SN54HC14, SN74HC14 HEX SCHMITT-TRIGGER INVERTERS SCLS085F − DECEMBER 1982 − REVISED DECEMBER 2010 D Wide Operating Voltage Range of 2 V to 6 V D Outputs Can Drive Up To 10 LSTTL Loads D Low Power Consumption, 20-μA Max ICC D Typical tpd = 11 ns D ±4-mA Output Drive at 5 V D Low Input Current of 1 μA Max SN54HC14 . . . J OR W PACKAGE SN74HC14 . . . D, DB, N, NS, OR PW PACKAGE (TOP VIEW) 1 14 2 13 3 12 4 11 5 10 6 9 7 8 1Y 1A NC VCC 6A VCC 6A 6Y 5A 5Y 4A 4Y 2A NC 2Y NC 3A 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 6Y NC 5A NC 5Y 3Y GND NC 4Y 4A 1A 1Y 2A 2Y 3A 3Y GND SN54HC14 . . . FK PACKAGE (TOP VIEW) NC − No internal connection description/ordering information These Schmitt-trigger devices contain six independent inverters. They perform the Boolean function Y = A in positive logic. ORDERING INFORMATION PACKAGE† TA PDIP − N SN74HC14N Tube of 50 SN74HC14D Reel of 2500 SN74HC14DRG3 Reel of 250 SN74HC14DT SOP − NS Reel of 2000 SN74HC14NSR HC14 SSOP − DB Reel of 2000 SN74HC14DBR HC14 Tube of 90 SN74HC14PW Reel of 2000 SN74HC14PWR Reel of 250 SN74HC14PWT CDIP − J Tube SNJ54HC14J SNJ54HC14J CFP − W Tube SNJ54HC14W SNJ54HC14W LCCC − FK Tube SNJ54HC14FK SNJ54HC14FK TSSOP − PW −55°C 55 C to 125 125°C C † TOP-SIDE MARKING Tube of 25 SOIC − D −40°C 40 C to 85 85°C C ORDERABLE PART NUMBER SN74HC14N HC14 HC14 Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright © 2004, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN54HC14, SN74HC14 HEX SCHMITT-TRIGGER INVERTERS SCLS085F − DECEMBER 1982 − REVISED DECEMBER 2010 FUNCTION TABLE (each inverter) INPUT A OUTPUT Y H L L H logic diagram (positive logic) A Y absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Package thermal impedance, θJA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 3) SN54HC14 MIN NOM 5 SN74HC14 MAX MIN NOM 5 MAX UNIT VCC Supply voltage 2 6 2 6 V VI Input voltage 0 VCC 0 VCC V VO Output voltage 0 VCC 0 VCC V TA Operating free-air temperature −55 125 −40 85 °C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN54HC14, SN74HC14 HEX SCHMITT-TRIGGER INVERTERS SCLS085F − DECEMBER 1982 − REVISED DECEMBER 2010 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC VT+ VT− VT+ − VT− VOH MIN MAX 2V 0.7 1.2 1.5 0.7 1.5 0.7 1.5 1.55 2.5 3.15 1.55 3.15 1.55 3.15 6V 2.1 3.3 4.2 2.1 4.2 2.1 4.2 2V 0.3 0.6 1 0.3 1 0.3 1 4.5 V 0.9 1.6 2.45 0.9 2.45 0.9 2.45 6V 1.2 2 3.2 1.2 3.2 1.2 3.2 2V 0.2 0.6 1.2 0.2 1.2 0.2 1.2 4.5 V 0.4 0.9 2.1 0.4 2.1 0.4 2.1 6V 0.5 1.3 2.5 0.5 2.5 0.5 2.5 1.998 1.9 1.9 4.499 4.4 4.4 6V 5.9 5.999 5.9 5.9 IOH = −4 mA 4.5 V 3.98 4.3 3.7 3.84 6V 5.48 5.8 5.2 5.34 IOL = 5.2 mA IO = 0 UNIT V V V V 2V 0.002 0.1 0.1 0.1 4.5 V 0.001 0.1 0.1 0.1 6V 0.001 0.1 0.1 0.1 4.5 V 0.17 0.26 0.4 0.33 6V 0.15 0.26 0.4 0.33 6V ±0.1 ±100 ±1000 ±1000 nA 2 40 20 μA 3 10 10 10 pF 6V Ci MAX 4.5 V 4.4 IOL = 4 mA VI = VCC or 0, SN74HC14 MIN 1.9 VI = VIH or VIL ICC SN54HC14 2V IOL = 20 μA VI = VCC or 0 MAX 4.5 V IOH = −5.2 mA II TYP IOH = −20 20 μA VI = VIH or VIL VOL TA = 25°C MIN 2 V to 6 V V switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER tpd tt FROM (INPUT) TO (OUTPUT) VCC A Y Y TA = 25°C MIN SN54HC14 SN74HC14 MIN MIN TYP MAX MAX MAX 2V 55 125 190 155 4.5 V 12 25 38 31 6V 11 21 32 26 2V 38 75 110 95 4.5 V 8 15 22 19 6V 6 13 19 16 UNIT ns ns operating characteristics, TA = 25°C PARAMETER Cpd TEST CONDITIONS Power dissipation capacitance per inverter POST OFFICE BOX 655303 No load • DALLAS, TEXAS 75265 TYP 20 UNIT pF 3 SN54HC14, SN74HC14 HEX SCHMITT-TRIGGER INVERTERS SCLS085F − DECEMBER 1982 − REVISED DECEMBER 2010 PARAMETER MEASUREMENT INFORMATION From Output Under Test Test Point Input 50% VCC 50% 0V CL = 50 pF (see Note A) tPLH In-Phase Output LOAD CIRCUIT 50% 10% tPHL 90% 90% tr Input 50% 10% 90% 90% tr tPHL VCC 50% 10% 0 V Out-of-Phase Output 90% tf VOH 50% 10% VOL tf tPLH 50% 10% tf 50% 10% 90% tr VOH VOL VOLTAGE WAVEFORMS PROPAGATION DELAY AND OUTPUT TRANSITION TIMES VOLTAGE WAVEFORM INPUT RISE AND FALL TIMES NOTES: A. CL includes probe and test-fixture capacitance. B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns. C. The outputs are measured one at a time, with one input transition per measurement. D. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) 5962-8409101VCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8409101VC A SNV54HC14J 5962-8409101VDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8409101VD A SNV54HC14W 84091012A ACTIVE LCCC FK 20 1 TBD Call TI Call TI -55 to 125 84091012A SNJ54HC 14FK 8409101CA ACTIVE CDIP J 14 1 TBD Call TI Call TI -55 to 125 8409101CA SNJ54HC14J 8409101DA ACTIVE CFP W 14 1 TBD Call TI Call TI -55 to 125 8409101DA SNJ54HC14W JM38510/65702BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 65702BCA JM38510/65702BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 65702BDA M38510/65702BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 65702BCA M38510/65702BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 65702BDA SN54HC14J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SN54HC14J SN74HC14D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC14 SN74HC14DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC14 SN74HC14DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC14 SN74HC14DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC14 SN74HC14DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC14 SN74HC14DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC14 Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) SN74HC14DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC14 SN74HC14DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC14 SN74HC14DRG3 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 HC14 SN74HC14DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC14 SN74HC14DT ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC14 SN74HC14DTE4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC14 SN74HC14DTG4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC14 SN74HC14N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 SN74HC14N TBD Call TI Call TI -40 to 85 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 SN74HC14N3 OBSOLETE PDIP N 14 SN74HC14NE4 ACTIVE PDIP N 14 SN74HC14NSLE OBSOLETE SO NS 14 TBD Call TI Call TI -40 to 85 SN74HC14NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC14 SN74HC14NSRE4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC14 SN74HC14NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC14 SN74HC14PW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC14 SN74HC14PWE4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC14 SN74HC14PWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC14 SN74HC14PWLE OBSOLETE TSSOP PW 14 TBD Call TI Call TI -40 to 85 SN74HC14PWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 Addendum-Page 2 SN74HC14N HC14 Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) SN74HC14PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC14 SN74HC14PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC14 SN74HC14PWT ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC14 SN74HC14PWTE4 ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC14 SN74HC14PWTG4 ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC14 SNJ54HC14FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 84091012A SNJ54HC 14FK SNJ54HC14J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 8409101CA SNJ54HC14J SNJ54HC14W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 8409101DA SNJ54HC14W (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 3 Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54HC14, SN54HC14-SP, SN74HC14 : • Catalog: SN74HC14, SN54HC14 • Automotive: SN74HC14-Q1, SN74HC14-Q1 • Military: SN54HC14 • Space: SN54HC14-SP NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects • Military - QML certified for Military and Defense Applications • Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74HC14DBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 SN74HC14DR SOIC D 14 2500 330.0 16.4 6.55 9.05 2.1 8.0 16.0 Q1 SN74HC14DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74HC14DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74HC14DRG4 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74HC14DT SOIC D 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74HC14PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74HC14PWT TSSOP PW 14 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74HC14DBR SSOP DB 14 2000 367.0 367.0 38.0 SN74HC14DR SOIC D 14 2500 385.0 388.0 194.0 SN74HC14DR SOIC D 14 2500 333.2 345.9 28.6 SN74HC14DR SOIC D 14 2500 367.0 367.0 38.0 SN74HC14DRG4 SOIC D 14 2500 333.2 345.9 28.6 SN74HC14DT SOIC D 14 250 367.0 367.0 38.0 SN74HC14PWR TSSOP PW 14 2000 367.0 367.0 35.0 SN74HC14PWT TSSOP PW 14 250 367.0 367.0 35.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. 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