TC221, TC225, TC227 SMALL-FORMAT CCD IMAGE SENSORS SOCS037C – DECEMBER 1991 – REVISED AUGUST 1997 • • • • • • • • • • Full-Frame Operation – 190 (H) × 190 (V) Active Elements for TC221 – 285 (H) × 285 (V) Active Elements for TC225 – 102 (H) × 102 (V) Active Elements for TC227 Dark-Reference Pixels 9-µm Square Pixels Single-Phase Clocking Low Dark Current Dynamic Range . . . More Than 60 dB High Photoresponse Uniformity High Sensitivity Low-Noise Operation Solid State Reliability With No Residual Imaging, Image Burn-In, Microphonics, or Image Distortion description The TC221, TC225 and TC227 are full-frame charge-coupled device (CCD) image sensors designed specifically for medical and industrial applications where ruggedness and small size are required. The image-area diagonal measures 1.3 mm for the TC227, 2.4 mm for the TC221, and 3.63 mm for the TC225. The image sensors contain, in addition to dark reference pixels, 190, 285, and 102 active lines with 190, 285, and 102 active pixels per line, respectively. The antiblooming feature is activated by supplying clock pulses to the antiblooming gate, an integral part of each image-sensing element. The charge is converted to signal voltage at 9.5 µV per electron by a high-performance structure with built-in automatic reset and a voltage-reference generator. The signal is further buffered by a low-noise two-stage source-follower amplifier to provide high output-drive capability. TC225 TRG 1 10 SRG1 2 9 OUT1 SRG2 3 8 OUT2 ABG 4 7 ADB IAG 5 6 NC SUB NC – No internal connection TC221 SRG 1 6 SUB ABG 2 5 OUT IAG 3 4 ADB TC227 SUB 1 6 SRG OUT 2 5 ABG ADB 3 4 IAG The TC221 and TC227 are supplied in 6-pin molded plastic packages; the TC225 is supplied in a 10-pin molded plastic package. The glass window can be cleaned using any standard method for cleaning optical assemblies or by wiping the surface with a cotton swab soaked in alcohol. This MOS device contains limited built-in gate protection. During storage or handling, the device leads should be shorted together or the device should be placed in conductive foam. In a circuit, unused inputs should always be connected to SUB. Under no circumstances should pin voltages exceed absolute maximum ratings. Avoid shorting OUTn to ADB during operation to prevent damage to the amplifier. The device can also be damaged if the output terminals are reverse-biased and an excessive current is allowed to flow. Specific guidelines for handling devices of this type are contained in the publication Guidelines for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices and Assemblies available from Texas Instruments. Copyright 1997, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 TC221, TC225, TC227 SMALL-FORMAT CCD IMAGE SENSORS SOCS037C – DECEMBER 1991 – REVISED AUGUST 1997 functional block diagrams Top Drain 190 Pixels ABG IAG 190 Lines ADB OUT SUB ÉÉ ÉÉ ÉÉ ÉÉ ÉÉ ÉÉ 9 Dummy Elements 1 SRG Dump Drain 217 Pixels 15.5 Optical Black 190 0.5 Optical Black 1 TC221 Top Drain 285 Pixels ABG IAG 285 Lines ADB TRG OUT2 17 11 142.5 1.5 SRG2 OUT1 17 11.5 142.5 1 SRG1 SUB Dump Drain Dummy Elements TC225 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TC221, TC225, TC227 SMALL-FORMAT CCD IMAGE SENSORS SOCS037C – DECEMBER 1991 – REVISED AUGUST 1997 functional block diagram Top Drain 102 Pixels ABG IAG 102 Lines VCC VO SUB Dummy Elements ÉÉ ÉÉ ÉÉ ÉÉ ÉÉ 8 1 SRG Dump Drain 129 Pixels 16.5 102 TC227 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 0.5 1 3 TC221, TC225, TC227 SMALL-FORMAT CCD IMAGE SENSORS SOCS037C – DECEMBER 1991 – REVISED AUGUST 1997 detailed description The TC221, TC225, and TC227 consist of four basic functional blocks: (1) the image-sensing area, (2) the serial registers, (3) the sensor node, and (4) the low-noise source-follower amplifier. The location of each of these blocks is identified in the functional block diagrams. image-sensing area As light enters the silicon