WINBOND W25Q16VZPIG

W25Q16V
16M-BIT
SERIAL FLASH MEMORY WITH
DUAL AND QUAD SPI
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Publication Release Date: October 7, 2009
Revision E
W25Q16V
Table of Contents
1.
GENERAL DESCRIPTION ......................................................................................................... 5
2.
FEATURES ................................................................................................................................. 5
3.
PIN CONFIGURATION SOIC 208-MIL ....................................................................................... 6
4.
PAD CONFIGURATION WSON 6X5-MM .................................................................................. 6
5.
PIN DESCRIPTION SOIC 208-MIL, AND WSON 6X5-MM ........................................................ 6
6.
PIN CONFIGURATION SOIC 300-MIL ....................................................................................... 7
7.
PIN DESCRIPTION SOIC 300-MIL ............................................................................................ 7
7.1
Package Types ............................................................................................................... 8
7.2
Chip Select (/CS) ............................................................................................................ 8
7.3
Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .............................. 8
7.4
Write Protect (/WP) ......................................................................................................... 8
7.5
HOLD (/HOLD) ............................................................................................................... 8
7.6
Serial Clock (CLK) .......................................................................................................... 8
8.
BLOCK DIAGRAM ...................................................................................................................... 9
9.
FUNCTIONAL DESCRIPTION ................................................................................................. 10
9.1
9.2
SPI OPERATIONS ....................................................................................................... 10
9.1.1
Standard SPI Instructions ...............................................................................................10
9.1.2
Dual SPI Instructions ......................................................................................................10
9.1.3
Quad SPI Instructions.....................................................................................................10
9.1.4
Hold Function .................................................................................................................10
WRITE PROTECTION.................................................................................................. 11
9.2.1
10.
Write Protect Features....................................................................................................11
CONTROL AND STATUS REGISTERS ................................................................................... 12
10.1
10.2
STATUS REGISTER .................................................................................................... 12
10.1.1
BUSY ............................................................................................................................12
10.1.2
Write Enable Latch (WEL) ............................................................................................12
10.1.3
Block Protect Bits (BP2, BP1, BP0) ..............................................................................12
10.1.4
Top/Bottom Block Protect (TB) .....................................................................................12
10.1.5
Sector/Block Protect (SEC) ..........................................................................................12
10.1.6
Status Register Protect (SRP1, SRP0) .........................................................................13
10.1.7
Quad Enable (QE) ........................................................................................................13
10.1.8
Status Register Memory Protection ..............................................................................15
INSTRUCTIONS ........................................................................................................... 16
10.2.1
Manufacturer and Device Identification.........................................................................16
10.2.2
Instruction Set Table 1 ..................................................................................................17
10.2.3
Instruction Set Table 2 (Read Instructions)...................................................................18
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W25Q16V
11.
12.
10.2.4
Write Enable (06h) ........................................................................................................19
10.2.5
Write Disable (04h) .......................................................................................................19
10.2.6
Read Status Register-1 (05h) and Read Status Register-2 (35h) .................................20
10.2.7
Write Status Register (01h) ..........................................................................................21
10.2.8
Read Data (03h) ...........................................................................................................22
10.2.9
Fast Read (0Bh) ...........................................................................................................23
10.2.10
Fast Read Dual Output (3Bh) .....................................................................................24
10.2.11
Fast Read Quad Output (6Bh) ....................................................................................25
10.2.12
Fast Read Dual I/O (BBh) ...........................................................................................26
10.2.13
Fast Read Quad I/O (EBh) .........................................................................................28
10.2.14
Octal Word Read Quad I/O (E3h) ...............................................................................30
10.2.15
Page Program (02h) ...................................................................................................32
10.2.16
Quad Input Page Program (32h) ................................................................................33
10.2.17
Sector Erase (20h) .....................................................................................................34
10.2.18
32KB Block Erase (52h) .............................................................................................35
10.2.19
64KB Block Erase (D8h) .............................................................................................36
10.2.20
Chip Erase (C7h / 60h) ...............................................................................................37
10.2.21
Erase Suspend (75h) ..................................................................................................38
10.2.22
Erase Resume (7Ah) ..................................................................................................38
10.2.23
Power-down (B9h) ......................................................................................................39
10.2.24
Release Power-down / Device ID (ABh) .....................................................................40
10.2.25
Read Manufacturer / Device ID (90h) .........................................................................42
10.2.26
Read Unique ID Number (4Bh) ...................................................................................43
10.2.27
JEDEC ID (9Fh)..........................................................................................................44
10.2.28
Continuous Read Mode Reset (FFh or FFFFh) ..........................................................45
ELECTRICAL CHARACTERISTICS ......................................................................................... 46
11.1
Absolute Maximum Ratings .......................................................................................... 46
11.2
Operating Ranges......................................................................................................... 46
11.3
Power-up Timing and Write Inhibit Threshold .............................................................. 47
11.4
DC Electrical Characteristics ........................................................................................ 48
11.5
AC Measurement Conditions ........................................................................................ 49
11.6
AC Electrical Characteristics ........................................................................................ 50
11.7
AC Electrical Characteristics (cont’d) ........................................................................... 51
11.8
Serial Output Timing ..................................................................................................... 52
11.9
Input Timing .................................................................................................................. 52
11.10
Hold Timing ................................................................................................................. 52
PACKAGE SPECIFICATION .................................................................................................... 53
12.1
8-Pin SOIC 208-mil (Package Code SS) ...................................................................... 53
12.2
8-Contact 6x5mm WSON (Package Code ZP) ............................................................ 54
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Publication Release Date: October 7, 2009
Revision E
W25Q16V
12.3
13.
ORDERING INFORMATION .................................................................................................... 57
13.1
14.
16-Pin SOIC 300-mil (Package Code SF) .................................................................... 56
Valid Part Numbers and Top Side Marking .................................................................. 58
REVISION HISTORY ................................................................................................................ 59
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W25Q16V
1. GENERAL DESCRIPTION
The W25Q16 (16M-bit) Serial Flash memory provides a storage solution for systems with limited
space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial
Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad
SPI (XIP) and storing voice, text and data. The devices operate on a single 2.7V to 3.6V power supply
with current consumption as low as 5mA active and 1µA for power-down. All devices are offered in
space-saving packages.
The W25Q16 array is organized into 8,192 programmable pages of 256-bytes each. Up to 256 bytes
can be programmed at a time. Pages can be erased in groups of 16 (sector erase), groups of 128
(32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q16
has 512 erasable sectors and 32 erasable blocks respectively. The small 4KB sectors allow for
greater flexibility in applications that require data and parameter storage. (See figure 2.)
The W25Q16 supports the standard Serial Peripheral Interface (SPI), and a high performance
Dual/Quad output as well as Dual/Quad I/O SPI: Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1
(DO), I/O2 (/WP), and I/O3 (/HOLD). SPI clock frequencies of up to 80MHz are supported allowing
equivalent clock rates of 160MHz for Dual Output and 320MHz for Quad Output when using the Fast
Read Dual/Quad Output instructions. These transfer rates can outperform standard Asyncronous 8
and 16-bit Parallel Flash memories. The Continuous Read Mode allows for efficient memory access
with as few as 8-clocks of instruction-overhead to read a 24-bit address, allowing true XIP (excute in
place) operation.
A Hold pin, Write Protect pin and programmable write protection, with top or bottom array control,
provide further control flexibility. Additionally, the device supports JEDEC standard manufacturer and
device identification with a 64-bit Unique Serial Number.
2. FEATURES
 Family of SpiFlash Memories
– W25Q16: 16M-bit / 2M-byte (2,097,152)
– 256-bytes per programmable page
 Low Power, Wide Temperature Range
– Single 2.7 to 3.6V supply
– 4mA active current, <1µA Power-down (typ.)
– -40°C to +85°C operating range
 Standard, Dual or Quad SPI
– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold
– Dual SPI: CLK, /CS, IO 0 , IO 1 , /WP, /Hold
– Quad SPI: CLK, /CS, IO 0 , IO 1 , IO 2 , IO 3
 Flexible Architecture with 4KB sectors
– Uniform Sector Erase (4K-bytes)
– Block Erase (32K and 64K-bytes)
– Program one to 256 bytes
– More than 100,000 erase/write cycles
– More than 20-year data retention
 Highest Performance Serial Flash
– Up to 6X that of ordinary Serial Flash
– 80MHz clock operation
– 160MHz equivalent Dual SPI
– 320MHz equivalent Quad SPI
– 40MB/S continuous data transfer rate
 Advanced Security Features
– Software and Hardware Write-Protect
– Top or Bottom, Sector or Block selection
– Lock-Down and OTP protection(1)
– 64-Bit Unique ID for each device(1)
 Efficient “Continuous Read Mode”
– Low Instruction overhead
– As few as 8 clocks to address memory
– Allows true XIP (excute in place) operation
– Outperforms X16 Parallel Flash
 Space Efficient Packaging
– 8-pin SOIC 208-mil
– 8-pad WSON 6x5-mm
– 16-pin SOIC 300-mil
– Contact Winbond for KGD and CSP options
Note 1: Contact Winbond for details
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Publication Release Date: October 7, 2009
Revision E
W25Q16V
3. PIN CONFIGURATION SOIC 208-MIL
Figure 1a. W25Q16 Pin Assignments, 8-pin SOIC 208-mil (Package Code SS)
4. PAD CONFIGURATION WSON 6X5-MM
Figure 1b. W25Q16 Pad Assignments, 8-pad WSON (Package Code ZP)
5. PIN DESCRIPTION SOIC 208-MIL, AND WSON 6X5-MM
PIN NO.
PIN NAME
I/O
FUNCTION
1
/CS
I
2
DO (IO1)
I/O
Data Output (Data Input Output 1)*1
3
/WP (IO2)
I/O
Write Protect Input ( Data Input Output 2)*2
4
GND
5
DI (IO0)
Chip Select Input
Ground
I/O
6
CLK
I
7
/HOLD (IO3)
I/O
8
VCC
Data Input (Data Input Output 0)*1
Serial Clock Input
Hold Input (Data Input Output 3)*2
Power Supply
*1 IO0 and IO1 are used for Standard and Dual SPI instructions
*2 IO0 – IO3 are used for Quad SPI instructions
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W25Q16V
6.
