TI AM26LV31E-EP

AM26LV31E-EP
www.ti.com............................................................................................................................................................................................ SLLS947 – NOVEMBER 2008
LOW-VOLTAGE HIGH-SPEED QUADRUPLE DIFFERENTIAL LINE DRIVER
WITH ±15-kV IEC ESD PROTECTION
FEATURES
1
•
•
•
•
•
•
•
•
•
•
•
•
•
Meets or Exceeds Standards TIA/EIA-422-B
and ITU Recommendation V.11
Operates From a Single 3.3-V Power Supply
ESD Protection for RS422 Bus Pins
– ±15-kV Human-Body Model (HBM)
– ±8-kV IEC61000-4-2, Contact Discharge
– ±15-kV IEC61000-4-2, Air-Gap Discharge
Switching Rates up to 32 MHz
Propagation Delay Time . . . 8 ns Typ
Pulse Skew Time . . . 500 ps Typ
High Output-Drive Current . . . ±30 mA
Controlled Rise and Fall Times . . . 5 ns Typ
Differential Output Voltage With 100-Ω
Load . . . 2.6 V Typ
Accepts 5-V Logic Inputs With 3.3-V Supply
Ioff Supports Partial-Power-Down Mode
Operation
Driver Output Short-Protection Circuit
Glitch-Free Power-Up/Power-Down Protection
SUPPORTS DEFENSE, AEROSPACE,
AND MEDICAL APPLICATIONS
•
•
•
•
•
•
•
Controlled Baseline
One Assembly/Test Site
One Fabrication Site
Available in Extended (–55°C/105°C)
Temperature Range (1)
Extended Product Life Cycle
Extended Product-Change Notification
Product Traceability
D PACKAGE
(TOP VIEW)
1A
1Y
1Z
G
2Z
2Y
2A
GND
(1)
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
VCC
4A
4Y
4Z
G
3Z
3Y
3A
Additional temperature ranges are available – contact factory
DESCRIPTION/ORDERING INFORMATION
The AM26LV31E is a quadruple differential line driver with 3-state outputs. This driver has ±15-kV ESD
(HBM and IEC61000-4-2, Air-Gap Discharge) and ±8-kV ESD (IEC61000-4-2, Contact Discharge) protection.
This device is designed to meet TIA/EIA-422-B and ITU Recommendation V.11 drivers with reduced supply
voltage.
The device is optimized for balanced-bus transmission at switching rates up to 32 MHz. The outputs have high
current capability for driving balanced lines, such as twisted-pair transmission lines, and provide a high
impedance in the power-off condition.
The AM26LV31ES is characterized for operation from –55°C to 105°C.
ORDERING INFORMATION
TA
–55°C to 105°C
(1)
(2)
PACKAGE
SOIC – D
(1) (2)
Tape and reel
ORDERABLE PART NUMBER
AM26LV31ESDREP
TOP-SIDE MARKING
A26LV31ESP
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008, Texas Instruments Incorporated
AM26LV31E-EP
SLLS947 – NOVEMBER 2008............................................................................................................................................................................................ www.ti.com
FUNCTION TABLE (1)
(1)
ENABLES
OUTPUTS
INPUT
A
G
G
Y
Z
H
H
X
H
L
H
L
H
X
L
H
X
L
H
L
L
X
L
L
H
X
L
H
Z
Z
H = high level, L = low level, X = irrelevant,
Z = high impedance (off)
LOGIC DIAGRAM
G
G
1A
2A
3A
4A
4
12
2
1
3
6
7
5
10
9
11
14
15
13
1Y
1Z
2Y
2Z
3Y
3Z
4Y
4Z
SCHEMATIC
EQUIVALENT OF EACH INPUT (A, G, OR G)
TYPICAL OF EACH DRIVER OUTPUT
VCC
VCC
2
Input
Output
GND
GND
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): AM26LV31E-EP
AM26LV31E-EP
www.ti.com............................................................................................................................................................................................ SLLS947 – NOVEMBER 2008
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range (2)
–0.5
6
V
VI
Input voltage range
–0.5
6
V
VO
Output voltage range
IIK
Input clamp current
VI < 0
–20
mA
IOK
Output clamp current
VO < 0
–20
mA
lO
Continuous output current
±150
mA
Continuous current through VCC or GND
±200
mA
150
°C
TJ
–0.5
Operating virtual junction temperature
6
UNIT
V
θJA
Package thermal impedance
73
°C/W
TA
Operating free-air temperature range
–55
105
°C
Tstg
Storage temperature range
–65
150
°C
(1)
(2)
(3)
(4)
(3) (4)
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values except differential input voltage are with respect to the network GND.
Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Selecting the maximum of 150°C can affect reliability.
The package thermal impedance is calculated in accordance with JESD 51-7.
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): AM26LV31E-EP
3
AM26LV31E-EP
SLLS947 – NOVEMBER 2008............................................................................................................................................................................................ www.ti.com
RECOMMENDED OPERATING CONDITIONS
MIN
NOM
MAX
UNIT
3.3
3.6
V
5.5
V
VCC
Supply voltage
3
VI
Input voltage
0
VIH
High-level input voltage
2
VIL
Low-level input voltage
0.8
V
IOH
High-level output current
–30
mA
IOL
Low-level output current
30
mA
TA
Operating free-air temperature
105
°C
MAX
UNIT
V
–55
ELECTRICAL CHARACTERISTICS
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VOH
High-level output voltage
VIH = 2 V, VIL = 0.8 V, IOH = –20 mA
VOL
Low-level output voltage
VIH = 2 V, VIL = 0.8 V, IOL = 20 mA
|VOD1|
Differential output voltage
IO = 0 mA
MIN
2.4
TYP (1)
3
V
0.2
2
|VOD2|
Differential output voltage
RL = 100 Ω (see Figure 1)
(2)
Δ|VOD|
Change in magnitude of
differential output voltage
RL = 100 Ω (see Figure 1)
(2)
VOC
Common-mode output voltage
RL = 100 Ω (see Figure 1) (2)
Δ|VOC|
Change in magnitude of
common-mode output voltage
RL = 100 Ω (see Figure 1)
(2)
IO(OFF)
Output current with power off
IOZ
II
2
0.4
V
4
V
2.6
V
±0.4
V
2
V
±0.4
V
VCC = 0, VO = –0.25 V or 5.5 V
±127
µA
High-impedance state output current
VO = –0.25 V or 5.5 V, G = 0.8 V or G = 2 V
±127
µA
Input current
VCC = 0 or 3.6 V, VI = 0 or 5.5 V
IOS
Short-circuit output current
VO = VCC or GND (3)
ICC
Supply current (total package)
VI = VCC or GND, No load, enable
Cpd
Power dissipation capacitance
No load (4)
(1)
(2)
(3)
(4)
4
1.5
–30
±10
µA
–150
mA
100
µA
160
pF
All typical values are at VCC = 3.3 V, TA = 25°C.
Refer to TIA-EIA-422-B for exact conditions.
Not more than one output should be shorted at a time, and the duration of the short circuit should not exceed one second.
Cpd determines the no-load dynamic current consumption: IS = Cpd × VCC × f + ICC
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): AM26LV31E-EP
AM26LV31E-EP
www.ti.com............................................................................................................................................................................................ SLLS947 – NOVEMBER 2008
SWITCHING CHARACTERISTICS
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP (1)
MAX
4
8
12
ns
3.5
8
12
ns
UNIT
tPHL
Propagation delay time, high- to low-level output
tPLH
Propagation delay time, low- to high-level output
tt
Transition time (tr or tf)
See Figure 2
5
10
ns
tPZH
Output-enable time to high level
See Figure 3
10
20
ns
tPZL
Output-enable time to low level
See Figure 4
10
20
ns
tPHZ
Output-disable time from high level
See Figure 3
10
20
ns
tPLZ
Output-disable time from low level
See Figure 4
10
20
ns
tsk(p)
Pulse skew
0.5
3
ns
1.5
ns
tsk(o)
Skew limit (pin to pin)
tsk(lim)
Skew limit (device to device)
f(max)
Maximum operating frequency
(1)
(2)
(3)
See Figure 2
See Figure 2
(2) (3)
3
See Figure 2
32
ns
MHz
All typical values are at VCC = 3.3 V, TA = 25°C.
