TAI-SAW TX0131A

TAI-SAW TECHNOLOGY CO., LTD.
No. 3, Industrial 2nd Rd., Ping-Chen Industrial District,
Taoyuan, 324, Taiwan, R.O.C.
TEL: 886-3-4690038
FAX: 886-3-4697532
E-mail: [email protected]
Web: www.taisaw.com
Approval Sheet For Product Specification
Issued Date: 3/16/2006 (REV. NO: 5)
Product Name: SMD 3.2x2.5 19.2MHz VCTCXO
TST Parts No.: TX0131A
Customer Parts No.:
Company:
Division:
Approved by:
Date:
Checked by:
CC Hsu
Approval by:
TF Yang
Date:
3/16/2006
TAI-SAW TECHNOLOGY CO., LTD.
TST DCC
Release document
FR-71S03-01
TAI-SAW TECHNOLOGY CO., LTD.
No. 3, Industrial 2nd Rd., Ping-Chen Industrial District,
Taoyuan, 324, Taiwan, R.O.C.
TEL: 886-3-4690038
FAX: 886-3-4697532
E-mail: [email protected]
Web: www.taisaw.com
SMD 3.2x2.5 19.2MHz VCTCXO
MODEL NO.: TX0131A
REV. NO.: 5
Features:
Ultra Miniature SMD Package
Good Frequency Stability
Good Phase Noise Response
RoHS Compliant
Lead free
Lead-free soldering
Description and Applications:
Surface mount 3.2mmx2.5mm VCTCXO for use in wireless communications devices
Electrical Specifications:
TX0131A
Specifications
Nominal Frequency, Fo
19.200000 MHz
Storage Temperature Range
-40°C to +85°C
Operating Temperature Range
-20°C to +75°C
Power Supply Voltage, Vcc
2.8 V
Output Voltage with Load 10pF//10KΩ, Vout
0.8 Vp-p min
Output Waveform
Clipped Sinewave
Power Supply Current, Icc
2.0 mA max
Control Voltage, Vcon
1.4 +/- 1.0 V
DC Terminal Input Impedance
100K ohms min
Frequency Tolerance (Vcon=1.4V) after Two
Reflows
Frequency Stability
a. Vs. Temperature (-20~75°C)
b. Vs. Load varied 10pF//10KΩ+/-10%
c. Vs. Supply Voltage varied 2.8+/-5%
+/- 2 ppm max @ 25°C +/- 3°C
+/- 2.5 ppm
+/- 0.2 ppm
+/- 0.2 ppm
Vcon Frequency Control Range (1.4+/-1.0 V)
+/-8 ~ +/-14 ppm
Start Up Time (90% of final RF level in Vp-p)
2.0 msec max.
Harmonics
-5.0 dBc max
SSB Phase Noise (@1KHz Carrier Offset)
-130 dBc/Hz max
Aging
+/-1.0 ppm/year @25°C
TAI-SAW TECHNOLOGY CO., LTD.
TST DCC
Release document
2
Mechanical Dimensions (mm):
Marking:
Line 1: Customer Frequency (19.20)
Line 2: TST Logo + Crystal Product Code + Date Code
Product Code Table
Year
2001
2005
2002
2006
2003
2007
2004
2008
Product Code
X
x
X
x
Date Code Table
WK01
WK02
WK03
WK04
WK05
WK06
WK07
WK08
WK09
WK10
WK11
WK12
A
B
C
D
E
F
G
H
I
J
K
L
WK13
M
WK14
WK15
WK16
WK17
WK18
WK19
WK20
WK21
WK22
WK23
WK24
WK25
WK26
N
O
P
Q
R
S
T
U
V
W
X
Y
Z
WK27
WK28
WK29
WK30
WK31
WK32
WK33
WK34
WK35
WK36
WK37
WK38
WK39
a
b
c
d
e
f
g
h
i
j
k
l
m
WK40
WK41
WK42
WK43
WK44
WK45
WK46
WK47
WK48
WK49
WK50
WK51
WK52
n
o
p
q
r
s
t
u
v
w
x
y
z
TAI-SAW TECHNOLOGY CO., LTD.
TST DCC
Release document
3
Recommended Circuit
Packing (mm):
1. Reel Dimension
A
Dimensions
Tolerance
180
B
C
D
E
F
H
G
T2 T1 T3
60 13.0 2.0
9.1
2.9
3.9
4.9 11.4
9.0
1.2
±1.0 +1.0 ±0.2 ±0.5 ±0.5 ±0.5 ±0.5 ±0.5 ±1.0 ±0.3 ±0.1
2. Tape Dimension
Unit: mm
A0
Dimension
2.80 3.71
Tolerance
±0.1 ±0.1 +0.3/-0.1
B0
W
F
E
8.00
3.5
±0.05
P0
P1
P2
D1
D
K0
t
1.75 4.00 4.00
2
1.50
1.0
1.75
0.25
±0.1 ±0.1 ±0.1
±0.05
+0.1/-0.00 +0.25/-0.00 ±0.1
±0.02
TAI-SAW TECHNOLOGY CO., LTD.
TST DCC
Release document
4
Reflow Profile:
300
Reflow Area
Rising Area
Temperature (deg C)
250
Preheat Area
Forced Cooling Area
200
150
100
Max peak temperature: 260 deg C
50
0
0
60
120
180
240
300
360
Time (seconds)
Notes of the Usage:
1. Touch the solder iron at 260+/-5 deg C onto the leads for 10+/-2 sec max or touch the
solder at 350+/-5 deg C onto the leads for 3+/-0.5 sec.
2. In the customer’s reflow process, if it will remain some mechanical stress at the soldering
terminals, also make some cracks on the soldering termination. Some cracks will cause
open or short circuit and cause of thermal increasing or smoking. Don’t make any excess
mechanical stress to soldering points.
3. In case of giving a heavy shock to the products, it may make an open or short circuit and
cause of thermal increasing and smoking. To avoid heavy shock impact applying to
products is strictly required.
Notes of the Storage:
1. To keep products under the condition at the room temperature (-5~35 deg C) with normal
humidity (45~75%). Absorption of moisture and dewdrop may make inferiority of
characteristics and a short circuit.
2. Oxidization of terminals shall make the solderability more inferior. Dusts and corrosive gas
will make a cause of the open or short circuit. Keep it in the clean place where is not in
dusty and no corrosive gas.
3. Use the unti-static material to the storage package.
4. Don’t put any excess weight to the VCTCXO in the storage process.
TAI-SAW TECHNOLOGY CO., LTD.
TST DCC
Release document
5
5. Don’t move the product from the cold place to the hot place in the short time, otherwise it
may make some dew-drop, then a short circuit may happen in case.
6. Storage periods should be maximum 6 months under condition of above item 1 after
delivery from TST factory.
7. Once open the bag, there is possibility of electrical characteristics deterioration due to
absorption of moisture. So, please use parts within 7 days after opening the bag.
8. If you have to keep parts without using after opening the bag, please put the drying agent
in the bag, fold the bag and keep it in the place where temperature and humidity are
controlled (nitrogen atmosphere box etc.)
TAI-SAW TECHNOLOGY CO., LTD.
TST DCC
Release document
6