LC5540LF Series Single-Stage Power Factor Corrected Off-Line Switching Regulators Features and Benefits Description • Integrated on-width control circuit (it realizes high power factor by average current control) • Integrated startup circuit (no external startup circuit necessary) • Integrated soft-start circuit (reduces power stress during start-up on the incorporated power MOSFET and rectifier) • Integrated bias assist circuit (improves the startup performance, suppresses VCC voltage droop during operation, allows reduction of VCC capacitor value as well as use of a ceramic capacitor) • Integrated Leading Edge Blanking (LEB) circuit • Integrated maximum on-time limit circuit • Dual-chip structure, with an avalanche-guaranteed power MOSFET (allows simplified surge suppressing circuits) • Protection features: ▫ Overcurrent protection (OCP): pulse-by-pulse ▫ Overvoltage protection (OVP): latched shutdown ▫ Overload protection (OLP): latched shutdown ▫ Thermal shutdown (TSD): latched shutdown LC5540LF series is a quasi-resonant topology switching power supply IC, designed for input capacitorless applications, and making it possible for systems to comply with the harmonics standard (IEC61000-3-2 class C). It incorporates separate controller and power MOSFET chips. The controller adapts the average current control method for realizing high power factors, and the quasi-resonant topology contributes to high efficiency and low EMI noise. The rich set of protection features helps to realize low component counts, and high performance-to-cost power supply. Packages: 7-pin TO-220F Not to scale The LC5540LF devices are intended for isolated designs. The incorporated MOSFET has a VDSS(min) rating from 650 V (LC5546LF and LC5547LF) to 800 V (LC5549LF). The RDS(on)(max) is 1.1 Ω (LC5547LF) to 1.9 Ω (LC5546LF). It is capable of a maximum output power of 80 W on 230 VAC supply to 55 W on universal supply (LC5547LF) based on the thermal rating. Note that the maximum output power can be up to 120% to 140% of this value. However, it may be limited in applications with low output voltage or short duty cycle. Applications LF 3052 F1 VAC LF 3051 • LED lighting fixtures • LED light bulbs LF 3054 Typical Application L1 C11 D1 D2 D3 D4 T1 L2 C1 C8 D8 R5 R8 R10 PC2 C2 C9 Q1 C10 D5 R1 U1 LC554xLF R9 PC1 R11 R12 C13 C4 DZ2 PC2 Control Part D6 C17 D/ST S/GND VCC OCP FB NC OVP 1 2 3 4 5 C3 6 7 R7 C5 R2 (Rocp) R4 PC1 C6 D7 C7 R3 LC5540LF-DS SANKEN ELECTRIC CO., LTD. R14 R17 R15 R18 - DZ1 C12 R6 LED R13 D9 U2 + C14 C15 R16 C16 R19 R20 LC5540LF Series Single-Stage Power Factor Corrected Off-Line Switching Regulators Selection Guide MOSFET VDSS(min) (V) Part Number LC5546LF RDS(on) (max) (Ω) 650 LC5547LF LC5549LF 800 POUT* (W) PWM Operation Frequency, fOSC(typ) (kHz) On-Time tON(MAX)(typ) (μs) 230 VAC 60 40 40 17.5 80 55 60 40 1.9 1.1 1.7 Universal *Based on the thermal rating; the allowable maximum output power can be up to 120% to 140% of this value. However, maximum output power may be limited in such an application with low output voltage or short duty cycle. The polarity value for current specifies a sink as "+," and a source as “−,” referencing the IC. Absolute Maximum Ratings Unless specifically noted, TA is 25°C Characteristic Symbol Notes Pins LC5546LF Drain Current1 IDPeak LC5547LF Single pulse 1–2 LC5549LF LC5549LF ILPeak = 2.8 A, VDD = 99 V, L = 20 mH A 10.5 A mJ mJ 92 mJ VCC 3–2 35 V VOCP 4–2 −2.0 to 5.0 V FB Pin Voltage VFB 5–2 −0.3 to 7.0 V OVP Pin Voltage