Push Switch Surface Mount Type Push Switch SPEF Series Surface mountable lead-free soldering push switch. Typical Specifications Detector Items Specifications Rating (max) (Resistive load) 1A 14.5V DC Initial contact resistance 100mΩ max. Push Slide Operating force Rotary 3N,5N Encoders 30,000cycles Operating life（Without load） Poles-Positions 1-pole,2-positions Power Dual-in-line Package Type Product Line Changeover timing TACT SwitchTM Travel Total travel Operating （mm） （mm） force Mounting method Operating 3N Non shorting 1.5 2.7 PC board Latching 5N Terminal type Minimum order unit （pcs.） Drawing Product No. No. Reflow 1,320 SPEF210101 1 Dip 2,100 SPEF110100 2 Reflow 1,320 SPEF210200 1 Dip 2,100 SPEF110200 2 CustomProducts Taping Specifications (Taping Packaging) Unit:mm Reel Size Number of packages（pcs.） ø380 1 reel 1 case /Japan 1 case /export packing 165 660 1,320 Tape width （mm） Horizontal Type Vertical Type 32 33.5 Note Please place purchase orders per minimum order unit (integer). 105 Push Switch Surface MountType Push Switch SPEF Series Dimensions Unit:mm No. Style PC board mounting hole dimensions Reflow Soldering Type Detector C 2 Push 1 Slide 14.3 9.5 6 3.7 Rotary 1.8 1 ho e） le） hol CustomProducts .1（ 6（ ¿1. TACT SwitchTM ¿1 Dual-in-line Package Type 6.7 7.4 8.85 12 Power 0.3 Encoders Dip Soldering Type Horizontal Type Terminal No. C Terminal No.1 Vertical Type Terminal No.2 12.2 9.8 6 A 6 9.8 12.2 PC board mounting face Circuit Diagram（Viewed from Direction A） 1 C 2 106 2.5 2.5 ¿1 .1（ 11.86 13.1 14.6 3.2 3.5 6.9 1.3 ø0.9 hol 1.3（ e） ho 1.5（ le） hol e） 2-¿ Lock position ø1.4 .6（ 1 1 1.2 5.7 6.7 ho le） 6.7 2 Full stroke position ¿1 5.7 9.4 3.5 2.5 4-¿ 9 3.5 2.5 Push Switches List of Varieties Series SPPH4 SPPH1 SPEC SPED2 SPED3 SPED4 SPED5 SPEF Photo Detector Push Travel（mm） 2.2 1.5 2.5 Total travel （mm） 3 2.5 3.4 Number of poles Dimensions （mm） 8.5 D 6.5 1 10 12 14 10 H 2.7 3.8 4.5 2 W Operating temperature range 1.5 ― 16.8 8.5 12.5 18 26.7 Slide Rotary Encoders 13.5 9.4 18.2 9 Power Dual-in-line Package Type 6.9 20.7 TACT SwitchTM −10˚C to ＋60˚C −40˚C to ＋85˚C Rating（max.） （Resistive load） 0.1A 30V DC Rating（min.） （Resistive load） 50BA 3V DC CustomProducts 1A 14.5V DC Electrical performance Mechanical performance Durability Environmental performance Initial contact resistance Insulation resistance Voltage proof Terminal strength Actuator strength 100mΩ max. 20mΩ max. 30mΩ max. 100MΩ min. 500V DC 5N for 1minute 100V AC for 1minute Horizontal Type 3N for 1minute 30N Pulling direction 10N ― 50N 10,000cycles 100mΩ max. 10,000cycles 40mΩ max. 10,000cycles 50mΩ max. Cold 50N 90N 30,000cycles 100mΩ max. –20±2℃ for 96h –40±2℃ for 96h 85±2℃ for 96h Damp heat 40±2℃, 90 to 95%RH for 96h Soldering Page 260±5℃ 5±1s Vertical Type 30N Dry heat Manual soldering Dip soldering Reflow soldering 3M Ω min. 100V DC 3MΩ min. 500V DC 500V AC for 1minute Operating direction Operating life without load Operating life without load Load:as rating 100mΩ max. 350±10℃ 3＋10s 350±10℃ 3±0.5s ※3 ― 350±10℃ 3±0.5s ― 350±5℃ 3s max. 260±5℃ 10±1s 260℃ max. 260±5℃ 10±1s ※3 5s max. ― 260±5℃ 10±1s ― 260±5℃10±1s ※4 Please see P.108 98 99 101 102 103 105 ● Push Switches Attached Parts ………………………………………………………………………………………………107 ● Push Switches Products Caution ……………………………………………………………………………………………109 Notes 1. ※3. Applicable to SPED220200（PC board type）only. 2. ※4. Applicable to SPEF110100 only. 83 Push Switches Soldering Conditions Example of Reflow Soldering Condition 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA (K) or CC (T) at soldering portion (copper foil surface). A heat resisting tape Detector should be used for fixed measurement. 3. Temperature profile Push Temperature (˚C ) 300 Slide Rotary Encoders A max. B 200 D E 100 Power Room temperature Dual-in-line Package Type Time (s) Pre-heating F max. TACT SwitchTM CustomProducts Series（Reflow type） C A（℃） 3s max. B（℃） C（s） D（℃） E（℃） F（s） 260 230 40 180 150 120 SPEE SPEF, SPEG Notes Horizontal Type Vertical Type 108 1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where the PC board's temperature greatly differs from that of the switch, depending on the PC board's material, size, thickness, etc. The above-stated conditions shall also apply to switch surface temperatures. 2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended.