Complies with Directive 2002/95/EC (RoHS) Product Overview TXC102 is a highly integrated single chip, multi-channel, low power, high data rate programmable RF transmitter ideal for the worldwide market and operates in the 433, 868 and 915 MHz frequency bands. The TXC102 is FCC & ETSI certifiable and improves upon the TXC101 with improved phase noise and is capable of higher output power. All critical RF and baseband functions are completely integrated in the chip, thus minimizing external component count and simplifying design-ins. Its small size with low power consumption makes it ideal for various short range radio applications. 16-TSSOP package The TXC102 is a dual mode solution. In the Micro controller mode, a generic 10MHz crystal and a low-cost microcontroller are the only requirements to create a complete Transmitter link. In the EEPROM mode, the TXC102 can function as a complete data transmitter with any SPI compatible EEPROM and does not need a micro controller. This makes it an ideal solution for a variety of simple short range radio applications. Popular applications Key Features • • • • • • • • • Modulation: OOK/FSK Frequency Hopping Spread Spectrum capability Operating frequency: 433/868/915 MHz Low current consumption (TX current @ 0dBm ~ 13mA) Wide Operating supply voltage: 2.2 to 5.4V Low standby current (0.2uA) OOK Data rate up to 512kbps FSK Data rate up to 256kbps Support for Multiple Channels • • • • • • • • • • • • • • • • • • • [433 Band]: 380 Channels (25kHz), [868 Band]: 761 Channels (25kHz) [915 Band]: 1040 Channels (25kHz) Generic 10MHz Xtal reference Processor or EEPROM Mode Operation Integrated PLL, IF & Baseband Circuitry Integrated, Programmable Low Battery Voltage Detector Programmable Push Button Control Programmable Output RF Power Programmable, Positive/Negative FSK Deviation Programmable Clock Output Frequency Standard SPI interface External Wake-up Events TTL/CMOS Compatible I/O pins Automatic Antenna tuning circuit No Manual Adjustment Needed for Production Very few external components requirement Small size plastic package: 16-pin TSSOP Standard 13 inch Reel, 2000 pieces. • • • • • • • • • • • • • • • Remote control applications Remote control applications Active RFID tags Wireless PC Peripherals Automated Meter reading Home & Industrial Automation Security systems Remote keyless entry Automobile Immobilizers Sports & Performance monitoring Wireless Toys Medical equipment Low power two way telemetry systems Wireless mesh sensors Wireless modules RF Monolithics, Inc. 4441 Sigma Road Dallas, Texas 75244 rev01 (800) 704-6079 toll-free in U.S. and Canada www.rfm.com Email: [email protected] 1 Table of Contents Table of Contents .......................................................................................................... 2 1.0 Pin Descriptions ...................................................................................................... 3 1.1 Processor Mode Pin Configuration .................................................................. 3 1.2 EEPROM Mode Pin Configuration .................................................................... 4 2.0 Functional Description ........................................................................................... 5 2.1 TXC102 Processor Mode Application .............................................................. 5 RF Transmitter Matching ..................................................................................... 5 Antenna Design Considerations........................................................................... 6 PCB Layout Considerations ................................................................................. 6 2.2 EEPROM Mode Application............................................................................... 8 3.0 TXC102 Functional Characteristics ..................................................................... 11 Output Amplifier ....................................................................................................... 11 Frequency Control (PLL) and Frequency Synthesizer ............................................. 11 Transmit Register..................................................................................................... 11 Crystal Oscillator...................................................................................................... 12 Wake-Up Mode ........................................................................................................ 12 Low Battery Detector ............................................................................................... 12 Key Switch Inputs .................................................................................................... 12 SPI Interface ............................................................................................................ 13 4.0 Control and Configuration Registers .................................................................. 14 Table of Control and Configuration Registers .......................................................... 14 Status Register ........................................................................................................ 15 Configuration Register [POR=8080h] ...................................................................... 16 Transmit Power Configuration Register [POR=B0h] ................................................ 18 Transmit Command Register ................................................................................... 19 Frequency Setting Register [POR=A7D0h].............................................................. 20 Data Rate Setup Register [POR=C800h]................................................................. 21 Button Command Register [POR=CA00h] ............................................................... 22 Sleep/Clock Command Register [POR=C400h]....................................................... 23 Wake-up Timer Period Register [POR=E000h]........................................................ 