VOVP 7–2 −0.3 to 5.0 V 20.2 W 23.6 W 1.8 W OCP Pin Voltage ILPeak = 4.4 A, VDD = 99 V, L = 20 mH 13.0 99 Input Voltage for Control Part (MIC) ILPeak = 2.9 A, VDD = 99 V, L = 20 mH A 233 EAS LC5547LF Unit 9.2 1–2 Single Pulse Avalanche Energy2 LC5546LF Rating LC5546LF Allowable Power Dissipation of MOSFET3 PD1 LC5547LF With infinite heatsink LC5549LF 1–2 Without heatsink TF ― −20 to 115 °C Operating Ambient Temperature TOP ― −55 to 115 °C Storage Temperature Tstg ― −55 to 125 °C Channel Temperature Tch ― 150 °C 1Refer to MOSFET Safe Operating Area Curve. to MOSFET Avalanche Energy Derating Coefficient Curve. 3Refer to MOSFET Temperature versus Power Dissipation Curve. 2Refer LC5540LF-DS SANKEN ELECTRIC CO., LTD. 2 LC5540LF Series Single-Stage Power Factor Corrected Off-Line Switching Regulators Electrical Characteristics of Control Part (MIC) Unless specifically noted, TA is 25°C, VCC = 20 V Characteristic Symbol Test Conditions Pins Min. Typ. Max. Unit Power Supply Startup Operation Operation Start Voltage VCC(ON) 3–2 13.8 15.1 17.3 V Operation Stop Voltage* VCC(OFF) 3–2 8.4 9.4 10.7 V ICC(ON) 3–2 – – 4.7 mA VSTARTUP 1–2 18 21 24 V 3–2 −8.5 −4.0 −1.5 mA VCC(BIAS) 3–2 9.5 11.0 12.5 V fOSC 1–2 33 40 47 kHz Maximum On-Time tON(MAX) 1–2 14 17.5 21 μs FB Pin Control Minimum Voltage VFB(MIN) 5–2 0.50 0.85 1.20 V Circuit Current in Operation Startup Circuit Operation Voltage Startup Current Startup Current Threshold Biasing Voltage* ICC(STARTUP) VCC = 13 V Normal Operation PWM Operation Frequency Maximum Feedback Current IFB(MAX) 5–2 –40 –25 –10 μA Leading Edge Blanking Time tON(LEB) 4–2 − 600 − ns Quasi-Resonant Operation Threshold Voltage-1 VBD(TH1) 4–2 0.14 0.24 0.34 V Quasi-Resonant Operation Threshold Voltage-2 VBD(TH2) 4–2 0.11 0.16 0.21 V OCP Pin Overcurrent Protection (OCP) Threshold Voltage VOCP 4–2 −0.66 −0.60 −0.54 V OCP Pin Source Current Protected Operation IOCP 4–2 −120 −40 −10 μA OCP Pin Overvoltage Protection (OVP) Operation Voltage VBD(OVP) 4–2 2.2 2.6 3.0 V Overload Protection (OLP) Threshold Voltage VFB(OLP) 5–2 4.1 4.5 4.9 V OVP Pin OVP Threshold Voltage VOVP(OVP) 7–2 1.6 2.0 2.4 V VCC Pin OVP Threshold Voltage VCC(OVP) 3–2 28.5 31.5 34.0 V TJ(TSD) ― 135 – – °C Thermal Shutdown Activating Temperature *VCC(BIAS) > VCC(OFF) always. LC5540LF-DS SANKEN ELECTRIC CO., LTD. 3 LC5540LF Series Single-Stage Power Factor Corrected Off-Line Switching Regulators Electrical Characteristics of MOSFET Unless specifically noted, TA is 25°C Characteristic Drain-to-Source Breakdown Voltage Drain Leakage Current On-Resistance Symbol VDSS Test Conditions Min. Typ. Max. Unit 650 ― ― V LC5549LF 800 ― ― V ― ― 300 μA LC5546LF ― ― 1.9 Ω ― ― 1.1 Ω ― ― 1.7 Ω ― ― 400 ns ― ― 300 ns ― ― 3.1 °C/W ― ― 2.2 °C/W LC5546LF LC5547LF Pins 1–2 IDSS RDS(ON) LC5547LF tf LC5546LF LC5547LF 1–2 LC5549LF Switching Time 1–2 LC5549LF LC5546LF Thermal Resistance* Rθch-F LC5547LF LC5549LF ― *The thermal resistance between the channels of the MOSFET and the internal frame. LC5540LF-DS SANKEN ELECTRIC CO., LTD. 4 LC5540LF Series Single-Stage Power Factor Corrected Off-Line Switching Regulators Characteristic Performance LC5546LF MOSFET Safe Operating Area Curve 10 0.1 ms 100 Drain current limited by on-resistance 80 Drain Current, ID (A) Safe Operating Area Temperature Derating Coefficient (%) S. O. A. Temperature Derating Coefficient Curve 60 40 20 0 0 25 50 75 100 125 1 1 ms 0.1 150 To use this graph, apply the S.O.A temperature derating coefficient taken from the graph at