ZMD-Standard January 2005 Package SOP8 (150 mil) MDS 726 Supersedes Edition 11.95 Dimensions in millimetres Based on IEC 191-2Q: Type 076E35 B 1 Dimensions X A2 A View X k x 45° 0,1 b θ LP c A1 0,2 M HE E 8 1 Z e D Dimensions of Sub-Group B1 Dimensions of Sub-Group C1 Amax 1,95 Amin 1,55 bPmin 0,35 A1min 0,10 bPmax 0,49 A1max 0,30 enom 1,27 A2min 1,40 HEmin 5,80 A2max 1,80 HEmax 6,30 cmin 0,15 LPmin 0,40 cmax 0,25 Zmax 0,635 Dmin* 4,80 Dmax* 5,00 2 Weight ≤ 0,3 g Emin* 3,80 3 Package Body Material Low Stress Epoxy Emax* 4,00 4 Lead Material FeNi-Alloy or Cu-Alloy kmin 0,33 5 Lead Finish solder plating θmin 0° 6 Lead Form Z-bends θmax 8° * without mold-flash Zentrum Mikroelektronik Dresden Editor: signature by Schoder Date: 06.01.2005 Check: signature by Marx Quality: signature by Tina Kochan Als Betriebsgeheimnis anvertraut. Alle Rechte vorbehalten. Doc-No. QS-000726-HD-03 Proprietary data, company confidential. All rights reserved.