24 Battery Detect Threshold Register [POR=C200h].................................................... 25 Power Management Register [POR=C000h] ........................................................... 26 5.0 Maximum Ratings.................................................................................................. 27 Recommended Operating Ratings........................................................................... 27 6.0 DC Electrical Characteristics ............................................................................... 27 7.0 AC Electrical Characteristics ............................................................................... 28 8.0 Package Information ............................................................................................. 30 2 1.0 Pin Description Processor Mode Pin 1 2 Name SDI SCK 3 nCS 4 5 6 7 8 SW1 SW2 SW3 SW4 ClkOut 9 Xtal/Ref 10 11 12 13 14 15 16 GND MODE RF_P RF_N nIRQ VDD MOD Description SPI Data In SPI Data Clock Chip Select Input– Selects the chip for an SPI data transaction. The pin must be pulled ‘low’ for a 16-bit read or write function. See Figure 4 for timing specifications. Switch or Push Button Input 1 with Internal pull-up resistor Switch or Push Button Input 2 with Internal pull-up resistor Switch or Push Button Input 3 with Internal pull-up resistor Switch or Push Button Input 4 with Internal pull-up resistor Optional host processor Clock Output Xtal - Connects to a 10MHz series crystal or an external oscillator reference. The circuit contains an integrated load capacitor (See Configuration Register) in order to minimize the external component count. The crystal is used as the reference for the PLL, which generates the local oscillator frequency. The accuracy requirements for production tolerance, temperature drift and aging can be determined from the maximum allowable local oscillator frequency error. Whenever a low frequency error is essential for the application, it is possible to “pull” the crystal to the accurate frequency by changing the load capacitor value. Ext Ref – An external reference, such as an oscillator, may be connected as a reference source. Connect through a .01uF capacitor. System Ground Mode Select – Connect to VDD for Processor Mode. RF Diff I/O RF Diff I/O Interrupt Request – Interrupt Request Output and Status Register Data Read Output. Supply Voltage Modulation Input – Serial data input for FSK or OOK modulation 1.1 Processor Mode Pin Configuration TOP VIEW SDI SCK nCS SW1 SW2 SW3 SW4 CLKOUT 1 2 16 15 3 4 14 13 5 TXC102 12 6 11 7 8 10 9 MOD VDD nIRQ RF_N RF_P MODE GND Xtal/Ref 3 EEPROM Mode Pin 1 2 Name SDI SCK 3 nCS 4 5 6 7 8 SW1 SW2 SW3 SW4 SDO 9 Xtal/Ref 10 11 12 13 GND MODE RF_P RF_N 14 nBD 15 16 VDD MOD Description SPI Data In SPI Data Clock Chip Select Input - Selects the chip for an SPI data transaction. The pin must be pulled ‘low’ for a 16-bit read or write function. See Figure 4 for timing specifications. Switch or Push Button Input 1 with Internal pull-up resistor Switch or Push Button Input 2 with Internal pull-up resistor Switch or Push Button Input 3 with Internal pull-up resistor Switch or Push Button Input 4 with Internal pull-up resistor SPI Data Out Xtal - Connects to a 10MHz series crystal or an external oscillator reference. The circuit contains an integrated load capacitor (See Configuration Register) in order to minimize the external component count. The crystal is used as the reference for the PLL, which generates the local oscillator frequency. The accuracy requirements for production tolerance, temperature drift and aging can be determined from the maximum allowable local oscillator frequency error. Whenever a low frequency error is essential for the application, it is possible to “pull” the crystal to the accurate frequency by changing the load capacitor value. Ext Ref – An external reference, such as an oscillator, may be connected as a reference source. Connect through a .01uF capacitor. System Ground Mode Select – Connect to VSS for EEPROM Mode. RF Diff I/O RF Diff I/O Low Battery Detect – When the battery voltage falls below the programmed level this output goes “low”. The voltage level is programmable through the Battery Detect Threshold Register. Supply Voltage Not used. Tie to VDD or VSS 1.2 EEPROM Mode Pin Configuration TOP VIEW SDI SCK nCS SW1 SW2 SW3 SW4 SDO 1 2 16 3 4 14 5 15 TXC102 13 12 6 11 7 8 10 9 NC VDD nBD RF_N RF_P MODE GND Xtal/Ref 4 2.0 Functional Description The TXC102 is a low power, frequency agile, multi-channel OOK/FSK transmitter for use in the 433, 868, and 916 MHz bands. All RF transmit functions are completely integrated requiring only a single 10MHz crystal as a reference source. The TXC102 has two modes of operation: EEPROM mode and Processor mode. EEPROM mode is fully compatible with any standard SPI interface EEPROM. Functions include: • PLL synthesizer • Power Amp • Crystal oscillator • Sleep Timer • OOK/FSK Modulation • 4 Key/Switch Functions The TXC102 is ideal for Frequency Hopping Spread Spectrum (FHSS) applications requiring frequency agility to meet FCC and ETSI requirements. Use of a low-cost microcontroller or SPI compatible EEPROM is all that is needed to create a complete transmitter. The TXC102 also incorporates different sleep modes to reduce overall current consumption and extend transmitter battery life. It is ideal for applications operating from typical lithium coin cells. 2.1 TXC102 Processor Mode Application Circuit Figure 1. Typical Processor Mode 50 Ohm Load Application Circuit The TXC102 may be used with a typical low-cost microcontroller. All internal functions are accessible through the SPI interface. Figure 1 shows a typical 50 Ohm load connection for using a microcontroller to control the TXC102 functions. RF Transmitter Matching The RF pins are high impedance and differential. The optimum differential load for the RF port at a given frequency band is shown in Table 1. 