AIC1190 Ultra LDO 1A Linear Regulator With Adjustable & Bypass Pin FEATURES DESCRIPTION Guaranteed 1A Output Current. Fast Response in Line/Load Transient Wide Operating Voltage Ranges: 2.3V to 6.0V. 0.1µA Shutdown Standby Current Low Quiescent Current: < 60µA. Fixed: 1.2V, 1.5V, 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V, 3.5V, 3.7V, 3.8V Output Voltage. Adjustable Output Voltage are available from 0.8~4.5V Low Dropout 440mV at 1A and 2.8V output voltage. High PSRR 70dB at 1KHz. ： ： Active Low or High Shutdown Control. Current Limit and Thermal Protection. ± Available in 2% Output Tolerance. Available in SOT-223 & TO-220 (3 pin) & SOP8 Exposed Pad (Heat Sink) and TO-252 &TO263 (3 & 5 pin) Package. APPLICATIONS LCD TV, LCD Monitor, DPF Networking STB DVD, HDD Driver Portable AV Equipment PC Peripherals A low noise, high PSRR and ultra low dropout linear regulator AIC1190 is optimized for low ESR ceramic capacitors operation with 1A continuous current. The AIC1190 offers high precision output voltage of ±2% tolerance. Output voltage can also be adjusted for those other than the preset values. A noise bypass pin is available for further reduction of output noise. The bypass pin could be floating if it’s unnecessary. At 1A load current and 2.8V output voltage, a 440mV dropout is performed. The quality of low quiescent current and low dropout voltage makes this device ideal for battery power applications. The high ripple rejection and low noise of the AIC1190 provide enhanced performances for critical applications such as cellular phones, and PDAs. In addition, a logic-level shutdown input is included, which reduce supply current to less than 0.1µA (typ.) in shutdown mode with fast turn-on time less than 100µs. The AIC1190’s current limit and thermal protection provide protection against any overload condition that would create excessive junction temperatures. TYPICAL APPLICATION CIRCUIT Fixed Linear Regulator Analog Integrations Corporation Adjustable Linear Regulator Si-Soft Research Center 3A1, No.1, Li-Hsin Rd. I, Science Park, Hsinchu 300, Taiwan, R.O.C. TEL: 886-3-5772500, FAX: 886-3-5772510 www.analog.com.tw DS-1190G-01 123008 1 AIC1190 TYPICAL APPLICATION CIRCUIT (Continued) Adjustable Linear Regulator in SOP-8 Exposed Pad Package ORDERING INFORMATION AIC1190-XXXXX XX 3 PIN CONFIGURATION PACKING TYPE TR: TAPE & REEL TB: TUBE PACKAGE TYPE Y3: SOT-223 E3: TO-252 M3: TO-263 T3: TO-220 P: Lead Free Commercial G: Green Package OUTPUT VOLTAGE 12: 1.2V 15: 1.5V 18: 1.8V 20: 2.0V 25: 2.5V 27: 2.7V 30: 3.0V 33: 3.3V 35: 3.5V 37: 3.7V 38: 3.8V (Of a unit of 0.1V within 0.8~4.5V, additional voltage versions are available on demand) SOT-223 (Y3) TOP VIEW 1: VIN 2: GND (TAB) 3: VOUT 1 2 3 TO-252 (E3) TOP VIEW 1: VIN 2: GND (TAB) 3: VOUT 1 2 3 1 2 3 1 2 3 TO-263 (M3) TOP VIEW 1: VIN 2: GND (TAB) 3: VOUT TO-220 (T3) TOP VIEW 1: VIN 2: GND (TAB) 3: VOUT Example: AIC1190-18PE3TR 1.8V Version, in TO-252 Lead Free Package & Tape & Reel Packing Type 2 AIC1190 ORDERING INFORMATION (Continued) AIC1190XX-XXXXXXX 5 PIN CONFIGURATION PACKING TYPE TR: TAPE & REEL TB: TUBE PACKAGE TYPE E5: TO-252-5 M5: TO-263-5 P: Lead Free Commercial G: Green Package OUTPUT