SECOS SSQ6N60

SSQ6N60
2.6A, 600V, RDS(ON) 1500mΩ
N-Ch Enhancement Mode Power MOSFET
Elektronische Bauelemente
RoHS Compliant Product
A suffix of “-C” specifies halogen free
TO-220P
D
FEATURES



C
Low RDS(on) Technology.
Low thermal impedance.
Fast switching speed.
B
E


T
S
G
APPLICATIONS

R
A
F
Electronic ballast.
Electronic transformer
Switch mode power supply.
H
J
I
K
L
U
M
X
P
N
O
Q
1 2 3
V
W
Q
Dimensions in millimeters

Drain
REF.
A
B
C
D
E
F
G
H
J
K
L
M

Gate

Source
Millimeter
Min.
Max.
7.90
8.10
9.45
9.65
9.87
10.47
11.50
1.06
1.46
2.60
3.00
6.30
6.70
8.35
8.75
1.60 Typ.
1.10
1.30
1.17
1.37
1.50
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise specified)
PARAMETER
SYMBOL
RATINGS
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Current
1
2
Continuous Source Current (Diode Conduction)
Total Power Dissipation
1
1
Operating Junction and Storage Temperature Range
REF.
N
O
P
Q
R
S
T
U
V
W
X
Millimeter
Min.
Max.
0.75
0.95
0.66
0.86
13.50
14.50
2.44
3.44
3.50
3.70
1.15
1.45
4.30
4.70
2.7
1.89
3.09
0.40
0.60
2.60
3.60
UNIT
VDS
600
V
VGS
±20
V
ID @TC=25℃
2.6
A
IDM
16
A
IS
2.6
A
PD @TC=25℃
36
W
TJ, TSTG
-55 ~ 175
°C
THERMAL RESISTANCE RATINGS
Maximum Thermal Resistance Junction-Ambient 1
RθJA
62.5
°C / W
Maximum Thermal Resistance Junction-Case
RθJC
3.47
°C / W
Notes:
1
Package Limited.
2
Pulse width limited by maximum junction temperature.
http://www.SeCoSGmbH.com/
02-Dec-2010 Rev.A
Any changes of specification will not be informed individually.
Page 1 of 4
SSQ6N60
2.6A, 600V, RDS(ON) 1500mΩ
N-Ch Enhancement Mode Power MOSFET
Elektronische Bauelemente
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise specified)
PARAMETER
SYMBO MIN. TYP. MAX. UNIT
TEST CONDITIONS
Static
Gate-Threshold Voltage
VGS(th)
2
-
4
V
VDS= VGS, ID = 250 μA
Gate-Body Leakage
IGSS
-
-
±100
nA
VDS = 0V, VGS= ±20V
Zero Gate Voltage Drain Current
IDSS
-
-
25
-
-
250
On-State Drain Current 1
ID(on)
5
-
-
A
Drain-Source On-Resistance 1
RDS(ON)
-
-
1500
mΩ
VGS= 10V, ID= 2.2 A
Forward Transconductance 1
gfs
-
2.5
-
S
VDS= 40V, ID= 2.2 A
Diode Forward Voltage
VSD
-
1.4
-
V
IS= 2.6 A, VGS= 0 V
μA
VDS= 600V, VGS= 0V
VDS= 480V,
VGS= 0V, TJ=125°C
VDS = 10V, VGS= 10V
Dynamic 2
Total Gate Charge
Qg
-
16
-
Gate-Source Charge
Qgs
-
3.4
-
Gate-Drain Charge
Qgd
-
8
-
Turn-on Delay Time
Td(on)
-
12.6
-
Tr
-
6.8
-
Td(off)
-
26.4
-
Tf
-
8.8
-
Input Capacitance
CISS
-
557
-
Output Capacitance
COSS
-
84
-
Reverse Transfer Capacitance
CRSS
-
20
-
Rise Time
Turn-off Delay Time
Fall Time
nC
VDS = 480 V
VGS = 10 V
ID = 2.2 A
nS
VDD= 300 V
ID= 2.2 A
VGEN = 10 V
RL= 136 
RGEN = 12 
pF
VDS = 25 V
VGS = 0 V
f = 1MHz
Notes
1
Pulse test:Pulse width ≦ 300 μs, duty cycle ≦ 2%.
2
Guaranteed by design, not subject to production testing.
http://www.SeCoSGmbH.com/
02-Dec-2010 Rev.A
Any changes of specification will not be informed individually.
Page 2 of 4
SSQ6N60
Elektronische Bauelemente
2.6A, 600V, RDS(ON) 1500mΩ
N-Ch Enhancement Mode Power MOSFET
CHARACTERISTIC CURVE
http://www.SeCoSGmbH.com/
02-Dec-2010 Rev.A
Any changes of specification will not be informed individually.
Page 3 of 4
SSQ6N60
Elektronische Bauelemente
2.6A, 600V, RDS(ON) 1500mΩ
N-Ch Enhancement Mode Power MOSFET
CHARACTERISTIC CURVE
http://www.SeCoSGmbH.com/
02-Dec-2010 Rev.A
Any changes of specification will not be informed individually.
Page 4 of 4