00517h .word 00684h .word 00800h .word 0097Ch .word 00AE9h .word 00C3Ah .word 00D61h .word 00E53h .word 00F07h .word 00F76h .word 00F9Ch .word 00F76h .word 00F07h 14 Submit Documentation Feedback TLV5614IYZ www.ti.com SBAS401 – DECEMBER 2006 .word 00E53h .word 00D61h .word 00C3Ah .word 00AE9h .word 0097Ch .word 00800h .word 00684h .word 00517h .word 003C6h .word 0029Fh .word 001ADh .word 000F9h .word 0008Ah .word 00064h .word 0008Ah .word 000F9h .word 001ADh .word 0029Fh .word 003C6h .word 00517h .word 00684h ;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– ; Main Program ;–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– .ps 1000h .entry start ;–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– ; disable interrupts ;–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– setc INTM ; disable maskable interrupts splk #0ffffh, IFR; clear all interrupts splk #0004h, IMR; timer interrupts unmasked ;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– ; set up the timer ; timer period set by values in PRD and TDDR ; period = (CLKOUT1 period) × (1+PRD) × (1+TDDR) ; examples for TMS320C203 with 40MHz main clock ; Timer rate TDDR PRD ; 80 kHz 9 24 (18h) ; 50 kHz 9 39 (27h) ;–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– prd_val.equ 0018h tcr_val.equ 0029h splk #0000h, temp; clear timer out temp, TIM splk #prd_val, temp; set PRD out temp, PRD splk #tcr_val, temp; set TDDR, and TRB=1 for auto-reload out temp, TCR ;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– ; Configure IO0/1 as outputs to be : ; IO0 CS - and set high ; IO1 LDAC - and set high ;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– in temp, ASPCR; configure as output lacl temp or #0003h sacl temp out temp, ASPCR in temp, IOSR; set them high lacl temp or #0003h sacl temp out temp, IOSR ;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– ; set up serial port for ; SSPCR.TXM=1 Transmit mode - generate FSX ; SSPCR.MCM=1 Clock mode - internal clock source ; SSPCR.FSM=1 Burst mode ;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– splk #0000Eh, temp Submit Documentation Feedback 15 TLV5614IYZ www.ti.com SBAS401 – DECEMBER 2006 out temp, SSPCR; reset transmitter splk #0002Eh, temp out temp,SSPCR ;–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– ; reset the rolling pointer ;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– lacl #000h sacl r_ptr ;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– ; enable interrupts ;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– clrc INTM ; enable maskable interrupts ;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– ; loop forever! ;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– next idle ;wait for interrupt b next ;–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– ;all else fails stop here ;–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– done b done ;hang there ;–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– ; Interrupt Service Routines ;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– int1 ret ; do nothing and return int23 ret ; do nothing and return timer_isr: in iosr_stat, IOSR; store IOSR value into variable space lacl iosr_stat ; load acc with iosr status and #0FFFDh ; reset IO1 - LDAC low sacl temp ; out temp, IOSR; or #0002h ; set IO1 - LDAC high sacl temp ; out temp, IOSR; and #0FFFEh ; reset IO0 - CS low sacl temp ; out temp, IOSR; lacl r_ptr ; load rolling pointer to accumulator add #sinevals ; add pointer to table start sacl DACa_ptr ; to get a pointer for next DAC a sample add #08h ; add 8 to get to DAC C pointer sacl DACc_ptr add #08h ; add 8 to get to DAC B pointer sacl DACb_ptr add #08h ; add 8 to get to DAC D pointer sacl DACd_ptr mar *,ar0 ; set ar0 as current AR ; DAC A lar ar0, DACa_ptr ; ar0 points to DAC a sample lacl * ; get DAC a sample into accumulator or #DACa_control ; OR in DAC A control bits sacl temp ; out temp, SDTR; send data ;–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––; We must wait for transmission to complete before writing next word to the SDTR.; TLV5614/04 interface does not allow the use of burst mode with the full packet; rate, as we need a CLKX -ve edge to clock in last bit before FS goes high again,; to allow SPI compatibility. ;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– rpt #016h ; wait long enough for this configuration nop ; of MCLK/CLKOUT1 rate ; DAC B lar ar0, dacb_ptr ; ar0 points to DAC a sample lacl * ; get DAC a sample into accumulator or #DACb_control ; OR in DAC B control bits sacl temp ; out temp, SDTR; send data rpt #016h ; wait long enough for this configuration nop ; of MCLK/CLKOUT1 rate ; DAC C lar ar0, dacc_ptr ; ar0 points to dac a sample 16 Submit Documentation Feedback TLV5614IYZ www.ti.com SBAS401 – DECEMBER 2006 lacl * ; get DAC a sample into accumulator or #DACc_control ; OR in DAC C control bits sacl temp ; out temp, SDTR; send data rpt #016h ; wait long enough for this configuration nop ; of MCLK/CLKOUT1 rate ; DAC D lar ar0, dacd_ptr; ar0 points to DAC a sample lacl * ; get DAC a sample into accumulator or #dacd_control ; OR in DAC D control bits sacl temp ; out temp, SDTR; send data lacl r_ptr ; load rolling pointer to accumulator add #1h ; increment rolling pointer and #001Fh ; count 0-31 then wrap back round sacl r_ptr ; store rolling pointer rpt #016h ; wait long enough for this configuration nop ; of MCLK/CLKOUT1 rate ; now take CS high again lacl iosr_stat ; load acc with iosr status or #0001h ; set IO0 - CS high sacl temp ; out temp, IOSR; clrc intm ; re-enable interrupts ret ; return from interrupt .end TLV5614IYZ INTERFACED TO MCS®51 MICROCONTROLLER Hardware Interfacing Figure 18 shows an example of how to connect the TLV5614IYZ to an MCS51 Microcontroller. The serial DAC input data and external control signals are sent via I/O Port 3 of the controller. The serial data is sent on the RxD line, with the serial clock output on the TxD line. Port 3 bits 3, 4, and 5 are configured as outputs to provide the DAC latch update (LDAC), chip select (CS) and frame sync (FS) signals for the TLV5614IYZ. The active low power-down pin (PD) of the TLV5614IYZ is pulled high to ensure that the DACs are enabled. ® MCS 51 TLV5614IYZ RxD SDIN VDD PD TxD SCLK P3.3 LDAC P3.4 CS P3.4 FS VOUTA VOUTB REF REFINAB VOUTC REFINCD VOUTD VSS Figure 18. TLV5614IYZ Interfaced With MCS51 Software The example is the same as for the TMS320C203 in this data sheet, but adapted for a MCS51 controller. It generates a differential in-phase (sine) signal between the VOUTA and VOUTB pins, and its quadrature (cosine) signal is the differential signal between VOUTC and VOUTD. The on-chip timer is used to generate interrupts at a fixed frequency. The related interrupt service routine pulses LDAC low to update all four DACs simultaneously, then fetches and writes the next sample to all four DACs. The samples are stored as a look-up table, that describes one full period of a sine wave. Submit Documentation Feedback 17 TLV5614IYZ www.ti.com SBAS401 – DECEMBER 2006 The serial port of the controller is used in Mode 0, which transmits eight bits of data on RxD, accompanied by a synchronous clock on TxD. Two writes concatenated together are required to write a complete word to the TLV5614IYZ. The CS and FS signals are provided in the required fashion through control of IO port 3, which has bit-addressable outputs. Processor: 80C51 ; ; Description: ; ; This program generates a differential in-phase (sine) on (OUTA-OUTB) ; and its quadrature (cosine) as a differential signal on (OUTC-OUTD). ; ; © 1998, Texas Instruments Inc. ;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– NAME GENIQ MAIN SEGMENT CODE ISR SEGMENT CODE SINTBL SEGMENT CODE VAR1 SEGMENT DATA STACK SEGMENT IDATA ;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– ; Code start at address 0, jump to start ;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– CSEG AT 0 LJMP start ; Execution starts at address 0 on power-up. ;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– ; Code in the timer0 interrupt vector ;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– CSEG AT 0BH LJMP timer0isr ; Jump vector for timer 0 interrupt is 000Bh ;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– ; Global variables need space allocated ;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– RSEG VAR1 temp_ptr: DS 1 rolling_ptr: DS 1 ;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– ; Interrupt service routine for timer 0 interrupts ;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– RSEG