VOLTAGE 12: 1.2V 15: 1.5V 18: 1.8V 20: 2.0V 25: 2.5V 27: 2.7V 30: 3.0V 33: 3.3V 35: 3.5V 37: 3.7V 38: 3.8V TO-252-5 (E5) TOP VIEW 1: EN / EN 2: VIN 3: GND (TAB) 4: VOUT 5: BP/ ADJ 12345 TO-263-5 (M5) TOP VIEW 1: EN / EN 2: VIN 3: GND (TAB) 4: VOUT 5: BP/ ADJ 12 3 4 5 (Of a unit of 0.1V within 0.8~4.5V, additional voltage versions are available on demand) ENABLE TYPE L: Chip Enable Low H: Chip Enable High B: Bypass A: ADJ Example: AIC1190BH-18PM5TR With Bypass Pin, Chip Enable High, 1.8V Version, in TO-263-5 Lead Free Package & Tape & Reel Packing Type 3 AIC1190 ORDERING INFORMATION (Continued) AIC1190X-XXXXXXX 8 PIN CONFIGURATION PACKING TYPE TR: TAPE & REEL TB: TUBE PACKAGE TYPE R8: SOP-8 G: Green Package OUTPUT VOLTAGE 12: 1.2V 15: 1.5V 18: 1.8V 20: 2.0V 25: 2.5V 27: 2.7V 30: 3.0V 33: 3.3V 35: 3.5V 37: 3.7V 38: 3.8V SOP-8 (R8) Exposed Pad (Heat Sink) TOP VIEW 1: EN / EN 2: VIN 3: VOUT 4: ADJ 5: GND (TAB) 6: BP 7: GND (TAB) 8: GND (TAB) 1 8 2 7 3 6 4 5 (Of a unit of 0.1V within 0.8~4.5V, additional voltage versions are available on demand) ENABLE TYPE L: Chip Enable Low H: Chip Enable High Example: AIC1190H-18GR8TR Chip Enable High, 1.8V Version, in SOP-8 Green Package & Tape & Reel Packing Type Marking Part No Marking Part No Marking AIC1190-xxPY3 HBxxP AIC1190-xxGY3 HBxxG xx represents output voltage. (08=0.8V, 09=0.9V, ….…, 44=4.4V, 45=4.5V) 4 AIC1190 ABSOLUTE MAXIMUM RATINGS Input Voltage ....................................................................................................................................... 7V EN Pin Voltage .................................................................................................................................... 7V Noise Bypass Terminal Voltage .......................................................................................................... 7V Operating Temperature Range ............................................................................................ -40ºC~85ºC Maximum Junction Temperature .................................................................................................. 150ºC Storage Temperature Range ............................................................................................. -65ºC~150ºC Lead Temperature (Soldering, 10 sec) ......................................................................................... 260ºC Thermal Resistance (Junction to Case) SOT-223 ............................................................... 15ºC /W TO-252 .................................................................... 8ºC /W TO-263 .................................................................... 3ºC /W TO-220 .................................................................... 3ºC /W SOP-8 (Exposed Pad*) ......................................... 15ºC /W Thermal Resistance (Junction to Ambient) SOT-223 ............................................................. 130ºC /W (Assume no ambient airflow, no heat sink) TO-252 ................................................................ 100ºC /W TO-263 .................................................................. 60ºC /W TO-220 .................................................................. 