433 MHz 868 MHz 916 MHz Admittance [S] 1.3e-3 – j6.3e-3 1.35e-3 - j1.2e-2 1.45e-3 - j1.3e-2 TABLE 1. Impedance [Ohm] 31 + j152 9 + j82 8.7 + j77 Lantenna (nH) 58 15.2 13.6 5 These values are what the RF port pins want to “see” as an antenna load for maximum power transfer. Antennas ideally suited for this would be a Dipole, Folded Dipole, and Loop. For all transmit antenna applications, a bias or “choke” inductor must be included since the RF outputs are open-collector type. The TXC102 may also drive a single ended 50 Ohm load, such as a monopole antenna, using the matching circuit as shown in Figure 1. Use of a balun would provide an optimum power transfer, but the matching circuit of Figure 1 has been optimized for use with discrete components, reducing the cost associated with use of a balun. The matching component values for a 50 Ohm load are given in Table 2. Ref Des C1 C2 L1 L2 L3 Table 2. 433 868 5.1pF 2.7pF 2.7pF 1.2pF 33nH 8.2nH 390nH 100nH 47nH 22nH 916 2.7pF 1.2pF 8.2nH 100nH 22nH Antenna Design Considerations The TXC102 was designed to drive a differential output such as a Dipole or a Loop antenna. A loop antenna is recommended for applications where size is critical. The dipole is typically not an attractive option for compact designs based on its inherent size at resonance and distance needed away from a ground plane to be an efficient radiating antenna. A monopole is possible with addition of a balun or using the matching circuit in Figure 1. PCB Layout Considerations PCB layout is very critical. For optimal transmit and receive performance, the trace lengths at the RF pins must be kept as short as possible. Using small, surface mount components, like 0402, will yield the best performance and also keep the RF port compact. It is recommended that all RF connections are made short and direct. A good rule of thumb to adhere to is to add 1nH of series inductance to the path for every 0.1” of trace length. The crystal oscillator is also affected by additional trace length as it adds parasitic capacitance to the overall load of the crystal. To minimize this effect the crystal must be placed as close as possible to the chip and all connections must be made short and direct. This will minimize the effects of “frequency pulling” , that stray capacitance may introduce and allow the internal load capacitance of the chip to be more effective in properly loading the crystal oscillator circuit. When an external processor is used, the TXC102 provides an on-chip clock. Even though this is an integrated function, long runs of the clock signal may radiate and cause interference. This can degrade receiver performance as well as add harmonics or unwanted modulation to the transmitter. Keep clock connections as short as possible and surround the clock trace with an adjacent ground plane pour where needed. This will help in reducing any radiation or crosstalk due to long runs of the clock signal. Good power supply bypassing is also essential. Large decoupling capacitors should be placed at the point where power is applied to the PCB. Smaller value decoupling capacitors should then be placed at each power point of the chip as well as bias nodes for the RF port. Poor bypassing lends itself to conducted interference which can cause noise and spurious signals to couple into the RF sections, thus significantly reducing performance. 6 Top Bottom Top Assembly 7 2.2 EEPROM Mode Figure 2. Typical EEPROM Mode 50 Ohm Load Application Circuit The TXC102 can operate from a single, SPI compatible EEPROM by simply reading the sequential codes stored in memory. No external microcontroller is required. The codes are read out and processed as command and data. In this special mode, four pins are configured as inputs with an internal pull-up resistor. All that is needed are external key switches connected to GND to activate that key’s code routine. When the key is pressed, the chip automatically begins executing code from a designated point within the EEPROM. When not in use, the last command of the code execution should be a sleep command so as to power down the device for maximum battery life. When the device is put into sleep one of the following seven (7) events can cause the device to wake up: • Power-on Reset • Low pulse on Key 1 • Low pulse on Key 2 • Low pulse on Key 3 • Low pulse on Key 4 • Low supply voltage output warning • Wake-up timer timeout For each wake-up event there is an internal address assigned as the starting point in EEPROM memory to begin executing code. These are defined in TABLE 3 as follows: TABLE 3. Wake-up Event Power up Low Pulse on SW1 Low Pulse on SW2 Low Pulse on SW3 Low Pulse on SW4 LBD Warning Wake-up Timer Timeout EEPROM Address Entry 0000h 0080h 0100h 0180h 0200h 0280h 0300h 8 Another feature allows the use of two keys being pressed at the same time. For this, Bit7 in the Button Command Register controls whether SW4 is used as a single key press or SW1 and SW2 are used as simultaneous key presses. By setting Bit7 of the Button Command Register, the EEPROM Address Entry point of SW4 is used for simultaneous presses of SW1 and SW2. Clearing Bit7 sets the EEPROM to use SW4 as a single key press. It is also possible to detect multiple key presses and execute sequential routines. When multiple keys are pressed, all routines associated with the keys are executed in the same sequence of which the keys were pressed. When a key is pressed, the chip looks to see if there is a debounce time to recognize before sampling the pin again. At this time the oscillator is turned on, independent of the state of Bit 5 of the Power Management Register, because it uses the crystal oscillator signal as a timing reference. After the debounce time has expired, it begins execution of the code from the EEPROM address entry point. All sources used to transmit are internal when using EEPROM mode. All external pin functions, such as external FSK modulation, are disabled and the internal functions are used. During sleep mode, all internal configurations are maintained as long as power is not interrupted. If there is a supply interruption the chip reboots from the Power-up EEPROM Address Entry point and all configurations are re-written. Example EEPROM Hex Code Contents: Power-On Reset: 00000000 00000010 00000020 00000030 00000040 00000050 00000060 00000070 C0 00 00 00 00 00 00 00 C4 00 00 00 00 00 00 00 CA 00 00 00 00 00 00 00 1E 00 00 00 00 00 00 00 C8 00 00 00 00 00 00 00 23 00 00 00 00 00 00 00 C4 00 00 00 00 00 00 00 64 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 The example above configures the initial settings of the registers at power-up. Other parameters may be changed as needed when the chip recognizes a key press. The code ends in a sleep command C400h where 00h is the number of clocks to output before disabling the clock output pin. See Sleep/Clock Command Register. Address Command Data Related Register 00–01 C0 C4 02–03 CA 00 Button Command Single execution for all keys 04–05 C8 8F Data Rate BR=10M/29/(143+1)~2400 bps 06-07 C4 64 Sleep Power down after 100 clocks Power Management Description Crystal– Synthesizer – Power Amplifier auto on/off mode enable Example Code for Key Press 3: 00000180 00000190 000001A0 000001B0 000001C0 000001D0 000001E0 000001F0 88 AA AA AA AA AA AA 00 72 AA AA AA AA AA AA 00 A6 AA AA AA AA AA AA 00 10 AA AA AA AA AA AA 00 C6 AA AA AA AA AA AA 00 60 AA AA AA AA AA AA 00 AA AA AA AA AA AA C4 00 AA AA AA AA AA AA 64 00 AA AA AA AA AA AA 00 00 AA AA AA AA AA AA 00 00 AA AA AA AA AA AA 00 00 AA AA AA AA AA AA 00 00 AA AA AA AA AA AA 00 00 AA AA AA AA AA AA 00 00 AA AA AA AA AA AA 00 00 AA AA AA AA AA AA 00 00 9 In the above example, some commands are one nibble long. For purposes of writing to the EEPROM the data must be arranged in bytes. The chip automatically distinguishes between command and data. On power-up, the keys are configured as a single execution. Hence, after this routine is executed, the chip returns to sleep and wakes up on another key press. If the keys were configured as a continuous execution, at the end of the sleep command, the chip restarts at address 0180h and re-executes the routine until the key is released. Address 180–181 182–183 184–185 186–1B7 1B8–1B9 Command 8 A C6 C4 Data 872 610 32 50xAA 64 Related Register Configuration Control Frequency Data Transmit Sleep Remarks 433MHz band, FSK dev=90kHz, Crystal CL=12pF fc=(43+1552/4000)*10MHz Transmit the next 50 bytes Data Power down after 100 clocks 10 3.0 TXC102 Functional Characteristics CONTROL SDI SCK nCS LOGIC RF_P RF_N nIRQ/nBD SW1 PA VCO PLL OSC SW2 SW3 SW4 BATT DET /N MODE Wake-up CLKOUT/SDO XTAL/REF VDD GND MOD Figure 3. Functional Block Diagram Output Power Amplifier The power amplifier is an open-collector, differential output with programmable output power which can directly drive a loop or dipole antenna, and with proper matching may also drive a monopole antenna. Incorporated in the power amplifier is an automatic antenna tuning circuit to avoid manual tuning during production and to offset “hand effects”. Registers common to the Power Amplifier are: • Power Management Register • Transmit Power Configuration Register Phase Lock Loop (PLL) The PLL synthesizer is the heart of the operating frequency. An integrated LC oscillator gives the TXC102 superior performance over it TXC101 counterpart with lower phase noise. It is programmable and completely integrated, providing all functions required to generate the carriers and tunability for each band. The PLL requires only a single 10MHz crystal reference source. RF stability is controlled by choosing a crystal with the particular specifications to satisfy the application. The PLL is able to perform manual and automatic calibration to compensate for changes in temperature or operating voltage. When changing band frequencies, re-calibration must be performed. This can be done by disabling the synthesizer and re-enabling again through the Power Management Register. Registers common to the PLL are: • Power Management Register • Configuration Register • Frequency Setting Register • Automatic Frequency Adjust Register • Transmit Configuration Register Transmit Register The transmit register is configured as two 8-bit shift registers connected in series to form a single 16-bit shift register. On POR the registers are filled with the value AAh. This can be used to generate a preamble before sending actual data. When the transmitter is enabled through the Power Management Register, transmission begins immediately and the value in the transmit register begins to be sent out. If there is nothing written to the register, it will send out the default value of AAh. The next data byte can be loaded via the SPI bus to the Transmit Register by monitoring the SDO pin for a logic ‘1’ or waiting for an 11 interrupt from the nIRQ pin for an active low interrupt output from the nIRQ pin. After data has been loaded to the Transmit Register, the processor must wait for the next interrupt before disabling the transmitter – otherwise, the rest of the data left in the register will be lost. Inserting a dummy byte of all 0’s is recommended for the last byte of data loaded. Crystal Oscillator The TXC102 incorporates an internal crystal oscillator circuit that provides a 10MHz reference, as well as internal load capacitors. This significantly reduces the component count required. The internal load capacitance is programmable from 8.5pF to 16pF in 0.5pF steps. This has the advantage of accepting a wide range of crystals from many different manufacturers having different load capacitance requirements. Since the crystal is the PLL reference for the carrier, being able to vary the load capacitance also helps with fine tuning the final carrier frequency. An external clock signal is also provided that may be used to run an external processor. This also has the advantage of reducing component count by eliminating an additional crystal for the host processor. The clock frequency is also programmable from eight pre-defined frequencies, each a pre-scaled value of the 10MHz crystal reference. These values are programmable through the Battery Detect Threshold and Clock Output Register. The internal clock oscillator may be disabled, thus also disabling the output clock signal to the host processor. When the oscillator is