SEMIKRON SKAI90A2GD06

SKAI 90 A2 GD06-W12DI
Characteristics
Symbol
Conditions
min.
typ.
max.
Unit
450
V
Electrical Data
HV SKAI 2
Three-phase IGBT inverter
Visol
DC, t = 1 s
3000
VCC
DC supply voltage
350
Inom
rms @ rated conditions: dV/dt = 10l/
min, 50% Glykol/ 50% H20, fsw = 4kHz,
VCC = 350V, Vout = 200V, fout = 50 Hz,
cos(phi) = 0.85, M = 0.93,
Tcoolant = 65 °C, Tair = 65 °C
300
fsw
Switching frequency
1
15
kHz
CDC
DC Bus Capacitance
0.9
1.25
mF
Cy
EMI Capacitor; DC to enclosure
0.66
RF
DC+ to enclosure, DC- to enclosure
7.5
M
RBL
DC+ to DC-
1
M
V
A
µF
SKAI 90 A2 GD06-W12DI
Mechanical Data
Target Data
Weight
15
kg
Features
Height
109
mm
Width
244
mm
Length
475
mm
•
•
•
•
Optimized for HEV and EV
high power density
high overload capability
Compact integration in IP67 Enclosure:
V, I, T sensors
Gate driver with protection features
EMI filters
Liquid cooling
DC link capacitor
Typical Applications*
• commercial application vehicle
• hybrid vehicle
• battery driven vehicle
No. 14282013
Mt
AC / DC terminals (M8 screw)
13
14
15
Nm
Mc
Cover of terminal box (M5x16
flat-head-screw)
3.5
4
4.5
Nm
Mcg
Me
Mgnd
AC / DC cable glands (recommended)
Assembly of
M8 screw
enclosure;
thread (l): > 15mm M6 screw
Ground connection
10
13
Hydraulical Data
Pressure [email protected] 10l/min,
dp
Tcoolant = 25°C
p
Operating pressure
P
14
Nm
20
Nm
14
Nm
15
Nm
100
mbar
2
Power dissipation to coolant; rated
conditions
1.9
bar
kW
Environmental Data
Tstg
storage temperature
-40
85
°C
Tno
Non operating temperature range
Operating range, derating for
Tair > 85°C
Operating range, derating for
Tcoolant > 65°C
Enclosure protection level
-40
105
°C
-40
105
°C
-40
75
°C
5000
m
Tair
Tcoolant
IP
With external connector protection
Altitude
VCC =450 V
IP67
IP6K9K
HV SKAI 2
© by SEMIKRON
Rev. 10 – 20.04.2011
1
SKAI 90 A2 GD06-W12DI
Characteristics
Symbol
Conditions
min.
typ.
max.
Unit
8
12
16
V
900
mA
3000
mA
Vs + 0.3
V
0.3 * Vs
V
0.9
s
3
s
Interface parameters
Vs
ViH
Auxiliary supply current primary side
without driving a gate (Vs = 12 V)
Auxiliary supply current primary side,
driving the gates (Vs = 12 V)
Input signal voltage (HIGH)
ViL
Input signal voltage (LOW)
tPOR
Power-on reset completed
tpRESET
Error reset time
ISO
IS
HV SKAI 2
Three-phase IGBT inverter
SKAI 90 A2 GD06-W12DI
Target Data
Features
•
•
•
•
Optimized for HEV and EV
high power density
high overload capability
Compact integration in IP67 Enclosure:
V, I, T sensors
Gate driver with protection features
EMI filters
Liquid cooling
DC link capacitor
Typical Applications*
• commercial application vehicle
• hybrid vehicle
• battery driven vehicle
No. 14282013
0.7 * Vs
GND - 0.3
0.1
Controller switching parameters
td(on)IO
Input-output turn-on propagation time
0.5
0.6
µs
td(off)IO
Input-output turn-off propagation time
0.5
0.6
µs
tjitter
Signal transfer prim - sec (total jitter)
50
ns
tSIS
Short pulse suppression time
0.2
0.25
0.3
µs
tet
Input impulse extension time
0.9
1
1.1
µs
td(err)DSCP
Error input-output propagation time for
DSCP error
0.2
1
µs
td(err)OCP
Error input-output propagation time for
OCP error
10
µs
td(err)TMP
Error input-output propagation time for
temperature error
50
ms
tTD
Top-Bot interlock dead time
4
4.1
µs
tbl
VCE monitoring blanking time
5
5.1
µs
4
Protection functions
TPCBtrip