ISR timer0isr: PUSH PSW PUSH ACC CLR INT1 ; pulse LDAC low SETB INT1 ; to latch all 4 previous values at the same time ; 1st thing done in timer isr => fixed period CLR T0 ; set CS low ; The signal to be output on each DAC is a sine function. One cycle of a sine wave is ; held in a table @ sinevals as 32 samples of msb, lsb pairs (64 bytes). ; We have ; one pointer which rolls round this table, rolling_ptr incrementing by ; 2 bytes (1 sample) on each interrupt (at the end of this routine). ; The DAC samples are read at an offset to this rolling pointer: ; DAC Function Offset from rolling_ptr ; A sine 0 ; B inverse sine 32 ; C cosine 16 ; D inverse cosine48 MOV DPTR,#sinevals; set DPTR to the start of the table of sine signal values MOV R7,rolling_ptr; R7 holds the pointer into the sine table MOV A,R7 ; get DAC A msb MOVC A,@A+DPTR ; msb of DAC A is in the ACC CLR T1 ; transmit it - set FS low MOV SBUF,A ; send it out the serial port INC R7 ; increment the pointer in R7 MOV A,R7 ; to get the next byte from the table MOVC A,@A+DPTR ; which is the lsb of this sample, now in ACC A_MSB_TX: JNB TI,A_MSB_TX ; wait for transmit to complete CLR TI ; clear for new transmit 18 Submit Documentation Feedback TLV5614IYZ www.ti.com SBAS401 – DECEMBER 2006 MOV SBUF,A ; and send out the lsb of DAC A ; DAC C next ; DAC C codes should be taken from 16 bytes (8 samples) further on ; in the sine table - this gives a cosine function MOV A,R7 ; pointer in R7 ADD A,#0FH ; add 15 - already done one INC ANL A,#03FH ; wrap back round to 0 if > 64 MOV R7,A ; pointer back in R7 MOVC A,@A+DPTR ; get DAC C msb from the table ORL A,#01H ; set control bits to DAC C address A_LSB_TX: JNB TI,A_LSB_TX ; wait for DAC A lsb transmit to complete SETB T1 ; toggle FS CLR T1 CLR TI ; clear for new transmit MOV SBUF,A ; and send out the msb of DAC C INC R7 ; increment the pointer in R7 MOV A,R7 ; to get the next byte from the table MOVC A,@A+DPTR ; which is the lsb of this sample, now in ACC C_MSB_TX: JNB TI,C_MSB_TX ; wait for transmit to complete CLR TI ; clear for new transmit MOV SBUF,A ; and send out the lsb of DAC C ; DAC B next ; DAC B codes should be taken from 16 bytes (8 samples) further on ; in the sine table - this gives an inverted sine function MOV A,R7 ; pointer in R7 ADD A,#0FH ; add 15 - already done one INC ANL A,#03FH ; wrap back round to 0 if > 64 MOV R7,A ; pointer back in R7 MOVC A,@A+DPTR ; get DAC B msb from the table ORL A,#02H ; set control bits to DAC B address C_LSB_TX: JNB TI,C_LSB_TX ; wait for DAC C lsb transmit to complete SETB T1 ; toggle FS CLR T1 CLR TI ; clear for new transmit MOV SBUF,A ; and send out the msb of DAC B ; get DAC B LSB INC R7 ; increment the pointer in R7 MOV A,R7 ; to get the next byte from the table MOVC A,@A+DPTR ; which is the lsb of this sample, now in ACC B_MSB_TX: JNB TI,B_MSB_TX ; wait for transmit to complete CLR TI ; clear for new transmit MOV SBUF,A ; and send out the lsb of DAC B ; DAC D next ; DAC D codes should be taken from 16 bytes (8 samples) further on ; in the sine table - this gives an inverted cosine function MOV A,R7 ; pointer in R7 ADD A,#0FH ; add 15 - already done one INC ANL A,#03FH ; wrap back round to 0 if > 64 MOV R7,A ; pointer back in R7 MOVC A,@A+DPTR ; get DAC D msb from the table ORL A,#03H ; set control bits to DAC D address B_LSB_TX: JNB TI,B_LSB_TX ; wait for DAC B lsb transmit to complete SETB T1 ; toggle FS CLR T1 CLR TI ; clear for new transmit MOV SBUF,A ; and send out the msb of DAC D INC R7 ; increment the pointer in R7 MOV A,R7 ; to get the next byte from the table MOVC A,@A+DPTR ; which is the lsb of this sample, now in ACC D_MSB_TX: JNB TI,D_MSB_TX ; wait for transmit to complete CLR TI ; clear for new transmit MOV SBUF,A ; and send out the lsb of DAC D ; increment the rolling pointer to point to the next sample ; ready for the next interrupt MOV A,rolling_ptr ADD A,#02H ; add 2 to the rolling pointer Submit Documentation Feedback 19 TLV5614IYZ www.ti.com SBAS401 – DECEMBER 2006 ANL A,#03FH ; wrap back round to 0 if > 64 MOV rolling_ptr,A ; store in memory again D_LSB_TX: JNB TI,D_LSB_TX ; wait for DAC D lsb transmit to complete CLR TI ; clear for next transmit SETB T1 ; FS high SETB T0 ; CS high POP ACC POP PSW RETI ;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– ; Stack