ZMD-Standard September 1997 Package SOP18 (300 mil) MDS 749 Dimensions in millimetres Based on JEDEC JEP95 MS-013 1 Dimensions View X k x 45° A A2 X 0,1 Z 1 e b G c LP HE E A1 18 0,2 M D Dimensions of Sub-Group B1 Dimensions of Sub-Group C1 Amax 2,65 Amin 2,35 bPmin 0,35 A1min 0,10 bPmax 0,49 A1max 0,30 enom 1,27 A2min 2,25 HEmin 10,00 A2max 2,45 HEmax 10,65 cmin 0,23 LPmin 0,61 cmax 0,32 Zmax 0,78 Dmin* 11,46 Dmax* 11,71 2 Weight £ 0,5 g Emin* 7,40 3 Package Body Material Low Stress Epoxy Emax* 7,60 4 Lead Material FeNi-Alloy or Cu-Alloy kmin 0,25 5 Lead Finish solder plating qmin 0° 6 Lead Form Z-bends qmax 8° * without mold-flash Zentrum Mikroelektronik Dresden AG Editor: signed Schoder Date: 15.09.1997 Check: signed Marx Quality: signed Lorenz Doc-No. QS-000749-HD-01