AS5011 Data Sheet Low Power Integrated Hall IC for Human Interface Applications 3 Key Features 1 General Description The AS5011 is a complete Hall Sensor IC for smart navigation key applications to meet the low power requirements and host SW integration challenges for products such as cell phones and smart handheld devices. Due to the on chip processing engine, system designers are not tasked with integrating complex SW algorithms on their host processor thus leading to rapid development cycles. The AS5011 single-chip IC includes 4 integrated Hall sensing elements for detecting up to ±2mm lateral displacement, high resolution ADC, XY coordinate and motion detection engine combined with a smart power management controller. The X and Y positions coordinates and magnetic field information for each Hall sensor element is transmitted over a 2-wire I²C compatible interface to the host processor. The AS5011 is available in a small 16-pin 5x5x0.55mm QFN package and specified over an operating temperature of -20 to +80°C. Figure 1 Typical Arrangement of AS5011 and Axial Magnet 2.7 to 3.6V operating voltage Down to 1.8V peripheral supply voltage Less than 200µA current consumption in Low Power mode Less than 50µA current consumption in Shutdown mode Lateral magnet movement radius up to 2mm I²C interface up to 4MHz Configurable interrupt output for motion detection Three operating modes: Shutdown mode Low Power mode Full Power mode 4 Applications The AS5011 is ideal for small factor manual input devices in battery operated equipment, such as Mobile phones MP3 players PDA’s GPS receivers Gaming consoles 2 Benefits Complete system-on-chip High reliability due to non-contact sensing Low power consumption Figure 2 AS5011 Block Diagram www.austriamicrosystems.com Revision 3.10 1 – 16 AS5011 Data Sheet 5 Package and pinout Figure 3: QFN-16 package and pinout (TOP view) Pin# Symbol Type Description 1 SDA DIO_OD I²C bus data 2 SCL DI I²C bus clock 3 Sample DI Test pin. Connect to VSS 4 INTn DO_OD Interrupt output. Active LOW 5 tb0 AIO Test pin. Leave unconnected 6 tb1 AIO Test pin. Leave unconnected 7 tb2 AIO Test pin. Leave unconnected 8 tb3 AIO Test pin. Leave unconnected 9 Test coil - Test pin. Connect to VSS 10 VDDp S Peripheral power supply, 1.8 ~ 3.6V 11 ScanTest DI Test pin. Connect to VSS 12 VDD S Core power supply, 2.7 ~ 3.6V 13 VSS S Supply ground 14 Wakeup DIO Test pin. Leave unconnected 15 Extclk DIO Test pin. Leave unconnected 16 Kill DIO Test pin. Leave unconnected Epad - - Center pad not connected QFN16 Table 1: AS5011 pinout in QFN-16 package PIN Types: S ... DI … DO_OD ... www.austriamicrosystems.com supply pad AIO ... digital input DIO_OD... digital output open drain DIO ... Revision 3.10 analog I/O digital input / output open drain digital input / output 2 – 16 AS5011 Data Sheet 6 Operating the AS5011 6.1 Typical application The AS5011 requires only a few external components in order to operate immediately when connected to the host microcontroller. Only 4 wires are needed for a simple application using a single power supply: two wires for power and two wires for the I²C communication. A fifth connection can be added in order to send an interrupt to the host CPU when the magnet is moving away from the center and to inform that a new valid coordinate can be read. Figure 4: Electrical connection of AS5011 with microcontroller 6.2 XY coordinates interpretation On Figure 5 the top view of the AS5011 is represented, with a round magnet (scaled) gliding over its surface. The magnet can be placed under the sensor too, with the PCB between them. • Magnet on position 1: The magnet is in its initial position, centered on the sensor. The AS5011 is in Shutdown mode. X and Y register values are (0,0) • Magnet on position 2: The center of the magnet has been moved upon the horizontal wakeup threshold Xp. An interrupt is sent to the host microcontroller which sets the AS5011 to Low Power mode. Wakeup thresholds are programmable independently for the four directions. • Magnet on position 3: The magnet is at the X and Y limit over the sensor surface (2mm, 2mm) but still in range. Figure 5: Position range of the magnet