RF3396 0 GENERAL PURPOSE AMPLIFIER Typical Applications • Basestation Applications • Driver Stage for Power Amplifiers • Broadband, Low-Noise Gain Blocks • Final PA for Low-Power Applications • IF or RF Buffer Amplifiers • High Reliability Applications Product Description 0.05 C The RF3396 is a general purpose, low-cost RF amplifier IC. The device is manufactured on an advanced Gallium Arsenide Heterojunction Bipolar Transistor (HBT) process, and has been designed for use as an easily-cascadable 50Ω gain block. Applications include IF and RF amplification in wireless voice and data communication products operating in frequency bands up to 6000MHz. The device is self-contained with 50Ω input and output impedances and requires only two external DC-biasing elements to operate as specified. The device is designed for cost effective high reliability in a plastic package. The 3mmx3mm footprint is compatible with standard ceramic and plastic Micro-X packages. 2 PLCS 0.10 C A 3.00 -A- 2 PLCS 0.10 C B 3 3.00 12° MAX 0.10 C B 2 PLCS 0.10 C A 2 PLCS -B- 2.75 SQ 9 GaAs HBT GaAs MESFET Si Bi-CMOS SiGe HBT Si CMOS InGaP/HBT GaN HEMT SiGe Bi-CMOS -C- Dimensions in mm. 0.60 0.24 TYP SEATING PLANE 0.10 M C A B Shaded lead is pin 1. 0.35 0.30 PIN 1 ID R0.20 1.90 1.60 0.375 0.275 Si BJT 0.05 0.00 1 0.45 0.35 Optimum Technology Matching® Applied 0.90 0.85 0.20 REF. 1.15 0.85 0.65 Package Style: QFN, 12-Pin, 3x3 Features • DC to >6000MHz Operation • Internally Matched Input and Output GND GND GND • 22dB Small Signal Gain • +2.0dB Noise Figure 12 11 10 • +11.5dBm Output P1dB NC 1 9 NC RF IN 2 8 RF OUT 4 5 6 GND GND 7 NC GND NC 3 Functional Block Diagram Rev A6 040224 • Footprint Compatible with Micro-X Ordering Information RF3396 RF3396 PCBA General Purpose Amplifier Fully Assembled Evaluation Board RF Micro Devices, Inc. 7628 Thorndike Road Greensboro, NC 27409, USA Tel (336) 664 1233 Fax (336) 664 0454 http://www.rfmd.com 4-599 RF3396 Absolute Maximum Ratings Parameter Input RF Power Operating Ambient Temperature Storage Temperature ICC Parameter Rating Unit +3 -40 to +85 -60 to +150 40 dBm °C °C mA Specification Min. Typ. Max. Caution! ESD sensitive device. RF Micro Devices believes the furnished information is correct and accurate at the time of this printing. However, RF Micro Devices reserves the right to make changes to its products without notice. RF Micro Devices does not assume responsibility for the use of the described product(s). Unit T=25 °C, ICC =35mA (See Note 1.) Overall Frequency Range 3dB Bandwidth Gain 21.0 20.2 17.8 Noise Figure Input VSWR Output VSWR Output IP3 Output P1dB Reverse Isolation +21.5 +22.0 +9.5 +9.5 DC to >6000 2 22.7 22.2 19.8 17.4 16.0 12.9 2.0 <1.9:1 <1.9:1 <1.4:1 +23.5 +24.0 +11.5 +11.5 22.5 24.2 21.8 MHz GHz dB dB dB dB dB dBm dBm dBm dBm dB Thermal ThetaJC Maximum Measured Junction Temperature at DC Bias Conditions Mean Time To Failures Condition 335 122 °C/W °C 17,635 years Freq=500MHz Freq=850MHz Freq=2000MHz Freq=3000MHz Freq=4000MHz Freq=6000MHz Freq=2000MHz In a 50Ω system, DC to 6000MHz In a 50Ω system, DC to 3000MHz In a 50Ω system, 3000MHz to 6000MHz Freq=850MHz Freq=2000MHz Freq=850MHz Freq=2000MHz Freq=2000MHz ICC =35mA, PDISS =110mW. (See Note 3.) TAMB =+85°C TAMB =+85°C With 22Ω bias resistor Device Operating Voltage 3.3 3.4 3.5 V At pin 8 with ICC =35mA 3.9 4.2 4.5 v At evaluation board connector, ICC =35mA Operating Current 35 40 mA See Note 2. Note 1: All specification and characterization data has been gathered on standard FR-4 evaluation boards. These evaluation boards are not optimized for frequencies above 2.5GHz. Performance above 2.5GHz may improve if a high performance PCB is used. Note 2: The RF3396 must be operated at or below 40mA in order to achieve the thermal performance listed above. While the RF3396 may be operated at higher bias