TI IEEE 1394a-2000 Consumer Electronics Solution TSB43EA/EB/EC42 TSB43EA/EB/EC43 Released – v1.1 SLLA275A – April 2008 – Revised July 2008 TSB43EA/EB/EC42 TSB43EA/EB/EC43 IEEE Std 1394a-2000 Consumer Electronics Solution Data Sheet Extract Rev 1.1 No duplication of this document is allowed without written consent from Texas Instruments. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet extract. NOTE Designing with this device may require extensive support. Before incorporating this device into a design, customers should contact TI or an Authorized TI Distributor. PRODUCTION DATA Information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 2008, Texas Instruments Incorporated 1 TI IEEE 1394a-2000 Consumer Electronics Solution TSB43EA/EB/EC42 TSB43EA/EB/EC43 Released – v1.1 SLLA275A – April 2008 – Revised July 2008 Table of Contents 1 2 3 4 5 6 7 Revision History .............................................................................................................................. 3 Overview.......................................................................................................................................... 4 Features .......................................................................................................................................... 5 3.1 1394 Features............................................................................................................................ 5 3.2 DTCP and AES Encryption Support for MPEG-DVB and DSS (TSB43EA42/43 and TSB43EC42/43 Only) ......................................................................................................................... 5 3.3 Video Interfaces......................................................................................................................... 5 3.4 External CPU Interfaces ............................................................................................................ 5 3.5 DMA........................................................................................................................................... 5 3.6 Data Buffers............................................................................................................................... 5 3.7 Hardware Packet Formatting for the Following Standards........................................................ 6 3.8 Additional Features.................................................................................................................... 6 General Information......................................................................................................................... 7 4.1 Disclaimer .................................................................................................................................. 7 4.2 Package Size/Ordering information........................................................................................... 7 4.3 Operating Voltage...................................................................................................................... 7 4.4 Operating Temperature ............................................................................................................. 7 Application Diagram ........................................................................................................................ 8 Block Diagram ............................................................................................................................... 10 Mechanical Data............................................................................................................................ 11 7.1 MicroStar™ BGA Package Information.................................................................................... 11 List of Figures Figure 1. TSB43EC42 in HDTV Application ........................................................................................... 8 Figure 2. TSB43EC2/43 in STB Application........................................................................................... 9 Figure 3. TSB43EA/EB/EC42, TSB43EA/EB/EC43 Block Diagram .................................................... 