www.austriamicrosystems.com Revision 3.10 3 – 16 AS5011 Data Sheet 6.3 Magnet-chip surface airgap range The relation between the magnet physical position and the resulting XY registers depends on the magnet type/size/shape, and the airgap between the magnet and the top (or bottom) surface of the AS5011. The measurements on Figure 6, Figure 6 Figure 8 have been processed with the AS5000-MA2H-1 d2x0.8mm cylinder magnet, available on austriamicrosystems website. For those magnets, used in EasyPoint modules EP40 and EP50, the airgap range is typically 0~3mm. The following diagrams show the relation between the X register value and the physical X coordinate (±2mm horizontal displacement, 0mm is the center of the chip package) of the magnet at different airgaps. The resulting X value range decreases when the airgap increases The Y axis measurements are the same as the X axis ones. 80 40 Airgap 1500um 30 60 Airgap 500um 20 40 10 0 -2500 -2000 -1500 -1000 -500 0 500 1000 1500 2000 2500 X register X register 20 0 -2.500 -20 -2.000 -1.500 -1.000 -500 0 500 1.000 1.500 2.000 2.500 -10 -20 -40 -30 -60 -40 -50 Magnet position (um) -80 Magnet position (um) Figure 6: X register / X displacement (500um airgap) Figure 7: X register / X displacement (1500um airgap) 30 Airgap 2500um 20 X register 10 0 -2.500 -2.000 -1.500 -1.000 -500 0 500 1.000 1.500 2.000 2.500 -10 -20 -30 Magnet position (um) Figure 8: X register / X displacement (2500um airgap) www.austriamicrosystems.com Revision 3.10 4 – 16 AS5011 Data Sheet 6.4 Power modes The AS5011 can operate in three different power modes, depending on the power consumption requirements of the whole system. Power Mode [0x76] Register Description Sleep phase Power state between wakeups in Shutdown and Low Power modes RC clock and analog part OFF Digital part in static mode Shutdown mode Default mode after power on 1001_x00x <50µA current consumption LP_Pulsed = 1 Wake up every 80ms from Sleep phase LP_Active = 0 Hall elements in reduced power during wake up LP_Continue = RC clock ON 0 Interrupt LOW on INTn if the magnet is away from the center above the INT_wup_en = Xp Xn Yp Yn threshold values (1) 1 Low Power mode <200µA current consumption 110x_100x Wake up every 20ms from Sleep phase LP_Pulsed = 1 Hall elements in high power during wake up for better accuracy LP_Active = 1 RC clock ON LP_Continue = Interrupt LOW on INTn when XY coordinates are ready to be read (1) 0 INT_act_en = 1 Full Power mode 010x_y00x <8mA current consumption Continuous read LP_Pulsed = 0 Hall elements in high power permanently LP_Active = 1 RC clock ON LP_Continue = Interrupt LOW on INTn when XY coordinates are ready to be read (1) If INT_act_en = 1, after reading the XY coordinate, the next sample is 0 INT_act_en = y stored and won’t be updated until the next read of XY with interrupt release. If INT_act_int_en = 0, the last converted XY coordinate is read in real time. (1) The interrupt will be released to HIGH by reading the X_res_int or Y_res_int registers, or by switching the device into a different power mode. Table 2: Overview of typical power modes www.austriamicrosystems.com Revision 3.10 5 – 16 AS5011 Data Sheet 6.4.1 Shutdown mode LP_Pulsed = 1, LP_Active = 0, LP_Continue = 0, INT_wup_en = 1 [0x76] = 1001_x00x This is the default operating mode when powering up the device, giving the lowest power consumption when the whole system is in idle mode. The analog part of the AS5011 is powered off (sleep mode). It is waked up every 80ms by an internal low power logic, the hall sensors are read and the XY coordinate of the magnet is computed. If the magnet position is above the threshold limits Xp, Xn, Yp, Yn, an interrupt will be generated on the INTn pin and the device returns to sleep mode waiting for the next wake up after 80ms. As the host microcontroller receives the interrupt, it can read the X and Y positions or configure the AS5011 to Low Power mode (see 6.4.2 below) in order to track the magnet position until it returns to its initial position on the center. INT_n remains LOW until X_int/Y_int have been read, or after a power mode change. The typical coordinates read application after an