STANLEY TAN1102W

□□1102W
Surface Mount IRED/Inner Lens Type
Features
Package
Product features
3015 type, Water clear epoxy
・Outer Dimension 3.0 x 1.5 x 1.5mm ( L x W x H )
・Inner Lenz type
・Radiant Intensity
DNK : 2.2mW/sr TYP. (IF=20mA)
TAN : 1.4mW/sr TYP. (IF=20mA)
AN
: 0.8mW/sr TYP. (IF=20mA)
・Lead–free soldering compatible
・RoHS compliant
Peak Wavelength
DNK
TAN
AN
: 865nm
: 940nm
: 950nm
Half Intensity Angle
DNK
TAN
AN
: θx = 60 deg., θy = 80 deg.
: θx = 80 deg., θy = 90 deg.
: θx = 60 deg., θy = 90 deg.
Die materials
GaAlAs(DNK)
GaAs(TAN,AN)
Rank grouping parameter
Sorted by radiant intensity per rank taping
Assembly method
Auto pick & place machine (Auto Mounter)
Soldering methods
Reflow soldering
※Please refer to Soldering Conditions about soldering.
Taping and reel
2,500pcs per reel in a 8mm width tape. (Standard)
Reel diameter:φ180mm
ESD-withstand voltage
2kV (HBM)
Recommended Applications
Car Audio, Electric Household Appliances, OA/FA, PC/Peripheral Equipment, Other General Applications
2010.03.30
Page 1
□□1102W
Surface Mount IRED/Inner Lens Type
Color and Luminous Intensity
Part No.
2010.03.30
Material
DNK1102W
GaAlAs
TAN1102W
GaAs
AN1102W
GaAs
Lens
Color
Water
Clear
(Ta=25℃)
Peak
Wavelength
Radiant Intensity
λ p (nm)
IE (m W/sr)
TYP.
I F (mA)
MIN.
TYP.
I F (mA)
865
20
1.1
2.2
20
940
20
0.7
1.4
20
950
20
0.5
0.8
20
Page 2
□□1102W
Surface Mount IRED/Inner Lens Type
Absolute Maximum Ratings
Item
Symbol
Power Dissipation
Forward Current
(Ta=25℃)
Absolute Maximum Ratings
Unit
DNK
TAN
AN
Pd
80
70
75
mW
IF
50
50
50
mA
IFRM
300
300
300
mA
⊿ IF
0.67
0.67
0.67
mA/℃
⊿ IFRM
4.00
4.00
4.00
mA/℃
Reverse Voltage
VR
5
5
5
V
Operating Temperature
Topr
-30~ +85
℃
Storage Temperature
Tstg
-40~ +100
℃
Pulse Forward Current
※1
Derating
(Ta=25℃ or higher)
※1 IFRM Measurement condition : Pulse Width≦100μs, Duty≦1/100
Electro-Optical Characteristics
Item
Conditions
(Ta=25℃)
Characteristics
Symbol
DNK
TAN
AN
TYP.
1.40
1.20
1.22
MAX.
1.65
1.40
1.40
MAX.
100
10
10
MIN.
1.1
0.7
0.5
TYP.
2.2
1.4
0.8
Unit
Forward Voltage
IF =20mA
VF
V
Reverse Current
VR =5V
IR
Radiant Intensity
IF =20mA
IE
Total Output Power
IF =20mA
Po
TYP.
8.5
5.7
2
mW
Peak Wavelength
IF =20mA
λp
TYP.
865
940
950
nm
Spectral Half-width
IF =20mA
⊿λ
TYP.
45
50
45
nm
Half Intensity Angle
IF =20mA
2θ1/2
TYP.
60(θx)
80(θx)
60(θx)
80(θy)
90(θy)
90(θy)
Cut-off Frequency
IF =20mADC ±5mA,
-3db from 0.1MHz
fc
MIN.
-
-
-
TYP.
50
-
0.5
Response Time
IF =20mA
tr/tf
TYP.
7
1000
700
μA
mW/sr
deg.
MHz
ns
※ θx:Product long side axis,θy:Product short side axis
2010.03.30
Page 3
□□1102W
Surface Mount IRED/Inner Lens Type
Radiant Intensity Rank
R a nk
IE(mW/sr)
TAN
IF=20mA
DNK
IF=20mA
MIN.
A
B
C
D
E
(Ta=25℃)
1.1
1.6
2.2
3.2
4.4
MAX.
