AM26LS33A-SP www.ti.com SLLSE22 – FEBRUARY 2010 QML CLASS V RS-422 QUADRUPLE DIFFERENTIAL LINE RECEIVER Check for Samples: AM26LS33A-SP FEATURES 1 • • • • • • • • • • • AM26LS33A Devices Meet or Exceed the Requirements of ANSI TIA/EIA-422-B, TIA/EIA-423-B, and ITU Recommendations V.10 and V.11 ±15-V Common-Mode Range With ±500-mV Sensitivity Input Hysteresis . . . 50 mV Typical Operate From a Single 5-V Supply Low-Power Schottky Circuitry 3-State Outputs Complementary Output-Enable Inputs Input Impedance . . . 12 kΩ Minimum Designed to Be Interchangeable With Advanced Micro Device AM26LS33™ QML-V Qualified, SMD 5962-78020 Military Temperature Range (-55°C to 125°C) • Rad-Tolerant: 25 kRad (Si) TID (1) J PACKAGE (TOP VIEW) (1) Radiation tolerance is a typical value based upon initial device qualification with dose rate = 10 mrad/sec. Radiation Lot Acceptance Testing is available - contact factory for details. DESCRIPTION The AM26LS33A is a quadruple differential line receiver for balanced and unbalanced digital data transmission. The enable function is common to all four receivers and offers a choice of active-high or active-low input. The 3-state outputs permit connection directly to a bus-organized system. Fail-safe design ensures that, if the inputs are open, the outputs always are high. Compared to the AM26LS33, the AM26LS33A incorporates an additional stage of amplification to improve sensitivity. The input impedance has been increased, resulting in less loading of the bus line. The additional stage has increased propagation delay; however, this does not affect interchangeability in most applications. The AM26LS33A is characterized for operation over the temperature range of –55°C to 125°C. ORDERING INFORMATION (1) (1) (2) TA PACKAGE (2) ORDERABLE PART NUMBER TOP-SIDE MARKING –55°C to 125°C CDIP - J 5962-7802007VEA 5962-7802007VEA For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2010, Texas Instruments Incorporated AM26LS33A-SP SLLSE22 – FEBRUARY 2010 www.ti.com Table 1. FUNCTION TABLE Each Receiver ENABLES DIFFERENTIAL A–B VID ≥ VIT+ VIT– ≤ VID ≤ VIT+ VID ≤ VIT– X Open G G OUTPUT Y H X H X L H H X ? X L ? H X L X L L L H Z H X H X L H LOGIC DIAGRAM (POSITIVE LOGIC) G G 1A 1B 2A 2B 3A 3B 4A 4B 4 12 2 3 1 1Y 6 5 7 2Y 10 11 9 3Y 14 13 15 4Y SCHEMATICS OF INPUTS AND OUTPUTS 8.3 kΩ 85 Ω 100 kΩ 20 kΩ 960 Ω 960 Ω 100 kΩ 2 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): AM26LS33A-SP AM26LS33A-SP www.ti.com SLLSE22 – FEBRUARY 2010 ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX Supply voltage (2) VCC 7 Any differential input VI Input voltage VID Differential input voltage (3) ±25 Other inputs 7 ±25 Continuous total power dissipation (1) (2) (3) V V V See Dissipation Ratings Table Lead temperature 1.6 mm (1/16 inch) from case for 60 seconds Tstg UNIT Storage temperature range –65 300 °C 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values, except differential voltages, are with respect to the network ground terminal. Differential voltage values are at the noninverting (A) input terminals with respect to the inverting (B) input terminals. 