the left Channel Temperature, Tch (°C) 0.01 10 100 1000 Drain-to-Source Voltage, VDS (V) MOSFET Temperature versus Power Dissipation Curve 80 60 40 20 0 25 50 75 100 125 150 30 25 20.2 20 With infinite heatsink 15 10 5 Without heatsink 1.8 0 0 Channel Temperature, Tch (°C) 25 50 115 100 Allowable Power Dissipation, PD1 (W) EAS Temperature Derating Coefficient (%) MOSFET Avalanche Energy Derating Coefficient Curve 75 100 125 150 Ambient Temperature, TA (°C) Transient Thermal Resistance, Rθch-c (°C/W) Transient Thermal Resistance Curve 10 1 0.1 0.01 0.001 10-6 10-5 10-4 10-3 10-2 10-1 Time (s) LC5540LF-DS SANKEN ELECTRIC CO., LTD. 5 LC5540LF Series Single-Stage Power Factor Corrected Off-Line Switching Regulators Characteristic Performance LC5547LF MOSFET Safe Operating Area Curve 100 Drain current limited by on-resistance 100 0.1 ms 10 80 Drain Current, ID (A) Safe Operating Area Temperature Derating Coefficient (%) S. O. A. Temperature Derating Coefficient Curve 60 40 20 1 ms 1 0.1 0 0 25 50 75 100 125 150 To use this graph, apply the S.O.A temperature derating coefficient taken from the graph at the left Channel Temperature, Tch (°C) 0.01 1 10 100 1000 Drain-to-Source Voltage, VDS (V) 100 MOSFET Temperature versus Power Dissipation Curve Allowable Power Dissipation, PD1 (W) EAS Temperature Derating Coefficient (%) MOSFET Avalanche Energy Derating Coefficient Curve 80 60 40 20 0 25 50 75 100 125 150 25 23.6 20 With infinite heatsink 15 10 5 Without heatsink 1.8 0 0 Channel Temperature, Tch (°C) 25 50 75 100 125 150 Ambient Temperature, TA (°C) Transient Thermal Resistance, Rθch-c (°C/W) Transient Thermal Resistance Curve 10 1 0.1 0.01 0.001 10-6 10-5 10-4 10-3 10-2 10-1 Time (s) LC5540LF-DS SANKEN ELECTRIC CO., LTD. 6 LC5540LF Series Single-Stage Power Factor Corrected Off-Line Switching Regulators Characteristic Performance LC5549LF MOSFET Safe Operating Area Curve 100 100 Drain current limited by on-resistance 80 Drain Current, ID (A) Safe Operating Area Temperature Derating Coefficient (%) S. O. A. Temperature Derating Coefficient Curve 60 40 20 0 0 25 50 75 100 125 10 0.1 ms 1 ms 1 150 To use this graph, apply the S.O.A temperature derating coefficient taken from the graph at the left Channel Temperature, Tch (°C) 0.1 10 100 1000 Drain-to-Source Voltage, VDS (V) MOSFET Temperature versus Power Dissipation Curve 80 60 40 20 0 25 50 75 100 125 150 30 25 23.6 With infinite heatsink 20 15 10 5 1.8 0 0 Channel Temperature, Tch (°C) Without heatsink 25 50 115 100 Allowable Power Dissipation, PD1 (W) EAS Temperature Derating Coefficient (%) MOSFET Avalanche Energy Derating Coefficient Curve 75 100 125 150 Ambient Temperature, TA (°C) Transient Thermal Resistance, Rθch-c (°C/W) Transient Thermal Resistance Curve 10 1 0.1 0.01 0.001 10-6 10-5 10-4 10-3 10-2 10-1 Time (s) LC5540LF-DS SANKEN ELECTRIC CO., LTD. 7 LC5540LF Series Single-Stage Power Factor Corrected Off-Line Switching Regulators Functional Block Diagram VCC ③ Contol Part ① D/ST START UP TSD UVLO Reg Drv Bias OVP 7 OVP ⑥ ② S/GND S RQ OCP ④ Bottom Detection NC ⑥ OCP OSC OLP LEB Feedback Control ⑤ FB Reg LC554xF Series Terminal List Table Number Name Function 1 D/ST MOSFET drain terminal and input of the startup current 2 S/GND MOSFET source and GND terminal for the Control Part 3 VCC Supply voltage input and Overvoltage protection (OVP) signal input 4 OCP Overcurrent Protection, quasi-resonant signal input terminal, and Overvoltage Protection (OVP) signal input 5 FB Feedback signal