PIN CONFIGURATION SOIC 300-MIL
Figure 1c. W25Q16 Pin Assignments, 16-pin SOIC 300-mil (Package Code SF)
7. PIN DESCRIPTION SOIC 300-MIL
PAD NO.
PAD NAME
I/O
FUNCTION
1
/HOLD (IO3)
I/O
2
VCC
Power Supply
3
N/C
No Connect
4
N/C
No Connect
5
N/C
No Connect
6
N/C
No Connect
7
/CS
I
8
DO (IO1)
I/O
Data Output (Data Input Output 1)*1
9
/WP (IO2)
I/O
Write Protect Input (Data Input Output 2)*2
10
GND
Ground
11
N/C
No Connect
12
N/C
No Connect
13
N/C
No Connect
14
N/C
No Connect
15
DI (IO0)
I/O
16
CLK
I
Hold Input (Data Input Output 3)*2
Chip Select Input
Data Input (Data Input Output 0)*1
Serial Clock Input
*1 IO0 and IO1 are used for Standard and Dual SPI instructions
*2 IO0 – IO3 are used for Quad SPI instructions
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Publication Release Date: October 7, 2009
Revision E
W25Q16V
7.1
Package Types
W25Q16 is offered in an 8-pin plastic 208-mil width SOIC (package code SS) and 6x5-mm WSON
(package code ZP) as shown in figure 1a, and 1b, respectively. The W25Q16 is also offered in a 16-pin
plastic 300-mil width SOIC (package code SF) as shown in figure 1c. Package diagrams and
dimensions are illustrated at the end of this datasheet.
7.2
Chip Select (/CS)
The SPI Chip Select (/CS) pin enables and disables device operation. When /CS is high the device is
deselected and the Serial Data Output (DO, or IO0, IO1, IO2, IO3) pins are at high impedance. When
deselected, the devices power consumption will be at standby levels unless an internal erase, program
or status register cycle is in progress. When /CS is brought low the device will be selected, power
consumption will increase to active levels and instructions can be written to and data read from the
device. After power-up, /CS must transition from high to low before a new instruction will be accepted.
The /CS input must track the VCC supply level at power-up (see “Write Protection” and figure 30). If
needed a pull-up resister on /CS can be used to accomplish this.
7.3
Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3)
The W25Q16 supports standard SPI, Dual SPI and Quad SPI operation. Standard SPI instructions use
the unidirectional DI (input) pin to serially write instructions, addresses or data to the device on the
rising edge of the Serial Clock (CLK) input pin. Standard SPI also uses the unidirectional DO (output) to
read data or status from the device on the falling edge CLK.
Dual and Quad SPI instruction use the bidirectional IO pins to serially write instructions, addresses or
data to the device on the rising edge of CLK and read data or status from the device on the falling edge
of CLK. Quad SPI instructions require the non-volatile Quad Enable bit (QE) in Status Register-2 to be
set. When QE=1 the /WP pin becomes IO2 and /HOLD pin becomes IO3.
7.4
Write Protect (/WP)
The Write Protect (/WP) pin can be used to prevent the Status Register from being written. Used in
conjunction with the Status Register’s Block Protect (SEC, TB, BP2, BP1 and BP0) bits and Status
Register Protect (SRP) bits, a portion or the entire memory array can be hardware protected. The /WP
pin is active low. When the QE bit of Status Register-2 is set for Quad I/O, the /WP pin (Hardware Write
Protect) function is not available since this pin is used for IO2. See figure 1a, 1b, and 1c for the pin
configuration of Quad I/O operation.
7.5
HOLD (/HOLD)
The /HOLD pin allows the device to be paused while it is actively selected. When /HOLD is brought low,
while /CS is low, the DO pin will be at high impedance and signals on the DI and CLK pins will be
ignored (don’t care). When /HOLD is brought high, device operation can resume. The /HOLD function
can be useful when multiple devices are sharing the same SPI signals. The /HOLD pin is active low.
When the QE bit of Status Register-2 is set for Quad I/O, the /HOLD pin function is not available since
this pin is used for IO3. See figure 1a, 1b, and 1c for the pin configuration of Quad I/O operation.
7.6
Serial Clock (CLK)
The SPI Serial Clock Input (CLK) pin provides the timing for serial input and output operations. ("See
SPI Operations")
-8-
W25Q16V
BLOCK DIAGRAM
Block Segmentation
xxFF00h
•
xxF000h
Sector 15 (4KB)
xxFFFFh
•
xxF0FFh
xxEF00h
•
xxE000h
Sector 14 (4KB)
xxEFFFh
•
xxE0FFh
xxDF00h
•
xxD000h
Sector 13 (4KB)
xxDFFFh
•
xxD0FFh
1FFF00h
•
1F0000h
Sector 2 (4KB)
xx2FFFh
•
xx20FFh
xx1F00h
•
xx1000h
Sector 1 (4KB)
xx1FFFh
•
xx10FFh
xx0F00h
•
xx0000h
Sector 0 (4KB)
xx0FFFh
•
xx00FFh
Write Protect Logic and Row Decode
xx2F00h
•
xx2000h
Write Control
Logic
Status
Register
10FF00h
•
100000h
Block 16 (64KB)
10FFFFh
•
1000FFh
0FFF00h
•
0F0000h
Block 15 (64KB)
0FFFFFh
•
0F00FFh
•
•
•
08FF00h
•
080000h
Block 8 (64KB)
08FFFFh
•
0800FFh
07FF00h
•
070000h
Block 7 (64KB)
07FFFFh
•
0700FFh
•
•
•
High Voltage
Generators
00FF00h
•
000000h
/HOLD (IO3)
CLK
/CS
DI (IO0)
DO (IO1)
SPI
Command &
Control Logic
1FFFFFh
•
1F00FFh
•
•
•
•
•
•
/WP (IO2)
Block 31 (64KB)
W25Q16
8.
Page Address
Latch / Counter
Beginning
Page Address
Block 0 (64KB)
00FFFFh
•
0000FFh
Ending
Page Address
Column Decode
And 256-Byte Page Buffer
Data
Byte Address
Latch / Counter
Figure 2. W25Q16 Block Diagram
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Publication Release Date: October 7, 2009
Revision E
W25Q16V
9. FUNCTIONAL DESCRIPTION
9.1
SPI OPERATIONS
9.1.1 Standard SPI Instructions
The W25Q16 is accessed through an SPI compatible bus consisting of four signals: Serial Clock (CLK),
Chip Select (/CS), Serial Data Input (DI) and Serial Data Output (DO). Standard SPI instructions use the
DI input pin to serially write instructions, addresses or data to the device on the rising edge of CLK. The
DO output pin is used to read data or status from the device on the falling edge CLK.
SPI bus operation Modes 0 (0,0) and 3 (1,1) are supported. The primary difference between Mode 0
and Mode 3 concerns the normal state of the CLK signal when the SPI bus master is in standby and
data is not being transferred to the Serial Flash. For Mode 0 the CLK signal is normally low on the
falling and rising edges of /CS. For Mode 3 the CLK signal is normally high on the falling and rising
edges of /CS.
9.1.2 Dual SPI Instructions
The W25Q16 supports Dual SPI operation when using the "Fast Read Dual Output and Dual I/O" (3B
and BB hex) instructions. These instructions allow data to be transferred to or from the device at two to
three times the rate of ordinary Serial Flash devices. The Dual Read instructions are ideal for quickly
downloading code to RAM upon power-up (code-shadowing) or for executing non-speed-critical code
directly from the SPI bus (XIP). When using Dual SPI instructions the DI and DO pins become
bidirectional I/O pins: IO0 and IO1.
9.1.3 Quad SPI Instructions
The W25Q16 supports Quad SPI operation when using the "Fast Read Quad Output and Fast Read
Quad I/O" (6B and EB hex respectively). These instructions allow data to be transferred to or from the
device four to six times the rate of ordinary Serial Flash. The Quad Read instructions offer a significant
improvement in continuous and random access transfer rates allowing fast code-shadowing to RAM or
execution directly from the SPI bus (XIP). When using Quad SPI instructions the DI and DO pins
become bidirectional IO0 and IO1, and the /WP and /HOLD pins become IO2 and IO3 respectively.
Quad SPI instructions require the non-volatile Quad Enable bit (QE) in Status Register-2 to be set.
9.1.4 Hold Function
The /HOLD signal allows the W25Q16 operation to be paused while it is actively selected (when /CS is
low). The /HOLD function may be useful in cases where the SPI data and clock signals are shared with
other devices. For example, consider if the page buffer was only partially written when a priority
interrupt requires use of the SPI bus. In this case the /HOLD function can save the state of the
instruction and the data in the buffer so programming can resume where it left off once the bus is
available again. The /HOLD function is only available for standard SPI and Dual SPI operation, not
during Quad SPI.
To initiate a /HOLD condition, the device must be selected with /CS low. A /HOLD condition will activate
on the falling edge of the /HOLD signal if the CLK signal is already low. If the CLK is not already low the
/HOLD condition will activate after the next falling edge of CLK. The /HOLD condition will terminate on
the rising edge of the /HOLD signal if the CLK signal is already low. If the CLK is not already low the
/HOLD condition will terminate after the next falling edge of CLK. During a /HOLD condition, the Serial
Data Output (DO) is high impedance, and Serial Data Input (DI) and Serial Clock (CLK) are ignored.
The Chip Select (/CS) signal should be kept active (low) for the full duration of the /HOLD operation to
avoid resetting the internal logic state of the device.
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W25Q16V
9.2
WRITE PROTECTION
Applications that use non-volatile memory must take into consideration the possibility of noise and other
adverse system conditions that may compromise data integrity. To address this concern the W25Q16
provides several means to protect data from inadvertent writes.
9.2.1
Write Protect Features

Device resets when VCC is below threshold

Time delay write disable after Power-up

Write enable/disable instructions and automatic write disable after program and erase

Software and Hardware (/WP pin) write protection using Status Register

Write Protection using Power-down instruction

Lock Down write protection until next power-up(1)

One Time Program (OTP) write protection(1)
Note 1: These features are available upon special order. Please contact Winbond for details.
Upon power-up or at power-down, the W25Q16 will maintain a reset condition while VCC is below the
threshold value of VWI, (See Power-up Timing and Voltage Levels and Figure 30). While reset, all
operations are disabled and no instructions are recognized. During power-up and after the VCC voltage
exceeds VWI, all program and erase related instructions are further disabled for a time delay of tPUW.
