HD3SS212 www.ti.com SLAS822 A – DECEMBER 2011 – REVISED MARCH 2012 5.4Gbps DisplayPort 1.2 2-to-1 Differential Switch Check for Samples: HD3SS212 FEATURES APPLICATIONS • • 1 • • • • • • • • Compatible with DisplayPort 1.2 Electrical Standard 2:1 Switching Supporting Data Rates up to 5.4Gbps Supports HPD Switching Wide -3dB Differential BW of over 5.4 GHz Excellent Dynamic Characteristics (at 2.7GHz) – Crosstalk = –50dB – Isolation = –22dB – Insertion Loss = –1.4dB – Return Loss = –11 dB – Max Bit-Bit Skew = 4 ps VDD Operating Range 3.3 V ±10% Small 5 mm x 5 mm x 1 mm, 48-Ball u*BGA Package Output Enable (OE) Pin Disables Switch to Save Power Power Consumption – HD3SS212 <10mW (Standby <30µW when OE = L) • • • Motherboard Applications Needing DP and PCI Express Desktop PCs Notebook PCs Docking 1 2 3 4 5 6 8 7 9 A B C D Top View 48-Ball ZQE u*BGA Package 5 mm x 5 mm E F G H J GND VDD Signal Pin Figure 1. HD3SS212 Ball Map DESCRIPTION The HD3SS212 is a high-speed passive switch capable of switching two full DisplayPort 4 lane ports from one of two sources to one target location in an application. For DisplayPort Applications that HD3SS212 also supports switching of the Auxiliary (AUX) and Hot Plug Detect (HPD) signals. HPD path is a buffer which requires a 125kΩ pull-down resistor on the HPDC line. A typical application would be a mother board that includes two GPUs that need to drive one DisplayPort sink. The GPU is selected by the Dx_SEL pin. The HD3SS212 is offered in a 48-ball BGA package and specified to operate from a single supply voltage of 3.3V over full industrial temperature range of –40°C to 105°C. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2011–2012, Texas Instruments Incorporated HD3SS212 SLAS822 A – DECEMBER 2011 – REVISED MARCH 2012 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION PART NUMBER HD3SS212ZQER HD3SS212ZQET PART MARKING PACKAGE HD3SS212 48-Ball u*BGA (ZQE) VDD DAz (p) DAz (n) 4 4 SEL = 0 4 4 (z = 0,1, 2or3) DBz (p) DBz (n) 4 4 DCz (p) DCz (n) SEL = 1 SEL Dx_SEL SEL HPDA SEL = 0 HPDB SEL = 1 HPDC 125kW SEL AUXA (p) AUXA (n) SEL = 0 AUXB (p) AUXB (n) SEL = 1 AUXC (p) AUXC (n) OE HD3SS212 GND Figure 2. HD3SS212 Functional Block Diagram 2 Copyright © 2011–2012, Texas Instruments Incorporated HD3SS212 www.ti.com SLAS822 A – DECEMBER 2011 – REVISED MARCH 2012 1 2 A Dx_SEL VDD B DC0(n) DC0(p) C 3 GND 4 5 6 DA0(n) DA1(n) DA2(n) DA0(p) DA1(p) DA2(p) 7 OE# 8 9 DA3(p) DA3(n) DB0(p) DB0(n) NC GND D DC1(n) DC1(p) DB1(p) DB1(n) E DC2(n) DC2(p) DB2(p) DB2(n) F DC3(n) DC3(p) DB3(p) DB3(n) GND GND G H AUXC(n) AUXC(p) J HPDC HPDA HPDB GND NC AUXB(p) VDD NC AUXB(n) GND NC AUXA(p) NC AUXA(n) Figure 3. HD3SS212 Ball Map by Signal Name PIN FUNCTIONS PIN PIN NAME I/O A1 Dx_SEL Control I B4 A4 DA0(p) DA0(n) I/O Port A, Channel 0, High Speed Positive Signal Port A, Channel 0, High Speed Negative Signal B5 A5 DA1(p) DA1(n) I/O Port A, Channel 1, High Speed Positive Signal Port A, Channel 1, High Speed Negative Signal B6 A6 DA2(p) DA2(n) I/O Port A, Channel 2, High Speed Positive Signal Port A, Channel 2, High Speed Negative Signal A8 A9 DA3(p) DA3(n) I/O Port A, Channel 3, High Speed Positive Signal Port A, Channel 3, High Speed Negative Signal B8 B9 