ZMD-Standard June 2004 MDS 772 Package PLCC32 Dimensions in millimetres Based on JEDEC MS-016 variant AE e 0,2 M bp A A2 1 Dimensions 0,1 e1 E β e2 1 HE 32 k D HD Dimensions of Sub-Group B1 Dimensions of Sub-Group C1 Amax 3.56 Amin 3.17 bPmin 0.33 A2min 2.69 bPmax 0.53 A2max 2.85 enom 1.27 Dmin* 13.94 HDmin 14.85 Dmax* 14.05 HDmax 15.12 Emin* 11.40 HEmin 12.31 Emax* 11.51 HEmax 12.58 kmin 1.00 2 Weight ≤ 1.2 g β 3 Package Body Material Low Stress Epoxy e1min 12.44 4 Lead Material Cu-Alloy e1max 13.48 5 Lead Finish solder plating e2min 9.90 6 Lead Form J-bends e2max 10.94 7 45° *without mold-flash Zentrum Mikroelektronik Dresden AG Editor: signed Schoder Date: 9. June 2004 Check: signed Marx Quality: signed Tina Kochan Doc-No. QS-000772-HD-01