CSD17327Q5A SLPS332 – JUNE 2011 www.ti.com 30V, N-Channel NexFET™ Power MOSFETs Check for Samples: CSD17327Q5A PRODUCT SUMMARY FEATURES 1 • • • • • • • 2 Ultralow Qg and Qgd Low Thermal Resistance Avalanche Rated Pb Free Terminal Plating RoHS Compliant Halogen Free SON 5-mm × 6-mm Plastic Package VDS Drain to Source Voltage 30 V Qg Gate Charge Total (4.5V) 2.8 nC Qgd Gate Charge Gate to Drain RDS(on) Drain to Source On Resistance VGS(th) Threshold Voltage • Point-of-Load Synchronous Buck in Networking, Telecom and Computing Systems Optimized for Control FET Applications DESCRIPTION The NexFET™ power MOSFET has been designed to minimize losses in power conversion applications. Top View S 8 S 7 2 S 3 D D 6 D 5 D mΩ VGS = 8V 9.9 mΩ 1.6 Device Package Media CSD17327Q5A SON 5-mm × 6-mm Plastic Package 13-Inch Reel V Qty Ship 2500 Tape and Reel Text Added For Spacing ABSOLUTE MAXIMUM RATINGS TA = 25°C unless otherwise stated VALUE UNIT VDS Drain to Source Voltage 30 V VGS Gate to Source Voltage +10 / -10 V Continuous Drain Current, TC = 25°C 65 A Continuous Drain Current(1) 13 A IDM Pulsed Drain Current, TA = 25°C(2) 85 A PD Power Dissipation(1) 3 W TJ, TSTG Operating Junction and Storage Temperature Range –55 to 150 °C EAS Avalanche Energy, single pulse ID = 30A, L = 0.1mH, RG = 25Ω 45 mJ ID 1 nC 12.5 Text Added For Spacing ORDERING INFORMATION APPLICATIONS • 0.8 VGS = 4.5V D G 4 (1) Typical RθJA = 44°C/W on 1-inch2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu pad on a 0.06-inch (1.52-mm) thick FR4 PCB. (2) Pulse duration ≤300μs, duty cycle ≤2% P0093-01 Text 4 Spacing RDS(on) vs VGS Text 4 Spacing GATE CHARGE 10 35 VGS - Gate-to-Source Voltage (V) RDS(on) - On-State Resistance - mΩ ID = 11A 30 25 20 15 10 5 0 TC = 25°C TC = 125ºC 0 1 2 3 ID = 11A VDD = 15V 9 8 7 6 5 4 3 2 1 4 5 6 7 VGS - Gate-to- Source Voltage - V 8 9 10 0 0 1 2 3 4 5 6 Qg - Gate Charge - (nC) 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NexFET is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2011, Texas Instruments Incorporated CSD17327Q5A SLPS332 – JUNE 2011 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise stated) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Static Characteristics BVDSS Drain to Source Voltage VGS = 0V, IDS = 250μA IDSS Drain to Source Leakage Current VGS = 0V, VDS = 24V IGSS Gate to Source Leakage Current VDS = 0V, VGS = +10/-10V VGS(th) Gate to Source Threshold Voltage VDS = VGS, IDS = 250μA RDS(on) Drain to Source On Resistance gfs Transconductance 30 1.1 V 1 μA 100 nA 1.6 2.0 V 12.5 15.5 mΩ VGS = 8V, IDS = 11A 9.9 12.2 mΩ VDS = 15V, IDS = 11A 44 VGS = 4.5V, IDS = 11A S Dynamic Characteristics Ciss Input Capacitance VGS = 0V, VDS = 15V, f = 1MHz 422 506 pF Coss Output Capacitance 286 343 pF Crss Reverse Transfer Capacitance 26 33 pF RG Series Gate Resistance 4.7 Qg Gate Charge Total (4.5V) 2.8 Qgd Gate Charge Gate to Drain 0.8 nC Qgs Gate Charge Gate to Source 1.2 nC Qg(th) Gate Charge at Vth 0.6 nC Qoss Output Charge 6.8 nC td(on) Turn On Delay Time 5.6 ns tr Rise Time 8.2 ns td(off) Turn Off Delay Time 9.8 ns tf Fall Time 3.2 ns VDS = 15V, IDS = 11A VDS = 13V, VGS = 0V VDS = 15V, VGS = 4.5V, IDS = 11A,RG = 2Ω Ω 3.4 nC Diode Characteristics VSD Diode Forward Voltage Qrr Reverse Recovery Charge trr Reverse Recovery Time ISD = 11A, VGS = 0V 0.85 VDS= 13V, IF = 11A, di/dt = 300A/μs 1 V 10.5 nC 14.6 ns THERMAL CHARACTERISTICS (TA = 25°C unless otherwise stated) MAX UNIT RθJC Thermal Resistance Junction to Case (1) PARAMETER 1.9 °C/W RθJA Thermal Resistance Junction to Ambient (1) (2) 51 °C/W (1) (2) 2 MIN TYP RθJC is determined with the device mounted on a 1-inch2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu pad on a 1.5-inch × 1.5-inch (3.81-cm × 3.81-cm), 0.06-inch (1.52-mm) thick FR4 PCB. RθJC is specified by design, whereas RθJA is determined by the user’s board design. Device mounted on FR4 material with 1-inch2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu. Copyright © 2011, Texas Instruments Incorporated CSD17327Q5A SLPS332 – JUNE 2011 www.ti.com GATE GATE Source N-Chan 5x6 QFN TTA MIN Rev3 N-Chan 5x6 QFN TTA MAX Rev3 Max RθJA = 51°C/W when mounted on 1 inch2 (6.45 cm2) of 2-oz. (0.071-mm thick) Cu. Source Max RθJA = 131°C/W when mounted on a minimum pad area of 2-oz. (0.071-mm thick) Cu. DRAIN DRAIN M0137-02 M0137-01 TYPICAL MOSFET CHARACTERISTICS (TA = 25°C unless otherwise stated) ZqJA - Normalized Thermal Impedance 10 1 0.5 0.3 0.1 0.01 0.1 0.05 Duty Cycle = t1/t2 0.02 0.01 P Single Pulse t1 t2 0.001 0.0001 0.0001 Typical RqJA = 105°C/W (min Cu) TJ = P ´ ZqJA ´ RqJA 0.001 0.01 0.1 1 tp - Pulse Duration - s 10 100 1k G012 Figure 1. Transient Thermal Impedance Copyright © 2011, Texas Instruments Incorporated 3 CSD17327Q5A SLPS332 – JUNE 2011 www.ti.com TYPICAL MOSFET CHARACTERISTICS (continued) (TA = 25°C unless otherwise stated) TEXT ADDED FOR SPACING TEXT ADDED FOR SPACING 30 100 VDS = 5V IDS - Drain-to-Source Current - A IDS - Drain-to-Source Current - A VGS = 8V 25 VGS = 4.5V 20 VGS = 3.5V 15 10 VGS = 3V VGS = 2.5V 5 0 10 1 T C = -55°C 0.1 T C = 25°C 0.01 T C = 125°C 0.001 0 0.2 0.4 0.6 0.8 1 1.2 VDS - Drain-to-Source Voltage - V 1.4 1.6 0 1 G001 Figure 2. Saturation Characteristics TEXT ADDED FOR SPACING TEXT ADDED FOR SPACING ID = 11A VDD = 15V 9 Ciss = Cgd + Cgs 7 6 5 4 3 C - Capacitance - nF C - Capacitance - nF 8 Coss = Cds + Cgd 0.1 Crss = Cgd 2 0 f = 1MHz VGS = 0V 0 1 2 3 4 5 6 0.01 0 5 Qg - Gate Charge - (nC) 10 15 20 VDS - Drain-to-Source Voltage - V Figure 4. Gate Charge TEXT ADDED FOR SPACING 30 G004 TEXT ADDED FOR SPACING 35 ID = 11A RDS(on) - On-State Resistance - mΩ ID = 250µA 2 1.5 1 0.5 0 -75 25 Figure 5. Capacitance 2.5 VGS(th) - Threshold Voltage - V G002 1 1 30 25 20 15 10 5 0 -25 25 75 T C - Case Temperature - °C 125 175 Figure 6. Threshold Voltage vs. Temperature 4 5 Figure 3. Transfer Characteristics 10 VGS - Gate-to-Source Voltage (V) 2 3 4 VGS - Gate-to-Source Voltage - V G005 TC = 25°C TC = 125ºC 0 1 2 3 4 5 6 7 8 9 10 VGS - Gate-to- Source Voltage - V Figure 7. On-State Resistance vs. Gate-to-Source Voltage Copyright © 2011, Texas Instruments Incorporated CSD17327Q5A SLPS332 – JUNE 2011 www.ti.com TYPICAL MOSFET CHARACTERISTICS (continued) (TA = 25°C unless otherwise stated) TEXT ADDED FOR SPACING TEXT ADDED FOR SPACING 100 ID = 11A VGS = 10V 1.6 ISD - Source-to-Drain Current - A Normalized On-State Resistance 1.8 1.4 1.2 1 0.8 0.6 0.4 0.2 −75 10 1 T C = 125°C 0.1 T C = 25°C 0.01 0.001 0.0001 −25 25 75 125 175 0 0.2 0.4 0.6 0.8 VSD - Source-to-Drain Voltage - V TC - Case Temperature - ºC Figure 8. Normalized On-State Resistance vs. Temperature TEXT ADDED FOR SPACING TEXT ADDED FOR SPACING I(AV) - Peak Avalanche Current - A IDS - Drain-to-Source Current - A G008 100 100 11110 100µs 10 1ms 1 10ms 100ms 