™ Peripheral Imaging Corporation PI3034A 200DPI CIS Sensor Chip Engineering Data Sheet Description: Peripheral Imaging Corporation PI3034A CIS sensor chip is a 200 dot per inch resolution linear array image sensor chip, which uses PIC’s proprietary CMOS Image Sensing Technology. This image sensor’s intended applications are to fabricate Contact Image Sensor, CIS modules with various lengths. This is accomplished by mounting them on a printed circuit board (PCB) through an end-to-end butting process. This process is generally referred to as the chip-on-board technology. Its typical circuit implementation in an A4 size 1728 elements CIS module is shown in a schematic diagram on page 6. The schematic demonstrates its operational implementation and interfacing circuits. They are used in facsimile, scanner, check reader, and office automation equipment. Figure 1 is a block diagram of the sensor chip. Each sensor chip consists of 64 detector elements, their associated multiplexing switches, buffers, and a chip selector. The detector element-to-element spacing is approximately 125 um. The size of each chip without scribe lines is 7950 um by 290 um. Each sensor chip has 6 bonding pads. The pad symbols and functions are described in Table 1. 7950 µm 1 2 3 4 61 Row of 64 Sensors and Video Signal Line Multiplexer 62 63 64 290 µm Read Out Shift Register Buffer SI Chip Select Buffer CLK VDD VSS SIG Figure 1. PI3034A Sensor Chip Block Diagram Page 1 of 7 - PI3034A, 06/15/03 Buffer SO SYMBOL SI CLK VDD VSS SIG SO FUNCTION Start Pulse: Input to start the line scan. Clock Pulse: Input to clock the Shift Register. Positive Supply: +5 volt supply connected to substrate. Digital Ground: Connection topside common. Signal Current Output: Output for video signal current End of Scan Pulse: Output from the shift register at end of scan. Table 1. Pad Symbols and Functions Bonding pad layout diagram: Figure 2 shows the bonding pad locations for PI3034A Sensor Chip relative to the lower left corner of the die. 7950 µm SENSOR DIE Y SI CLK VDD X 290 µm SIG SO NOTE: ALL PAD OPENINGS ARE 140 X 80 µm. X PAD SI CLK VDD VSS SIG SO GRD FUNCTION START INPUT CLOCK INPUT +5 SUPPLY GROUND VIDEO SIGNAL OUT SCAN OUTPUT Y X 67.5 67.5 67.5 67.5 67.5 67.5 737.0 1546.5 2356.0 3156.5 3975.0 7213.0 NOTES: 1. THE DRAWING IS NOT TO SCALE. 2. THE DIE LENGTH AND WIDTH ARE GIVEN AS SHOWN. 3. THE PAD LOCATION ARE GIVEN IN THE TABLE. 4. THERE ARE TWO EXAMPLES OF THE X AND Y LOCATIONS SHOWN ON THE FIRST TWO PADS. THEY ARE MEASURED TO THE LEFT BOTTOM CORNER OF THE PAD OPENING. 5. ALL DIMENSIONS ARE IN µm. PI3034A IMAGE SENSOR Figure 2. Bonding Pad Layout Diagram Electro-Optical Characteristics (25 °C) Table 2, below, lists the electro-optical characteristics of PI3034A sensor chip at 25 °C. Parameters Number of Photo-elements Pixel-to-pixel spacing Line scanning rate Clock frequency Video Output Voltage Amplitude Output voltage non-uniformity Symbols Tint (1) f (2) Vp (3) Typical 64 125 3.45 0.5 1.0 Units elements µm ms/line MHz Volts Up (4) ± 7.5 % Page 2 of 7 - PI3034A, 06/15/03 Notes Vp depends the output circuits. See note 3. Chip-to-chip non-uniformity Dark output voltage Dark output non-uniformity Ud Vd Ud (5) (6) ± 7.5 <50 <50 % mV mV Table 2. Electro-Optical Characteristic Notes: (1) Tint stands for the line scanning rate or the integration time. It is determined by the time interval between two start pulses. (2) f stands for the input clock frequency: @ 500 kHz the total active line scan time for a A4 CIS module is 3.45 ms of the line integration time. (3) Vp is