DB0(p) DB0(n) I/O Port B, Channel 0, High Speed Positive Signal Port B, Channel 0, High Speed Negative Signal D8 D9 DB1(p) DB1(n) I/O Port B, Channel 1, High Speed Positive Signal Port B, Channel 1, High Speed Negative Signal E8 E9 DB2(p) DB2(n) I/O Port B, Channel 2, High Speed Positive Signal Port B, Channel 2, High Speed Negative Signal F8 F9 DB3(p) DB3(n) I/O Port B, Channel 3, High Speed Positive Signal Port B, Channel 3, High Speed Negative Signal B2 B1 DC0(p) DC0(n) I/O Port C, Channel 0, High Speed Positive Signal Port C, Channel 0, High Speed Negative Signal D2 D1 DC1(p) DC1(n) I/O Port C, Channel 1, High Speed Positive Signal Port C, Channel 1, High Speed Negative Signal E2 E1 DC2(p) DC2(n) I/O Port C, Channel 2, High Speed Positive Signal Port C, Channel 2, High Speed Negative Signal F2 F1 DC3(p) DC3(n) I/O Port C, Channel 3, High Speed Positive Signal Port C, Channel 3, High Speed Negative Signal H9 J9 AUXA(p) AUXA(n) I/O Port A AUX Positive Signal Port A AUX Negative Signal Copyright © 2011–2012, Texas Instruments Incorporated DESCRIPTION High Speed Port Selection Control Pins 3 HD3SS212 SLAS822 A – DECEMBER 2011 – REVISED MARCH 2012 www.ti.com PIN FUNCTIONS (continued) PIN PIN NAME H6 J6 AUXB(p) AUXB(n) I/O I/O Port B AUX Positive Signal Port B AUX Negative Signal DESCRIPTION H2 H1 AUXC(p) AUXC(n) I/O Port C AUX Positive Signal Port C AUX Negative Signal J2, H3, J1 HPDA/B/C I/O Port A/B/C Hot Plug Detect B7 OE I Output Enable A2, J4 VDD Supply 3.3V Positive power supply voltage B3, C8, G2, G8, H4, H7 GND Supply Negative power supply voltage C2, H5, H8, J5, J8 NC Electrically not connected FUNCTIONAL DESCRIPTION Refer to Figure 2. The HD3SS212 behaves as a two to one using high bandwidth pass gates. The input port is selected using the Dx_SEL pin according to Table 1. Table 1. Switch Control Logic SWITCHED I/O PINS (1) (2) CONTROL LINES (1) (2) Dx_SEL DCz(p) PIN z = 0, 1, 2 or 3 DCz(n) PIN z = 0, 1, 2 or 3 HPDC PIN L DAz(p) DAz(n) HPDA AUXA(p) AUXA(n) H DBz(p) DBz(n) HPDB AUXVB(p) AUXVB(n) AUXC(p) PIN AUXC(n) PIN OE pin - For nomal operation, drive OE high. Driving the OE pin low will disable the switch to enable power savings. The ports which are not selected by the Control Lines will be in High Impedance State. ABSOLUTE MAXIMUM RATINGS (1) (2) over operating free-air temperature range (unless otherwise noted) VALUE / UNIT Supply voltage range (3) Voltage range Electrostatic discharge VDD –0.5 V to 4 V Differential I/O –0.5 V to 4 V Control pin –0.5 V to VCC +0.5V Human body model (4) Charged-device model ±4,000V (5) ±1000V Operating free-air temperature –40°C to 105°C Continuous power dissipation See The Thermal Information Table (1) (2) (3) (4) (5) 4 Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values, except differential voltages, are with respect to network ground terminal. Tested in accordance with JEDEC Standard 22, Test Method A114-B Tested in accordance with JEDEC Standard 22, Test Method C101-A 5. Tested in accordance with JEDEC Standard 22, Test Method A115-A Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): HD3SS212 HD3SS212 www.ti.com SLAS822 A – DECEMBER 2011 – REVISED MARCH 2012 THERMAL INFORMATION HD3SS212 THERMAL METRIC (1) θJA