Pulse skew is defined as the |tPLH – tPHL| of each channel of the same device.
Skew limit (device to device) is the maximum difference in propagation delay times between any two channels of any two devices.
ESD PROTECTION
PARAMETER
Driver output
TEST CONDITIONS
TYP
HBM
±15
IEC61000-4-2, Air-Gap Discharge
±15
IEC61000-4-2, Contact Discharge
±8
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): AM26LV31E-EP
UNIT
kV
5
AM26LV31E-EP
SLLS947 – NOVEMBER 2008............................................................................................................................................................................................ www.ti.com
PARAMETER MEASUREMENT INFORMATION
RL/2
VOD
VOC
RL/2
Figure 1. Test Circuit, VOD and VOC
C2 = 40 pF
Y
Input
C1 = 40 pF
Z
RL = 100 Ω
C3 = 40 pF
See Note A
VCC
Input
50%
50%
A
0V
tPHL
tPLH
Z
Output, V O
Y
PROPAGATION DELAY TIMES
90%
10%
Y
VOH
90%
10%
tr
tf
tf
tr
VOL
Output, V O
Z
90%
90%
10%
10%
VOH
VOL
RISE AND FALL TIMES
NOTES: A. CL includes probe and jig capacitance.
B.
tr and tf ≤ 2 ns.
Figure 2. Test Circuit and Voltage Waveforms, tPHL and tPLH
6
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): AM26LV31E-EP
AM26LV31E-EP
www.ti.com............................................................................................................................................................................................ SLLS947 – NOVEMBER 2008
PARAMETER MEASUREMENT INFORMATION (continued)
Y
A
VCC
S1
Z
Output
CL = 40 pF
(see Note A)
RL = 110 Ω
G
Generator
(see Note B)
G
50 Ω
VCC
(see Note C)
TEST CIRCUIT
VCC
50%
Input
50%
0V
t PHZ
t PZH
0.3 V
VOH
Output
50%
Voff ≈ 0
VOLTAGE WAVEFORMS
A.
CL includes probe and jig capacitance.
B.
The input pulse is supplied by a generator having the following characteristics: PRR = 10 MHz, duty cycle = 50%,
tr = tf ≤ 2ns.
C.
To test the active-low enable G, ground G and apply an inverted waveform G.
Figure 3. Test Circuit and Voltage Waveforms, tPZH and tPHZ
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): AM26LV31E-EP
7
AM26LV31E-EP
SLLS947 – NOVEMBER 2008............................................................................................................................................................................................ www.ti.com
PARAMETER MEASUREMENT INFORMATION (continued)
VCC
Y
A
VCC
RL = 110 Ω
S1
Z
Output
CL = 40 pF
(see Note A)
G
Generator
(see Note B)
G
50 Ω
VCC
(see Note C)
TEST CIRCUIT
VCC
Input
50%
50%
0V
t PLZ
t PZL
Voff ≈ VCC
Output
50%
VOL
VOLTAGE WAVEFORMS
0.3 V
A.
CL includes probe and jig capacitance.
B.
The input pulse is supplied by a generator having the following characteristics: PRR = 10 MHz, duty cycle = 50%,
tr = tf ≤ 2ns.
C.
To test the active-low enable G, ground G and apply an inverted waveform G.
Figure 4. Test Circuit and Voltage Waveforms, tPZL and tPLZ
8
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): AM26LV31E-EP
PACKAGE OPTION ADDENDUM
www.ti.com
17-Nov-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
AM26LV31ESDREP
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
V62/09603-01XE
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF AM26LV31E-EP :
• Catalog: AM26LV31E
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
Addendum-Page 1
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee® Solutions
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2008, Texas Instruments Incorporated