interrupt is to read X first then Y_int. 6.4.2 Low Power mode LP_Pulsed = 1, LP_Active = 1, LP_Continue = 0, INT_act_en = 1 [0x76] = 110x_100x The Low Power mode is used to track the magnet coordinates when it has been moved from its initial center position. The AS5011 is in sleep mode and is waked up every 20ms. As soon as the XY position of the magnet is computed, an interrupt is sent on the INTn pin to the microcontroller indicating that a valid coordinate is available, then the sensor returns to sleep mode waiting for the next wake up after 20ms. INT_n remains LOW until X_int/Y_int have been read, or after a power mode change. The typical coordinates read application after an interrupt is to read X first then Y_int. This mode generates a higher power consumption than the Shutdown mode because of the faster sampling rate and the higher hall sensor current to provide an optimal accuracy of the coordinates. When the microcontroller detects that the magnet has returned to the initial center position, it has to configure the AS5011 back to Shutdown mode (see 6.4.1). 6.4.3 Full Power mode LP_Pulsed = 0, LP_Active = 1, LP_Continue = 0 [0x76] = 010x_y00x This mode allows the fastest coordinates reading. The sensor stays at its full capability, and never enters in sleep mode. The interrupt output goes LOW each time a new X and Y result has been computed and the valid data are ready to be read by the host microcontroller. INT_n remains LOW until X_int/Y_int have been read, or after a power mode change. The typical coordinates read application after an interrupt is to read X first then Y_int. The INT_act_en bit (y): • If INT_act_en = 1, after reading the X_int or Y_int register, the next sampled XY coordinate is stored and won’t be updated until the next read of X_int or Y_int. • If INT_act_en = 0, the last converted XY coordinate is read in real time. www.austriamicrosystems.com Revision 3.10 6 – 16 AS5011 Data Sheet 6.4.4 Switching the power modes The following sequence example would be used for a typical mobile application (mobile phone, PDA, MP3 player): Figure 9: Typical application sequence for mobile device After a complete system power up, a soft reset should be applied by sending the I²C commands [0x76] = 0x9A then [0x76] = 0x98. If needed the host microcontroller writes the configuration once to the AS5011, for example the inv_spinning register if the magnet is inverted (see 7.2) or the Xp Xn Yp Yn wakeup threshold values. The cursor is normally centered X,Y = (0,0) as the magnet position 1 on Figure 5 . The AS5011 is in Shutdown mode by default. The cursor is moved by the user above the Yp threshold. An interrupt is generated and remains LOW until an X_int/Y_int read or a power mode changing. The microcontroller configures the AS5011 in Low Power mode ( [0x76] = 110x_100x ) for faster reading. The interrupt is released to HIGH automatically by the power mode change. Interrupts are generated automatically every 20ms when the XY coordinates are ready for reading. The microcontroller reads the X register [0x41] then Y_int register [0x52] which releases INTn to HIGH. During this phase, the cursor is still moving and stays out of the wakeup thresholds range. If the microcontroller doesn’t read X_int or Y_int immediately after an interrupt, the INTn pin remains LOW until the next read of X_int or Y_int. The last new converted (a new sample every 20ms) coordinate will be transferred. The cursor has been released by the user, and returns to the center of the AS5011 (magnet position 1 on Figure 5). The microcontroller will read X,Y = (0,0), and will configure the sensor to Shutdown mode ([0x76] = 1001_x00x). Note: Firmware application notes with source code example for AS5011 and EasyPoint modules are available on www.austriamicrosystems.com website. www.austriamicrosystems.com Revision 3.10 7 – 16 AS5011 Data Sheet 7 I²C interface The AS5011 supports the 2-wire I²C protocol without “repeat start” as a slave device, the host CPU (master) has to initiate the data transfers. The 7-bit device address of the AS5011 is ‘1000 000’. The SDA signal is bidirectional and is used to read and write the serial data. The SCL