Junction-to-ambient thermal resistance 90.5 θJCtop Junction-to-case (top) thermal resistance 41.9 θJB Junction-to-board thermal resistance 53.9 ψJT Junction-to-top characterization parameter 1.8 ψJB Junction-to-board characterization parameter 53.4 (1) UNITS 48-Ball u*BGHA (ZQE) °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. RECOMMENDED OPERATING CONDITIONS typical values for all parameters are at VCC = 3.3V and TA = 25°C, all temperature limits are specified by design PARAMETER CONDITIONS MIN TYP MAX 3.0 3.3 3.6 V 2.0 VDD V –0.1 0.8 V Switch I/O diff voltage 0 1.8 Vpp Switch I/O common mode voltage 0 2.0 V –40 105 °C VDD Supply voltage VIH Input high voltage Control Pins, Signal Pins (Dx_SEL, OE) (HPDC, 5V Tolerant) VIL Input low voltage Control Pins, Signal Pins (Dx_SEL, OE, HPDC) VI/O_Diff Differential voltage (Dx, AUXx) VI/O_CM Common voltage (Dx, AUXx) Operating free-air temperature UNIT ELECTRICAL CHARACTERISTICS under recommended operating conditions PARAMETER TEST CONDITIONS MIN TYP MAX UNIT DEVICE PARAMETERS IIH Input high current (Dx_SEL) VDD = 3.6 V, VIN = VDD 3 10 µA IIL Input low current (Dx_SEL) VDD = 3.6 V, VIN = GND µA Leakage current (Dx_SEL) ILK 0.01 1 VDD = 3.3 V, Vi = 2V, OE = 3.3V 2 5 VDD = 0 V, Vi = 2 V, OE = 3.3 V 6 10 Leakage current (HPDA) VDD = 3.3 V, Vi = 2 V, OE = 3.3 V; Dx_SEL=3.3 V 0.01 2 0.01 2 Leakage current (HPDB) VDD = 3.3 V, Vi = 2 V, OE = 3.3 V; Dx_SEL=GND Ioff Device shut down current VDD = 3.6 V, OE = GND IDD Supply current VDD = 3.6 V, Dx_SELx = VCC/GND; Outputs floating 2.5 1.5 µA 5 µA 5 mA DA, DB, DC HIGH SPEED SIGNAL PATH CON Outputs ON capacitance Vi = 0 V, Outputs open, Switch ON COFF Outputs OFF capacitance Vi = 0 V, Outputs open, Switch OFF RON Output ON resistance VDD = 3.3 V, VCM = 0.5V - 1.5 V, IO = –40 mA ΔRON On resistance match between pairs of the VDD = 3.3 V; -0.35V ≤ VI ≤ 1.2 V; IO = –40 mA same channel RFLAT_ON On resistance flatness (RON (MAX) – RON (MAIN) ) pF 1 VDD = 3.3 V; -0.35 V ≤ VI ≤ 1.2 V 6.5 pF 10 Ω 1.5 Ω 1.3 Ω pF AUXx SIGNAL PATH CON Outputs ON capacitance Vi = 0 V, Outputs open, Switch ON 9 COFF Outputs OFF capacitance Vi = 0 V, Outputs open, Switch OFF 3 RON Output ON resistance VDD = 3.3 V, VCM = 0.5 V - 1.5 V, IO = -40 mA 7 pF 12 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): HD3SS212 Ω 5 HD3SS212 SLAS822 A – DECEMBER 2011 – REVISED MARCH 2012 www.ti.com ELECTRICAL CHARACTERISTICS (continued) under recommended operating conditions PARAMETER TEST CONDITIONS MIN TYP MAX UNIT DEVICE PARAMETERS (under recommended operating conditions; RL, Rsc = 50 Ω unless otherwise noted Rsc and RL = 50 Ω, See Figure 5 tPD Switch propagation delay Ton Dx_SEL -to-Switch Ton (Data and AUX) Toff Dx_SEL -to-Switch Toff (Data and AUX) Ton Dx_SEL -to-Switch Ton (HPD) Toff Dx_SEL -to-Switch Toff (HPD) TSK(O) Inter-pair output skew (CH-CH) TSK(b-b) Intra-pair output skew (bit-bit) RL Dx Differential return loss (1) Dx Differential crosstalk OIRR Dx Differential off-isolation (1) IL Dx Differential insertion loss(1) 250 175 250 275 350 275 350 50 Rsc and RL = 1 kΩ, See Figure 5 AUX Differential insertion loss(1) (1) Rsc and RL = 50 Ω, See Figure 4 RL = 50 Ω, See Figure 4 (1) XTALK 200 175 1 1.35 GHz, See