in the image-sensing area, free electrons are generated and collected in the potential wells of the sensing elements. During this time, blooming protection is activated by applying a burst of pulses to the antiblooming gate. This prevents blooming by the spilling of charge from overexposed elements into neighboring elements. After integration and under dark conditions, the charge is transferred line by line into the serial register(s). The required timing is shown in Figure 1 through Figure 3. During transfer, the antiblooming gate is held at a low level. Each imager contains a specified number of dark pixels on the left side of the image-sensing area. These elements provide the dark reference used in subsequent video-processing circuits to restore the video black-level. serial register(s) Once an image line is transferred into the serial register, the serial-register gate can be clocked until all of the charge packets are moved out onto the sense node. A drain is also included to provide the capability to clear the image-sensing area of unwanted charge. Such charge can accumulate in the imager during the start-up of operation or under special conditions when nonstandard TV operation is desired. sense node(s) and source-follower amplifier(s) After the charge packet is placed on the sense node, the potential of this node changes in proportion to the amount of signal received. It is then buffered by a dual-stage source-follower amplifier. The sense node and amplifier are located some distance from the serial register; a specified number of dummy elements is used to span the distance. The location and number of the dummy elements are shown in the functional block diagrams. Terminal Functions TERMINAL NAME I/O NUMBER TC221 TC225 TC227 ABG 2 4 5 ADB 4 7 3 IAG 3 5 4 I Antiblooming gate Amplifier-drain bias I Image-area gate NC N/A 6 N/A OUT1 5 9 2 O No internal connection Output signal 1 OUT2 N/A 8 N/A O Output signal 2 SRG1 1 2 6 I Serial-register gate 1 SRG2 N/A 3 N/A I Serial-register gate 2 SUB 6 10 1 TRG N/A 1 N/A Substrate I N/A – not applicable 4 DESCRIPTION POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 Transfer gate TC221, TC225, TC227 SMALL-FORMAT CCD IMAGE SENSORS SOCS037C – DECEMBER 1991 – REVISED AUGUST 1997 Readout Integration ABG 190 Cycles IAG 217 Cycles SRG IAG tw3 tw1 tw2 tw4 SRG tw1 ≥ 125 ns 50 ns ≤ t2 ≤ 250 ns tw3 ≥ 600 ns tw4 ≥ 600 ns Figure 1. TC221 Timing Diagram POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 TC221, TC225, TC227 SMALL-FORMAT CCD IMAGE SENSORS SOCS037C – DECEMBER 1991 – REVISED AUGUST 1997 Readout Integration ABG 285 Cycles IAG TRG 172 Cycles SRG1 172 Cycles SRG2 tw3 IAG tw1 tw4 TRG tw2 SRG1 SRG2 tw1 tw2 tw3 tw4 ≥ 600 ns ≥ 600 ns ≥ 600 ns ≥ 125 ns Figure 2. TC225 Timing Diagram 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TC221, TC225, TC227 SMALL-FORMAT CCD IMAGE SENSORS SOCS037C – DECEMBER 1991 – REVISED AUGUST 1997 Readout Integration ABG 102 Cycles IAG 129 Cycles SRG IAG tw3 tw1 tw2 tw4 SRG tw1 ≥ 125 ns 50 ns ≤ t2 ≤ 250 ns tw3 ≥ 600 ns tw4 ≥ 600 ns Figure 3. TC227 Timing Diagram VRF QR VDD Q4 Q2 Q3 SRG Q1 Q5 CCD VO C0 Q6 Q7 SUB Figure 4. Charge-Detection Schematic POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 TC221, TC225, TC227 SMALL-FORMAT CCD IMAGE SENSORS SOCS037C – DECEMBER 1991 – REVISED AUGUST 1997 spurious-nonuniformity specification The spurious-nonuniformity specification of the TC221, TC225 and TC227 grades – 30 and – 40 is based on several sensor characteristics: • • Amplitude of the nonuniform pixel Polarity of the nonuniform pixel — Black — White • • Location of the nonuniformity (see Figure 5) Nonuniform pixel count The CCD sensors are characterized in both an illuminated condition and a dark condition. In the dark condition, the nonuniformity is specified in terms of absolute amplitude as shown in Figure 6. In the illuminated condition, the nonuniformity is specified as