This includes the Write Enable, Page Program, Sector Erase, Block Erase, Chip Erase and the Write
Status Register instructions. Note that the chip select pin (/CS) must track the VCC supply level at
power-up until the VCC-min level and tVSL time delay is reached. If needed a pull-up resister on /CS can
be used to accomplish this.
After power-up the device is automatically placed in a write-disabled state with the Status Register Write
Enable Latch (WEL) set to a 0. A Write Enable instruction must be issued before a Page Program,
Sector Erase, Chip Erase or Write Status Register instruction will be accepted. After completing a
program, erase or write instruction the Write Enable Latch (WEL) is automatically cleared to a writedisabled state of 0.
Software controlled write protection is facilitated using the Write Status Register instruction and setting
the Status Register Protect (SRP0, SRP1) and Block Protect (SEC,TB, BP2, BP1 and BP0) bits. These
settings allow a portion or all of the memory to be configured as read only. Used in conjunction with the
Write Protect (/WP) pin, changes to the Status Register can be enabled or disabled under hardware
control. See Status Register for further information. Additionally, the Power-down instruction offers an
extra level of write protection as all instructions are ignored except for the Release Power-down
instruction.
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Publication Release Date: October 7, 2009
Revision E
W25Q16V
10.
CONTROL AND STATUS REGISTERS
The Read Status Register-1 and Status Register-2 instructions can be used to provide status on the
availability of the Flash memory array, if the device is write enabled or disabled, the state of write
protection and the Quad SPI setting. The Write Status Register instruction can be used to configure the
devices write protection features and Quad SPI setting. Write access to the Status Register is controlled by
the state of the non-volatile Status Register Protect bits (SRP0, SRP1), the Write Enable instruction, and
in some cases the /WP pin.
10.1 STATUS REGISTER
10.1.1 BUSY
BUSY is a read only bit in the status register (S0) that is set to a 1 state when the device is executing a
Page Program, Sector Erase, Block Erase, Chip Erase or Write Status Register instruction. During this
time the device will ignore further instructions except for the Read Status Register and Erase Suspend
instruction (see tW, tPP, tSE, tBE, and tCE in AC Characteristics). When the program, erase or write status
register instruction has completed, the BUSY bit will be cleared to a 0 state indicating the device is
ready for further instructions.
10.1.2 Write Enable Latch (WEL)
Write Enable Latch (WEL) is a read only bit in the status register (S1) that is set to a 1 after executing a
Write Enable Instruction. The WEL status bit is cleared to a 0 when the device is write disabled. A write
disable state occurs upon power-up or after any of the following instructions: Write Disable, Page
Program, Sector Erase, Block Erase, Chip Erase and Write Status Register.
10.1.3 Block Protect Bits (BP2, BP1, BP0)
The Block Protect Bits (BP2, BP1, BP0) are non-volatile read/write bits in the status register (S4, S3,
and S2) that provide Write Protection control and status. Block Protect bits can be set using the Write
Status Register Instruction (see tW in AC characteristics). All, none or a portion of the memory array can
be protected from Program and Erase instructions (see Status Register Memory Protection table). The
factory default setting for the Block Protection Bits is 0, none of the array protected.
10.1.4 Top/Bottom Block Protect (TB)
The non-volatile Top/Bottom bit (TB) controls if the Block Protect Bits (BP2, BP1, BP0) protect from the
Top (TB=0) or the Bottom (TB=1) of the array as shown in the Status Register Memory Protection table.
The factory default setting is TB=0. The TB bit can be set with the Write Status Register Instruction
depending on the state of the SRP0, SRP1 and WEL bits.
10.1.5 Sector/Block Protect (SEC)
The non-volatile Sector protect bit (SEC) controls if the Block Protect Bits (BP2, BP1, BP0) protect 4KB
Sectors (SEC=1) or 64KB Blocks (SEC=0) in the Top (TB=0) or the Bottom (TB=1) of the array as
shown in the Status Register Memory Protection table. The default setting is SEC=0.
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W25Q16V
10.1.6 Status Register Protect (SRP1, SRP0)
The Status Register Protect bits (SRP1 and SRP0) are non-volatile read/write bits in the status register
(S8 and S7). The SRP bits control the method of write protection: software protection, hardware
protection, power supply lock-down or one time programmable (OTP) protection.
SRP1
SRP0
/WP
Status
Register
Description
0
0
X
Software
Protection
/WP pin has no control. The Status register can be written to
after a Write Enable instruction, WEL=1. [Factory Default]
0
1
0
Hardware
Protected
When /WP pin is low the Status Register locked and can not
be written to.
0
1
1
Hardware
Unprotected
When /WP pin is high the Status register is unlocked and can
be written to after a Write Enable instruction, WEL=1.
1
0
X
Power Supply
Lock-Down(1)
1
1
X
One Time
Program(1)
Status Register is protected and can not be written to again
until the next power-down, power-up cycle.(2)
Status Register is permanently protected and can not be
written to.
Note:
1. These features are available upon special order. Please contact Winbond for details.
2. When SRP1, SRP0 = (1, 0), a power-down, power-up cycle will change SRP1, SRP0 to (0, 0) state.
10.1.7 Quad Enable (QE)
The Quad Enable (QE) bit is a non-volatile read/write bit in the status register (S9) that allows Quad
operation. When the QE bit is set to a 0 state (factory default) the /WP pin and /Hold are enabled. When
the QE pin is set to a 1 the Quad IO2 and IO3 pins are enabled.
WARNING: The QE bit should never be set to a 1 during standard SPI or Dual SPI operation if the
/WP or /HOLD pins are tied directly to the power supply or ground.
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Publication Release Date: October 7, 2009
Revision E
W25Q16V
Figure 3a. Status Register-1
Figure 3b. Status Register-2
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W25Q16V
10.1.8 Status Register Memory Protection
STATUS REGISTER(1)
(2)
W25Q16 (16M-BIT) MEMORY PROTECTION
TB
BP2
BP1
BP0
BLOCK(S)
ADDRESSES
DENSITY
PORTION
X
X
0
0
0
NONE
NONE
NONE
NONE
0
0
0
0
1
31
1F0000h - 1FFFFFh
64KB
Upper 1/32
0
0
0
1
0
30 and 31
1E0000h - 1FFFFFh
128KB
Upper 1/16
0
0
0
1
1
28 thru 31
1C0000h - 1FFFFFh
256KB
Upper 1/8
0
0
1
0
0
24 thru 31
180000h - 1FFFFFh
512KB
Upper 1/4
0
0
1
0
1
16 thru 31
100000h - 1FFFFFh
1MB
Upper 1/2
0
1
0
0
1
0
000000h - 00FFFFh
64KB
Lower 1/32
0
1
0
1
0
0 and 1
000000h - 01FFFFh
128KB
Lower 1/16
0
1
0
1
1
0 thru 3
000000h - 03FFFFh
256KB
Lower 1/8
0
1
1
0
0
0 thru 7
000000h - 07FFFFh
512KB
Lower 1/4
0
1
1
0
1
0 thru 15
000000h – 0FFFFFh
1MB
Lower 1/2
X
X
1
1
X
0 thru 31
000000h – 1FFFFFh
2MB
ALL
1
0
0
0
1
31
1FF000h – 1FFFFFh
4KB
Top Block
1
0
0
1
0
31
1FE000h – 1FFFFFh
8KB
Top Block
1
0
0
1
1
31
1FC000h – 1FFFFFh
16KB
Top Block
1
0
1
0
X
31
1F8000h – 1FFFFFh
32KB
Top Block
1
1
0
0
1
0
000000h – 000FFFh
4KB
Bottom Block
1
1
0
1
0
0
000000h – 001FFFh
8KB
Bottom Block
1
1
0
1
1
0
000000h – 003FFFh
16KB
Bottom Block
1
1
1
0
X
0
000000h – 007FFFh
32KB
Bottom Block
SEC
Note:
1. x = don’t care
2. When SEC=1, Block Erase (32KB or 64KB) instructions should not issued to Top or Bottom Blocks.
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W25Q16V
10.2 INSTRUCTIONS
The instruction set of the W25Q16 consists of twenty six basic instructions that are fully controlled
through the SPI bus (see Instruction Set table). Instructions are initiated with the falling edge of Chip
Select (/CS). The first byte of data clocked into the DI input provides the instruction code. Data on the
DI input is sampled on the rising edge of clock with most significant bit (MSB) first.
Instructions vary in length from a single byte to several bytes and may be followed by address bytes,
data bytes, dummy bytes (don’t care), and in some cases, a combination. Instructions are completed
with the rising edge of edge /CS. Clock relative timing diagrams for each instruction are included in
figures 4 through 29. All read instructions can be completed after any clocked bit. However, all
instructions that Write, Program or Erase must complete on a byte boundary (/CS driven high after a full
8-bits have been clocked) otherwise the instruction will be terminated. This feature further protects the
device from inadvertent writes. Additionally, while the memory is being programmed or erased, or when
the Status Register is being written, all instructions except for Read Status Register will be ignored until
the program or erase cycle has completed.
10.2.1 Manufacturer and Device Identification
MANUFACTURER ID
(M7-M0)
Winbond Serial Flash
EFh
Device ID
(ID7-ID0)
(ID15-ID0)
Instruction
ABh, 90h
9Fh
W25Q16
14h
4015h
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W25Q16V
10.2.2 Instruction Set Table 1 (1)
INSTRUCTION
NAME
BYTE 1
(CODE)
BYTE 2
BYTE 3
BYTE 4
BYTE 5
BYTE 6
Write Enable
06h
Write Disable
04h
Read Status Register-1
05h
(S7–S0)
Read Status Register-2
35h
(S15-S8)
Write Status Register
01h
(S7–S0)
(S15-S8)
Page Program
02h
A23–A16
A15–A8
A7–A0
(D7–D0)
Quad Page Program
32h
A23–A16
A15–A8
A7–A0
(D7–D0, …)
Block Erase (64KB)
D8h
A23–A16
A15–A8
A7–A0
Block Erase (32KB)
52h
A23–A16
A15–A8
A7–A0
Sector Erase (4KB)
20h
A23–A16
A15–A8
A7–A0
Chip Erase
75h
Erase Resume
7Ah
Power-down
B9h
Continuous Read Mode
(4)
Release Power down/
Device ID
Manufacturer/
Device ID
(6)
Read Unique ID
JEDEC ID
(2)
(3)
C7h/60h
Erase Suspend
Reset
(2)
(7)
FFh
FFh
ABh
dummy
dummy
dummy
90h
dummy
dummy
00h
(M7-M0)
(ID7-ID0)
4Bh
dummy
dummy
dummy
Dummy
(ID63-ID0)
(M7-M0)
(ID15-ID8)
(ID7-ID0)
Manufacturer
Memory Type
Capacity
9Fh
(ID7-ID0)
(5)
Notes:
1. Data bytes are shifted with Most Significant Bit first. Byte fields with data in parenthesis “()” indicate data being
read from the device on the DO pin.