disabled, the chip provides an additional 196 clock cycles before releasing the output, which may be used by the host processor to setup any functions before going to sleep. Wake-Up Mode The TXC102 has an internal wake-up timer that has very low current consumption (1.5uA typical) and may be programmed from 1msec to several days. A calibration is performed to the crystal at startup and every 30 sec thereafter, even if in sleep mode. If the oscillator circuit is disabled the calibration circuit will turn it on briefly to perform a calibration to maintain accurate timing and return to sleep. The TXC102 also incorporates other power saving modes aside from the wake-up timer. Return to active mode may be initiated from several external events: • Logic ‘0’ applied to nINT pin (16) • Low Supply Voltage Detect • FIFO Fill • SPI request If any of these wake-up events occur, including the wake-up timer, the TXC102 generates an external interrupt which may be used as a wake-up signal to a host processor. The source of the interrupt may be read out from the Status Register over the SPI bus. Low Battery Detect The integrated low battery detector monitors the voltage supply against a preprogrammed value and generates an interrupt when the supply voltage falls below the programmed value. The detector circuit has 50mV of hysteresis built in. Key Switch Inputs In microcontroller mode, the TXC102 generates an interrupt on the nIRQ pin when a key is pressed. The source of the interrupt may be determined by reading the Status Register. In EEPROM mode, each switch has an internal address assigned to it. It uses this address as the entry point to the EEPROM and executes commands after that address until it sees a sleep command (C400h). The chip has internal weak pull-up resistors so there is no need for additional components. These weak pull-ups may be disabled through the Button Command Register. For each mode the chip repeats this function while the key is pressed if configured by the Button Command Register. In the microcontroller mode, the chip continuously generates interrupts until the key is released. In the EEPROM mode, the chip continuously enters the EEPROM at the assigned address and executes the commands following the entry point as long as the key is active, if enabled through the Button Command Register. There are seven defined entry points for the EEPROM mode. The chip also has an integrated, programmable de-bounce circuit for each key. See Button Command Register for a detailed explanation. 12 SPI Interface The TXC102 is equipped with a standard SPI bus that is compatible to almost all SPI devices. All functions and status of the chip are accessible through the SPI bus. Typical SPI devices are configured for byte write operations. The TXC102 uses word writes and hence the nCS (Pin 3) should be pulled low for 16 bits. TABLE 4. Figure 4. Timing Diagram 13 4.0 Control and Configuration Registers Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit POR Value 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 STATUS X X X X X X X X 1 1 0 0 1 1 0 0 -- CAP1 CAP0 MODP DEV2 DEV1 DEV0 8080h OOKEN PWR2 PWR1 PWR0 XXB0h CONFIG 1 0 0 TX POWER CONFIG TX COMMAND X X X X X X X X 1 0 1 1 1 1 0 0 0 1 1 0 B7 B6 B5 B4 B3 B2 B1 B0 -- FREQ SET 1 0 1 0 Freq5 Freq4 Freq3 Freq2 Freq1 Freq0 A7D0h DATA RATE SET BUTTON CMD 1 1 0 0 1 0 0 0 BITR7 BITR6 BITR5 BITR4 BITR3 BITR2 BITR1 BITR0 C800h 1 1 0 0 1 0 1 0 2KPEN DB1 DB0 SW4 SW3 SW2 SW1 SLEEP/CLK CMD WAKE-UP PERIOD BATT DETECT 1 1 0 0 0 1 0 0 SLP6 SLP5 SLP4 SLP3 SLP2 SLP1 SLP0 C400h 1 1 1 R4 R3 R2 R1 R0 MUL7 MUL6 MUL5 MUL4 MUL3 MUL2 MUL1 MUL0 E000h 1 1 0 0 0 0 1 0 0 0 0 LBD4 LBD3 LBD2 LBD1 LBD0 C200h POWER MANAGEMENT 1 1 0 0 0 0 0 0 TX1 TX0 BAND1 BAND0 CLK2 CLK1 CLK0 CAP3 CAP2 Freq11 Freq10 Freq9 Freq8 Freq7 Freq6 SLP7 PUPDIS CA00h OSCEN SYNEN PAEN LBDEN WKUPEN CLKEN C000h Table 5. Control and Configuration Registers Table 14 Status Register (Read Only) Bit Bit Bit Bit Bit Bit Bit Bit 7 6 5 4 3 2 1 0 1 1 0 0 1 1 0 0 The Status Register provides feedback for: • POR • Interrupt Request state • Low Battery • Push Button event The Status Register requires only the Command Code to be sent. Status bits can be read out through the nIRQ pin (14). Clock pulses are continually sent and data is read out. When this command is issued it clears the last interrupt and starts processing the next pending interrupt. See Figure 5 for read sequence. nCS Figure 5. Status Register Read Through nIRQ pin (14) Bit [7..0]: Command Code: These bits are the command code that is sent serially to the processor that identifies the bits to be written to the Status Register. 15 Configuration Register [POR=8080h] Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 1 0 0 BAND1 BAND0 CLK2 CLK1 CLK0 CAP3 CAP2 CAP1 CAP0 MODP DEV2 DEV1 DEV0 The Configuration Register sets up the following: • Frequency Band in use • Crystal Load capacitance • TX Modulation Polarity • TX Modulation Bandwidth Bit [15..13] – Command Code: These bits are the command code that is sent serially to the processor that identifies the bits to be written to the configuration register. Bit [12..11] – Band Select: These bits set the frequency band to be used. There are four (4) bands that are supported. See Table 6 below for Band configuration. TABLE 6. Frequency Band BAND1 BAND0 433 868 916 0 1 1 1 0 1 Bit [10..8] – Clock Output Frequency: These bits set the output frequency of the on-board clock that may be used to run an external host processor. See Table 7 below. TABLE 7. Output Clock Frequency (MHz) 1 1.25 1.66 2 2.5 3.33 5 10 CLK2 CLK1 CLK0 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 Bit [7..4] – Load Capacitance Select: These bits set the load capacitance for the crystal reference. The internal load capacitance can be varied from 8.5pF to 16pF in 0.5pF steps to accommodate a wide range of crystal vendors and also to adjust the reference frequency and compensate for stray capacitance that may be introduced due to PCB layout. See Table 8 below for load capacitance configuration. TABLE 8. CAP3 0 0 0 0 1 1 CAP2 0 0 0 0 …… 1 1 CAP1 0 0 1 1 CAP0 0 1 0 1 1 1 0 1 Crystal Load Capacitance 8.5 9 9.5 10 …… 15.5 16 Bit [3] - Modulation Polarity: When clear, a logic ‘0’ is defined as the lower channel frequency and a logic ‘1’ as the higher channel frequency (positive deviation). When set, a logic ‘0’ is defined as the higher channel frequency and a logic ‘1’ as the lower channel frequency (negative deviation). 