a percentage of the total illumination as shown in Figure 7. TC221 nonuniformity table DARK CONDITION PART NUMBER TC221-30 TC221-40 TC221-30 TC221-40 TC221-30 TC221-40 PIXEL AMPLITUDE 12 mV 8 –12 12 –16 16 mV > 16 mV ILLUMINATED CONDITION PIXEL COUNT AREA A AREA B 4 6 8 12 2 4 4 8 0 0 0 0 % OF TOTAL ILLUMINATION 30 – 40 40 – 50 > 50 PIXEL COUNT AREA A AREA B 4 6 8 12 2 4 4 8 0 0 0 0 TC225 nonuniformity table DARK CONDITION PART NUMBER TC225-30 TC225-40 TC225-30 TC225-40 TC225-30 TC225-40 PIXEL AMPLITUDE 8 –12 12 mV 12 –16mV 16mV > 16 mV ILLUMINATED CONDITION PIXEL COUNT AREA A AREA B 6 9 12 15 3 6 6 10 0 0 0 0 % OF TOTAL ILLUMINATION 30 – 40 40 – 50 > 50 PIXEL COUNT AREA A AREA B 6 9 12 15 3 6 6 10 0 0 0 0 TC227 nonuniformity table DARK CONDITION PART NUMBER TC227-30 TC227-40 TC227-30 TC227-40 TC227-30 TC227-40 8 PIXEL AMPLITUDE 8 –12 12 mV 16 mV 12 –16 > 16 mV ILLUMINATED CONDITION PIXEL COUNT AREA A AREA B 4 6 8 12 2 4 4 8 0 0 0 0 POST OFFICE BOX 655303 % OF TOTAL ILLUMINATION 30 – 40 40 – 50 > 50 • DALLAS, TEXAS 75265 PIXEL COUNT AREA A AREA B 4 6 12 12 2 4 4 8 0 0 0 0 TC221, TC225, TC227 SMALL-FORMAT CCD IMAGE SENSORS SOCS037C – DECEMBER 1991 – REVISED AUGUST 1997 H 1/2 H Area A 1/2 V V Area B Figure 5. Area Location Map Amplitude % of Total Illumination mV t Figure 6. Pixel Nonuniformity, Dark Condition POST OFFICE BOX 655303 t Figure 7. Pixel Nonuniformity, Illuminated Condition • DALLAS, TEXAS 75265 9 TC221, TC225, TC227 SMALL-FORMAT CCD IMAGE SENSORS SOCS037C – DECEMBER 1991 – REVISED AUGUST 1997 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range VCC for ADB (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V to 15 V Input voltage range VI for ABG, IAG, SRG, TRG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 15 V to 15 V Operating free-air temperature range, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 10°C to 60°C Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 30°C to 85°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: All voltage values are with respect to the substrate. recommended operating conditions Supply voltage, VCC ADB MIN NOM MAX 11 12 13 Substrate bias voltage 0 IAG SRG Input voltage, VI‡ ABG 1.5 2 Low level – 11 – 10 –9 High level 1.5 2 2.5 Low level – 11 – 10 –9 11 Intermediate level§ –3 Low level TRG Pulse duration Clock frequency, frequency fclock l k 2.5 V –6 High level 1.5 2 Low level – 11 – 10 –9 0.7 1.0 1.3 IAG SRG, TRG 2.5 10 ABG 4 Load capacitance V V High level High level UNIT 6 µs MHz pF Operating free-air temperature, TA – 10 45 °C ‡ The algebraic convention, in which the least positive (most negative) value is designated minimum, is used in this data sheet for clock voltage levels. § The antiblooming gate clocks from high level to intermediate level during exposure time and is held at low level during readout time. 10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TC221, TC225, TC227 SMALL-FORMAT CCD IMAGE SENSORS SOCS037C – DECEMBER 1991 – REVISED AUGUST 1997 electrical characteristics over recommended operating ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER MIN TYP† MAX UNIT Dynamic range (see Note 2) 60 dB Charge-conversion factor 9.5 µV/e Charge-transfer efficiency (see Note 3) 0.99990 Signal-response delay (see Note 4) 1.00000 30 Gamma (see Note 5) ns 0.90 Noise-equivalent signal (KTC noise without CDS circuit) 1.0 36 e Output resistance 600 Rejection ratio ADB (see Note 6) – 20 SRG (see Note 7) – 40 ABG (see Note 8) – 50 IAG 600 dB Supply current 5 Input capacitance, Ci (TC221) Input capacitance, capacitance Ci (TC225) Input capacitance, Ci (TC227) SRG 20 ABG 240 IAG 1320 SRG1, SRG2 40 TRG 60 ABG 520 IAG 200 SRG 10 ABG 100 Ω mA pF pF pF † All typical values are at TA = 25°C. NOTES: 2. Dynamic range is – 20 times the logarithm of the mean-noise signal divided by the saturation-output signal. 