2. The Status Register contents will repeat continuously until /CS terminates the instruction.
3. Quad Page Program Input Data
IO0 = (D4, D0, ……)
IO1 = (D5, D1, ……)
IO2 = (D6, D2, ……)
IO3 = (D7, D3, ……)
4. This instruction is recommended when using the Dual or Quad “Continuous Read Mode” feature. See section
10.2.28 for more information.
5. The Device ID will repeat continuously until /CS terminates the instruction.
6. See Manufacturer and Device Identification table for Device ID information.
7. This feature is available upon special order. Please contact Winbond for details.
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W25Q16V
10.2.3 Instruction Set Table 2 (Read Instructions)
INSTRUCTION
NAME
BYTE 1
(CODE)
BYTE 2
BYTE 3
BYTE 4
BYTE 5
Read Data
03h
A23-A16
A15-A8
A7-A0
(D7-D0)
Fast Read
0Bh
A23-A16
A15-A8
A7-A0
dummy
(D7-D0)
Fast Read Dual Output
3Bh
A23-A16
A15-A8
A7-A0
dummy
(D7-D0, …)
Fast Read Dual I/O
BBh
A23-A8
Fast Read Quad Output
6Bh
A23-A16
dummy
(D7-D0, …)
Fast Read Quad I/O
EBh
A23-A0, M7-M0
E3h
A23-A0, M7-M0
Octal Word Read
(6)
Quad I/O
(2)
A7-A0, M7-M0
(2)
(4)
(1)
A7-A0
(5)
(x,x,x,x, D7-D0, …)
(3)
(D7-D0, …)
(3)
(D7-D0, …)
Notes:
1. Dual Output data
IO0 = (D6, D4, D2, D0)
IO1 = (D7, D5, D3, D1)
2. Dual Input Address
IO0 = A22, A20, A18, A16, A14, A12, A10, A8 A6, A4, A2, A0, M6, M4, M2, M0
IO1 = A23, A21, A19, A17, A15, A13, A11, A9 A7, A5, A3, A1, M7, M5, M3, M1
3. Quad Output Data
IO0 = (D4, D0, …..)
IO1 = (D5, D1, …..)
IO2 = (D6, D2, …..)
IO3 = (D7, D3, …..)
4. Quad Input Address
IO0 = A20, A16, A12, A8, A4, A0, M4, M0
IO1 = A21, A17, A13, A9, A5, A1, M5, M1
IO2 = A22, A18, A14, A10, A6, A2, M6, M2
IO3 = A23, A19, A15, A11, A7, A3, M7, M3
5. Fast Read Quad I/O Data
IO0 = (x, x, x, x, D4, D0, …..)
IO1 = (x, x, x, x, D5, D1, …..)
IO2 = (x, x, x, x, D6, D2, …..)
IO3 = (x, x, x, x, D7, D3, …..)
6. The lowest 4 address bits must be 0. ( A0, A1, A2, A3 = 0 )
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(1)
(D7-D0, …)
A15-A8
(4)
BYTE 6
(3)
W25Q16V
10.2.4 Write Enable (06h)
The Write Enable instruction (Figure 4) sets the Write Enable Latch (WEL) bit in the Status Register to a
1. The WEL bit must be set prior to every Page Program, Sector Erase, Block Erase, Chip Erase and
Write Status Register instruction. The Write Enable instruction is entered by driving /CS low, shifting the
instruction code “06h” into the Data Input (DI) pin on the rising edge of CLK, and then driving /CS high.
Figure 4. Write Enable Instruction Sequence Diagram
10.2.5 Write Disable (04h)
The Write Disable instruction (Figure 5) resets the Write Enable Latch (WEL) bit in the Status Register
to a 0. The Write Disable instruction is entered by driving /CS low, shifting the instruction code “04h” into
the DI pin and then driving /CS high. Note that the WEL bit is automatically reset after Power-up and
upon completion of the Write Status Register, Page Program, Sector Erase, Block Erase and Chip
Erase instructions.
Figure 5. Write Disable Instruction Sequence Diagram
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10.2.6 Read Status Register-1 (05h) and Read Status Register-2 (35h)
The Read Status Register instructions allow the 8-bit Status Registers to be read. The instruction is
entered by driving /CS low and shifting the instruction code “05h” for Status Register-1 and “35h” for
Status Register-2 into the DI pin on the rising edge of CLK. The status register bits are then shifted out
on the DO pin at the falling edge of CLK with most significant bit (MSB) first as shown in figure 6. The
Status Register bits are shown in figure 3a and 3b and include the BUSY, WEL, BP2-BP0, TB, SEC,
SRP0, SRP1 and QE bits (see description of the Status Register earlier in this datasheet).
The Status Register instruction may be used at any time, even while a Program, Erase or Write Status
Register cycle is in progress. This allows the BUSY status bit to be checked to determine when the
cycle is complete and if the device can accept another instruction. The Status Register can be read
continuously, as shown in Figure 6. The instruction is completed by driving /CS high.
Figure 6. Read Status Register Instruction Sequence Diagram
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W25Q16V
10.2.7 Write Status Register (01h)
The Write Status Register instruction allows the Status Register to be written. A Write Enable instruction
must previously have been executed for the device to accept the Write Status Register Instruction
(Status Register bit WEL must equal 1). Once write enabled, the instruction is entered by driving /CS
low, sending the instruction code “01h”, and then writing the status register data byte as illustrated in
figure 7. The Status Register bits are shown in figure 3 and described earlier in this datasheet.
Only non-volatile Status Register bits SRP0, SEC, TB, BP2, BP1, BP0 (bits 7, 5, 4, 3, 2 of Status
Register-1) and QE, SRP1(bits 9 and 8 of Status Register-2) can be written to. All other Status Register
bit locations are read-only and will not be affected by the Write Status Register instruction.
The /CS pin must be driven high after the eighth or sixteenth bit of data that is clocked in. If this is not
done the Write Status Register instruction will not be executed. If /CS is driven high after the eighth
clock (compatible with the 25X series) the QE and SRP1 bits will be cleared to 0. After /CS is driven
high, the self-timed Write Status Register cycle will commence for a time duration of tW (See AC
Characteristics). While the Write Status Register cycle is in progress, the Read Status Register
instruction may still be accessed to check the status of the BUSY bit. The BUSY bit is a 1 during the
Write Status Register cycle and a 0 when the cycle is finished and ready to accept other instructions
again. After the Write Register cycle has finished the Write Enable Latch (WEL) bit in the Status
Register will be cleared to 0.
The Write Status Register instruction allows the Block Protect bits (SEC, TB, BP2, BP1 and BP0) to be
set for protecting all, a portion, or none of the memory from erase and program instructions. Protected
areas become read-only (see Status Register Memory Protection table and description). The Write
Status Register instruction also allows the Status Register Protect bits (SRP0, SRP1) to be set. Those
bits are used in conjunction with the Write Protect (/WP) pin, Lock out or OTP features to disable writes
to the status register. Please refer to 10.1.6 for detailed descriptions regarding Status Register
protection methods. Factory default for all status Register bits are 0.
Figure 7. Write Status Register Instruction Sequence Diagram
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W25Q16V
10.2.8 Read Data (03h)
The Read Data instruction allows one more data bytes to be sequentially read from the memory. The
instruction is initiated by driving the /CS pin low and then shifting the instruction code “03h” followed by
a 24-bit address (A23-A0) into the DI pin. The code and address bits are latched on the rising edge of
the CLK pin. After the address is received, the data byte of the addressed memory location will be
shifted out on the DO pin at the falling edge of CLK with most significant bit (MSB) first. The address is
automatically incremented to the next higher address after each byte of data is shifted out allowing for a
continuous stream of data. This means that the entire memory can be accessed with a single instruction
as long as the clock continues. The instruction is completed by driving /CS high. The Read Data
instruction sequence is shown in figure 8. If a Read Data instruction is issued while an Erase, Program
or Write cycle is in process (BUSY=1) the instruction is ignored and will not have any effects on the
current cycle. The Read Data instruction allows clock rates from D.C. to a maximum of fR (see AC
Electrical Characteristics).
Figure 8. Read Data Instruction Sequence Diagram
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W25Q16V
10.2.9 Fast Read (0Bh)
The Fast Read instruction is similar to the Read Data instruction except that it can operate at the
highest possible frequency of FR (see AC Electrical Characteristics). This is accomplished by adding
eight “dummy” clocks after the 24-bit address as shown in figure 9. The dummy clocks allow the
devices internal circuits additional time for setting up the initial address. During the dummy clocks the
data value on the DO pin is a “don’t care”.
Figure 9. Fast Read Instruction Sequence Diagram
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W25Q16V
10.2.10 Fast Read Dual Output (3Bh)
The Fast Read Dual Output (3Bh) instruction is similar to the standard Fast Read (0Bh) instruction
except that data is output on two pins; IO 0 and IO 1 . This allows data to be transferred from the W25Q16
at twice the rate of standard SPI devices. The Fast Read Dual Output instruction is ideal for quickly
downloading code from Flash to RAM upon power-up or for applications that cache code-segments to
RAM for execution.
Similar to the Fast Read instruction, the Fast Read Dual Output instruction can operate at the highest
possible frequency of F R (see AC Electrical Characteristics). This is accomplished by adding eight
“dummy” clocks after the 24-bit address as shown in figure 10. The dummy clocks allow the device's
internal circuits additional time for setting up the initial address. The input data during the dummy clocks
is “don’t care”. However, the IO 0 pin should be high-impedance prior to the falling edge of the first data
out clock.