10 MicroStar BGA is a trademark of Texas Instruments. PRODUCTION DATA Information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 2008, Texas Instruments Incorporated 2 TI IEEE 1394a-2000 Consumer Electronics Solution TSB43EA/EB/EC42 TSB43EA/EB/EC43 Released – v1.1 1 SLLA275A – April 2008 – Revised July 2008 Revision History Version 1.0 - Released 1.1 - Released Date April 2008 July 2008 Notes Initial release Modification on operating ambient temperature range(section 4.4) PRODUCTION DATA Information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 2008, Texas Instruments Incorporated 3 TSB43EA/EB/EC42 TSB43EA/EB/EC43 Released – v1.1 2 TI IEEE 1394a-2000 Consumer Electronics Solution SLLA275A – April 2008 – Revised July 2008 Overview The TSB43Ex42/43 is high-performance consumer electronics 1394 link layer and integrated physical layer device designed for digitally interfacing advanced video consumer electronics applications. It supports formatting and transmission of IEC61883 data, including IEC61883-1 (general), IEC61883-2 (SD-DVCR), IEC61883-4 (MPEG2-TS), and IEC61883-7 (ITU-R BO.1294 SystemB-DSS). TSB43Ex42/43 also supports standard 1394 data types, such as asynchronous, asynchronous streams, and PHY packets. The TSB43EAxx/ECxx version incorporates DTCP (M6) baseline per the DTLA (5C) specification to support transmit and receive of up to two MPEG2 transport streams with encryption and decryption. The TSB43EAxx/ECxx version also includes hardware acceleration for content key generation. The TSB43EBxx devices are identical to the TSB43EAxx/ECxx devices, except without implementation of the encryption/decryption features. The TSB43EB42xx/43xx devices allow customers that do not require the encryption/decryption features to incorporate the TSB43Ex42/43 function without becoming DTLA licensees. The TSB43Ex42/43 features an integrated 2-port/3-port PHY. The PHY operates at 100 Mbps, 200 Mbps, or 400 Mbps. They follow all requirements as stated in IEEE Std 1394-1995 and IEEE Std 1394a-2000. PRODUCTION DATA Information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 2008, Texas Instruments Incorporated 4 TSB43EA/EB/EC42 TSB43EA/EB/EC43 Released – v1.1 3 3.1 1394 Features • • • Motorola 68K-style 16-bit asynchronous interface SRAM-like 16-bit asynchronous interface PCI interface (33 MHz) compliant to PCI specification version 3.0 (supports PCI slave and master functions) DMA • • 3.6 Two configurable high-speed data ports for video data o One port configurable as parallel or serial o One port serial only Pass-through modes for HSDI0 and HSDI1 Packet Insertion – Two insertion buffers per HSDI for PAT, PMT, SIT, and DIT packets PID filtering (32 PID filters per HSDI port) External CPU Interfaces • • • 3.5 DTCP encryption support on 1394 bus AES128 encryption support on HSDI path (TSB43EC42/43 only) Support for up to two encrypted/decrypted streams at one time Full or restricted AKE performed with hardware assist Secure method for loading DTCP and AES128 information using Ex-CPU interface Localization support compliant with DTCP draft revision 1.51. Video Interfaces • 3.4 Integrated 400/200/100-Mbps 2-port/3-port PHY Compliant with IEEE Std 1394-1995 and IEEE Std 1394a-2000 Supports bus manager functions and automatic 1394 self-id verification Separate asynchronous acknowledgement (Ack) buffers decrease Ack-tracking burden on external CPU DTCP and AES Encryption Support for MPEG-DVB and DSS (TSB43EA42/43 and TSB43EC42/43 Only) • • • • • • 3.3 SLLA275A – April 2008 – Revised July 2008 Features • • • • 3.2 TI IEEE 1394a-2000 Consumer Electronics Solution Higher asynchronous throughput with DMA hardware enhancements (available in PCI mode only) Internal DMA controller – Asynchronous, asynchronous Stream TX/RX o General DMA o Auto-response DMA for SBP2 transactions Data Buffers • • • • • • Two 4-KByte isochronous buffers for video data Two 2-KByte asynchronous/asynchronous stream transmit buffers Two 2-KByte asynchronous/asynchronous stream receive buffers One 1-KByte self-ID buffer Insertion buffers for MPEG-DVB/DSS packet insertion Programmable data/space available indicators for buffer flow control PRODUCTION DATA Information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 2008, Texas Instruments Incorporated 5 TSB43EA/EB/EC42 TSB43EA/EB/EC43 Released – v1.1 3.7 SLLA275A – April 2008 – Revised July 2008 Hardware Packet Formatting for the Following Standards • • • • • • • • • 3.8 TI IEEE 1394a-2000 Consumer Electronics Solution IEC61883-1 (general) IEC61883-2 (SD-DVCR) IEC61883-4 (MPEG2-TS) IEC61883-7 (ITU-R BO.1294 System B) – DSS Generic 61883 mode Asynchronous packets Asynchronous streams PHY packets (including self-IDs) MPEG4 supported under IEC61883-4 (no new requirement for MPEG4 over 1394) Additional Features • • • JTAG interface to support post-assembly scan of device I/O – boundary scan Unique “binding” method for protecting sensitive data on the circuit board traces at the Ex-CPU interface Unique “EMI-AES Binding” method to prevent protected data from being transmitted in the clear. PRODUCTION DATA Information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 2008, Texas Instruments Incorporated 6 TI IEEE 1394a-2000 Consumer Electronics Solution TSB43EA/EB/EC42 TSB43EA/EB/EC43 Released – v1.1 4 4.1 SLLA275A – April 2008 – Revised July 2008 General Information Disclaimer Any operations not described by this data sheet are undefined. TI is not responsible for the results if the user operates TSB43Ex42/43 in a manner not described by this document. 