3. Charge-transfer efficiency is 1 minus the charge loss per transfer in the output register. The test is performed in the dark using an electrical-input signal. 4. Signal-response delay time is the time between the falling edge of the SRG clock pulse and the output-signal valid state. 5. Gamma (γ) is the value of the exponent in the equation below for two points on the linear portion of the transfer-function curve (this value represents points near saturation): ǒ Ǔ +ǒ Exposure (2) Exposure (1) g Ǔ Output signal (2) Output signal (1) 6. ADB rejection ratio is – 20 times the logarithm of the ac amplitude at the output divided by the ac amplitude at ADB. 7. SRG rejection ratio is – 20 times the logarithm of the ac amplitude at the output divided by the ac amplitude at SRG. 8. ABG rejection ratio is – 20 times the logarithm of the ac amplitude at the output divided by the ac amplitude at ABG. optical characteristics, TA = 25°C, integration time = 16.67 ms (unless otherwise noted) PARAMETER Sensitivity (see Note 9) MIN No IR Filter TYP MAX 210 With IR Filter UNIT mV/lx 30 Saturation signal (see Note 10) 350 380 400 mV Maximum usable signal 170 190 200 mV Blooming overload ratio (see Note 11) 5 Image-area well capacity Dark current 40 Dark signal uniformity TA = 21°C TA = 45°C Shading Output signal = 100 mV ke nA/cm2 0.27 10 mV 20% NOTES: 9. Sensitivity is measured at a source temperature of 2856 K. A 1-mm CM-500 filter is used. 10. Saturation is the condition in which further increase in exposure does not lead to further increase in output signal. 11. Blooming-overload ratio is the ratio of blooming exposure to saturation exposure. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 11 TC221, TC225, TC227 SMALL-FORMAT CCD IMAGE SENSORS SOCS037C – DECEMBER 1991 – REVISED AUGUST 1997 APPLICATION INFORMATION V VSS OUT +5 V GND VCC SN28846 C1 0.1 µF Master Oscillator 1 2 3 VCC 4 5 6 7 8 9 10 VCC C2 0.1 µF CLK ABH ABM ABL GND VCC SG2 SG1 TG IAG User-Defined Timer + C5 68 µF VSS SEL1OUT SEL0 GND NC PD VCC SRG3IN SRG3OUT SRG2IN SRG2OUT SRG1IN SRG1OUT TRGIN TRGOUT NC VCC SEL2OUT SEL1 VSS 20 C4 + 68 µF TRG SUB SRG1 OUT1 SRG2 OUT2 ABG ADB IAG NC TC225 VCC VSS C7 68 µF + VCC 1 2 3 4 5 6 7 8 9 10 IALVL I/N IAIN ABIN MIDSEL SAIN PD GND Vabg+ VSS 12 V R11 100 Ω C11 0.1 µF Q1 2N3904 12 V OUT1 R12 1 kΩ C10 0.1 µF R1 22 kΩ TMS3473B VCC C3 68 µF + 19 18 17 16 15 14 13 12 11 VSS IASR ABSR V ABLVL IAOUT ABOUT SAOUT VCC Vabg– 12 V 20 19 18 17 16 15 14 13 12 11 R2 22 kΩ C12 0.1 µF Q2 2N3904 OUT2 R13 100 Ω ABLVL R14 1 kΩ + C6 68 µF VABG– VABG+ EL2020 R3 500 Ω –12 V –15 V R7 200 Ω C10 68 µF 15 V C8 0.1 µF 1 8 6 5 4 R6 1.5 Ω + D2 D1 1N4148 3 + 2 – R4 70 Ω R5 5 kΩ R9 1 kΩ 7 C9 0.1 µF R8 300 Ω R10 1 kΩ 1N4148 DC VOLTAGES 12 V ADB 5V VCC – 10 V VSS 2V V – 2.5 V ABLVL 4V VABG + –6 V VABG – SUPPORT CIRCUITS DEVICE PACKAGE APPLICATION 20 pin small outline Serial driver Driver for SRG TMS3473BDW 20 pin small outline Parallel driver Driver for IAG Figure 8. Typical Application Circuit Diagram 12 FUNCTION SN28846DW POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TC221, TC225, TC227 SMALL-FORMAT CCD IMAGE SENSORS SOCS037C – DECEMBER 1991 – REVISED AUGUST 1997 MECHANICAL DATA TC225 TC221 4,20 (0.165) NOM 3,30 (0.130) 3,10 (0.122) 3,60 (0.142) NOM 2,70 (0.106) 2,40 (0.094) ÉÉ ÉÉ ÉÉ ÉÉ ÉÉ ÉÉ ÉÉ ÉÉ ÉÉÉÉÉ ÉÉ ÉÉ 1 6 2 5 3 4 ÉÉ ÉÉ ÉÉ ÉÉ ÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉ 2,50 (0.098) 2,30 (0.091) 1 10 2 9 3 8 4 7 5 6 3,50 (0.138) NOM TC227 1,70 (0.067) 1,45 (0.057) 1,20 (0.047) NOM 1 2 3 É É É É É 6 5 2,00 (0.079) NOM 2,70 (0.106) 2,45 (0.096) 4 ALL LINEAR DIMENSIONS ARE IN MILLIMETERS AND PARENTHETICALLY IN INCHES POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7/94 13 IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. 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INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER’S RISK. In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof. Copyright 1999, Texas Instruments Incorporated