Figure 10. Fast Read Dual Output Instruction Sequence Diagram
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W25Q16V
10.2.11 Fast Read Quad Output (6Bh)
The Fast Read Quad Output (6Bh) instruction is similar to the Fast Read Dual Output (3Bh) instruction
except that data is output on four pins, IO 0 , IO 1 , IO 2 , and IO 3 . A Quad enable of Status Register-2 must
be executed before the device will accept the Fast Read Quad Output Instruction (Status Register bit
QE must equal 1). The Fast Read Quad Output Instruction allows data to be transferred from the
W25Q16 at four times the rate of standard SPI devices.
The Fast Read Quad Output instruction can operate at the highest possible frequency of F R (see AC
Electrical Characteristics). This is accomplished by adding eight “dummy” clocks after the 24-bit
address as shown in figure 11. The dummy clocks allow the device's internal circuits additional time for
setting up the initial address. The input data during the dummy clocks is “don’t care”. However, the IO
pins should be high-impedance prior to the falling edge of the first data out clock.
Figure 11. Fast Read Quad Output Instruction Sequence Diagram
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10.2.12 Fast Read Dual I/O (BBh)
The Fast Read Dual I/O (BBh) instruction allows for improved random access while maintaining two IO
pins, IO 0 and IO 1 . It is similar to the Fast Read Dual Output (3Bh) instruction but with the capability to
input the Address bits (A23-0) two bits per clock. This reduced instruction overhead may allow for code
execution (XIP) directly from the Dual SPI in some applications.
Fast Read Dual I/O with “Continuous Read Mode”
The Fast Read Dual I/O instruction can further reduce instruction overhead through setting the
“Continuous Read Mode” bits (M7-0) after the input Address bits (A23-0), as shown in figure 12a. The
upper nibble of the (M7-4) controls the length of the next Fast Read Dual I/O instruction through the
inclusion or exclusion of the first byte instruction code. The lower nibble bits of the (M3-0) are don’t care
(“x”). However, the IO pins should be high-impedance prior to the falling edge of the first data out clock.
If the “Continuous Read Mode” bits (M7-0) equals “Ax” hex, then the next Fast Read Dual I/O instruction
(after /CS is raised and then lowered) does not require the BBh instruction code, as shown in figure 12b.
This reduces the instruction sequence by eight clocks and allows the Read address to be immediately
entered after /CS is asserted low. If the “Continuous Read Mode” bits (M7-0) are any value other than
“Ax” hex, the next instruction (after /CS is raised and then lowered) requires the first byte instruction
code, thus returning to normal operation. A “Continuous Read Mode” Reset instruction can be used to
reset (M7-0) before issuing normal instructions (See 10.2.29 for detailed descriptions).
Figure 12a. Fast Read Dual Input/Output Instruction Sequence Diagram (M7-0 = 0xh or NOT Axh)
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W25Q16V
Figure 12b. Fast Read Dual Input/Output Instruction Sequence Diagram (M7-0 = Axh)
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10.2.13 Fast Read Quad I/O (EBh)
The Fast Read Quad I/O (EBh) instruction is similar to the Fast Read Dual I/O (BBh) instruction except
that address and data bits are input and output through four pins IO 0 , IO 1 , IO 2 and IO 3 and four Dummy
clock are required prior to the data output . The Quad I/O dramatically reduces instruction overhead
allowing faster random access for code execution (XIP) directly from the Quad SPI. The Quad Enable
bit (QE) of Status Register-2 must be set to enable the Fast read Quad I/O Instruction.
Fast Read Quad I/O with “Continuous Read Mode”
The Fast Read Quad I/O instruction can further reduce instruction overhead through setting the
“Continuous Read Mode” bits (M7-0) after the input Address bits (A23-0), as shown in figure 13a. The
upper nibble of the (M7-4) controls the length of the next Fast Read Quad I/O instruction through the
inclusion or exclusion of the first byte instruction code. The lower nibble bits of the (M3-0) are don’t care
(“x”). However, the IO pins should be high-impedance prior to the falling edge of the first data out clock.
If the “Continuous Read Mode” bits (M7-0) equals “Ax” hex, then the next Fast Read Quad I/O
instruction (after /CS is raised and then lowered) does not require the EBh instruction code, as shown in
figure 13b. This reduces the instruction sequence by eight clocks and allows the Read address to be
immediately entered after /CS is asserted low. If the “Continuous Read Mode” bits (M7-0) are any value
other than “Ax” hex, the next instruction (after /CS is raised and then lowered) requires the first byte
instruction code, thus returning to normal operation. A “Continuous Read Mode” Reset instruction can
be used to reset (M7-0) before issuing normal instructions (See 10.2.29 for detailed descriptions).
Figure 13a. Fast Read Quad Input/Output Instruction Sequence Diagram (M7-0 = 0xh or NOT Axh)
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W25Q16V
Figure 13b. Fast Read Quad Input/Output Instruction Sequence Diagram (M7-0 = Axh)
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10.2.14 Octal Word Read Quad I/O (E3h)
The Octal Word Read Quad I/O (E3h) instruction is similar to the Fast Read Quad I/O (EBh) instruction
except that the lower four Address bits (A0, A1, A2, A3) must equal 0. As a result, the four dummy
clocks are not required, which further reduces the instruction overhead allowing even faster random
access for code execution (XIP). The Quad Enable bit (QE) of Status Register-2 must be set to enable
the Octal Word Read Quad I/O Instruction.
Octal Word Read Quad I/O with “Continuous Read Mode”
The Octal Word Read Quad I/O instruction can further reduce instruction overhead through setting the
“Continuous Read Mode” bits (M7-0) after the input Address bits (A23-0), as shown in figure 14a. The
upper nibble of the (M7-4) controls the length of the next Octal Word Read Quad I/O instruction through
the inclusion or exclusion of the first byte instruction code. The lower nibble bits of the (M3-0) are don’t
care (“x”). However, the IO pins should be high-impedance prior to the falling edge of the first data out
clock.
If the “Continuous Read Mode” bits (M7-0) equals “Ax” hex, then the next Octal Word Read Quad I/O
instruction (after /CS is raised and then lowered) does not require the E3h instruction code, as shown in
figure 14b. This reduces the instruction sequence by eight clocks and allows the Read address to be
immediately entered after /CS is asserted low. If the “Continuous Read Mode” bits (M7-0) are any value
other than “Ax” hex, the next instruction (after /CS is raised and then lowered) requires the first byte
instruction code, thus returning to normal operation. A “Continuous Read Mode” Reset instruction can
be used to reset (M7-0) before issuing normal instructions (See 10.2.29 for detailed descriptions).
Instruction (E3h)
4
0
4
0
4
0
4
0
5
1
5
1
5
1
5
1
6
2
6
2
6
2
6
2
7
3
7
3
7
3
7
3
Byte 1
Byte 2
Byte 3
Byte 4
Figure 14a. Octal Word Read Quad I/O Instruction Sequence (M7-0 = 0xh or NOT Axh)
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W25Q16V
4
0
4
0
4
0
4
0
5
1
5
1
5
1
5
1
6
2
6
2
6
2
6
2
7
3
7
3
7
3
7
3
Byte 1
Byte 2
Byte 3
Byte 4
Figure 14b. Octal Word Read Quad I/O Instruction Sequence (M7-0 = Axh)
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W25Q16V
10.2.15 Page Program (02h)
The Page Program instruction allows from one byte to 256 bytes (a page) of data to be programmed at
previously erased (FFh) memory locations. A Write Enable instruction must be executed before the
device will accept the Page Program Instruction (Status Register bit WEL= 1). The instruction is initiated
by driving the /CS pin low then shifting the instruction code “02h” followed by a 24-bit address (A23-A0)
and at least one data byte, into the DI pin. The /CS pin must be held low for the entire length of the
instruction while data is being sent to the device. The Page Program instruction sequence is shown in
figure 15.
If an entire 256 byte page is to be programmed, the last address byte (the 8 least significant address
bits) should be set to 0. If the last address byte is not zero, and the number of clocks exceed the
remaining page length, the addressing will wrap to the beginning of the page. In some cases, less than
256 bytes (a partial page) can be programmed without having any effect on other bytes within the same
page. One condition to perform a partial page program is that the number of clocks can not exceed the
remaining page length. If more than 256 bytes are sent to the device the addressing will wrap to the
beginning of the page and overwrite previously sent data.
As with the write and erase instructions, the /CS pin must be driven high after the eighth bit of the last
byte has been latched. If this is not done the Page Program instruction will not be executed. After /CS is
driven high, the self-timed Page Program instruction will commence for a time duration of tpp (See AC
Characteristics). While the Page Program cycle is in progress, the Read Status Register instruction may
still be accessed for checking the status of the BUSY bit. The BUSY bit is a 1 during the Page Program
cycle and becomes a 0 when the cycle is finished and the device is ready to accept other instructions
again. After the Page Program cycle has finished the Write Enable Latch (WEL) bit in the Status
Register is cleared to 0. The Page Program instruction will not be executed if the addressed page is
protected by the Block Protect (BP2, BP1, and BP0) bits.
Figure 15. Page Program Instruction Sequence Diagram
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W25Q16V
10.2.16 Quad Input Page Program (32h)
The Quad Page Program instruction allows up to 256 bytes of data to be programmed at previously
erased (FFh) memory locations using four pins: IO 0 , IO 1 , IO 2 , and IO 3 . The Quad Page Program can
improve performance for PROM Programmer and applications that have slow clock speeds <5MHz.
Systems with faster clock speed will not realize much benefit for the Quad Page Program instruction
since the inherent page program time is much greater than the time it take to clock-in the data.
To use Quad Page Program the Quad Enable in Status Register-2 must be set (QE=1). A Write Enable
instruction must be executed before the device will accept the Quad Page Program instruction (Status
Register-1, WEL=1). The instruction is initiated by driving the /CS pin low then shifting the instruction
code “32h” followed by a 24-bit address (A23-A0) and at least one data byte, into the IO pins. The /CS
pin must be held low for the entire length of the instruction while data is being sent to the device. All
other functions of Quad Page Program are identical to standard Page Program. The Quad Page
Program instruction sequence is shown in figure 16.
Figure 16. Quad Input Page Program Instruction Sequence Diagram
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10.2.17 Sector Erase (20h)
The Sector Erase instruction sets all memory within a specified sector (4K-bytes) to the erased state of
all 1s (FFh). A Write Enable instruction must be executed before the device will accept the Sector Erase
Instruction (Status Register bit WEL must equal 1). The instruction is initiated by driving the /CS pin low
and shifting the instruction code “20h” followed a 24-bit sector address (A23-A0) (see Figure 2). The
Sector Erase instruction sequence is shown in figure 17.