currents, 35mA is the recommended bias to ensure the highest possible reliability and electrical performance. Note 3: Because of process variations from part to part, the current resulting from a fixed bias voltage will vary. As a result, caution should be used in designing fixed voltage bias circuits to ensure the worst case bias current does not exceed 40mA over all intended operating conditions. Power Supply 4-600 Rev A6 040224 RF3396 Pin 1 2 Function NC RF IN 3 4 5 6 7 8 NC GND GND GND NC RF OUT Description Interface Schematic No internal connections. It is not necessary to ground this pin. RF input pin. This pin is NOT internally DC blocked. A DC blocking capacitor, suitable for the frequency of operation, should be used in most applications. DC coupling of the input is not allowed, because this will override the internal feedback loop and cause temperature instability. No internal connections. It is not necessary to ground this pin. Ground connection. Ground connection. Ground connection. No internal connections. It is not necessary to ground this pin. RF output and bias pin. Biasing is accomplished with an external series resistor and choke inductor to VCC. The resistor is selected to set the DC current into this pin to a desired level. The resistor value is determined by the following equation: ( V SUPPLY – V DEVICE ) R = ------------------------------------------------------I CC 9 10 11 12 Die Flag NC GND GND GND GND Rev A6 040224 RF OUT RF IN Care should also be taken in the resistor selection to ensure that the current into the part never exceeds 40mA over the planned operating temperature. This means that a resistor between the supply and this pin is always required, even if a supply near 3.4V is available, to provide DC feedback to prevent thermal runaway. Because DC is present on this pin, a DC blocking capacitor, suitable for the frequency of operation, should be used in most applications. The supply side of the bias network should also be well bypassed. No internal connections. It is not necessary to ground this pin. Ground connection. Ground connection. Ground connection. Ground connection. To ensure best performance, avoid placing ground vias directly beneath the part. 4-601 RF3396 Application Schematic VCC 10 nF 22 pF 47 nH 12 11 10 1 9 2 8 22 pF RF IN RBIAS RF OUT 22 pF 3 7 4 5 6 Evaluation Board Schematic (Download Bill of Materials from www.rfmd.com.) P1 P1-1 P1-3 1 VCC 2 GND 3 NC VCC P1-1 CON3 12 J1 RF IN 50 Ω µstrip C1 100 pF 11 10 1 9 2 8 3 7 4 5 R1 22 Ω C3 100 pF L1 100 nH C2 100 pF C4 1 µF 50 Ω µstrip J2 RF OUT 6 NOTE: Evaluation board optimized for frequencies above 300 MHz and below 2.5 GHz. For operation below 300 MHz the value of inductor L1 and capcitors C1 and C2 should be increased. 4-602 Rev A6 040224 RF3396 Evaluation Board Layout Board Size 1.195" x 1.000" Board Thickness 0.033”, Board Material FR-4 Note: A small amount of ground inductance is required to achieve datasheet performance. The necessary inductance may be generated by ensuring that no ground vias are placed directly below the footprint of the part. Overlay of Suggested Micro-X and 3mmx3mm Layouts Showing Compatibility Rev A6 040224 4-603 RF3396 Gain versus Frequency Across Temperature Output P1dB versus Frequency Across Temperature ICC=35mA 24.0 ICC=35mA 14.0 -40°C +25°C 22.0 12.0 +85°C 10.0 Output P1dB (dBm) Gain (dB) 20.0 18.0 16.0 8.0 6.0 14.0 4.0 12.0 2.0 10.0 0.0 -40°C +25°C +85°C 100.0 1100.0 2100.0 3100.0 4100.0 5100.0 6100.0 100.0 600.0 1100.0 1600.0 2100.0 2600.0 3100.0 3600.0 4100.0 Frequency (MHz) Frequency (MHz) Output IP3 versus Frequency Across Temperature Noise Figure versus Frequency Across Temperature ICC=35mA 28.0 ICC=35mA 5.0 -40°C 26.0 +25°C 4.5 +85°C 24.0 4.0 Noise Figure (dB) OIP3 (dBm) 22.0 20.0 18.0 16.0 3.5 3.0 2.5 2.0 14.0 -40°C +25°C 12.0 1.5 +85°C 10.0 1.0 100.0 