input and Overload Protection (OLP) signal input 6 NC No connection 7 OVP Overvoltage Protection (OVP) signal input Pin-out Diagrams D/ST S/GND 2 VCC 3 OCP 4 FB NC OVP LC5540LF-DS D/ST 1 S/GND (LF 3051) 5 6 7 1 2 VCC OCP 3 4 FB NC OVP (LF 3052) 5 6 7 SANKEN ELECTRIC CO., LTD. 1 D/ST 2 S/GND 3 VCC 4 OCP 5 FB 6 NC 7 OVP (LF 3054) 8 LC5540LF Series Single-Stage Power Factor Corrected Off-Line Switching Regulators Package Outline Drawing Leadframe 3051 2.6 ±0.2 15 ±0.3 （5.6） Gate burr Ø3.2 ±0.2 4.2 ±0.2 2.8 +0.2 10 ±0.2 LC （1.1） a 2.6 ±0.1 （At base of pin） 10.4 ±0.5 7-0.62 ±0.15 +0.2 7-0.55 -0.1 R-end R-end +0.2 0.45 -0.1 5×P1.17±0.15 ＝5.85±0.15 2 ±0.15 5±0.5 5±0.5 b （At base of pin） 5.08±0.6 2.54±0.6 （At tip of pin） （At tip of pin） 2 1 4 3 6 5 7 0.5 0.5 Front view Unit: mm Package: TO-220F-7L Leadframe material: Cu Pin treatment: Solder dip Weight: Approximately 1.45 g Note: "Gate Burr" shows area where 0.3 mm (max) gate burr may be present. Pin treatment Pb-free. Device composition compliant with the RoHS directive. LC5540LF-DS 0.5 0.5 Side view a: Part # 556xLF b: Lot number st 1 letter: Last digit of year nd 2 letter: Month Jan to September: Numeric October: O November: N December: D rd th 3 and 4 letter: Date 01 to 31: Numeric th 5 letter: Internal use control number SANKEN ELECTRIC CO., LTD. 9 LC5540LF Series Single-Stage Power Factor Corrected Off-Line Switching Regulators Package Outline Drawing Leadframe 3052 2.6 ±0.2 LC 15 ±0.3 （5.6） Gate burr Ø3.2 ±0.2 4.2 ±0.2 2.8 +0.2 10 ±0.2 a （1.1） 2.6 ±0.1 （At base of pin） 5±0.5 b 10.4 ±0.5 7-0.62 ±0.15 +0.2 7-0.55 -0.1 0.45 +0.2 -0.1 5×P1.17±0.15 ＝5.85±0.15 2 ±0.15 R-end 5.08±0.6 （At base of pin） （At tip of pin） 0.5 0.5 Front View 1 0.5 0.5 Side View 2 3 4 5 6 7 Unit: mm Package: TO-220F-7L Leadframe material: Cu Pin treatment: Solder dip Weight: Approximately 1.45 g "Gate Burr" shows area where 0.3 mm (max) gate burr may be present a: Part # 556xLF b: Lot number st 1 letter: Last digit of year nd 2 letter: Month Jan to September: Numeric October: O November: N December: D rd th 3 and 4 letter: Date 01 to 31: Numeric th 5 letter: Internal use control number Pin treatment Pb-free. Device composition compliant with the RoHS directive. LC5540LF-DS SANKEN ELECTRIC CO., LTD. 10 LC5540LF Series Single-Stage Power Factor Corrected Off-Line Switching Regulators 2.8 ±0.2 Package Outline Drawing Leadframe 3054 2.6 ±0.2 a b 2.8 ±0.5 （At tip of pin） 2.5 ±0.5 LC 15 ±0.3 (5.6) Gate burr 4.2±0.2 Ø3.2 ±0.2 10 ±0.2 (1.1) 3-( R1) 2.6 ±0.1 （At base of pin） （At base of pin） 0.5 （At tip of pin） 5×P 1.17 ±0.15 = 5.85 ±0.15 2 ±0.15 +0.2 0.45 -0.1 7-0.55 +0.2 -0.1 5 ±0.5 7-0.62 ±0.15 3.8 ±0.5 0.5 Plan View 1 0.5 0.5 Side View 2 3 4 5 6 7 Unit: mm Package: TO-220F-7L Leadframe material: Cu Pin treatment: Solder dip Weight: Approximately 1.45 g "Gate Burr" shows area where 0.3 mm (max) gate burr may be present a: Part # 556xLF b: Lot number st 1 letter: Last digit of year nd 2 letter: Month Jan to September: Numeric October: O November: N December: D rd th 3 and 4 letter: Date 01 to 31: Numeric th 5 letter: Internal use control number Pin treatment Pb-free. Device composition compliant with the RoHS directive. LC5540LF-DS SANKEN ELECTRIC CO., LTD. 11 LC5540LF Series Single-Stage Power Factor Corrected Off-Line Switching Regulators Because reliability can be affected adversely by improper storage environments and handling methods, please observe the following cautions. Cautions for Storage • Ensure that storage conditions