SEOUL SSC-HBFR411-SK

Pb Free
*Customer:
SPECIFICATION
ITEM
MODEL
Revision Date
CHIP LED DEVICE
SSC-HBFR411-SK
Rev0.0(071204)
[Contents]
1. Features
2. Absolute maximum ratings
3. Electro-optical characteristics
4. Characteristic diagram
5. Soldering profile
6. Outline dimension
7. Packing
8. Reel packing structure
9. Precaution for use
Customer
Approved by
Approved by
Approved by
Supplier
Drawn by
SSC-QP-0401-06(REV.0)
Checked by
Approved by
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
- 1/7 -
SSC-HBFR41
1-S
Seoul
Semiconductor
1. Features
Package : 1.6×1.5×0.5mm
Untinted, Diffused flat mold
Wavelength : 465㎚(Blue), 625㎚(Red)
(Ta=25℃)
2. Absolute Maximum Ratings
Parameter
Symbol
Value
Power Dissipation
Pd
Forward Current
IF
Peak Forward Current
IFM*1
Reverse Voltage
VR
5
V
Operating Temperature
Topr
-30 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +100
℃
Blue
Red
Blue
Red
Blue
Red
Unit
72
72
20
30
50
60
㎽
㎃
㎃
*1 IFM conditions: Pulse width Tw≤ 0.1ms, Duty ratio≤ 1/10
3. Electro-optical Characteristics
(Ta=25℃)
Parameter
Symbol
Condition
Forward Voltage
VF
IF=20㎃
Reverse Current
IR
VR=5V
Luminous Intensity*2
IV
IF=20㎃
Wavelength
λ
D
IF=20㎃
Spectral Bandwidth
Δλ
IF=20㎃
2θ
IF=20㎃
Viewing angle*3
1/2
Color
Min
Typ
Max
Blue
Red
Blue
Red
Blue
Red
Blue
Red
Blue
Red
Blue
Red
25
50
462
615
-
3.2
1.9
60
90
470
625
30
25
150
150
3.7
2.4
10
10
100
150
475
635
-
Unit
V
㎂
mcd
㎚
㎚
˚
*2 The luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package.
*3 θ
1/2
is the off-axis where the luminous intensity is 1/2 the peak intensity.
[Note] All products confirm to the listed minimum and maximum specifications for electric and optical characteristics, when operated at 20mA within
the maximum ratings shown above. All measurements were made under the standardized environment of SSC. (Tolerance : Iv ±20 %, λD ±2 nm,
VF ±0.1 V)
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
- 2/7 -
SSC-HBFR411-S
4. Characteristic Diagram
Forward Current vs Forward Voltage
Relative Intensity vs Forward Current
100
140
Red
Red
Relative Intensity IV(%)
Forward Current IF(mA)
120
10
Blue
1
100
80
Blue
60
40
20
0
0.1
1.8
2.2
2.6
3.0
3.4
0
5
10
15
20
25
30
Forward Current IF(mA)
Forward Voltage VF(V)
Forward Current Derating Curve
Radiation Diagram
40
Red
Forward current IF(mA)
30
20
Blue
10
0
-25
0
25
50
75
100
Ambient temperature Ta(℃)
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
- 3/7 -
SSC-HBFR411-S
5. Soldering Profile
Reflow Soldering Conditions/ Profile
(1) Lead Solder
-Preliminary heating to be at 150℃max. for 2 minutes max.
-Soldering heat to be at 240℃max. for 5 seconds max.
LED Surface temperature
°C
Operation heating
240
150
Pre-heating
Temperature
rise: 5°C/sec.
Cooling:
-5°C/sec.
~
120
0
60 to 120 sec.
5sec. max
(2) Lead-Free Solder
-Preliminary heating to be at 150℃max. for 2 minutes max.
-Soldering heat to be at 260℃max. for 10 seconds max.
LED Surface temperature
°C
Operation heating
260
150
Pre-heating
Temperature
rise: 5°C/sec.
Cooling:
-5°C/sec.
~
120
0
60 to 120 sec.