2.2
3.2
4.4
6.4
8.8
MIN.
0.7
1.0
1.4
2.0
2.8
AN
IF=20mA
MAX.
1.4
2.0
2.8
4.0
5.6
MIN.
0.5
MAX.
1.0
0.7
1.0
1.4
2.0
1.4
2.0
2.8
-
※Please contact our sales staff concerning rank designation.
2010.03.30
Page 4
□□1102W
Surface Mount IRED/Inner Lens Type
Technical Data (DNK)
Spectral Distribution
Spatial Distribution Example
Relative Intensity vs. Wavelength
Condition : Ta = 25℃, IF = 20mA
Condition : Ta = 25℃
y
1.2
x
Relative Intensity
1.0
0.8
0.6
0.4
0.2
0.0
700
800
900
1000
Wavelength [nm]
Forward Voltage vs. Forward Current
Pulse Forward Voltage vs. Pulse Forward Current
Condition : Ta = 25℃
Condition : Ta=25℃, tw≦100μs, Duty≦1/100
1000
Pulse Forward Current IFRM(mA)
Forward Current IF(mA)
100
10
1
10
1
1.2
1.3
1.4
Forward Voltage : VF(V)
2010.03.30
100
1.5
1.6
1.2
1.4
1.6
1.8
2.0
2.2
2.4
2.6
Pulse Forward Voltage : VFM(V)
Page 5
□□1102W
Surface Mount IRED/Inner Lens Type
Technical Data (DNK)
Derating
Power Dissipation vs. Ambient Temperature
Ambient Temperature vs. Maximum Forward Curren
Pulse Width tw≦100μsec
90
Duty=1%
300
Power Dissipation : Pd (mW)
Maximum Forward Current : IF MAX. (mA)
350
250
200
Duty=5%
150
Duty=10%
Duty=20%
Duty=50%
100
50
80
70
60
50
40
30
20
10
DC
0
0
-30
-10
10
30
50
70
-30 -20 -10 0
90
Ambient Temperature : Ta(℃)
Ambient Temperature : Ta(℃)
Ambient Temperature vs. Forward Voltage
Duty Ratio vs. Pulse Forward Current
Condition : Ta = 25℃, tw ≦ 100μs
Condition : IF =20mA
1.8
Pulse Forward Current IFRM(mA)
1000
Forward Voltage VF(V)
1.6
1.4
1.2
100
10
1.0
-40
-20
0
20
40
60
Ambient Temperature : Ta (℃)
2010.03.30
10 20 30 40 50 60 70 80 90 100
80
100
0.001
0.01
0.1
1
Duty Ratio
Page 6
□□1102W
Surface Mount IRED/Inner Lens Type
Technical Data (DNK)
Pulse Forward Current vs. Relative Total Power
Forward Current vs. Relative Total Power
Condition : tw≦100μs,
Duty≦1/100, Ta = 25℃
Condition : Ta = 25℃
100.0
Relative Total Power
Relative Total Power
10.0
1.0
0.1
10.0
1.0
0.1
1
10
100
1
10
100
1000
Pulse Forward Current : IFRM (mA)
Forward Current : IF (mA)
Ambient Temperature vs. Relative Total Power
Condition : IF = 20mA
Relative Total Power
10
1
0.1
-40
-20
0
20
40
60
80
100
Ambient Temperature : Ta (℃)
2010.03.30
Page 7
□□1102W
Surface Mount IRED/Inner Lens Type
Technical Data (TAN)
Spectral Distribution
Spatial Distribution Example
Relative Intensity vs. Wavelength
Condition : Ta = 25℃, IF = 20mA
Condition : Ta = 25℃
y
1.2
x
Relative Intensity
1.0
0.8
0.6
0.4
0.2
0.0
700
800
900
1000
1100
Wavelength [nm]
Forward Voltage vs. Forward Current
Pulse Forward Voltage vs. Pulse Forward Current
Condition : Ta = 25℃
Condition : Ta=25℃, tw≦100μs, Duty≦1/100
1000
Pulse Forward Current IFRM(mA)
Forward Current IF(mA)
100
10
1
10
1
1.0
1.1
1.2
Forward Voltage : VF(V)
2010.03.30
100
1.3
1.0
1.2
1.4
1.6
1.8
2.0
Pulse Forward Voltage : VFM(V)
Page 8
□□1102W
Surface Mount IRED/Inner Lens Type
Technical Data (TAN)
Derating
Power Dissipation vs. Ambient Temperature
Ambient Temperature vs. Maximum Forward Curren
Pulse Width tw≦100μsec
350
90
80
300
Power Dissipation : Pd (mW)