16 Configuration Register – continued Bit [2..0] - Modulation Bandwidth: These bits set the FSK frequency deviation for transmitting a logic ‘1’ and logic ‘0’. The deviation is programmable from 15kHz to 240kHz in 15kHz steps. See Table 9 below for deviation settings. TABLE 9. Modulation Bandwidth 15 kHz 30 kHz 45 kHz 60 kHz 75 kHz 90 kHz 105 kHz DEV3 DEV2 DEV1 DEV0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 0 0 1 1 0 0 1 0 1 0 1 0 1 0 …………….. …………. …………. …………. …………. 210 kHz 225 kHz 240 kHz 1 1 1 1 1 1 0 1 1 1 0 1 17 Transmit Power Configuration Register [POR=B0h] Bit Bit Bit Bit Bit Bit Bit Bit 7 6 5 4 3 2 1 0 1 0 1 1 OOKEN PWR2 PWR1 PWR0 The Power Configuration Register configures the output transmit power desired. Bit [7..4] - Command Code: These bits are the command code that is sent serially to the processor that identifies the bits to be written to the Transmit Power Configuration Register. Bit [3] – OOKEN: This bit enables OOK mode for the power amplifier. In this mode, data is applied to the MOD pin (16). When a logic ‘1’ is applied, the power amplifier is On. When a logic ‘0’ is applied, the power amplifier is Off. Bit [2..0] – Output Transmit Power: These bits set the transmit output power. The output power is programmable from Max to -21dB in -3dB steps. See Table 10 below for Output Power settings. TABLE 10. Output Power (Relative) Max -3dB -6dB -9dB -12dB -15dB -18dB -21dB PWR2 PWR1 PWR0 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 18 Transmit Command Register [POR=C600h] (EEPROM Mode) Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 1 1 0 0 0 1 1 0 B7 B6 B5 B4 B3 B2 B1 B0 (Processor Mode) Bit Bit Bit Bit Bit Bit Bit Bit 7 6 5 4 3 2 1 0 1 1 0 0 0 1 1 0 The Transmit Command Register in EEPROM mode holds the count of the number of data bytes to follow. In processor mode, only the command code is sent and the data is applied to the SDI pin WITHOUT a clock. If clock pulses are sent, the data will be interpreted as commands. In this mode the SDI pin acts like the MOD input pin (16). See Figure 6. nCS SCK SDI Tsx is the oscillator startup time Tsp is the synthesizer start-up and lock time Figure 6. Data Transmit through SDI pin The MOD pin(16) may also be used to manually send modulated data. The Oscillator and Synthesizer must manually be enabled through the Power Management Register. Startup and settle time must be allowed before applying a modulating signal to the MOD pin(16). Bit [15..8] - Command Code: These bits are the command code that is sent serially to the processor that identifies the bits to be written to the Transmit Command Register. Bit [7..0] – Byte Count (EEPROM Mode Only): These bits are the 8-bit value of the number of data bytes to be transmitted. Before issuing this command the power amplifier must be enabled either by setting the respective Power Management Register bits PAEN bit (3) or TX0 bit (6). Bit [7..0] - Command Code (Processor Mode Only): These bits are the command code that is sent serially to the processor that identifies the bits to be written to the Transmit Command Register. Note: When manually controlling the oscillator and synthesizer turn-on, valid data can only be transmitted when the oscillator has had time to start-up and the synthesizer has had time to lock. 19 Frequency Setting Register [POR=A7D0h] Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 1 0 1 0 Freq11 Freq10 Freq9 Freq8 Freq7 Freq6 Freq5 Freq4 Freq3 Freq2 Freq1 Freq0 The Frequency Setting Register sets the exact frequency within the selected band for transmit or receive. Each band has a range of frequencies available for channelization or frequency hopping. The selectable frequencies for each band are: Frequency Band 400 MHz 800 MHz 900 MHz Min (MHz) 430.24 860.48 900.72 Max (MHz) 439.75 879.51 929.27 Tuning Resolution 2.5 kHz 5.0 kHz 7.5 kHz Bit descriptions are as follows: Bit [15..12] – Command Code: These bits are the command code that is sent serially to the processor that identifies the bits to be written to the Frequency Setting register. Bit [11..0] – Frequency Setting: These bits set the center frequency to be used during transmit or receive. The value of bits[11..0] must be in the decimal range of 96 to 3903. Any value outside of this range will cause the previous value to be kept and no frequency change will occur. To calculate the center frequency fc, use Table 11 below and the following equation: fc = 10 * B1 * (B0 + fVAL/4000) MHz where fVAL = decimal value of Freq[11..0] = 96<fVAL<3903. Use Table 11 to select the frequency band and substitute into the above equation to calculate the center frequency of the desired band. TABLE 11. Range 433 MHz 868 MHz 916 MHz B1 1 2 3 B0 43 43 30 20 Data Rate Setup Register [POR=C800h] (EEPROM Mode ONLY) Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 1 1 0 0 1 0 0 0 BITR7 BITR6 BITR5 BITR4 BITR3 BITR2 BITR1 BITR0 The Data Rate Setup Register configures the effective transmit data rate for the transmitter. Bit [15..8] - Command Code: These bits are the command code that is sent serially to the processor that identifies the bits to be written to the Data Rate Setup Register. Bit [7..0] – Data Rate Parameter Value: These bits represent the decimal value of the 7-bit parameter used to calculate the expected data rate. The definable data rates range from 1.346kpbs to 344.828kbps. To calculate the expected data rate, use the following formula: DRexp(kbps) = 10000 / [29 * (BITR[6..0]+1)] where BITR[6..0] is the decimal value 0 to 255. To calculate the BITR[6..0] decimal value for a given bit rate, use the following formula: BITR[6..0] = (10000 / [29 * DRexp]) - 1 where DRexp is the expected data rate. TABLE 