11110 Area Limited by RDS(on) 0.01 0.01 1.2 Figure 9. Typical Diode Forward Voltage 1k 0.1 1 1s Single Pulse Typical R θJA = 105°C/W (min Cu) DC 0.1 1 10 VDS - Drain-to-Source Voltage - V 100 T C = 25°C 10 T C = 125°C 1 0.01 0.1 1 t(AV) - Time in Avalanche - ms G009 Figure 10. Maximum Safe Operating Area 10 G010 Figure 11. Single Pulse Unclamped Inductive Switching TEXT ADDED FOR SPACING TEXT ADDED FOR SPACING IDS - Drain-to-Source Current - A 100 90 80 70 60 50 40 30 20 10 0 -50 -25 0 25 50 75 100 125 T C - Case Temperature - °C 150 175 G011 Figure 12. Maximum Drain Current vs. Temperature Copyright © 2011, Texas Instruments Incorporated 5 CSD17327Q5A SLPS332 – JUNE 2011 www.ti.com MECHANICAL DATA Q5A Package Dimensions E2 L K H 2 7 8 8 2 7 1 1 q 3 5 4 6 3 4 D2 6 D1 5 e b L1 Top View Bottom View Side View q A c E1 E Front View M0135-01 DIM 6 MILLIMETERS MIN NOM MAX A 0.90 1.00 1.10 b 0.33 0.41 0.51 c 0.20 0.25 0.34 D1 4.80 4.90 5.00 D2 3.61 3.81 4.02 E 5.90 6.00 6.10 E1 5.70 5.75 5.80 E2 3.38 3.58 3.78 e 1.17 1.27 1.37 H 0.41 0.56 0.71 K 1.10 L 0.51 0.61 0.71 L1 0.06 0.13 0.20 θ 0° 12° Copyright © 2011, Texas Instruments Incorporated CSD17327Q5A SLPS332 – JUNE 2011 www.ti.com Recommended PCB Pattern 4.900 (0.193) 0.605 (0.024) 5 4 0.630 (0.025) 0.620 (0.024) 1.270 (0.050) 4.460 (0.176) 8 1 0.650 (0.026) 3.102 (0.122) 0.700 (0.028) 1.798 (0.071) M0139-01 NOTE: Dimensions are in mm (inches). TEXT ADDED FOR SPACING Stencil Recommendation 0.500 (0.020) 1.235 (0.049) 0.500 (0.020) 1.585 (0.062) 4 5 0.450 (0.018) 1.570 (0.062) 0.620 (0.024) 1.270 (0.050) 1.570 (0.062) 4.260 (0.168) 8 1 PCB Pattern 0.632 (0.025) 3.037 (0.120) 1.088 (0.043) Stencil Opening M0209-01 NOTE: Dimensions are in mm (inches). TEXT ADDED FOR SPACING For recommended circuit layout for PCB designs, see application note SLPA005 – Reducing Ringing Through PCB Layout Techniques. Copyright © 2011, Texas Instruments Incorporated 7 CSD17327Q5A SLPS332 – JUNE 2011 www.ti.com Q5A Tape and Reel Information K0 4.00 ±0.10 (See Note 1) 0.30 ±0.05 +0.10 2.00 ±0.05 Ø 1.50 –0.00 1.75 ±0.10 5.50 ±0.05 12.00 ±0.30 B0 R 0.30 MAX A0 8.00 ±0.10 Ø 1.50 MIN R 0.30 TYP A0 = 6.50 ±0.10 B0 = 5.30 ±0.10 K0 = 1.40 ±0.10 M0138-01 NOTES: 1. 10-sprocket hole-pitch cumulative tolerance ±0.2 2. Camber not to exceed 1mm in 100mm, noncumulative over 250mm 3. Material: black static-dissipative polystyrene 4. All dimensions are in mm (unless otherwise specified) 5. A0 and B0 measured on a plane 0.3mm above the bottom of the pocket spacer 8 Copyright © 2011, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 22-Aug-2011 PACKAGING INFORMATION Orderable Device CSD17327Q5A Status (1) ACTIVE Package Type Package Drawing SON DQJ Pins Package Qty 8 2500 Eco Plan (2) Pb-Free (RoHS Exempt) Lead/ Ball Finish CU SN MSL Peak Temp (3) Samples (Requires Login) Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 2-Mar-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device CSD17327Q5A Package Package Pins Type Drawing SON DQJ 8 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 12.4 Pack Materials-Page 1 6.3 B0 (mm) K0 (mm) P1 (mm) 5.3 1.2 8.0 W Pin1 (mm) Quadrant 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 2-Mar-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CSD17327Q5A SON DQJ 8 2500 340.0 340.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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