TYPICAL PERFORMANCE PLOTS –17 2.7 GHz, See TYPICAL PERFORMANCE PLOTS –11 2.7 GHz –50 2.7 GHz, See TYPICAL PERFORMANCE PLOTS –22 f = 1.35 GHz, See TYPICAL PERFORMANCE PLOTS –0.7 f = 2.7 GHz, See TYPICAL PERFORMANCE PLOTS –1.4 f = 5.4 GHz, See TYPICAL PERFORMANCE PLOTS –1.7 f = 360 MHz –1 4 ps ns ns ps dB dB dB For Return Loss, Crosstalk, Off-Isolation, and Insertion Loss values the data was collected on a Rogers material board with minimum length traces on the input and output of the device under test. TEST TIMING DIAGRAMS Dx_SEL VOUT 50% 90% 10% Ton Toff Figure 4. Select to Switch Ton and Toff 6 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): HD3SS212 HD3SS212 www.ti.com SLAS822 A – DECEMBER 2011 – REVISED MARCH 2012 Vcc 50 Ω DAx/DBx(p) HD3SS212 DCx(p) 50 Ω 50 Ω DCx(n) DAx/DBx(n) 50 Ω SEL DAx/DBx(p) 50% 50% DAx /DBx(n) DCx(p) 50% 50% DCx(n) tP1 t1 tP2 t3 t2 t4 DCx(p) 50% DCx(n) DCy(p) tSK(O) DCy(n) t PD = Max(t p1, t p2) tSK(O) = Difference between tPD for any two pairs of outputs tSK(b-b) = 0.5 X |(t 4 – t3) + (t 1 – t2)| Figure 5. Propagation Delay and Skew Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): HD3SS212 7 HD3SS212 SLAS822 A – DECEMBER 2011 – REVISED MARCH 2012 www.ti.com 0 0 -5 -5 -10 -10 Magnitude - dB Magnitude - dB TYPICAL PERFORMANCE PLOTS -15 -15 -20 -20 -25 -25 -30 1E8 1E9 1E10 2E8 -30 1E8 Frequency - Hz Figure 6. Insertion Loss and -3dB Bandwidth 1E9 Frequency - Hz 1E10 2E10 Figure 7. Return Loss 0 Magnitude - dB -20 -40 -60 -80 -100 1E8 8 1E9 Frequency - Hz Figure 8. OF Isolation Submit Documentation Feedback 1E10 2E10 Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): HD3SS212 HD3SS212 www.ti.com SLAS822 A – DECEMBER 2011 – REVISED MARCH 2012 REVISION HISTORY Changes from Original (December 2011) to Revision A Page • Changed Description From: full industrial temperature range of –40°C to 85°C To: full industrial temperature range of –40°C to 105°C ................................................................................................................................................................. 1 • Added Operating Temperature to the Abs Max Table .......................................................................................................... 4 • Changed the values of ψJT and ψJB in the Thermal Information table .................................................................................. 5 • Changed the Operating free-air temperature From MAX = 85°C To: 105°C ........................................................................ 5 • Changed the MAX value of Leakage current (Dx_SEL), VDD = 0 V From: 8µA To: 10µA .................................................. 5 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): HD3SS212 9 PACKAGE OPTION ADDENDUM www.ti.com 3-Mar-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) HD3SS212ZQER ACTIVE BGA MICROSTAR JUNIOR ZQE 48 2500 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR HD3SS212ZQET ACTIVE BGA MICROSTAR JUNIOR ZQE 48 250 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap Wireless Connectivity www.ti.com/wirelessconnectivity TI E2E Community Home Page e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2012, Texas Instruments Incorporated