10 sec.
(3) Hand Soldering conditions
-Not more than 3 seconds @MAX280℃, under Soldering iron.
[Note] In case the soldered products are reused in soldering process, we don’t guarantee the products.
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
- 4/7 -
SSC-HBFR411-S
6. Outline Dimension
0.4
0.2
Cathode
2
0.8
1.1
1.2
1.6
Resin
4
Blue
0.8
(0.18)
Marking
4
Unit: ㎜
Red
2.4
1.5
2
Tolerance: ±0.1,
1
3
0.2
0.5
0.4
PCB
1
0.6
3
0.2
Anode
0.8
1.8
[Recommended Solder Pattern]
7. Packing
±0.2
±0.05
±0.05
(2.75)
3.5
0.2
8.0
±0.05
1.75
±0.05
2.0
1.75
4.0
+0.1
1.5 -0
Unit: ㎜
±0.1
Tolerance: ±0.2,
±0.1
4.0
±0.05
±0.1
0.5
1.73
±0.05
0.7 ±0.05
11.4
180 +0
-3
9
±0.3
60
+0.2
-0
2 ±0.2
22
13
±0.2
Label
(1) Quantity : 4000pcs/Reel
(2) Cumulative Tolerance : Cumulative Tolerance/10pitches to be ±0.2mm
(3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off
from the carrier tape at 10˚ angle to be the carrier tape.
(4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package.
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
- 5/7 -
SSC-HBFR411-S
8. Reel Packing Structure
Reel
#
#
#
#
#
#
#
#
#
#
:
N
/
P
##
제품명 SSC-HBFR-S
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#
#
#
#
#
#
#
#
o
N
t
o
L
수량 : 3000
Aluminum Vinyl Bag
#
#
#
#
#
#
#
#
#
#
:
N
/
P
##
제품명 SSC-HBFR-S
#
#
#
#
#
#
#
#
#
o
N
t
o
L
수량 : 3000
Outer Box
*Material: Paper(SW3B(B))
SIZE(mm)
TYPE
a
7inch 245
c
b
220 142
c
CHIP LED
PART : SSC-HBFR-S
CODE :
Q'YT : 30,000EA
CHIP LED
b
LOT NO :
DATE :
a
SEOUL SEMICONDUCTOR CO.,LTD
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
- 6/7 -
SSC-HBFR411-S
9. Precaution for use
(1) Storage
In order to avoid the absorption of moisture, it is recommended to store in the dry box (or desiccator)
with a desiccant . Otherwise, to store them in the following environment is recommended.
Temperature : 5℃~30℃
Humidity : 60%HR max.
(2) Attention after opened
However LED is correspond SMD, when LED be soldered dip, interfacial separation may affect the
light transmission efficiency, causing the light intensity to drop. Attention in followed.
a. After opened and mounted, the soldering shall be quickly.
b. Keeping of a fraction
Temperature : 5 ~ 40℃
Humidity : less than 30%
(3) In case of more than 1 week passed after opening or change color of indicator on desiccant
components shall be dried 10-12hr. at 60±5℃.
(4) In case of supposed the components is humid, shall be dried dip-solder just before.
100Hr at 80±5℃ or 12Hr at 100±5℃.
(5) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to
normal temp. after soldering.
(6) Quick cooling shall not be avoid.
(7) Components shall not be mounted on warped direction of PCB.
(8) Anti radioactive ray design is not considered for the products listed here in.
(9) Gallium arsenide is used in some of the products listed in this publication. These products are
dangerous if they are burned or smashed in the process of disposal. It is also dangerous to drink the liquid
or inhale the gas generated by such products when chemically disposed.
(10) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When
washing is required, IPA should be used.
(11) When the LEDs are illuminating, operating current should be decided after considering the ambient
maximum temperature.
(12) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more
after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage.
(13) The LEDs must be soldered within seven days after opening the moisture-proof packing.
(14) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry
place.
(15) The appearance and specifications of the product may be modified for improvement without notice.
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
- 7/7 -
SSC-HBFR411-S