comply with the standard temperature (5°C to 35°C) and the standard relative humidity (around 40% to 75%); avoid storage locations that experience extreme changes in temperature or humidity. • Avoid locations where dust or harmful gases are present and avoid direct sunlight. • Reinspect for rust on leads and solderability of products that have been stored for a long time. Cautions for Testing and Handling When tests are carried out during inspection testing and other standard test periods, protect the products from power surges from the testing device, shorts between the product pins, and wrong connections. Remarks About Using Silicone Grease with a Heatsink • When silicone grease is used in mounting this product on a heatsink, it shall be applied evenly and thinly. If more silicone grease than required is applied, it may produce excess stress. • Volatile-type silicone greases may crack after long periods of time, resulting in reduced heat radiation effect. Silicone grease with low consistency (hard grease) may cause cracks in the mold resin when screwing the product to a heatsink. • Our recommended silicone greases for heat radiation purposes, which will not cause any adverse effect on the product life, are indicated below: • Please select suitable screws for the product shape. Do not use a flat-head machine screw because of the stress to the product. Self-tapping screws are not recommended. When using self-tapping screws, the screw may enter the hole diagonally, not vertically, depending on the conditions of hole before threading or the work situation. That may stress the products and may cause failures. • • Recommended screw torque: 0.588 to 0.785 N●m (6 to 8 kgf●cm). Type Suppliers G746 Shin-Etsu Chemical Co., Ltd. YG6260 MOMENTIVE Performance Materials, Inc SC102 Dow Corning Toray Co., Ltd. Cautions for Mounting to a Heatsink • When the flatness around the screw hole is insufficient, such as when mounting the product to a heatsink that has an extruded (burred) screw hole, the product can be damaged, even with a lower than recommended screw torque. For mounting products, the mounting surface flatness should be 0.05 mm or less. LC5540LF-DS For tightening screws, if a tightening tool (such as a driver) hits the product, the package may crack, and internal stress fractures may occur, which shorten the lifetime of the electrical elements and can cause catastrophic failure. Tightening with an air driver makes a substantial impact. In addition, a screw torque higher than the set torque can be applied and the package may be damaged. Therefore, an electric driver is recommended. When the package is tightened at two or more places, first pre-tighten with a lower torque at all places, then tighten with the specified torque. When using a power driver, torque control is mandatory. Soldering • When soldering the products, please be sure to minimize the working time, within the following limits: 260±5°C 10±1 s (Flow, 2 times) 380±10°C 3.5±0.5 s (Solder iron, 1 time) • Soldering iron should be at a distance of at least 1.5 mm from the body of the products Electrostatic Discharge • When handling the products, the operator must be grounded. Grounded wrist straps worn should have at least 1 MΩ of resistance from the operator to ground to prevent shock hazard, and it should be placed near the operator. • Workbenches where the products are handled should be grounded and be provided with conductive table and floor mats. • When using measuring equipment