an average of the pixel amplitudes in one complete line scan. These video pixels are converted from signal currents produced by the phototransistor at each pixel site. The signal current charges the video line capacitance that is isolated with amplifier buffer. The output current is proportional to the charges that have been collected on the phototransistor’s base through a photon-to-electron conversion process. These charges on the base draw signal current through the emitter proportionally to the Beta of the phototransistor. Then the emitter current flows out onto the output video line capacitance where it is integrated and converted to signal voltage. This is the signal voltage that the host receiver senses. Before accessing the subsequent pixel, this video signal on the video line capacitance is reset through a shunt switch on the video line. Then the next pixel in sequence is readout onto the video line. This video buffer amplifier terminating the video line provides the necessary amplification. Most user generally set their operating output signal to ~ 1.0 V peak average with the saturation level of ~ 1.5 V. For the circuit reference see the attached schematic diagram on page 6. Typical amplification (adjustable) gain is between 4 to 5 times the voltage that is measured on the video line. (4) Up = [( Vpmax-Vp)/ Vp]x100% Or [( Vp-Vpmin)/ Vp]x100% N Where Vp = ∑ Vpn / N n Vpmax is the maximum pixel output voltage in the light. Vpmin is the minimum pixel output voltage in the light. In the light means module exposed a uniform light. (5) Vd = ( Vdmax+Vdmin)/2 Vdmax is the maximum pixel output voltage in the dark. Vdmin is the minimum pixel output voltage in the dark. In the dark means that sensor has no exposure to the light. (6) Ud = [( Vdmax-Vdmin)/ Vd]x100% Absolute Maximum Ratings (not operational conditions): Parameters Power Supply Voltage Power Supply Current Input clock pulse (high level) Input clock pulse (low level) Symbol VDD IDD Vih Vil Maximum Rating 10 <2.0 Vdd + 0.5 -0.25 Table 3. Maximum Specification Page 3 of 7 - PI3034A, 06/15/03 Units Volts ma Volts Volts Operating Conditions at Room Temperature Parameters Power Supply Input clock pulses high level Input clock pulse low level Operating high level exposed output Clock Frequency Clock pulse duty cycle Clock pulse high durations Integration time Operating Temperature Symbol VDD Vih (1) Vil (1) Vsig (Isig) (2) f Min. 4.5 3.0 0 tw Tint Top Typical 5.0 5.0 0 1.0 Max. 5.5 VDD 0.8 Units Volts Volts Volts Volts 0.5 25 0.5 3.45 25 1.0 MHz % µsec ms o C 10 50 Notes 1 1 2 Table 4. Operating Specifications Note: (1) Applies to both CLK and SI. (2) See note 3 under Table 2. Electro-Optical Characteristics. See the schematic on page 6. Switching Characteristics @ 25 °C tw to CLK tprh tdh SI tds tdl Vsig tsh Figure 3. Timing Diagram of the PI3034A Sensor Page 4 of 7 - PI3034A, 06/15/03 Item Symbol Minimum Clock cycle time Clock pulse width(1) Clock duty cycle Data setup time Data hold time Prohibit crossing time(2) EOS rise delay EOS fall delay Signal delay time(3) Signal settling time(3) to tw 1000 250 25 50 20 tds tdh tprh terdl tefdl tdl tsh Mean 50 Maximum Units 10000 ns ns % ns ns ns ns ns ns ns 75 30 60 70 100 200 Table 5. Timing Symbols and Definition Notes: 1. Clock pulse width varies with frequency, as it was explained foregoing paragraphs. 