ZMD-Standard November 2003 Package PQFP64 (10x10) MDS 755 Dimensions in millimetres Supersedes Edition 12.98 Based on JEDEC JEP95: MO-143 1 Dimensions Z A A2 Detail Z HE bp E e 64 1 D HD Dimensions of Sub-Group B1 Dimensions of Sub-Group C1 enom 0.50 A1min 0.10 Amax 2.45 A1max 0.50 bPmin 0.15 A2min 1.95 bPmax 0.30 A2max 2.10 HEmin 12.95 cmin 0.13 HEmax 13.45 cmax 0.23 HDmin 12.95 Dmin 9.90 HDmax 13.45 Dmax 10.10 Emin 9.90 2 Weight ≤ 0,6 g 0.73 Emax 10.10 3 Package Body Material Low Stress Epoxy θmin 0° 4 Lead Material FeNi-Alloy or Cu-Alloy θmax 10° 5 Lead Finish solder plating 6 Lead Form Z-bends LPmin Zentrum Mikroelektronik Dresden Editor: signed Schoder Date: 03. November 2003 Check: signes Marx Quality: signed Lorenz Doc-No. QS-000755-HD-02 θ c LP 0,1 M A1 0,1