Maximum Forward Current : IF MAX. (mA)
Duty=1%
250
200
Duty=5%
150
Duty=10%
Duty=20%
100
Duty=50%
50
70
60
50
40
30
20
10
DC
0
0
-30
-10
10
30
50
70
-30
90
Ambient Temperature : Ta(℃)
30
50
70
90
Duty Ratio vs. Pulse Forward Current
Condition : Ta = 25℃, tw ≦ 100μs
Condition : IF = 20mA
1000
Pulse Forward Current IFRM(mA)
1.4
1.3
Forward Voltage VF(V)
10
Ambient Temperature : Ta(℃)
Ambient Temperature vs. Forward Voltage
1.2
1.1
100
10
1.0
-40
-20
0
20
40
60
Ambient Temperature : Ta (℃)
2010.03.30
-10
80
100
0.001
0.01
0.1
1
Duty Ratio
Page 9
□□1102W
Surface Mount IRED/Inner Lens Type
Technical Data (TAN)
Pulse Forward Current vs. Relative Total Power
Forward Current vs. Relative Total Power
Condition : tw≦100μs,
Duty≦1/100, Ta = 25℃
Condition : Ta = 25℃
100
10
10
Relative Total Power
Relative Total Power
1
0.1
0.01
1
0.1
0.01
1
10
100
Forward Current : IF (mA)
1
10
100
1000
Pulse Forward Current : IFRM (mA)
Ambient Temperature vs. Relative Total Power
Condition : IF = 20mA
Relative Total Power
10
1
0.1
-40
-20
0
20
40
60
80
100
Ambient Temperature : Ta (℃)
2010.03.30
Page 10
□□1102W
Surface Mount IRED/Inner Lens Type
Technical Data(AN)
Spectral Distribution
Spatial Distribution Example
Relative Intensity vs. Wavelength
Condition : Ta = 25℃, IF = 20mA
Condition : Ta = 25℃
y
Relative Intensity
x
Wavelength [nm]
Forward Voltage vs. Forward Current
Duty Ratio vs. Pulse Forward Current
Condition : Ta = 25℃, tw ≦ 100μs
Forward Current IF(mA)
Pulse Forward Current IFRM(mA)
Condition : Ta = 25℃
Forward Voltage : VF(V)
2010.03.30
2009.1.26
Duty Ratio
Page
11 4
Page
□□1102W
Surface Mount IRED/Inner Lens Type
Technical Data(AN)
Ambient Temperature vs. Forward Current
Ambient Temperature vs. Pulse Forward Current
Forward Current : IF (mA)
Pulse Forward Current IFRM(mA)
Condition : tw≦100μs, Duty≦1/100
Ambient Temperature : Ta(℃)
Ambient Temperature : Ta(℃)
Ambient Temperature vs. Forward Voltage
Pulse Forward Voltage vs. Pulse Forward Current
Forward Voltage VF(V)
Ambient Temperature : Ta (℃)
2010.03.30
2004.11.17
Condition : Ta=25℃, tw≦100μs, Duty≦1/100
Pulse Forward Current IFRM(mA)
Condition : IF = 20mA
Pulse Forward Voltage : VFM(V)
Page
12 5
Page
□□1102W
Surface Mount IRED/Inner Lens Type
Technical Data(AN)
Ambient Temperature vs. Peak Wavelength
Forward Current vs. Relative Total Power
Condition : - - Pulse, tw≦100μs,
Duty≦1/100, Ta = 25℃
Relative Total Power
Peak Wavelength λp (nm)
Condition : IF = 20mA
Ambient Temperature : Ta(℃)
Forward Current : IF (mA)
Ambient Temperature vs. Relative Total Power
Relative Total Power
Condition : IF = 20mA
Ambient Temperature : Ta (℃)
2010.03.30
2004.11.17
Page
13 6
Page
□□1102W
Surface Mount IRED/Inner Lens Type
Package Dimensions
(Unit: mm)
Weight: (7.80)mg
Recommended Soldering Pattern
Taping Specification
(Unit: mm)
(Unit: mm)
Quantity: 2,500pcs/ reel (standard)
2010.03.30
Page 14
□□1102W
Surface Mount IRED/Inner Lens Type
Reflow Soldering Conditions
1) The above profile temperature gives the maximum temperature of the LED resin surface.
