Connector for microSD™ Card (Hinge Cover Type) SCHB Series Hinge cover type with improved card retention. For SD Memory Card For microSD™ Card For SIM Card 8pins For W-SIM Features ● Applications Locking mechanism prevents the card from dropping during use. ● For Memory Stick Micro™ For mobile phones For Memory Stick™ Typical Specifications Items Applicable media Specifications Combine Type microSD™ Card For Compact Flash™ Mounting type Surface mounting type Mounting style Standard mount Media ejection structure Manual insertion/removal For PC cards supporting CardBus Structure Performance Operating temperature range −20℃ to ＋70℃ Voltage proof 500V AC 1minute Insulation resistance （Initial） Contact resistance （Initial） For Express Card™ For CMOS Camera Module 1,000MΩ min. 100mΩ max. Insertion and removal cycle 5,000cycles Product Line Media ejection structure Mounting system Stand-off （mm） Packing system Product No. Manual insertion/removal Standard mount 0 Taping SCHB1A0205 19 Connector for microSD™ Card (Hinge Cover Type) SCHB Series Dimensions Unit:mm PC board mounting hole dimensions （Viewed from the mounting face side） Style No.4 No.3 No.2 No.8 No.7 No.6 No.5 For Compact Flash™ 13.3 For PC cards supporting CardBus 14.6 For CMOS Camera Module 20 （15） 8- 0.3 For Express Card™ For Memory Stick™ Combine Type 9.8 11.95 13.65 For Memory Stick Micro™ 4-1.4 For W-SIM 1.93 3.65 For SIM Card 8pins Pitch 7-1.1 ø4 Area for vacuum 3.2 Connector center For microSD™ Card For SD Memory Card No.1 Small Memory Card Connectors Soldering Conditions Example of Reflow Soldering Condition（Reference） For SD Memory Card 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA（K）or CC（T）. 3. Temperature profile（Surface of products）. For microSD™ Card For W-SIM For Memory Stick Micro™ For Memory Stick™ Temperature (˚C ) For SIM Card 8pins 240℃(max.) 230℃(min.) 200 180℃ 150℃ 100 Room temperature Time (s) Pre-heating 90±30 sec. 10 sec.(max.) Combine Type Heating time sec. For Compact Flash™ For PC cards supporting CardBus For Express Card™ For CMOS Camera Module 50 Cautions for using this product 1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. Caution is therefore required. 2. Avoid use of water-soluble soldering flux, since it may corrode the product. 3. Check and conform to reflow soldering requirements under actual mass production conditions. 4. PC board warping may alter the characteristics. Please take this into consideration when designing patterns and layout. 5. The card specifications are provided by the above manufactures. Products by other manufactures may not be compliant with these specifications and are subject to change without prior notice.