4.2 Package Size/Ordering information Only the devices in the green rows are available for order. Other devices are previews and are scheduled to be released. Ordering Number Availability Number of PHY Ports 5C/Non-5C Voltage TSB43EA42 Available 2 5C only 3.3 V/1.5 V TSB43EB42 Preview 2 Non-5C 3.3 V/1.5 V TSB43EC42 Preview 2 5C + AES 3.3 V/1.5 V TSB43EB43 Preview 3 Non-5C 3.3 V/1.5 V TSB43EA43 Preview 3 5C only 3.3 V/1.5 V TSB43EC43 Preview 3 5C + AES 3.3 V/1.5 V 4.3 Package MicroStar BGA™ 144 MicroStar BGA144 MicroStar BGA 144 MicroStar BGA 144 MicroStar BGA 144 MicroStar BGA 144 Package Type ZGU ZGU ZGU ZGU ZGU ZGU Operating Voltage Nominal voltage 1.5 V 3.3 V MIN 1.35 3 MAX 1.65 3.6 UNIT V V NOM MAX 70 85 UNIT °C °C 150 °C Note: I/Os are not 5-V tolerant (including PCI interface) 4.4 Operating Temperature Operating ambient temperature Commercial Industrial (To be released) Storage temperature MIN 0 -40 -65 PRODUCTION DATA Information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 2008, Texas Instruments Incorporated 7 TI IEEE 1394a-2000 Consumer Electronics Solution TSB43EA/EB/EC42 TSB43EA/EB/EC43 Released – v1.1 5 SLLA275A – April 2008 – Revised July 2008 Application Diagram Figure 1. TSB43EC42 in HDTV Application In the HDTV application, the TSB43EC42/43 receives the MPEG2 transport stream, decrypts it using the M6 cipher, and outputs it to the application over the HSDI port AES encrypted. The MPEG2 demultiplex and decode device separates the audio and video streams, decodes them, and outputs the 2-channel audio to an audio DAC for listening and the video to an NTSC/PAL encoder for display. The HDTV receives on-screen display (OSD) information from the video source, such as a set top box, using the EIA775 standard. The system processor receives the OSD data through the TSB43EC42/43 asynchronous receive buffer. The system graphics controller controls the OSD and mixes it with the video data for display. PRODUCTION DATA Information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 2008, Texas Instruments Incorporated 8 TI IEEE 1394a-2000 Consumer Electronics Solution TSB43EA/EB/EC42 TSB43EA/EB/EC43 Released – v1.1 PHY HSDI SLLA275A – April 2008 – Revised July 2008 Figure 2. TSB43EC2/43 in STB Application The set top box receives the MPEG2 transport stream from either satellite or cable sources. The MPEG2 transport stream is input to the TSB43EC42/43 HSDI port in AES encrypted format. The TSB43EC42/43 decrypts the packets received over the HSDI port, performs any PID filtering or packet insertion, encrypt the stream using M6 cipher, and transmit the stream over 1394. The set top box also creates on-screen display (OSD) graphics to transmit to the sink device. The system inputs the OSD data to the TSB43Ex42/43 asynchronous transmit buffer. The TSB43EC42/43 transmits the OSD using asynchronous packets to the sink device. PRODUCTION DATA Information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 2008, Texas Instruments Incorporated 9 TSB43EA/EB/EC42 TSB43EA/EB/EC43 Released – v1.1 6 TI IEEE 1394a-2000 Consumer Electronics Solution SLLA275A – April 2008 – Revised July 2008 Block Diagram Note: Blocks with the checked and shaded pattern are available only in selected versions of the device. Figure 3. TSB43EA/EB/EC42, TSB43EA/EB/EC43 Block Diagram PRODUCTION DATA Information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 2008, Texas Instruments Incorporated 10 TSB43EA/EB/EC42 TSB43EA/EB/EC43 TI IEEE 1394a-2000 Consumer Electronics Solution Released – v1.1 7 7.1 SLLA275A – April 2008 – Revised July 2008 Mechanical Data MicroStar™ BGA Package Information PRODUCTION DATA Information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 2008, Texas Instruments Incorporated 11 PACKAGE OPTION ADDENDUM www.ti.com 21-Oct-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TSB43EA42ZGU ACTIVE BGA ZGU 144 160 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR TSB43EC42ZGU ACTIVE BGA ZGU 144 126 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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