such as a curve tracer, the equipment should be grounded. • When soldering the products, the head of soldering irons or the solder bath must be grounded in order to prevent leak voltages generated by them from being applied to the products. • The products should always be stored and transported in Sanken shipping containers or conductive containers, or be wrapped in aluminum foil. SANKEN ELECTRIC CO., LTD. 12 LC5540LF Series Single-Stage Power Factor Corrected Off-Line Switching Regulators • The contents in this document are subject to changes, for improvement and other purposes, without notice. Make sure that this is the latest revision of the document before use. • Application and operation examples described in this document are quoted for the sole purpose of reference for the use of the products herein and Sanken can assume no responsibility for any infringement of industrial property rights, intellectual property rights or any other rights of Sanken or any third party which may result from its use. • Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device failure or malfunction. • Sanken products listed in this document are designed and intended for the use as components in general purpose electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). When considering the use of Sanken products in the applications where higher reliability is required (transportation equipment and its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), and whenever long life expectancy is required even in general purpose electronic equipment or apparatus, please contact your nearest Sanken sales representative to discuss, prior to the use of the products herein. The use of Sanken products without the written consent of Sanken in the applications where extremely high reliability is required (aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited. • In the case that you use our semiconductor devices or design your products by using our semiconductor devices, the reliability largely depends on the degree of derating to be made to the rated values. Derating may be interpreted as a case that an operation range is set by derating the load from each rated value or surge voltage or noise is considered for derating in order to assure or improve the reliability. In general, derating factors include electric stresses such as electric voltage, electric current, electric power etc., environmental stresses such as ambient temperature, humidity etc. and thermal stress caused due to self-heating of semiconductor devices. For these stresses, instantaneous values, maximum values and minimum values must be taken into consideration. In addition, it should be noted that since power devices or IC’s including power devices have large self-heating value, the degree of derating of junction temperature (Tj) affects the reliability significantly. • When using the products specified herein by either (i) combining other products or materials therewith or (ii) physically, chemically or otherwise processing or treating the products, please duly consider all possible risks that may result from all such uses in advance and proceed therewith at your own responsibility. • Anti radioactive ray design is not considered for the products listed herein. • Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of Sanken’s distribution network. • The contents in this document must not be transcribed or copied without Sanken’s written consent. LC5540LF-DS SANKEN ELECTRIC CO., LTD. 13