Combine Type Connector (for SIM Card 8pins, microSDTM Card) SCHG Series Double-deck for SIM Card (8pins) combine type. For SD Memory Card NEW For microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™ For Memory Stick™ Features ● Applications Two-slot, double-deck structure enables two typs cards, the SIM Card (8pins) and microSD™ Card, to be separately inserted. ● For mobile phones, various personal digital assistants, notebook PCs. Combine Type Typical Specifications For Compact Flash™ Items SIM Card 8pins For PC cards supporting CardBus For Express Card™ Specifications Applicable media microSDTM Card Structure For CMOS Camera Module Performance Mounting type Surface mounting type Mounting style Standard mount Media ejection structure Manual insertion/removal/Push-push type Operating temperature range −25℃ to ＋70℃ Voltage proof 500V AC 1minute Insulation resistance（Initial） Contact resistance （Initial） 1,000MΩ min. Connector contacts 100mΩ max. Detection switch 500mΩ max. Insertion and removal cycle 5,000cycles（SIM Card 8pins） 10,000cycles（microSDTM Card） Product Line 44 Media ejection structure Mounting system Stand-off（mm） Packing system Product No. Push-push type Standard mount 0 Taping SCHG1B0100 Combine Type Connector (for SIM Card 8pins, microSD™ Card) SCHG Series Dimensions Unit:mm Style For microSD™ Card !4 !1 !5 !2 !6 8 7 6 5 4 3 2 1 !3 For Memory Stick Micro™ For Memory Stick™ Combine Type CONNECTOR TERMINAL No. No.1 No.2 No.3 No.4 No.5 No.6 No.7 No.8 PIN No. microSD No.1 microSD No.2 microSD No.3 microSD No.4 microSD No.5 microSD No.6 microSD No.7 microSD No.8 PIN ASSIGMENTS CONNECTOR PIN LAYOUT TERMINAL No. DAT 2 No.9 CD/DAT3 No.10 CMD No.11 VDD No.12 CLK No.13 VSS No.14 DAT0 No.15 DAT1 No.16 PC board mounting hole dimensions （Viewed from the mounting face side） PIN No. SIM No.C1 SIM No.C2 SIM No.C3 SIM No.C4 SIM No.C5 SIM No.C6 SIM No.C7 SIM No.C8 PIN LAYOUT VCC RST CLK RESERVED GND VPP I/O RESERVED For Compact Flash™ For PC cards supporting CardBus For Express Card™ For CMOS Camera Module 0.35 2-R 0.2 Hole Land 7 0.8 1.5 17.345 3.095 0.555 9-0.8 7.75 6.85 5.195 4.045 2.895 1.745 0.595 1.1 1.8 0.55 2-R 9.295 8.175 8 6.085 5.085 2-0.4 2-1.1 18.045 0.8 16.9 8.8 4.545 P=1.1 1.05 9-0.8 0.52 1.8 For W-SIM # $% $ $% 1.8 For SIM Card 8pins !0 9 !8 !7 !" For SD Memory Card No pattern area Land area 45 Small Memory Card Connectors Soldering Conditions Example of Reflow Soldering Condition（Reference） For SD Memory Card 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA（K）or CC（T）. 3. Temperature profile（Surface of products）. For microSD™ Card For W-SIM For Memory Stick Micro™ For Memory Stick™ Temperature (˚C ) For SIM Card 8pins 240℃(max.) 230℃(min.) 200 180℃ 150℃ 100 Room temperature Time (s) Pre-heating 90±30 sec. 10 sec.(max.) Combine Type Heating time sec. For Compact Flash™ For PC cards supporting CardBus For Express Card™ For CMOS Camera Module 50 Cautions for using this product 1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. Caution is therefore required. 2. Avoid use of water-soluble soldering flux, since it may corrode the product. 3. Check and conform to reflow soldering requirements under actual mass production conditions. 4. PC board warping may alter the characteristics. Please take this into consideration when designing patterns and layout. 5. The card specifications are provided by the above manufactures. Products by other manufactures may not be compliant with these specifications and are subject to change without prior notice.