The /CS pin must be driven high after the eighth bit of the last byte has been latched. If this is not done
the Sector Erase instruction will not be executed. After /CS is driven high, the self-timed Sector Erase
instruction will commence for a time duration of tSE (See AC Characteristics). While the Sector Erase
cycle is in progress, the Read Status Register instruction may still be accessed for checking the status
of the BUSY bit. The BUSY bit is a 1 during the Sector Erase cycle and becomes a 0 when the cycle is
finished and the device is ready to accept other instructions again. After the Sector Erase cycle has
finished the Write Enable Latch (WEL) bit in the Status Register is cleared to 0. The Sector Erase
instruction will not be executed if the addressed page is protected by the Block Protect (SEC, TB, BP2,
BP1, and BP0) bits (see Status Register Memory Protection table).
Figure 17. Sector Erase Instruction Sequence Diagram
- 34 -
W25Q16V
10.2.18 32KB Block Erase (52h)
The Block Erase instruction sets all memory within a specified block (32K-bytes) to the erased state of
all 1s (FFh). A Write Enable instruction must be executed before the device will accept the Block Erase
Instruction (Status Register bit WEL must equal 1). The instruction is initiated by driving the /CS pin low
and shifting the instruction code “52h” followed a 24-bit block address (A23-A0) (see Figure 2). The
Block Erase instruction sequence is shown in figure 18.
The /CS pin must be driven high after the eighth bit of the last byte has been latched. If this is not done
the Block Erase instruction will not be executed. After /CS is driven high, the self-timed Block Erase
instruction will commence for a time duration of tBE1 (See AC Characteristics). While the Block Erase
cycle is in progress, the Read Status Register instruction may still be accessed for checking the status
of the BUSY bit. The BUSY bit is a 1 during the Block Erase cycle and becomes a 0 when the cycle is
finished and the device is ready to accept other instructions again. After the Block Erase cycle has
finished the Write Enable Latch (WEL) bit in the Status Register is cleared to 0. The Block Erase
instruction will not be executed if the addressed page is protected by the Block Protect (SEC, TB, BP2,
BP1, and BP0) bits (see Status Register Memory Protection table).
Figure 18. 32KB Block Erase Instruction Sequence Diagram
Note:
For W25Q16, user should not issue 32KB Block Erase (52h) instruction to the top or bottom 32KB block
when SEC bit in Status Register is set to “1”.
- 35 -
Publication Release Date: October 7, 2009
Revision E
W25Q16V
10.2.19 64KB Block Erase (D8h)
The Block Erase instruction sets all memory within a specified block (64K-bytes) to the erased state of
all 1s (FFh). A Write Enable instruction must be executed before the device will accept the Block Erase
Instruction (Status Register bit WEL must equal 1). The instruction is initiated by driving the /CS pin low
and shifting the instruction code “D8h” followed a 24-bit block address (A23-A0) (see Figure 2). The
Block Erase instruction sequence is shown in figure 19.
The /CS pin must be driven high after the eighth bit of the last byte has been latched. If this is not done
the Block Erase instruction will not be executed. After /CS is driven high, the self-timed Block Erase
instruction will commence for a time duration of tBE (See AC Characteristics). While the Block Erase
cycle is in progress, the Read Status Register instruction may still be accessed for checking the status
of the BUSY bit. The BUSY bit is a 1 during the Block Erase cycle and becomes a 0 when the cycle is
finished and the device is ready to accept other instructions again. After the Block Erase cycle has
finished the Write Enable Latch (WEL) bit in the Status Register is cleared to 0. The Block Erase
instruction will not be executed if the addressed page is protected by the Block Protect (SEC, TB, BP2,
BP1, and BP0) bits (see Status Register Memory Protection table).
Figure 19. 64KB Block Erase Instruction Sequence Diagram
Note:
For W25Q16, user should not issue 64KB Block Erase (D8h) instruction to the top or bottom 64KB block
when SEC bit in Status Register is set to “1”.
- 36 -
W25Q16V
10.2.20 Chip Erase (C7h / 60h)
The Chip Erase instruction sets all memory within the device to the erased state of all 1s (FFh). A Write
Enable instruction must be executed before the device will accept the Chip Erase Instruction (Status
Register bit WEL must equal 1). The instruction is initiated by driving the /CS pin low and shifting the
instruction code “C7h” or “60h”. The Chip Erase instruction sequence is shown in figure 20.
The /CS pin must be driven high after the eighth bit has been latched. If this is not done the Chip Erase
instruction will not be executed. After /CS is driven high, the self-timed Chip Erase instruction will
commence for a time duration of tCE (See AC Characteristics). While the Chip Erase cycle is in
progress, the Read Status Register instruction may still be accessed to check the status of the BUSY
bit. The BUSY bit is a 1 during the Chip Erase cycle and becomes a 0 when finished and the device is
ready to accept other instructions again. After the Chip Erase cycle has finished the Write Enable Latch
(WEL) bit in the Status Register is cleared to 0. The Chip Erase instruction will not be executed if any
section of the array is protected by the Block Protect (BP2, BP1, and BP0) bits (see Status Register
Memory Protection table).
Figure 20. Chip Erase Instruction Sequence Diagram
- 37 -
Publication Release Date: October 7, 2009
Revision E
W25Q16V
10.2.21 Erase Suspend (75h)
The Erase Suspend instruction “75h”, allows the system to interrupt a sector or block erase operation
and then read from or program data to, any other sector or block. The Write Status Register instruction
(01h) and Erase instructions (20h, 52h, D8h, C7h, 60h ) are not allowed during suspend. Erase
Suspend is valid only during the sector or block erase operation. If written during the chip erase or
program operation, the Erase Suspend instruction is ignored. A maximum of time of “tsus” (See AC
Characteristics) is required to suspend the erase operation. The BUSY bit in the Status register will
clear to 0 after Erase Suspend. A power-off during the suspend period will reset the device and release
the suspend state.
Figure 21. Erase Suspend Instruction Sequence
10.2.22 Erase Resume (7Ah)
The Erase Resume instruction must be written to resume the sector or block erase operation after an
Erase Suspend. After issued the BUSY bit in the status register will be set to a 1 and the sector or block
will complete the erase operation. Resume instructions will be ignored unless an Erase Suspend
operation is active.
Figure 22. Erase Resume Instruction Sequence
- 38 -
W25Q16V
10.2.23 Power-down (B9h)
Although the standby current during normal operation is relatively low, standby current can be further
reduced with the Power-down instruction. The lower power consumption makes the Power-down
instruction especially useful for battery powered applications (See ICC1 and ICC2 in AC
Characteristics). The instruction is initiated by driving the /CS pin low and shifting the instruction code
“B9h” as shown in figure 23.
The /CS pin must be driven high after the eighth bit has been latched. If this is not done the Powerdown instruction will not be executed. After /CS is driven high, the power-down state will entered within
the time duration of tDP (See AC Characteristics). While in the power-down state only the Release from
Power-down / Device ID instruction, which restores the device to normal operation, will be recognized.
All other instructions are ignored. This includes the Read Status Register instruction, which is always
available during normal operation. Ignoring all but one instruction makes the Power Down state a useful
condition for securing maximum write protection. The device always powers-up in the normal operation
with the standby current of ICC1.
Figure 23. Deep Power-down Instruction Sequence Diagram
- 39 -
Publication Release Date: October 7, 2009
Revision E
W25Q16V
10.2.24 Release Power-down / Device ID (ABh)
The Release from Power-down / Device ID instruction is a multi-purpose instruction. It can be used to
release the device from the power-down state, or obtain the devices electronic identification (ID)
number.
To release the device from the power-down state, the instruction is issued by driving the /CS pin low,
shifting the instruction code “ABh” and driving /CS high as shown in figure 24. Release from powerdown will take the time duration of tRES1 (See AC Characteristics) before the device will resume normal
operation and other instructions are accepted. The /CS pin must remain high during the tRES1 time
duration.
When used only to obtain the Device ID while not in the power-down state, the instruction is initiated by
driving the /CS pin low and shifting the instruction code “ABh” followed by 3-dummy bytes. The Device
ID bits are then shifted out on the falling edge of CLK with most significant bit (MSB) first as shown in
figure 25. The Device ID values for the W25Q16 is listed in Manufacturer and Device Identification
table. The Device ID can be read continuously. The instruction is completed by driving /CS high.
When used to release the device from the power-down state and obtain the Device ID, the instruction is
the same as previously described, and shown in figure 25, except that after /CS is driven high it must
remain high for a time duration of tRES2 (See AC Characteristics). After this time duration the device will
resume normal operation and other instructions will be accepted. If the Release from Power-down /
Device ID instruction is issued while an Erase, Program or Write cycle is in process (when BUSY
equals 1) the instruction is ignored and will not have any effects on the current cycle.
Figure 24. Release Power-down Instruction Sequence
- 40 -
W25Q16V
Figure 25. Release Power-down / Device ID Instruction Sequence Diagram
- 41 -
Publication Release Date: October 7, 2009
Revision E
W25Q16V
10.2.25 Read Manufacturer / Device ID (90h)
The Read Manufacturer/Device ID instruction is an alternative to the Release from Power-down /
Device ID instruction that provides both the JEDEC assigned manufacturer ID and the specific device
ID.
The Read Manufacturer/Device ID instruction is very similar to the Release from Power-down / Device
ID instruction. The instruction is initiated by driving the /CS pin low and shifting the instruction code
“90h” followed by a 24-bit address (A23-A0) of 000000h. After which, the Manufacturer ID for Winbond
(EFh) and the Device ID are shifted out on the falling edge of CLK with most significant bit (MSB) first
as shown in figure 26. The Device ID values for the W25Q16 is listed in Manufacturer and Device
Identification table. If the 24-bit address is initially set to 000001h the Device ID will be read first and
then followed by the Manufacturer ID. The Manufacturer and Device IDs can be read continuously,
alternating from one to the other. The instruction is completed by driving /CS high.