needs definition ;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– RSEG STACK DS 10h ; 16 Byte Stack! ;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– ; Main program code ;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– RSEG MAIN start: MOV SP,#STACK–1 ; first set Stack Pointer CLR A MOV SCON,A ; set serial port 0 to mode 0 MOV TMOD,#02H ; set timer 0 to mode 2 - auto-reload MOV TH0,#038H ; set TH0 for 5kHs interrupts SETB INT1 ; set LDAC = 1 SETB T1 ; set FS = 1 SETB T0 ; set CS = 1 SETB ET0 ; enable timer 0 interrupts SETB EA ; enable all interrupts MOV rolling_ptr,A ; set rolling pointer to 0 SETB TR0 ; start timer 0 always: SJMP always ; while(1) ! RET ;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– ; Table of 32 sine wave samples used as DAC data ;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– RSEG SINTBL sinevals: DW 01000H DW 0903EH DW 05097H DW 0305CH DW 0B086H DW 070CAH DW 0F0E0H DW 0F06EH DW 0F039H DW 0F06EH DW 0F0E0H DW 070CAH DW 0B086H DW 0305CH DW 05097H DW 0903EH DW 01000H DW 06021H DW 0A0E8H DW 0C063H DW 040F9H DW 080B5H DW 0009FH DW 00051H DW 00026H DW 00051H DW 0009FH DW 080B5H DW 040F9H DW 0C063H DW 0A0E8H DW 06021H 20 Submit Documentation Feedback TLV5614IYZ www.ti.com SBAS401 – DECEMBER 2006 USING THE TLV5614IYZ WAFER CHIP-SCALE PACKAGE (WCSP) TLV5614 qualifications are done using a wire-bonded small outline (SO) package. The qualifications include: steady state life, thermal shock, ESD, latch-up, biased HAST, autoclave, and characterization. These qualified devices are orderable as TLV5614IDW. NOTE: The wafer chip-scale package (WCSP) for the TLV5614IYZ uses the same die as TLV5614IDW, but is not qualified. WCSP qualification, including board level reliability (BLR), is the responsibility of the customer. It is recommended that underfill be used for increased reliability. BLR is application-dependent, but may include tests such as: temperature cycling, drop test, key push, bend, vibration, and package shear. For general guidelines on board assembly of the WCSP, the following documentation provides more details: • • Application Report NanoStar™ & NanoFree™ 300µm Solder Bump WCSP Application—SBVA017 Design Summary WCSP Little Logic—SCET007B NOTE: The use of underfill is required and greatly reduces the risk of thermal mismatch fails. Underfill is an epoxy/adhesive that may be added during the board assembly process to improve board level/system level reliability. The process of underfilling is to dispense the epoxy under the device after die attach reflow. The epoxy adheres to the body of the device and to the printed circuit board (PCB). It reduces stress placed upon the solder joints as a result of the thermal coefficient of expansion (TCE) mismatch between the board and the component. Underfill material typically consists of silica or other fillers to increase modulus of an epoxy, reduce creep sensitivity, and decrease the material TCE. The recommendation for peak flow temperatures of +220°C to +230°C is based on general empirical results that indicate that this temperature range is needed to facilitate good wetting of the solder bump to the substrate or PCB. Lower peak temperatures may cause nonwets (cold solder joints). Bottom View Top View NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. Figure 19. TLV5614IYZ Bumped Die Package Submit Documentation Feedback 21 PACKAGE OPTION ADDENDUM www.ti.com 21-Aug-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) TLV5614IYZR ACTIVE DSBGA YZ 16 3000 Green (RoHS & no Sb/Br) SNAGCU Level-NC-NC-UNLIM TLV5614IYZT ACTIVE DSBGA YZ 16 250 Green (RoHS & no Sb/Br) SNAGCU N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 21-Aug-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) TLV5614IYZR DSBGA YZ 16 3000 180.0 8.4 TLV5614IYZT DSBGA YZ 16 250 180.0 8.4 Pack Materials-Page 1 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 2.15 3.1 0.95 4.0 8.0 Q2 2.15 3.1 0.95 4.0 8.0 Q2 PACKAGE MATERIALS INFORMATION www.ti.com 21-Aug-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLV5614IYZR DSBGA YZ 16 3000 220.0 220.0 34.0 TLV5614IYZT DSBGA YZ 16 250 220.0 220.0 34.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. 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