1000 Electromigration Fail Mode Estimated Life (Years) 100 10 1 80 90 100 110 120 130 140 150 160 170 180 190 200 Continuous T J (°C) A. See datasheet for absolute maximum and minimum recommended operating conditions. B. Silicon operating life design goal is 10 years at 105°C junction temperature (does not include package interconnect life). Figure 1. AM26LS33A 16/J Package Operating Life Derating Chart Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): AM26LS33A-SP 3 AM26LS33A-SP SLLSE22 – FEBRUARY 2010 www.ti.com RECOMMENDED OPERATING CONDITIONS MIN NOM MAX 4.5 5 5.5 UNIT VCC Supply voltage VIH High-level input voltage VIL Low-level input voltage VIC Common-mode input voltage ±15 V IOH High-level output current –440 mA IOL Low-level output current 8 mA TA Operating free-air temperature 125 °C MAX UNIT 2 V V 0.8 -55 V ELECTRICAL CHARACTERISTICS over recommended ranges of VCC, VIC, and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS VIT+ Positive-going input threshold voltage VO = VOHmin, IOH = –440 mA -15 V ≤ VIC ≤ 15 V VIT– Negative-going input threshold voltage VO = 0.45 V , IOL = 8 mA -15 V ≤ VIC ≤ 15 V Vhys Hysteresis voltage (VIT+ – VIT–) VIK Enable-input clamp voltage VCC = 4.5 V, VOH High-level output voltage VCC = 4.5 V, VID = 1 V, VI(G) = 0.8 V, IOH = –440 mA VOL Low-level output voltage VCC = 4.5 V, VID = –1 V, VI(G) = 0.8 V IOZ Off-state (high-impedance state) output current VCC = 5.5 V II MIN TYP (1) 0.5 –0.5 (2) V 50 II = –18 mA mV –1.5 2.5 V V IOL= 4 mA 0.4 IOL= 8 mA 0.45 VO = 2.4 V 20 VO = 0.4 V –20 VI = 15 V, Other input at –10 V to 15 V 1.2 VI = –15 V, Other input at –15 V to 10 V –1.7 Line input current V V mA mA II(EN) Enable input current VI = 5.5 V, VCC = 5.5 V IH High-level enable current VI = 2.7 V, VCC = 5.5 V 20 mA IL Low-level enable current VI = 0.4 V, VCC = 5.5 V –0.36 mA ri Input resistance VIC = –15 V to 15 V, IOS Short-circuit output current (3) VCC = MAX, VID = 1 V, VO = 0 V ICC Supply current VCC = MAX, data inputs = GND, (1) (2) (3) 4 100 One input to ac ground 12 15 –15 All outputs disabled 52 mA kΩ –85 mA 70 mA All typical values are at VCC = 5 V, TA = 25°C, and VIC = 0. The algebraic convention, in which the less positive (more negative) limit is designated as minimum, is used in this data sheet for threshold levels only. Not more than one output should be shorted to ground at a time, and duration of the short circuit should not exceed one second. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): AM26LS33A-SP AM26LS33A-SP www.ti.com SLLSE22 – FEBRUARY 2010 SWITCHING CHARACTERISTICS VCC = 5 V, over operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS tPLH Propagation delay time, low-to-high-level output CL = 15 pF, tPHL Propagation delay time, high-to-low-level output CL = 15 pF, tPZH Output enable time to high level CL = 15 pF, tPZL Output enable time to low level CL = 15 pF, tPHZ Output disable time from high level CL = 15 pF, tPLZ Output disable time from low level CL = 15 pF, (1) MIN See Figure 2 TYP (1) MAX 20 35 TA = –55°C to 125°C See Figure 2 53 22 TA = –55°C to 125°C See Figure 2 53 17 TA = –55°C to 125°C See Figure 2 20 TA = –55°C to 125°C 30 45 30 TA = –55°C to 125°C 25 38 21 See Figure 2 25 38 TA = –55°C to 125°C See Figure 2 35 40 60 UNIT ns ns ns ns ns ns All typical values are at VCC = 5 V, TA = 25°C, and VIC = 0. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): AM26LS33A-SP 5 AM26LS33A-SP SLLSE22 – FEBRUARY 2010 www.ti.com PARAMETER MEASUREMENT INFORMATION VCC Test Point RL = 2 kΩ 2.5 V S1 From Output Under Test CL (see Note A) Input 00 –2.5 V 5 kΩ tPLH See Note B tPHL VOH Output S2 1.3 V 1.3 V VOL S1 and S2 Closed TEST CIRCUIT VOLTAGE WAVEFORMS FOR tPLH, tPHL ≤5 ns 90% Enable G ≤5 ns 3V 90% 10% See Note C 90% 90% 10% S1 Open S2 Closed 10% 3V 90% 90% 10% VOH 1.3 V Output ≈1.4 V S1 Closed S2 Closed tPHZ 10% S1 Closed S2 Closed tPZL 1.3 V VOLTAGE WAVEFORMS FOR tPHZ, tPZH 3V 1.3 V 1.3 V 0 0.5 V 0 See Note C Enable G 10% tPZH 3V 1.3 V1.3 V 10% 0 1.3 V 1.3 V Enable G ≤5 ns 90% 90% Enable G 1.3 V1.3 V 10% Output ≤5 ns 0 ≈1.4 V tPLZ VOL S1 Closed S2 Open 0.5 V VOLTAGE WAVEFORMS FOR tPLZ, tPZL NOTES: A. CL includes probe and jig capacitance. B. All diodes are 1N3064 or equivalent. C. Enable G is tested with G high; G is tested with G low. Figure 2. Test Circuit and Voltage Waveforms 6 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): AM26LS33A-SP AM26LS33A-SP www.ti.com SLLSE22 – FEBRUARY 2010 TYPICAL CHARACTERISTICS HIGH-LEVEL OUTPUT VOLTAGE vs FREE-AIR TEMPERATURE High-Level Output Voltage, VOH (V) High-Level Output Voltage, VOH (V) HIGH-LEVEL OUTPUT VOLTAGE vs HIGH-LEVEL OUTPUT CURRENT IOH = –440 μA High-Level Output Current, IOH (mA) Free-Air Temperature, TA (°C) Figure 4. LOW-LEVEL OUTPUT VOLTAGE vs LOW-LEVEL OUTPUT CURRENT LOW-LEVEL OUTPUT VOLTAGE vs FREE-AIR TEMPERATURE Low-Level Output Voltage, VOL (V) Low-Level Output Votlage, VOL (V) Figure 3. Low-Level Output Current, IOL (mA) Figure 5. Free-Air Temperature, TA (°C) Figure 6. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): AM26LS33A-SP 7 AM26LS33A-SP SLLSE22 – FEBRUARY 2010 www.ti.com TYPICAL CHARACTERISTICS (continued) OUTPUT VOLTAGE vs ENABLE G VOLTAGE OUTPUT VOLTAGE vs ENABLE G VOLTAGE Load = 8 kΩ to GND Output Voltage, VO (V) Output Voltage, VO (V) Load = 8 kΩ to GND Enable G Voltage (V) Enable G Voltage (V) Figure 8. OUTPUT VOLTAGE vs ENABLE G VOLTAGE OUTPUT VOLTAGE vs ENABLE G VOLTAGE Output Voltage, VO (V) Output Voltage, VO (V) Figure 7. Load = 1 kΩ to VCC Load = 1 kΩ to VCC Enable G Voltage (V) Enable G Voltage (V) Figure 9. 8 Figure 10. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): AM26LS33A-SP AM26LS33A-SP www.ti.com SLLSE22 – FEBRUARY 2010 TYPICAL CHARACTERISTICS (continued) INPUT CURRENT vs INPUT VOLTAGE Input Current, II (mA) Output Voltage, VO (V) OUTPUT VOLTAGE vs DIFFERENTIAL INPUT VOLTAGE Differential Input Voltage, VID (mV) Input Voltage, VI (V) The unshaded area shows requirements of paragraph 4.2.1 of ANSI Standards EIA/TIA-422-B and EIA/TIA-423-B. Figure 11. Figure 12. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): AM26LS33A-SP 9 AM26LS33A-SP SLLSE22 – FEBRUARY 2010 www.ti.com APPLICATION INFORMATION Figure 13. Circuit with Multiple Receivers 10 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): AM26LS33A-SP PACKAGE OPTION ADDENDUM www.ti.com 29-Aug-2012 PACKAGING INFORMATION Orderable Device 5962-7802007VEA Status (1) ACTIVE Package Type Package Drawing CDIP J Pins Package Qty 16 1 Eco Plan TBD (2) Lead/ Ball Finish A42 MSL Peak Temp (3) Samples (Requires Login) N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF AM26LS33A-SP : • Catalog: AM26LS33A • Military: AM26LS33AM NOTE: Qualified Version Definitions: Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 29-Aug-2012 • Catalog - TI's standard catalog product • Military - QML certified for Military and Defense Applications Addendum-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2012, Texas Instruments Incorporated