2. Prohibit crossing time to insure that two start pulses are not locked into the shift register during any single scan time. 3. Pixel delay times and settling time depend on the output amplifier. The numbers, which are given, are measured with an EL2044 amplifier. The faster the amplifier, the faster the signal will respond. In other words, faster rise and settle times are faster. Output Circuits for Video Signal The circuit in following page shows the PI3034A in a CIS module application. It also serves not only a reference for the above operational explanation given in note 3 under Table 2. Electro-Optical Characteristics; it further exemplifies a method for interfacing the device in developing a 1728 element, A4 size CIS module. Page 5 of 7 - PI3034A, 06/15/03 1 2 3 4 5 6 7 8 9 10 1 2 VLED GLED SMT JUMPER PADS J1 CONN-10PIN P1 1 VOUT 2 GND 3 VDD 4 VN 5 GND 6 SP 7 GND 8 CP 9 GLED 10 VLED 13 12 2 1 VDD 74HC00 U1A U1D 74HCT00 3 9 11 10 5 4 U1C 74HC00 74HC00 U1B EOS IS THE SAME AS SO. IOUT IS THE SAME AS VSIG. VDD IS THE SAME, VDD. DGND IS THE SAME AS VSS. 14 7 6 8 VDD 50 R1 VDD VDD C1 0.1UF S1 PI3034A SP CP VDD DGND IOUT EOS S10 PI3034A 1 2 3 4 5 6 SP CP VDD DGND IOUT EOS S19 PI3034A 1 2 3 4 5 6 SP CP VDD DGND IOUT EOS C10 10uF C6 10uF VDD 1 2 3 4 5 6 S2 PI3034A T1 TESTPOINT SP CP VDD DGND IOUT EOS S11 PI3034A T10 TESTPOINT 1 2 3 4 5 6 SP CP VDD DGND IOUT EOS C11 0.1uF C7 0.1uF S20 PI3034A T19 TESTPOINT 1 2 3 4 5 6 SP CP VDD DGND IOUT EOS 6 EL2044C U2 1 2 3 4 5 6 S12 PI3034A T11 TESTPOINT 5pF 2 3 S21 PI3034A T20 TESTPOINT C12 R4 2K - + S3 PI3034A T2 TESTPOINT SP CP VDD DGND IOUT EOS 1 2 3 4 5 6 SP CP VDD DGND IOUT EOS 1 2 3 4 5 6 R6 1K 2K R2 2 C8 50pF S4 PI3034A T3 TESTPOINT SP CP VDD DGND IOUT EOS S13 PI3034A T12 TESTPOINT 1 2 3 4 5 6 SP CP VDD DGND IOUT EOS S22 PI3034A T21 TESTPOINT 1 2 3 4 5 6 R3 2K VDD R5 1K SP CP VDD DGND IOUT EOS 2 S5 PI3034A T4 TESTPOINT SP CP VDD DGND IOUT EOS S14 PI3034A T13 TESTPOINT 1 2 3 4 5 6 SP CP VDD DGND IOUT EOS S23 PI3034A T22 TESTPOINT 1 2 3 4 5 6 SP CP VDD DGND IOUT EOS C9 0.1UF 1 2 3 4 5 6 S6 PI3034A T5 TESTPOINT SP CP VDD DGND IOUT EOS S24 PI3034A T23 TESTPOINT C3 0.1uF S15 PI3034A T14 TESTPOINT 1 2 3 4 5 6 SP CP VDD DGND IOUT EOS 1 2 3 4 5 6 SP CP VDD DGND IOUT EOS 1 2 3 4 5 6 S7 PI3034A T6 TESTPOINT SP CP VDD DGND IOUT EOS S16 PI3034A T15 TESTPOINT 1 2 3 4 5 6 SP CP VDD DGND IOUT EOS C13 150pF S25 PI3034A T24 TESTPOINT 1 2 3 4 5 6 SP CP VDD DGND IOUT EOS CP IS THE SAME AS CLK. 7 V- V+ 4 VDD 14 U3A CD4066 S8 PI3034A T7 TESTPOINT S17 PI3034A T16 TESTPOINT 7 S26 PI3034A T25 TESTPOINT 3 2Z SP CP VDD DGND IOUT EOS 1 2 3 4 5 6 3 1 2E 1 2 3 4 5 6 1 SP CP VDD DGND IOUT EOS 1 2 3 4 5 6 SP CP VDD DGND IOUT EOS 1 2 3 4 5 6 SP CP VDD DGND IOUT EOS 4 2Y SP IS THE SAME AS SI. U3D S27 PI3034A T26 TESTPOINT C4 0.1uF CD4066 S18 PI3034A T17 TESTPOINT C5 0.1UF C2 0.1uF S9 PI3034A T8 TESTPOINT 3Z 1 2 3 4 5 6 3 1 2 VCC 1 Y 1E 1Z GND 13 9 3E 6 U3C CD4066 10 4Z PIN DEFINITION ON THE PI3034A SENSORS 4Y 1 2 3 4 5 6 5 8 3Y SP CP VDD DGND IOUT EOS 1 2 3 4 5 6 SP CP VDD DGND IOUT EOS 1 2 3 4 5 6 SP CP VDD DGND IOUT EOS 1 2 3 4 5 6 11 4E 12 Page 6 of 7 - PI3034A, 06/15/03 U3B CD4066 T27 TESTPOINT T18 TESTPOINT T9 TESTPOINT ©2003 Peripheral Imaging Corporation. Printed in USA. All rights reserved. Specifications are subject to change without notice. Contents may not be reproduced in whole or in part without the express prior written permission of Peripheral Imaging Corporation. Information furnished herein is believed to be accurate and reliable. However, no responsibility is assumed by Peripheral Imaging Corporation for its use nor for any infringement of patents or other rights granted by implication or otherwise under any patent or patent rights of Peripheral Imaging Corporation. Page 7 of 7 - PI3034A, 06/15/03