600.0 1100.0 1600.0 2100.0 2600.0 3100.0 3600.0 100.0 4100.0 600.0 1100.0 1600.0 2100.0 Input VSWR versus Frequency Across Temperature Output VSWR versus Frequency Across Temperature ICC=35mA ICC=35mA 5.0 -40°C -40°C +25°C 4.5 +25°C 4.5 +85°C +85°C 4.0 4.0 3.5 3.5 VSWR VSWR 3100.0 Frequency (MHz) 5.0 3.0 3.0 2.5 2.5 2.0 2.0 1.5 1.5 1.0 100.0 1.0 1100.0 2100.0 3100.0 4100.0 Frequency (MHz) 4-604 2600.0 Frequency (MHz) 5100.0 6100.0 100.0 1100.0 2100.0 3100.0 4100.0 5100.0 6100.0 Frequency (MHz) Rev A6 040224 RF3396 Reverse Isolation versus Frequency Across Temperature ICC=35mA Current versus Voltage 27.0 (At Evaluation Board Connector, RBIAS=22Ω) 60.0 -40°C +25°C 50.0 +85°C 23.0 40.0 ICC (mA) Reverse Isolation (dB) 25.0 21.0 30.0 19.0 20.0 17.0 10.0 -40°C +25°C +85°C 15.0 0.0 100.0 1100.0 2100.0 3100.0 4100.0 5100.0 6100.0 3.5 3.7 3.9 4.1 Frequency (MHz) Current versus Voltage 4.5 4.7 Power Dissipated versus Voltage at Pin 8 (At Pin 8 of the RF3396) 55.00 0.140 50.00 0.130 45.00 (TAMB=+85°C) Power Dissipated (W) 0.120 40.00 ICC (mA) 4.3 VCC (V) 35.00 30.00 25.00 0.110 0.100 0.090 0.080 20.00 -40°C +25°C +85°C Vcc=4.2V 15.00 0.070 10.00 0.060 3.20 3.25 3.30 3.35 3.40 3.45 3.50 3.55 3.60 3.65 VPIN (V) 3.195 3.200 3.205 3.210 3.215 3.220 3.225 3.230 3.235 VPIN (V) Junction Temperature versus Power Dissipated (TAMB=+85°C) 135.00 Junction Temperature (°C) 130.00 125.00 120.00 115.00 110.00 105.00 0.07 0.08 0.09 0.10 0.11 0.12 0.13 Power Dissipated (Watts) Rev A6 040224 4-605 RF3396 PCB Design Requirements PCB Surface Finish The PCB surface finish used for RFMD’s qualification process is Electroless Nickel, immersion Gold. Typical thickness is 3µinch to 8µinch Gold over 180µinch Nickel. PCB Land Pattern Recommendation PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and tested for optimized assembly at RFMD; however, it may require some modifications to address company specific assembly processes. The PCB land pattern has been developed to accommodate lead and package tolerances. PCB Metal Land Mask Pattern A = 0.59 x 0.32 (mm) Typ. 0.80 (mm) Typ. 1.00 (mm) 0.40 (mm) Typ. 0.70 (mm) 1.00 (mm) Typ. Typ. Pin 1 3.20 (mm) Typ. 0.65 (mm) Typ. A A A A A A 2.20 (mm) Typ. 0.95 (mm) Typ. 0.30 (mm) Typ. 0.65 (mm) Typ. 1.30 (mm) Typ. 2.60 (mm) Figure 1. PCB Metal Land Pattern (Top View) 4-606 Rev A6 040224 RF3396 PCB Solder Mask Pattern Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the PCB metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all pads. The center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask clearance can be provided in the master data or requested from the PCB fabrication supplier. A = 0.72 x 0.45 (mm) Typ. 0.72 (mm) Typ. 1.15 (mm) 0.41 (mm) Typ. 0.75 (mm) Typ. 1.05 (mm) Typ. Pin 1 3.32 (mm) Typ. 0.65 (mm) Typ. A A A A A A 2.27 (mm) Typ. 1.01 (mm) Typ. 0.45 (mm) Typ. 0.65 (mm) Typ. 1.30 (mm) Typ. 2.60 (mm) Figure 2. PCB Solder Mask (Top View) Thermal Pad and Via Design The PCB metal land pattern has been designed with a thermal pad that matches the exposed die paddle size on the bottom of the device. Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been designed to address thermal, power dissipation and electrical requirements of the device as well as accommodating routing strategies. The via pattern used for the RFMD qualification is based on thru-hole vias with 0.203mm to 0.330mm finished hole size on a 0.5mm to 1.2mm grid pattern with 0.025mm plating on via walls. If micro vias are used in a design, it is suggested that the quantity of vias be increased by a 4:1 ratio to achieve similar results. NOTE: A small amount of ground inductance is required to achieve data sheet performance. The necessary inductance may be generated by ensuring that no ground vias are placed directly below the footprint of the part. Rev A6 040224 4-607 RF3396 4-608 Rev A6 040224