50ºC /W (Assume no ambient airflow) SOP-8 (Exposed Pad*) ........................................ 60ºC /W Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. * The package is placed on a two layers PCB with 2 ounces copper and 2 square inch, connected by 8 vias. 5 AIC1190 ELECTRICAL CHARACTERISTICS (CIN = Cout = 2.2µF, CBP = 22nF, VIN = VOUT + 1V, TJ=25°°C, unless otherwise specified) (Note 1) PARAMETER TEST CONDITIONS Input Voltage Output Voltage Tolerance IOUT = 1 mA Continuous Output Current Quiescent Current GND Pin Current Standby Current Chip Enable Low, VEN IOUT = 0 mA Chip Enable High, VEN IOUT = 0 mA Chip Enable Low, VEN IOUT = 1A Chip Enable High, VEN IOUT = 1A ≦0.4V, ≧1.6V, ≦0.4V, ≧1.6V, =V Chip Enable High, V = 0 R = 0.1Ω Chip Enable Low, VEN IN SYMBOL MIN. VIN TYP. MAX. UNIT 2.3 6.0 V VOUT -2 2 % IOUT 1.0 A IQ 60 110 µA IGND 60 110 µA ISTBY 0.1 0.5 µA EN Output Current Limit LOAD IIL 1.1 1.6 IOUT = 1A, 0.8V<VOUT<2V Dropout Voltage IOUT = 1A, 2V<VOUT<2.8V A 1500 VDROP IOUT = 1A, VOUT>2.8V 500 900 440 700 mV 10 mV 20 mV Line Regulation VIN = VOUT + 1V to 6.0V ∆VLIR Load Regulation IOUT = 1mA to 1A ∆VLOR 1 Ripple Rejection (Note 2) f=1KHz, Ripple=0.5Vp-p, PSRR 70 dB Output Noise Voltage CBP = 22nF, f= 10~100KHz 24 µVrms TC 50 ppm/ TSD 150 ∆TSD 20 IADJ 10 100 nA Temperature Coefficient Thermal Shutdown Temperature VIN = VOUT + 1V Thermal Shutdown Hysteresis ℃ ℃ ADJ Pin Specifications ADJ Pin Current VADJ = VREF ADJ Pin Threshold VTH(ADJ) 0.05 0.1 0.2 V Reference Voltage Tolerance VREF 0.784 0.8 0.816 V 6 ℃ AIC1190 ELECTRICAL CHARACTERISTICS (Continued) PARAMETER TEST CONDITIONS SYMBOL Shutdown Pin Current VEN = VIN or GND Shutdown Exit Delay Time IOUT = 30mA MIN. TYP. MAX. UNIT IEN 0 100 nA ∆t 100 RDSON_ CLMP 20 Shutdown Pin Specifications Max Output Discharge Resistance to GND during Shutdown Chip Enable Low, Output OFF, VIN = 2.3V to 6.0V Shutdown Input Threshold Chip Enable High, Output ON, VIN = 2.3V to 6.0V Chip Enable Low, Output ON, VIN = 2.3V to 6.0V Chip Enable High, Output OFF, VIN = 2.3V to 6.0V VENH µS 100 Ω 1.6 V VENL 0.4 Note 1: Specifications are production tested at T =25°C. Specifications over the -40°C to 85°C operating A temperature range are assured by design, characterization and correlation with Statistical Quality Controls (SQC). Note 2: Connecting a 22nF bypass capacitor to BP pin can improve AIC1190 PSRR in High frequency. 7 AIC1190 TYPICAL PERFORMANCE CHARACTERISTICS 2.0000 64 VIN=VOUT+1 VOUT=2.0V 1.9975 62 Output Voltage (V) Supply Current (uA) IOUT=90mA 60 VOUT=2.0V 58 56 VOUT=3.3V 54 1.9950 IOUT=10mA 1.9925 IOUT=1mA 1.9900 1.9875 52 1.9850 50 2.5 3.0 3.5 4.0 4.5 5.0 5.5 2.5 6.0 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Input Voltage (V) Input Voltage (V) Fig. 1 Supply Current vs. Input Voltage Fig. 2 Output Voltage vs. Input Voltage 65 64 VIN=VOUT+1 VOUT=2.0V 64 63 VIN=VOUT+1 VOUT=2.0V 62 Quiescent Current (uA) 61 ILOAD=500mA 60 59 58 ILOAD=100mA 57 58 56 54 52 50 48 56 46 55 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 -40 -20 0 20 40 60 80 ℃) 100 120 140 Temperature( Supply Voltage (V) Fig. 3 Ground Current Fig. 4 Quiescent Current vs. Temperature 0.4 VIN=VOUT+1 VOUT=2.0V 0.2 Output Voltage