Figure 26. Read Manufacturer / Device ID Diagram
- 42 -
W25Q16V
10.2.26 Read Unique ID Number (4Bh)(1)
The Read Unique ID Number instruction accesses a factory-set read-only 64-bit number that is unique
to each W25Q16 device. The ID number can be used in conjunction with user software methods to help
prevent copying or cloning of a system. The Read Unique ID instruction is initiated by driving the /CS
pin low and shifting the instruction code “4Bh” followed by a four bytes of dummy clocks. After which,
the 64-bit ID is shifted out on the falling edge of CLK as shown in figure 27.
DO
24 25
26
27
28
29 30
31 32 33
34
35 36
37 38
39
40
*
DO
41
42
43 44 101 102 103
63 62 61 60 59
2
1
0
*=MSB
Figure 27. Read Unique ID Number Instruction Sequence
Note:
1. For W25Q16, this feature is available upon special request. Please contact Winbond for details.
- 43 -
Publication Release Date: October 7, 2009
Revision E
W25Q16V
10.2.27 JEDEC ID (9Fh)
For compatibility reasons, the W25Q16 provides several instructions to electronically determine the
identity of the device. The Read JEDEC ID instruction is compatible with the JEDEC standard for SPI
compatible serial memories that was adopted in 2003. The instruction is initiated by driving the /CS pin
low and shifting the instruction code “9Fh”. The JEDEC assigned Manufacturer ID byte for Winbond
(EFh) and two Device ID bytes, Memory Type (ID15-ID8) and Capacity (ID7-ID0) are then shifted out on
the falling edge of CLK with most significant bit (MSB) first as shown in figure 28. For memory type and
capacity values refer to Manufacturer and Device Identification table.
Figure 28. Read JEDEC ID
- 44 -
W25Q16V
10.2.28 Continuous Read Mode Reset (FFh or FFFFh)
For Fast Read Dual/Quad I/O operations, “Continuous Read Mode” Bits (M7-0) are implemented to
further reduce instruction overhead. By setting the (M7-0) to “Ax” hex, the next Fast Read Dual/Quad
I/O operation does not require the BBh/EBh instruction code (See 10.2.12 Fast Read Dual I/O and
10.2.13 Fast Read Quad I/O for detail descriptions).
If the system controller is Reset during operation it will likely send a standard SPI instruction, such
as Read ID (9Fh) or Fast Read (0Bh), to the W25Q16. However, as with most SPI Serial Flash
memories, the W25Q16 does not have a hardware Reset pin, so if Continuous Read Mode bits are set
to “Ax” hex, the 25Q16 will not recognize any standard SPI instructions. To address this possibility, it is
recommended to issue a Continuous Read Mode Reset instruction as the first instruction after a system
Reset. Doing so will release the Continuous Read Mode from the “Ax” hex state and allow Standard SPI
instructions to be recognized. The Continuous Read Mode Reset instruction is shown in figure 29.
Mode Bit Reset
for Dual I/O
Mode Bit Reset
for Quad I/O
/CS
Mode 3
CLK
IO0
0
1
2
3
4
5
6
7
8
9
10
11
12
13
Mode 0
14
15
Mode 3
Mode 0
FFh
FFh
IO1
Don’t Care
IO2
Don’t Care
IO3
Don’t Care
Figure 29. Continuous Read Mode Reset for Fast Read Dual/Quad I/O
To reset “Continuous Read Mode” during Quad I/O operation, only eight clocks are needed. The
instruction is “FFh”. To reset “Continuous Read Mode” during Dual I/O operation, sixteen clocks are
needed to shift in instruction “FFFFh”.
- 45 -
Publication Release Date: October 7, 2009
Revision E
W25Q16V
11. ELECTRICAL CHARACTERISTICS
11.1 Absolute Maximum Ratings (1)
PARAMETERS
SYMBOL
Supply Voltage
VCC
Voltage Applied to Any Pin
VIO
Transient Voltage on any Pin
VIOT
Storage Temperature
Lead Temperature
Electrostatic Discharge Voltage
CONDITIONS
RANGE
UNIT
–0.6 to +4.0
V
Relative to Ground
–0.6 to VCC+0.4
V
<20nS Transient
Relative to Ground
–2.0V to VCC+2.0V
V
TSTG
–65 to +150
°C
TLEAD
See Note (2)
°C
–2000 to +2000
V
VESD
Human Body
Model(3)
Notes:
1. This device has been designed and tested for the specified operation ranges. Proper operation
outside of these levels is not guaranteed. Exposure to absolute maximum ratings may affect device
reliability. Exposure beyond absolute maximum ratings may cause permanent damage.
2. Compliant with JEDEC Standard J-STD-20C for small body Sn-Pb or Pb-free (Green) assembly and
the European directive on restrictions on hazardous substances (RoHS) 2002/95/EU.
3. JEDEC Std JESD22-A114A (C1=100pF, R1=1500 ohms, R2=500 ohms).
11.2 Operating Ranges
PARAMETER
Supply Voltage(1)
Ambient Temperature,
Operating
SYMBOL
VCC
TA
CONDITIONS
F R = 80MHz, fR = 50MHz
F R = 50MHz (for E3h
command)
Commercial
Industrial
SPEC
MIN
MAX
2.7
3.0
3.6
3.6
0
+70
–40
+85
UNIT
V
°C
Note:
1. VCC voltage during Read can operate across the min and max range but should not exceed ±10%
of the programming (erase/write) voltage.
- 46 -
W25Q16V
11.3 Power-up Timing and Write Inhibit Threshold
SPEC
PARAMETER
SYMBOL
VCC (min) to /CS Low
tVSL(1)
10
Time Delay Before Write Instruction
tPUW(1)
1
10
ms
Write Inhibit Threshold Voltage
VWI(1)
1
2
V
MIN
MAX
UNIT
µs
Note:
1. These parameters are characterized only.
Figure 30. Power-up Timing and Voltage Levels
- 47 -
Publication Release Date: October 7, 2009
Revision E
W25Q16V
11.4 DC Electrical Characteristics
PARAMETER
SYMBOL
CONDITIONS
Input Capacitance
CIN(1)
VIN = 0V(2)
Output Capacitance
Cout(1)
Input Leakage
ILI
I/O Leakage
ILO
VOUT =
SPEC
MIN
TYP
0V(2)
MAX
UNIT
6
pF
8
pF
±2
µA
±2
µA
Standby Current
ICC1
/CS = VCC,
VIN = GND or VCC
Power-down Current
ICC2
/CS = VCC,
VIN = GND or VCC
Current Read Data /
Dual /Quad 1MHz(2)
ICC3
C = 0.1 VCC / 0.9 VCC
DO = Open
4/5/6
6/7.5/9
mA
Current Read Data /
Dual /Quad 33MHz(2)
ICC3
C = 0.1 VCC / 0.9 VCC
DO = Open
6/7/8
9/10.5/12
mA
Current Read Data /
Dual /Quad 50MHz(2)
ICC3
C = 0.1 VCC / 0.9 VCC
DO = Open
7/8/9
10/12/13.5
mA
Current Read Data /
Dual Output Read/Quad
Output Read 80MHz(2)
ICC3
C = 0.1 VCC / 0.9 VCC
DO = Open
10/11/12
15/16.5/18
mA
Current Write Status
Register
ICC5
/CS = VCC
8
12
mA
Current Page Program
ICC6
/CS = VCC
20
25
mA
Current Sector/Block
Erase
ICC7
/CS = VCC
20
25
mA
Current Chip Erase
ICC8
/CS = VCC
20
25
mA
Input Low Voltage
VIL
–0.5
VCC x 0.3
V
Input High Voltage
VIH
VCC x 0.7
VCC + 0.4
V
Output Low Voltage
VOL
IOL = 1.6 mA
0.4
V
Output High Voltage
VOH
IOH = –100 µA
25
50
µA
1
5
µA
VCC – 0.2
Notes:
1. Tested on sample basis and specified through design and characterization data. TA=25° C, VCC 3V.
2. Checker Board Pattern.
- 48 -
V
W25Q16V
11.5 AC Measurement Conditions
PARAMETER
SYMBOL
Load Capacitance
Input Rise and Fall Times
Input Pulse Voltages
Input Timing Reference Voltages
Output Timing Reference Voltages
SPEC
MIN
MAX
UNIT
CL
30
pF
TR, TF
5
ns
VIN
0.2 VCC to 0.8 VCC
V
IN
0.3 VCC to 0.7 VCC
V
OUT
0.5 VCC to 0.5 VCC
V
Note:
1. Output Hi-Z is defined as the point where data out is no longer driven.
Figure 31. AC Measurement I/O Waveform
- 49 -
Publication Release Date: October 7, 2009
Revision E
W25Q16V
11.6 AC Electrical Characteristics
DESCRIPTION
SYMBOL
SPEC
ALT
MIN
TYP
UNIT
MAX
Clock frequency for all instructions,
except Read Data (03h) & Octal Word Read (E3h)
2.7V-3.6V VCC & Industrial Temperature
FR
fC
D.C.
80
MHz
Clock frequency
for Octal Word Read Quad I/O (E3h)
3.0V-3.6V VCC & Industrial Temperature
FR
fC
D.C.
50
MHz
Clock freq. Read Data instruction (03h)
fR
D.C.