Please set the temperature so as to avoid exceeding this range.
2) Total times of reflow soldering process shall be no more than 2 times.
When the second reflow soldering process is performed, intervals between the first
and second reflow should be short as possible (while allowing some time for the
component to return to normal temperature after the first reflow) in order to prevent the
LED from absorbing moisture.
3) Temperature fluctuation to the LED during the pre-heating process shall be minimized.
Manual Soldering Conditions
Iron tip temp.
Soldering time and frequency
2010.03.30
350 ℃
3 s
1 time
(MAX.) (30 W Max.)
(MAX.)
(MAX.)
Page 15
□□1102W
Surface Mount IRED/Inner Lens Type
Reliability Testing Result
Reliability Testing
Result
Applicable Standard
Room Temp.
Operating Life
EIAJ ED4701/100(101)
Ta = 25℃, IF = Maxium Rated Current
Resistance to
Soldering Heat
EIAJ ED4701/300(301)
(Pretreatment) Individual standard
(Reflow Soldering) Pre-heating
150℃~180℃ 120s
Operating Heating
230℃ Min.
Peak temperature 260℃
Temperature Cycling
EIAJ ED4701/100(105)
Wet High Temp.
Storage Life
EIAJ ED4701/100(103)
High Temp.
Storage Life
Low Temp.
Storage Life
EIAJ ED4701/200(201)
EIAJ ED4701/200(202)
Vibration,
Variable Frequency
EIAJ ED4701/400(403)
Testing Conditions
Duration
Failure
1,000 h
0/25
Twice
0/25
Minimum Rated Storage Temperature(30min)
~Normal Temperature(15min)
~Maximum Rated Storage Temperature(30min)
~Normal Temperature(15min)
5 cycles
0/25
Ta = 60±2℃, RH = 90±5%
1,000 h
0/25
Ta = Maximum Rated Storage Temperature
1,000 h
0/25
Ta = Minimum Rated Storage Temperature
1,000 h
0/25
2h
0/10
2
98.1m/s (10G), 100 ~ 2KHz sweep for 20min.,
XYZ each direction
Failure Criteria
Items
Symbols
Radiant Intensity
IE
Forward Voltage
VF
Reverse Current
IR
2010.03.30
2010.12.30
Conditions
IF Value of each product
Radiant Intensity
IF Value of each product
Forward Voltage
VR = Maximum Rated
Reverse Voltage V
Failure criteria
Testing Min. Value < Initial Value x 0.5
Testing Max. Value > Spec. Max. Value x 1.2
Testing Max. Value ≧ Spec. Max. Value x 2.5
Page 16
□□1102W
Surface Mount IRED/Inner Lens Type
Special Notice to Customers Using the Products and
Technical Information Shown in This Data Sheet
1) The technical information shown in the data sheets are limited to the typical characteristics and circuit
examples of the referenced products. It does not constitute the warranting of industrial property nor the
granting of any license.
2) For the purpose of product improvement, the specifications, characteristics and technical data described in
the data sheets are subject to change without prior notice. Therefore it is recommended that the most
updated specifications be used in your design.
3) When using the products described in the data sheets, please adhere to the maximum ratings for operating
voltage, heat dissipation characteristics, and other precautions for use. We are not responsible for any
damage which may occur if these specifications are exceeded.
4) The products that have been described to this catalog are manufactured so that they will be used for the
electrical instrument of the benchmark (OA equipment, telecommunications equipment, AV machine, home
appliance and measuring instrument).
The application of aircrafts, space borne application, transportation equipment, medical equipment and
nuclear power control equipment, etc. needs a high reliability and safety, and the breakdown and the wrong
operation might influence the life or the human body. Please consult us beforehand if you plan to use our
product for the usages of aircrafts, space borne application, transportation equipment, medical equipment
and nuclear power control equipment, etc. except OA equipment, telecommunications equipment, AV
machine, home appliance and measuring instrument.
5) In order to export the products or technologies described in this data sheet which are under the
“Foreign Exchange and Foreign Trade Control Law,” it is necessary to first obtain an export permit from the
Japanese government.
6) No part of this data sheet may be reprinted or reproduced without prior written permission from Stanley
Electric Co., Ltd.
7) The most updated edition of this data sheet can be obtained from the address below:
http://www.stanley-components.com
2010.03.30
Page 17