Over temperature protection trip level
(PCB)
100
°C
TCStrip
Over temperature protection trip level
on ceramic-substrate
120
°C
TRelPCBtrip
Release temperature for PCB
overtemperature trip level
90
°C
TRelCStrip
Release temperature for ceramic
substrate overtemperature trip level
85
°C
VDCtrip
Trip level of DC-link voltage monitoring
450
V
VVStrip
Under voltage protection trip level of
board primary side
VVSrst
Threshold voltage level for driver reset
after failure event
ITRIPSC
7
V
8
V
Overcurrent trip level
850
APEAK
Ioutsens
AC sensing range
-924
mIoutsens
Gradient of output current sensing
10.8
BWIoutsens
Bandwidth (3 dB) of AC current sensing
VDCsens
Measurable DC-link voltage
mVDCsens
Gradient of DC-link voltage sensing
BWVDCsens
Bandwidth (3 dB) of DC-link voltage
sensing
TCSsens
Temperature sensing range on ceramic
substrate
mTCSsens
Gradient of temperature sensing on
ceramic-substrate
83.3
mV/°C
BWTCSsens
Bandwidth of temperature sensing on
ceramic-substrate
100
Hz
11.13
924
A
11.47
mV/A
17
kHz
0
19.669
20.067
600
V
20.472
mV/V
0.25
30
kHz
150
°C
HV SKAI 2
2
Rev. 10 – 20.04.2011
© by SEMIKRON
SKAI 90 A2 GD06-W12DI
Signal Connector
PIN
Signal
Function
Specifications
X1:01
PWR_VP
INPUT
Auxiliary power supply / battery “+”
Supply voltage Vs
X1:02
PWR_GND
Auxiliary power supply ground
Ground of auxiliary power supply
X1:03
DC_LINK_DISCHAR INPUT
GE
HIGH, NOT CONNECTED (n.c.) or module
not supplied with Auxiliary power = DC Link
discharge active
LOW = DC Link discharge disabled
(internal pull-up resistor, external pull-up
resistor required as well)
X1:04
CMN_HALT
INPUT/OUTPUT
All connected units have to change the signal
mode to „dominant“ if following happens:
The unit is not ready to operate
Error happened
All connected units must be able to process
(read) the signal. In case of recognised
dominant signal, following steps need to be
performed:
The unit must be switched to a defined safe
operation mode
The unit must interrupt the main process unitl
a recessive signal has been recognised
LOW (dominant) = not ready to operate
HIGH (recessive) = ready to operate
X1:05
CMN_TEMP_GND
Ground for temperature sensor signal
CMN_TEMP
Internally connected to PWR_GND
X1:06
HB1_TOP
INPUT
Switching PWM signal [push/pull]
Digital PWR_VP logic
LOW = IGBT off
HIGH = IGBT on
X1:07
HB1_BOT
INPUT
Switching PWM signal [push/pull]
Digital PWR_VP logic
LOW = IGBT off
HIGH = IGBT on
X1:08
HB2_TOP
INPUT
Switching PWM signal [push/pull]
Digital PWR_VP logic
LOW = IGBT off
HIGH = IGBT on
X1:09
HB2_BOT
INPUT
Switching PWM signal [push/pull]
Digital PWR_VP logic
LOW = IGBT off
HIGH = IGBT on
X1:10
HB3_TOP
INPUT
Switching PWM signal [push/pull]
Digital PWR_VP logic
LOW = IGBT off
HIGH = IGBT on
X1:11
HB3_BOT
INPUT
Switching PWM signal [push/pull]
Digital PWR_VP logic
LOW = IGBT off
HIGH = IGBT on
X1:12
CAN_GND
© by SEMIKRON
GND
Ground of CAN bus
Rev. 10 – 20.04.2011
3
SKAI 90 A2 GD06-W12DI
PIN
Signal
Function
Specifications
X1:13
PWR_VP
INPUT
Auxiliary power supply / battery “+”
Supply voltage Vs
X1:14
PWR_GND
Auxiliary power supply ground
Ground of auxiliary power supply
X1:15
CMN_GND
Ground for CMN_DIAG, CMN_HALT,
CMN_GPIO
Internally connected to PWR_GND
X1:16
CMN_TEMP
OUTPUT
Temperature sensor signal CMN_TEMP
This pin is used to transmit the temperature
sensor analog signal.