Variation (%) Ground Current (uA) 60 62 Input Voltage 0.0 -0.2 Output Voltage -0.4 Input Current -0.6 -40 -20 0 20 40 60 80 ℃) 100 120 140 Temperature ( Fig. 5 Output Voltage vs. Temperature Fig.6 Start-up waveform without bypass capacitance 8 AIC1190 TYPICAL PERFORMANCE CHARACTERISTICS (Continued) CIN=COUT=2.2µF CIN=COUT=2.2µF EN EN Output Voltage Output Voltage VIN=4.5V, VOUT=3.3V and IOUT= 10mA Fig.7 Shutdown Transient VIN=4.5V, VOUT=3.3V and IOUT= 10mA Fig. 8 Start-up waveform without bypass capacitor CIN=COUT=2.2µF CIN=COUT=2.2µF Input Voltage Output Voltage Ripple Output Ripple Output Current Output Current IOUT= 1mA to 1A VIN=2.3~3.3V, VOUT=0.8V, I OUT =1000mA Fig. 9 Line Transient Fig.10 Load Transient Response at VIN=4.3V, VOUT=3.3V CIN=COUT=2.2µF Output Voltage Ripple Output Current CIN=COUT=2.2µF Output Voltage Ripple Output Current IOUT= 1mA to 1A Fig.11 Load Transient Response at VIN=2.3V, VOUT=0.8V IOUT= 1mA to 1A Fig.12 Load Transient Response at VIN=3.0V, VOUT=2.0V 9 AIC1190 TYPICAL PERFORMANCE CHARACTERISTICS (Continued) 1.0 Feedback Voltage (V) 0.8 0.6 0.4 0.2 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 Foldback Current (A) Fig. 13 Current Fold back (Vout<0.2V) Fig. 14 PSRR Curve 10 AIC1190 BLOCK DIAGRAM PIN DESCRIPTION VIN – Power supply input pin. Bypass with a 2.2µF capacitor to GND GND – Ground. VOUT – Regulator Output pin. Sources up to 1A. EN (5 Pin and 8 Pin) – Chip Enable (Active Low). This pin isn’t allowed to float. EN (5 Pin and 8 Pin) – Chip Enable (Active High). This pin isn’t allowed to float. BP (5 Pin and 8 Pin) – Bypass pin. It can connect to external 22nF capacitor to GND to reduce output noise. The bypass pin could be floating if it’s unnecessary (Keep floating cannot pull low and pull high). ADJ (5 Pin and 8 Pin) – The output voltage can either be set by the internal feedback resistors when this pin is grounded, or be set by the external feedback resistors when using a resistive divider. 11 AIC1190 APPLICATION INFORMATION The AIC1190 is a high performance linear regulator voltage noise. The bypass pin can be floating if it’s that provides low-dropout voltage and low quiescent- unnecessary. current. The device is available in an adjustable version and fixed output voltages ranging from 1.2V to 3.8V, and the device can supply loads up to 1A. OUTPUT VOLTAGE PROGRAMMING The output voltage of AIC1190 linear regulator can be set by its internal feedback resistors when the ADJ pin SHUTDOWN is grounded. In addition, the output voltage of AIC1190 By connecting EN(EN) pin to VIN(ground), the AIC1190 linear regulator can be set by the external feedback can be shut down to reduce the supply current to resistors when connecting a resistive divider R1 and R2. 