12. Conversion for Common Data Rates Hex Value 0x8E 0x47 0x23 0x19 0x17 0x11 0x0B 0x02 Common Data Rate (bps) 2400 4800 9600 13200 14400 19200 28800 115200 21 Button Command Register [POR=CA00h] Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 1 1 0 0 1 0 1 0 2KPEN DB1 DB0 SW4 SW3 SW2 SW1 PUPDIS The Button Command Register configures: • Key press de-bounce time • Key press events • Weak Pull-ups Bit [15..8] – Command Code: These bits are the command code that is sent serially to the processor that identifies the bits to be written to the Button Command Register. Bit [7] – 2-Key Press Enable: This bit enables simultaneous key press of SW1 and SW2 to execute the same address entry point as SW4. Enabling this bit does NOT disable SW4 function. Bit [6..5] – De-Bounce Time Set: These bits set the key press de-bounce time. See Table 13 for settings. TABLE 13. DB1 0 0 1 1 DB0 0 1 0 1 De-Bounce Time 160msec 40msec 10msec NONE Bit [4] – SW4 Continuous Execute Enable: This bit, when set, enables the chip to continuously execute the routine as long as the key is pressed. Bit [3] – SW3 Continuous Execute Enable: This bit, when set, enables the chip to continuously execute the routine as long as the key is pressed. Bit [2] – SW2 Continuous Execute Enable: This bit, when set, enables the chip to continuously execute the routine as long as the key is pressed. Bit [1] – SW1 Continuous Execute Enable: This bit, when set, enables the chip to continuously execute the routine as long as the key is pressed. Bit [0] – Weak Internal Pull-ups: This bit DISABLES the internal weak pull-up resistors for all keys when set. This bit defaults to clear so that the weak pull-ups are enabled. 22 Sleep/Clock Command Register [POR=C400h] Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 1 1 0 0 0 1 0 0 SLP7 SLP6 SLP5 SLP4 SLP3 SLP2 SLP1 SLP0 The Sleep Command Register defines the byte command and the number of clock cycles to generate after a sleep instruction to put the chip into sleep mode. When the chip sees this command issued, it immediately disables the power amplifier, turns off the synthesizer, and turns off the oscillator after SLP[7..0] clock cycles. Bit [15..8] – Command Code: These bits are the command code that is sent serially to the processor that identifies the bits to be written to the Sleep Command Register. Bit [7..0] – Sleep Command Value: These bits define the sleep command value that is issued by a host controller instructing the chip to go into sleep mode. This also sets the number of clock cycles that are generated after the oscillator has been disabled and before the chip goes into sleep mode. 23 Wake-up Timer Period Register [POR=E000h] Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 1 1 1 R4 R3 R2 R1 R0 MUL7 MUL6 MUL5 MUL4 MUL3 MUL2 MUL1 MUL0 The Wake-up Timer Period register sets the wake-up interval for the TXC102. After setting the wake-up interval, the WKUPEN (Bit 1 of Power Management Register) should be cleared and set at the end of every wake-up cycle. To calculate the wake-up interval desired, use the following: TWAKE = MUL[7..0] * 2 R[4..0] where MUL[7..0] = decimal value 0 to 255 and R[4..0] = decimal value 0 to 31. Bit [15..13] – Command Code: These bits are the command code that is sent serially to the processor that identifies the bits to be written to the Wake-up Timer Period register. Bit [12..8] – Exponential: These bits define the exponential value as used in the above equation. The value used must be the decimal equivalent between 0 and 31. Bit [7..0] – Multiplier: These bits define the multiplier value as used in the above equation. The value used must be the decimal equivalent between 0 and 255. 24 Battery Detect Threshold Register [POR=C200h] Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 1 1 0 0 0 0 1 0 0 0 0 LBD4 LBD3 LBD2 LBD1 LBD0 The Battery Detect Threshold and Clock Output Register configures the following: • Low Battery Detect Threshold The Low Battery Threshold is programmable from 2.2V to 5.3V using the following equation: VT = (LBD[4..0] / 10) + 2.2 (V) where LBD[4..0] is the decimal value 0 to 31. Bit [15..8] - Command Code: These bits are the command code that is sent serially to the processor that identifies the bits to be written to the Battery Detect Threshold Register. Bit [7..5] – Not Used. Write a logic ‘0’. Bit [4..0] – Low Battery Detect Value: These bits set the decimal value as used in the equation above to calculate the battery detect threshold voltage value. When the battery level falls 50mV below this value, the LBD bit (5) in the status register is set indicating that the battery level is below the programmed threshold. This is useful in monitoring discharge sensitive batteries such as Lithium cells. The Low Battery Detect can be enabled by setting the LBDEN bit (2) of the Power Management Register and disabled by clearing the bit. 25 Power Management Register [POR=C000h] Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 1 1 0 0 0 0 0 0 TX1 TX0 OSCEN SYNEN PAEN LBDEN WKUPEN CLKEN The Power Management Register enables/disables the following: • Transmit Chain • PLL • Power Amplifier • Synthesizer • Crystal Oscillator • Low battery Detect Circuit • Wake-up Timer • Clock Output Bit [15..8] – Command Code: These bits are the command code that is sent serially to the processor that identifies the bits to be written to the Power Management register. Bit [7..6] – Transmit Chain Automatic Enable: These bits enable the entire transmit chain when set. When TX1 is set, the oscillator and synthesizer turn-on are controlled by the chip. When the Data Transmit Command is issued, the oscillator is enabled. As soon as a stable frequency is reached the synthesizer is enabled. When TX0 is set, this turns on the power amplifier after the PLL has successfully achieved lock. Bit [5] – Crystal Oscillator Enable: This bit enables the oscillator circuit when set. The oscillator provides the reference signal for the synthesizer when setting the transmit frequency of use. Bit [4] – Synthesizer Enable: This bit enables the synthesizer when set. The synthesizer