Max. output current: 5 mA
Nominal voltage range: 0…10 V
X1:17
Reserved
X1:18
HB1_GND
X1.19
Reserved
X1:20
HB2_GND
Ground for HB1_TOP, HB1_BOT
Internally connected to PWR_GND
Ground for HB2_TOP, HB2_BOT
Internally connected to PWR_GND
X1:21
Reserved
X1:22
HB3_GND
Ground for HB3_TOP, HB3_BOT
Internally connected to PWR_GND
X1:23
CAN_L
INPUT/OUTPUT
CAN interface LOW line
Input impedance = 121 
Specification:
ISO 11783 (2.5V, 250 kbit/sec minimum,
quad twisted cable) or J1939/11 (250 kbit/sec
minimum, twisted shielded pair).
X1:24
PWR_VP
INPUT
Auxiliary power supply / battery “+”
Supply voltage Vs
X1:25
PWR_GND
Auxiliary power supply ground
Ground of auxiliary power supply
X1:26
CMN_DIAG
INPUT/OUTPUT
Single line CAN communication
[dominant/recessive]
Dominant/Recessive diagnose input/output
signal. All connected units can communicate
using this serial signal for setting/getting
parameters of the unit and reading error
information from unit registers.
X1:27
CMN_DCL
OUTPUT
DC-Link voltage signal
[analog]
This pin is used to transmit the DC-Link
voltage level.
Max. output current: 5 mA
Nominal voltage range: 0….+10 V
X1:28
CMN_DCL_GND
Ground for DC-Link voltage signal CMN_DCL Internally connected to PWR_GND
X1:29
HB1_I
OUTPUT
Current sensor out for HB1
[analog]
Max. output current: 5 mA
Nominal voltage range: -10 … +10 V
X1:30
HB1_I_GND
Ground for HB1_I
Internally connected to PWR_GND
X1:31
HB2_I
OUTPUT
Current sensor out for HB2
[analog]
Max. output current: 5 mA
Nominal voltage range: -10 … +10 V
X1:32
HB2_I_GND
Ground for HB2_I
Internally connected to PWR_GND
X1:33
HB3_I
OUTPUT
Current sensor out for HB3
[analog]
Max. output current: 5 mA
Nominal voltage range: -10 … +10 V
X1:34
HB3_I_GND
Ground for HB3_I
Internally connected to PWR_GND
X1:35
CAN_H
INPUT/OUTPUT
CAN interface HIGH line
Input impedance = 121 
Specification:
ISO 11783 (2.5V, 250 kbit/sec minimum,
quad twisted cable) or J1939/11 (250 kbit/sec
minimum, twisted shielded pair).
4
Rev. 10 – 20.04.2011
© by SEMIKRON
SKAI 90 A2 GD06-W12DI
Power Connectors
Terminal
Function
cable harness cross section Cu / mm²
DC+
HVDC Bus "+"
≤ 70
DC-
HVDC Bus "-"
≤ 70
L1
Phase L1
≤ 70
L2
Phase L2
≤ 70
L3
Phase L3
≤ 70
Coolant fittings
Terminal
Function
IN
Coolant Inlet
OUT
Coolant Outlet
© by SEMIKRON
Rev. 10 – 20.04.2011
5
SKAI 90 A2 GD06-W12DI
Fig. 1: Normalized output current vs. cos(phi)
Fig. 2: Normalized output current vs. coolant
temperature
Fig. 3: Normalized output current vs. ambient
temperature
Fig. 4: Normalized output current vs. coolant flow
Fig. 5: Overload capability
Fig. 6: Legend
6
Rev. 10 – 20.04.2011
© by SEMIKRON
SKAI 90 A2 GD06-W12DI
Fig. 7: Pressure drop characteristic
Fig. 8: Safe operating area
Fig. 9: Normilized output current vs. output frequency
© by SEMIKRON
Rev. 10 – 20.04.2011
7
SKAI 90 A2 GD06-W12DI
This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX
* The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested
for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is
subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our staff.
8
Rev. 10 – 20.04.2011
© by SEMIKRON