0.1µA(typ.). At this operation mode, the output voltage While connecting a resistive divider, VOUT can be of AIC1190 is equal to 0V. calculated as: CURRENT LIMIT R VOUT = 0.8 × 1 + 1 R2 The AIC1190 includes a current limiter, which monitors and controls the maximum output current. If the output is overloaded or shorted to ground, this can protect the The resistive divider should sit as close to ADJ pin as possible. device from being damaged. POWER DISSIPATION THERMAL PROTECTION The maximum power dissipation of AIC1190 depends The AIC1190 includes a thermal-limiting circuit, which is designed to protect the device against overload condition. When the junction temperature exceeds TJ=150ºC, the thermal-limiting circuit turns off the pass transistor and allows the IC to cool. For continuous load condition, maximum rating of junction temperature must not be exceeded. on the thermal resistance of its case and circuit board, the temperature difference between the die junction and ambient air, and the rate of airflow. The rate of temperature rise is greatly affected by the mounting pad configuration on the PCB, the board material, and the ambient temperature. When the IC mounting with good thermal conductivity is used, the junction temperature will be low even when large power INPUT-OUTPUT CAPACITORS dissipation applies. Linear regulators require input and output capacitors to The power dissipation across the device is maintain stability. Input capacitor at 2.2µF with a 2.2µF P = IOUT (VIN-VOUT) ceramic output capacitor is recommended. To avoid The maximum power dissipation is: oscillation, it is recommended to follow the figure of “Region of Stable COUT ESR vs. Load Current” to choose proper capacitor specifications. When choosing the input and output ceramic capacitors, X5R and X7R types are recommended because they retain their capacitance over wider ranges of voltage and temperature than other types. PMAX = (TJ-max - TA ) Rθ JA Where TJ-max is the maximum allowable junction temperature (150°C), and TA is the ambient temperature suitable in application. As a general rule, the lower temperature is, the better reliability of the device is. So the PCB mounting pad NOISE BYPASS CAPACITOR should provide maximum thermal conductivity to A 22nF bypass capacitor at BP pin can reduce output maintain low device temperature. 12 AIC1190 PHYSICAL DIMENSIONS SOT-223 PACKAGE OUTLINE DRAWING D b2 1 E A A E SEE VIEW B e e1 b WITH PLATING 2 A A BASE METAL 1 A L VIEW B c SECTION A-A GAUGE PLANE SEATING PLANE θ 5 2 . 0 Note: 1. Refer to JEDEC TO-261AA. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "E1" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. S Y M B O L SOT-223 MILLIMETERS MIN. MAX. A 1.80 A1 0.02 0.10 A2 1.55 1.65 b 0.66 0.84 b2 2.90 3.10 c 0.23 0.33 D 6.30 6.70 E 6.70 7.30 E1 3.30 e e1 L θ 3.70 2.30 BSC 4.60 BSC 0.90 0° 8° 13 AIC1190 TO-252-3L PACKAGE OUTLINE DRAWING E A c2 b3 3L D H 4L A A e SEE VIEW B b WITH PLATING BASE METAL c SECTION A-A θ GAUGE PLANE 2L SEATING PLANE L L1 VIEW B 1A Note: 1. Refer to JEDEC TO-252AA and AB. 2. Dimension "E" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "D" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. S Y M B O L A A1 b b3 c c2 D E e H L L1 L2 L3 L4 θ MIN. 2.19 0.00 0.64 4.95 0.46 0.46 5.33 6.35 9.40 1.40 0.89 -0° TO-252-3L MILLIMETERS 2.28 BSC 2.67 REF 0.51 BSC MAX. 2.38 0.13 0.89 5.46 0.61 0.89 6.22 6.73 10.41 1.78 2.03 1.02 8° 14 AIC1190 TO-252-5L PACKAGE OUTLINE DRAWING E A c2 b3 3L D e H A A SEE VIEW B b WITH PLATING c BASE METAL SECTION A-A S Y M B O L θ GAUGE PLANE L 2L SEATING PLANE L1 VIEW B 1 A Note: 1. Refer to JEDEC TO-252AD and AB. 2. Dimension "E" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "D" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. TO-252-5L MILLIMETERS MIN. MAX. A 2.19 2.38 A1 0.00 0.13 b 0.51 0.71 b3 4.32 5.46 c 0.46 0.61 c2 0.46 0.89 D 5.33 6.22 E 6.35 e 6.73 1.27 BSC H 9.40 L 1.40 L1 10.41 1.78 2.67 REF L2 0.51 BSC L3 0.89 2.03 q 0° 8° 15 AIC1190 TO-263-3L PIN PACKAGE OUTLINE DRAWING A c2 E 1 L D H 2 L A A b2 SEE VIEW B e b WITH PLATING c BASE METAL SECTION A-A θ S Y M B O L GAUGE PLANE L 3 L VIEW B SEATING PLANE 1 A Note: 1. Refer to JEDEC TO-263AB. 2. Dimension "E" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "D" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. TO-263-3L MILLIMETERS MIN. MAX. A 4.06 4.83 A1 0.00 0.25 b 0.51 0.99 b2 1.14 1.78 c 0.38 0.74 c2 1.14 1.65 D 8.38 9.65 E 9.65 10.67 e 2.54 BSC H 14.61 15.88 L L1 1.78 -- 1.68 L2 -- 1.78 0.25 BSC L3 q 2.79 0° 8° 16 AIC1190 TO-263-5L PACKAGE OUTLINE DRAWING A c2 E 1L D H A A e SEE VIEW B b WITH PLATING c BASE METAL SECTION A-A θ GAUGE PLANE L 3 L VIEW B SEATING PLANE 1 A Note: 1. Refer to JEDEC TO-263BA. 2. Dimension "E" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "D" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. S Y M B O L TO-263-5L MILLIMETERS MIN. MAX. A 4.06 4.83 A1 0.00 0.25 b 0.51 0.99 c 0.38 0.74 c2 1.14 1.65 D 8.38 9.65 E 9.65 10.67 e 1.70 BSC H 14.61 15.88 L 1.78 -- 1.68 L1 0.25 BSC L3 q 2.79 0° 8° 17 AIC1190 TO-220 PACKAGE OUTLINE DRAWING A E A1 Q P 1 H D 1 D b WITH PLATING BASE METAL 1L c SECTION A-A L A b2 e A A2 S Y M B O L Note: 1. Refer to JEDEC TO-220AB. 2. Dimension "E" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "D1" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. TO-220 MILLIMETERS MIN. MAX. A 3.56 4.82 A1 0.51 1.39 A2 2.04 2.92 b 0.38 1.01 b2 1.15 1.77 c 0.35 0.61 D 14.23 16.51 D1 8.38 9.02 E 9.66 10.66 2.54 BSC e H1 5.85 6.85 L 14.73 L1 12.70 -- P 3.54 4.08 Q 2.54 3.42 6.35 18 AIC1190 SOP-8 Exposed Pad PACKAGE OUTLINE DRAWING D D1 E X P O S E D T H E R M A L P A D (H e a t S in k ) (B O T T O M C E N T E R O F P A C K A G E ) E1 e A E H 5°4 X h A S E E V IE W B A B 1A W IT H P L A T IN G BASE M ETAL 25. 0 S E C T IO N A -A GAUG E PLAN E S E A T IN G P L A N E S Y M B O L θ L V IE W B C Note : 1. Refer to JEDEC MS-012E. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "E" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. SOP-8 Exposed Pad(Heat Sink) MILLIMETERS MIN. MAX. A 1.35 1.75 A1 0.00 0.15 B 0.31 0.51 C 0.17 0.25 D 4.80 5.00 E 3.80 e 4.00 1.27 BSC H 5.80 6.20 h 0.25 0.50 L 0.40 1.27 q 0° 8° D1 E1 1.5 1.0 3.5 2.55 Note: Information provided by AIC is believed to be accurate and reliable. However, we cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in an AIC product; nor for any infringement of patents or other rights of third parties that may result from its use. We reserve the right to change the circuitry and specifications without notice. Life Support Policy: AIC does not authorize any AIC product for use in life support devices and/or systems. Life support devices or systems are devices or systems which, (I) are intended for surgical implant into the body or (ii) support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 19