TIGER ELECTRONIC CO.,LTD
SK32 THRU SK310
Features
•
•
•
•
•
•
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
For Surface Mount Applications
High Current Capability With Low Forward Voltage
High Temp Soldering: 260°C for 10 Seconds At Terminals
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
Maximum Ratings
•
•
•
•
Operating Temperature: -55°C to +150°C
Storage Temperature: -55°C to +150°C
Maximum Thermal Resistance :10°C/W Junction To Lead
Maximum Thermal Resistance :55°C/W Junction To Ambiemt
MCC
Catalog
Number
Device
Marking
SK32
SK33
SK34
SK35
SK36
SK38
SK310
SK32
SK33
SK34
SK35
SK36
SK38
SK310
Maximum
Recurrent
Peak Reverse
Voltage
20V
30V
40V
50V
60V
80V
100V
Maximum
RMS
Voltage
14V
21V
28V
35V
42V
56V
70V
3 Amp Schottky
Rectifier
20 to 100 Volts
DO-214AB
(SMC) (LEAD FRAME)
A
Maximum
DC
Blocking
Voltage
20V
30V
40V
50V
60V
80V
100V
B
C
F
H
D
G
E
Electrical Characteristics @ 25°C Unless Otherwise Specified
Average Forward
Current
Peak Forward Surge
Current
Maximum
Instantaneous
Forward Voltage
SK32-34
SK35-36
SK38-310
Maximum DC
Reverse Current At
Rated DC Blocking
Voltage
Typical Junction
Capacitance
IF(AV)
3.0A
IFSM
100A
VF
.50V
.75V
.85V
DIMENSIONS
TL = 100°C
8.3ms, half sine
IFM = 3.0A;
TJ = 25°C*
DIM
A
B
C
D
E
F
G
H
INCHES
MIN
.260
.220
.006
.030
.305
.079
.108
.002
MM
MIN
6.60
5.59
0.15
0.76
7.75
2.00
2.75
0.050
MAX
.280
.245
.012
.060
.320
.103
.128
.008
MAX
7.11
6.22
0.31
1..52
8.13
2.62
3.25
0.203
NOTE
SUGGESTED SOLDER
PAD LAYOUT
0.190
IR
.5mA
20mA
TJ = 25°C
TJ = 100°C
CJ
250pF
Measured at
1.0MHz, VR=4.0V
0.125”
0.070”
*Pulse test: Pulse width 200 µsec, Duty cycle 2%
Note:
1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
www.mccsemi.com
Revision: B
1 of 4
2011/07/04
SK32 thru SK310
TM
Figure 1
Typical Forward Characteristics
Micro Commercial Components
100
Figure 2
Forward Derating Curve
60
3.0
40
SK35-36
20
SK32-SK34
2.5
SK38-SK310
10
2.0
6
1.5
4
Amps
2
Amps
1.0
1
.5
Single Phase, Half Wave
60Hz Resistive or Inductive Load
.6
.4
0
40
60
100
80
.2
120
140
160
°C
25°C
Average Forward Rectified Current - Amperesversus
Lead Temperature - °C
.1
.06
.04
.02
.01
.2
.4
.6
.8
1.0
1.2
1.4
Volts
Instantaneous Forward Current - Amperesversus
Instantaneous Forward Voltage - Volts
Figure 3
Junction Ca pacitance
100
600
400
200
pF
TJ =25°C
100
60
40
20
10
.1
.2
.4
1
Volts
2
4
10
20
40
100 200
400
1000
Junction Capacitance - pF versus
Reverse Voltage - Volts
www.mccsemi.com
Revision: B
2 of 4
2011/07/04
SK32 thru SK310
TM
Figure 4
Typical Reverse Characteristics
Micro Commercial Components
10
6
Figure 5
Peak Forward Surge Current
150
100°C
4
2
125
1
100
.6
75
75°C
.4
Amps
50
.2
25°C
25
mAmps .1
0
.06
1
2
4
6
8 10
20
40
60 80 100
Cycles
.04
Peak Forward Surge Current - Amperesversus
Number Of Cycles At 60Hz - Cycles
.02
.01
.006
SK32-34
SK35-310
.004
.002
.001
20
40
60
80
100
120
140
Volts
Instantaneous Reverse Leakage Current - MicroAmperesversus
Percent Of Rated Peak Reverse Voltage - Volts
Transient Thermal Impedance [ºC/W]
Figure 6
Thermal Impedance Characteristics
100
10
1
0.1
0.01
0.1
1
10
Pulse Duration [s]
100
www.mccsemi.com
Revision: B
3 of 4
2011/07/04
Ordering Information :
Device
Packing
Part Number-TP
Tape&Reel: 3Kpcs/Reel
***IMPORTANT NOTICE***
Revision: B
2011/07/04