contains the PLL, oscillator, and VCO for controlling the channel frequency. This must be enabled when the transmitter is enabled. The oscillator also must be enabled to provide the reference frequency for the PLL. On power-up the synthesizer performs a calibration automatically. If there are significant changes in voltage or temperature, recalibration can be performed by simply disabling the synthesizer and re-enabling it. Bit [3] –Power Amplifier Enable: This bit enables the power amplifier when set. The power amplifier may be manually enabled from other functions. Bit [2] – Low Battery Detector: This bit enables the battery voltage detect circuit when set. The battery detector can be programmed to 32 different threshold levels. See Battery Detect Threshold and Clock Output Register section for programming. Bit [1] – Wake-up Timer Enable: This bit enables the wake-up timer when set. See Wake-up Timer Period Register section for programming the wake-up timer interval value. Bit [0] – Clock Output Disable: This bit disables the oscillator clock output when set. On chip reset or power up, clock output is on so that a processor may begin execution of any special setup sequences as required by the designer. See Battery Detect Threshold and Clock Output Register section for programming details. 26 5.0 Maximum Ratings Absolute Maximum Ratings Symbol VDD Vin Voc Parameter Min Max Positive supply voltage Notes -0.5 6 V Voltage on any pin (except RF_P and RF_N) -0.5 Vdd+0.5 V -0.5 6 25 mA Voltage on open collector outputs (RF1, RF2) Iin Input current into any pin except VDD and VSS ESD Electrostatic discharge with human body model Tstg Storage temperature Tlead Lead temperature (soldering, max 10 s) 1 -25 Units V 1000 -55 125 V °C 260 °C Note 1: At maximum, VDD+1.5 V cannot be higher than 7 V. Recommended Operation Ratings Symbol VDD VDCRF Top Parameter Positive supply voltage DC voltage on open collector outputs (RF1, RF2) Ambient operating temperature Notes Min Max Units 5.4 1,2 2.2 Vdd-1 -40 V V °C Vdd+1 85 Note 1: At minimum, VDD - 1.5 V cannot be lower than 1.2 V. Note 2: At maximum, VDD+1.5 V cannot be higher than 5.5 V. 6.0 DC Electrical Characteristics (Min/max values are valid over the whole recommended operating range Vdd = 2.2-5.4V. Typical conditions: Top = 27°C; Vdd = 3.0 V) Digital I/O Sym Parameter Min Supply current (TX mode, Pout = 0dBm, into 50 Ohm Load) IddTX0 Supply current (TX mode, Pout = Pmax, differential or 50 Ohm Load) IddTX Sleep current Idle current Limit Values Notes Unit typ max 13 14 14 15 15 16 21 23 22 24 23 25 433MHz Band mA 433MHz Band mA µA IIDLE 1.5 mA Low battery voltage detector current consumption Wake-up timer current consumption IVD 0.5 µA IWUT 1.5 µA Low battery detect threshold Vlb Low battery detection accuracy ±75 Digital input low level Vil Digital input high level Vih 0.7*Vdd Digital input current low Iil Digital input current high Iih Digital output low level Vol Digital output high level Voh 868MHz Band 916MHz Band 0.2 5.3 868MHz Band 916MHz Band IS 2.2 Test Conditions V All blocks disabled Oscillator and baseband enabled Programmable in 0.1 V steps mV 0.3*Vdd V -1 1 µA Vil = 0 V -1 1 µA Vih = Vdd, Vdd = 5.4 V V 0.4 Vdd-0.4 V Iol = 2 mA V Ioh = -2 mA Digital input capacitance 2 pF Digital output rise/fall time 10 ns Load = 15 pF 27 7.0 AC Electrical Characteristics (Min/max values are valid over the whole recommended operating range Vdd = 2.2-5.4V. Typical conditions: Top = 27°C; Vdd = 3.0 V) Transmitter Sym Notes Parameter min Open collector output DC current 0.5 Output power (Differential Load) Limit Values typ Unit max 6 +8 PDL mA dBm +6 +6 Output power (into 50 Ohms) dBm +4 +4 dBm -70 -75 dBm -25 -35 dBm -45 2.3 3.1 pF Antenna tuning capacitance Output capacitance Quality factor 868 MHz Band 433MHz Band 868MHz Band 433MHz Band 868MHz Band 433MHz Band 868MHz Band 916MHz Band -45 1.5 433 MHz Band 916MHz Band -23 3rd Harmonics 868 MHz Band 916MHz Band -25 2nd Harmonics 433 MHz Band 916 MHz Band -65 Reference Spur Programmable 916 MHz Band +7 PO Test Conditions 1.6 2.2 2.8 16 18 22 433MHz Band 868MHz Band 916MHz Band 433MHz Band 868MHz Band 916MHz Band Phase noise 1 FSK bit rate 1 -85 OOK bit rate FSK frequency deviation dBc/Hz -105 15 256 kbps 512 kbps 240 kHz 100 kHz from carrier 1 MHz from carrier ∆FSK = 240kHz Programmable in 15 kHz steps 28 Timing Sym Notes Parameter Limit Values min typ Internal POR timeout Wake-up timer period Wake-up Time PLL Characteristics Sym PLL reference freq max 100 ms Vdd at 90% of final value 1.05 ms Calibrated every 30 seconds 1 2e+9 ms Limit Values Unit min typ max 8 10 12 PLL lock time 10 PLL startup time Crystal load capacitance CL 8.5 Xtal oscillator startup time Tuning Range (w/ 10MHz ref xtal) Test Conditions 0.95 Notes Parameter Unit Test Conditions MHz us within 1kHz settle, 10MHz step 250 us Crystal running 16 pF Programmable in 0.5 pF steps, tolerance +/- 10% 5 ms Crystal ESR < 100 430.24 439.75 860.48 879.51 900.72 929.27 MHz 433MHz Band (2.5kHz steps) 868MHz Band (5.0kHz steps) 916MHz Band (7.5kHz steps) NOTES: 1- The phase noise and max Data Rate is dependent on the PLL configuration. PLL command Data Rate (kbps) D240h D2C0h D200h D280h 19.2 28 64 115 Phase Noise at 1MHz offset (dBc/Hz) -112 -110 -107 -102 Description 25% current 33% current 50% current (POR default) 100% current 29 8.0 Package Dimensions – 5x4.4mm 16-pin TSSOP Package (all values in mm) Detail A C θ2 B 0.20 F G R1 R D E Gauge Plane θ1 0.25 L θ3 L1 Detail Symbol 4441 Sigma Road Dallas, Texas 75244 (800) 704-6079 toll-free in U.S. and Canada Email: [email protected] A B C D E F G L L1 R R1 θ1 θ2 θ3 Dimensions in mm Min Nom Max 4.30 4.40 4.50 4.90 5.00 5.10 6.40 BSC. 0.19 0.30 0.65 BSC. 0.80 0.90 1.05 1.20 0.50 0.60 0.75 1.00 REF. 0.09 0.09 0 8 12 REF. 12 REF. Dimensions in Inches Min Nom Max 0.169 0.173 0.177 0.193 0.197 0.201 0.252 BSC. 0.007 0.012 0.026 BSC. 0.031 0.035 0.041 0.47 0.020 0.024 0.030 0.39 REF 0.004 0.004 0 8 12 REF. 12 REF. www.rfm.com www.wirelessis.com © 2005 RF Monolithics, Inc. TXC102 2006-03-06 rev01 30