50
MHz
Clock High, Low Time except Read Data (03h)
tCLH,
tCLL(1)
6
ns
Clock High, Low Time for Read Data (03h)
instruction
tCRLH,
tCRLL(1)
8
8
ns
Clock Rise Time peak to peak
tCLCH(2)
0.1
V/ns
Clock Fall Time peak to peak
tCHCL(2)
0.1
V/ns
5
ns
5
ns
/CS Active Setup Time relative to CLK
tSLCH
/CS Not Active Hold Time relative to CLK
tCHSL
Data In Setup Time
tDVCH
tDSU
2
ns
Data In Hold Time
tCHDX
tDH
5
ns
/CS Active Hold Time relative to CLK
tCHSH
5
ns
/CS Not Active Setup Time relative to CLK
tSHCH
5
ns
/CS Deselect Time (for Array Read  Array Read /
Erase or Program  Read Status Registers)
tSHSL
tCSH
10/50
ns
tSHQZ(2)
tDIS
7
ns
tCLQV1
tV1
7/6
ns
tCLQV2
tV2
8.5 / 7.5
ns
Output Hold Time
tCLQX
tHO
/HOLD Active Setup Time relative to CLK
tHLCH
Output Disable Time
Clock Low to Output Valid
2.7V-3.6V / 3.0V-3.6V
Clock Low to Output Valid (for Read ID instructions)
2.7V-3.6V / 3.0V-3.6V
tCSS
0
ns
5
ns
Continued – next page
- 50 -
W25Q16V
11.7 AC Electrical Characteristics (cont’d)
SPEC
DESCRIPTION
SYMBOL
ALT
UNIT
MIN
TYP
MAX
/HOLD Active Hold Time relative to CLK
tCHHH
5
ns
/HOLD Not Active Setup Time relative to CLK
tHHCH
5
ns
/HOLD Not Active Hold Time relative to CLK
tCHHL
5
ns
/HOLD to Output Low-Z
tHHQX(2)
tLZ
7
ns
/HOLD to Output High-Z
tHLQZ(2)
tHZ
12
ns
Write Protect Setup Time Before /CS Low
tWHSL(3)
20
ns
Write Protect Hold Time After /CS High
tSHWL(3)
100
ns
tDP(2)
3
µs
/CS High to Standby Mode without Electronic
Signature Read
tRES1(2)
3
µs
/CS High to Standby Mode with Electronic Signature
Read
tRES2(2)
1.8
µs
/CS High to next Instruction after Suspend
tSUS(2)
20
µs
/CS High to Power-down Mode
Write Status Register Time
tW
10
15
ms
Byte Program Time (First Byte) (4)
t BP1
30
50
µs
Additional Byte Program Time (After First Byte) (4)
t BP2
6
12
µs
Page Program Time
tPP
1.5
3
ms
Sector Erase Time (4KB)
tSE
120
200
ms
Block Erase Time (32KB)
tBE 1
0.5
1
s
Block Erase Time (64KB)
tBE 2
0.75
1.5
s
Chip Erase Time
tCE
15
30
s
Notes:
1. Clock high + Clock low must be less than or equal to 1/fC.
2. Value guaranteed by design and/or characterization, not 100% tested in production.
3. Only applicable as a constraint for a Write Status Register instruction when SRP0 is set to 1.
4.
For multiple bytes after first byte within a page, t BPN = t BP1 + t BP2 * N (typical) and t BPN = t BP1 + t BP2 * N (max), where N =
number of bytes programmed.
- 51 -
Publication Release Date: October 7, 2009
Revision E
W25Q16V
11.8 Serial Output Timing
11.9 Input Timing
11.10 Hold Timing
- 52 -
W25Q16V
θ
12. PACKAGE SPECIFICATION
12.1 8-Pin SOIC 208-mil (Package Code SS)
SYMBOL
A
A1
A2
b
C
D
D1
E
E1
e
H
L
y
θ
MILLIMETERS
INCHES
MIN
NOM
MAX
MIN
NOM
MAX
1.75
0.05
1.70
0.35
0.19
5.18
5.13
5.18
5.13
1.95
0.15
1.80
0.42
0.20
5.28
5.23
5.28
5.23
1.27 BSC
7.90
0.65
-
2.16
0.25
1.91
0.48
0.25
5.38
5.33
5.38
5.33
0.069
0.002
0.067
0.014
0.007
0.204
0.202
0.204
0.202
0.085
0.010
0.075
0.019
0.010
0.212
0.210
0.212
0.210
8.10
0.80
0.010
8°
0.303
0.020
0°
0.077
0.006
0.071
0.017
0.008
0.208
0.206
0.208
0.206
0.050 BSC
0.311
0.026
-
7.70
0.50
0°
0.319
0.031
0.004
8°
Notes:
1. Controlling dimensions: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D1 and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches.
- 53 -
Publication Release Date: October 7, 2009
Revision E
W25Q16V
12.2 8-Contact 6x5mm WSON (Package Code ZP)
SYMBOL
MILLIMETERS
INCHES
MIN
TYP.
MAX
MIN
TYP.
MAX
A
0.70
0.75
0.80
0.0275
0.0295
0.0314
A1
0.00
0.02
0.05
0.0000
0.0007
0.0019
b
0.35
0.40
0.48
0.0137
0.0157
0.0188
C
-
0.20 REF.
-
-
0.0078 REF.
-
D
5.90
6.00
6.10
0.2322
0.2362
0.2401
D2
3.35
3.40
3.45
0.1318
0.1338
0.1358
E
4.90
5.00
5.10
0.1929
0.1968
0.2007
E2
4.25
4.30
4.35
0.1673
0.1692
0.1712
E(2)
1.27 BSC
0.0500 BSC
L
0.55
0.60
0.65
0.0216
0.0236
0.0255
y
0.00
-
0.75
0.0000
-
0.0029
- 54 -
W25Q16V
8-Contact 6x5mm WSON Cont’d.
SYMBOL
MILLIMETERS
MIN
TYP.
INCHES
MAX
MIN
TYP.
MAX
SOLDER PATTERN
M
3.40
0.1338
N
4.30
0.1692
P
6.00
0.2360
Q
0.50
0.0196
R
0.75
0.0255
Notes:
1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.
4. The metal pad area on the bottom center of the package is connected to the device ground (GND pin). Avoid placement of
exposed PCB vias under the pad.
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Publication Release Date: October 7, 2009
Revision E
W25Q16V
12.3 16-Pin SOIC 300-mil (Package Code SF)
SYMBOL
A
A1
A2
b
C
D
E
E1
MILLIMETERS
MIN
NOM
MAX
MIN
NOM
MAX
2.36
0.10
0.33
0.18
10.08
10.01
7.39
2.49
2.31
0.41
0.23
10.31
10.31
7.49
2.64
0.30
0.51
0.28
10.49
10.64
7.59
0.093
0.004
0.013
0.007
0.397
0.394
0.291
0.098
0.091
0.016
0.009
0.406
0.406
0.295
0.104
0.012
0.020
0.011
0.413
0.419
0.299
1.27
0.076
8°
0.015
0°
2
E
L
y
θ
INCHES
1.27 BSC
0.38
0°
0.81
-
0.50 BSC
0.032
-
0.050
0.003
8°
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
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W25Q16V
13.
ORDERING INFORMATION (1)
W
W
=
25Q
16
V =
SpiFlash Serial Flash Memory with 4KB sectors, Dual/Quad I/O
16M-bit
2.7V to 3.6V
SS = 8-pin SOIC 208-mil
SF = 16-pin SOIC 300-mil
I
V xx(1)
Winbond
=
=
25Q xx
=
ZP
=
8-pad WSON 6x5mm
Industrial (-40°C to +85°C)
(2)
G
=
Green Package (Lead-free, RoHS Compliant, Halogen-free (TBBA), Antimony-Oxide-free Sb 2 O 3 )
Notes:
nd
1a. Only the 2 letter is used for the part marking; WSON package type ZP is not used for the part marking.
1b. The “W” prefix is not included on the part marking.
2a.
Standard bulk shipments are in Tube (shape E). Please specify alternate packing method, such as Tape and Reel
(shape T) or Tray (shape S), when placing orders.
2b.
For shipments with OTP feature enabled, please specify when placing orders.
- 57 -
Publication Release Date: October 7, 2009
Revision E
W25Q16V
13.1 Valid Part Numbers and Top Side Marking
The following table provides the valid part numbers for the W25Q16 SpiFlash Memory. Please contact
Winbond for specific availability by density and package type. Winbond SpiFlash memories use an 11digit Product Number for ordering. However, due to limited space, the Top Side Marking on all
packages use an abbreviated 9-digit number.
PACKAGE TYPE
SS
SOIC-8 208mil
SF
SOIC-16 300mil
ZP(1)
WSON-8 6x5mm
DENSITY
PRODUCT NUMBER
TOP SIDE MARKING
16M-bit
W25Q16VSSIG
25Q16VSIG
16M-bit
W25Q16VSFIG
25Q16VFIG
16M-bit
W25Q16VZPIG
25Q16VIG
Note:
1. WSON package type ZP is not used in the top side marking.
- 58 -
W25Q16V
14.
REVISION HISTORY
VERSION
DATE
A
10/20/06
A1
11/9/06
Various
A2
11/15/06
49
A3
2/22/07
20, 45, 49 & 57
Removed Octal Word Read Quad I/O Instruction.
Added transient voltage specification.
A4
4/20/07
19, 28, 30 & 45
Added Mode Bit Reset instruction and description.
A5
6/20/07
13, 15-17 & 23
Added note for SRP1,0 status during Power LockDown protection.
Updated Status Register memory protection tables.
5, 11, 13, 15-17,
19, 35, 36, 43,
45-47, 50 & 59
Added note for Power Lock-Down, OTP functions.
Added note for 64 Bit unique ID.
Added note for 32KB/64KB block erase command.
Updated Mode Bit Reset command description.
Updated data retention temperature.
Updated tSHSL description, added tCLQV2.
Updated tBP1.
5, 18, 26, 28, 30,
31, 40, 45, 46,
50, 51, 57 & 58
Seperated W25Q16 & W25Q32.
Updated Features section.
Added Octal Word Read Quad I/O (E3h) Instruction.
Added note for HPM release (06h & B9h).
Added 50MHz clock frequency for E3h.
Updated Continuous Read Mode descriptions.
Updated tCLH, tCLL.
Updated chip erase time.
Updated Top Side Marking table.
Added note for WSON top side marking.
Removed preliminary designation.
B
C
D
9/26/07
8/13/08
08/20/09
PAGE
New Create Advanced
17, 48 & 57
43
E
10/7/09
DESCRIPTION
Erase Suspend 10.2.21
tCHSH, tSHCH = 5nS
tSHSL = 10ns for Read & 50ns for Write, Erase and
Program instructions
Removed HPM instruction
Updated Ordering Information
Updated package diagram
UID Waveform Correction
Table of Contents Error Correction
- 59 -
Publication Release Date: October 7, 2009
Revision E
W25Q16V
Trademarks
Winbond and SpiFlash are trademarks of Winbond Electronics Corporation.
All other marks are the property of their respective owner.
Important Notice
Winbond products are not designed, intended, authorized or warranted for use as components in
systems or equipment intended for surgical implantation, atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control
instruments, or for other applications intended to support or sustain life. Further more, Winbond
products are not intended for applications wherein failure of Winbond products could result or lead to a
situation wherein personal injury, death or severe property or environmental damage could occur.
Winbond customers using or selling these products for use in such applications do so at their own risk
and agree to fully indemnify Winbond for any damages resulting from such improper use or sales.
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