signal is the clock generated by the host CPU, to synchronize the SDA data in read and write mode. The maximum I²C clock frequency is 4MHz, data are triggered on the rising edge of SCL. 7.1 Interface operation For both read and write data transfers consist of three phases: 1. The master sends a START command by pulling down SDA while SCL remains high. Then the 7-bit device address is sent followed by a read/write bit indicator. In READ mode (r/w = ‘1’), the slave has to send the data from its selected register. In WRITE mode (r/w = ‘0’), the master writes the data in the selected register. The slave has to acknowledge by sending ‘0’ after the r/w bit from the master. 2. The slave register is selected by the second data sent by the master. The address has an 8-bit format. The slave has to acknowledge by sending ‘0’ after the bit R0. 3. The 8-bit data is transferred from/to the slave selected register, depending on the r/w bit. At the end of the 8-bit data transfer, the master (read mode) or the slave (write mode) acknowledges by sending ‘1’. The transfer ends when the master sends a STOP command by sending a low to high transition while SCL remains high. The AS5011 does not send any acknowledge after the device address or register address (ACK remains High) in the following cases: - Wrong address - Write access to a read-only register Figure 10: I²C bus Read and Write operation www.austriamicrosystems.com Revision 3.10 8 – 16 AS5011 Data Sheet 7.2 I²C Registers The following registers / functions are accessible over the serial I²C interface. size Acces s Address LP_pulsed LP_active LP_continue 1 1 1 R/W R/W R/W 0x76 0x76 0x76 INT_wup_en 1 R/W 0x76 INT_act_en 1 R/W 0x76 ext_clk_en 1 R/W 0x76 soft_rst 1 R/W 0x76 data_valid 1 R 0x76 Test 7 Test 6 Test 5 Test 4 ext_sample_en rc_bias_on 1 1 1 1 1 1 R/W R/W R/W R/W R/W R/W 0x75 0x75 0x75 0x75 0x75 0x75 inv_spinning 1 R/W 0x75 pptrim_en 1 R/W 0x75 Xp 8 R/W 0x43 2’ comp Xn 8 R/W 0x44 2’ comp Yp 8 R/W 0x53 2’ comp Yn 8 R/W 0x54 2’ comp X 8 R 0x41 2’ comp Y 8 R 0x42 2’ comp X_res_int Y_res_int 8 8 R R 0x51 0x52 2’ comp 2’ comp Register Format Reset Value Bit Description Control Register 1 <7> Low Power control register. See Table 2. <6> Low Power control register. See Table 2. <5> For test only. Must be 0. Interrupt control register. If set, the interrupt pin goes low in Shutdown mode when 1 <4> the magnet has moved away from the center, above the xp, xn, yp yn threshold values. Interrupt control register. If set, the interrupt pin goes LOW in Low Power mode 1 <3> when a new XY value is ready for reading. Stores coordinate until next read in full power mode, 0 <2> For test only. Must be 0. Soft Reset. soft_rst = 0: normal mode 0 <1> soft_rst = 1: all registers return to their respective reset value Data valid. 0 <0> data_valid = 0: no valid XY coordinates data_valid = 1: valid data are ready to be read Control Register 2 0 <7> For test only. Must be 0. 1 <6> For test only. Must be 1. 0 <5> For test only. Must be 0. 0 <4> For test only. Must be 0. 0 <3> For test only. Must be 0. 0 <2> For test only. Must be 0. Invert the channel voltage. 0 <1> Set if the magnet polarity is reversed. 0 <0> For test only. Must be 0. Range and position values 0x28 Wakeup threshold on the positive X direction. (40d) 0xD8 Wakeup threshold on the negative X direction. (-40d) 0x28 Wakeup threshold on the positive Y direction. (40d) 0xD8 Wakeup threshold on the negative Y direction. (-40d) X position. The zero value means the horizontal center 0x00 position on the AS5011. Y position. The zero value means the vertical center 0x00 position on the AS5011. 0x00 X position. Releases INT_n to ‘1’ 0x00 Y position. Releases INT_n to ‘1’ 1 0 0 Table 3: I²C Registers www.austriamicrosystems.com Revision 3.10 9 – 16 AS5011 Data Sheet 8 Device specifications 8.1 Absolute maximum ratings (non operating) Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated under “Operating Conditions” is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Parameter Symbol Min Max Unit DC supply voltage VDD -0.3 5 V Peripheral supply voltage VDDp -0.3 5 V Note VDD +0.3 Input pin voltage Vin -0.3 VDDp +0.3 V Input pin voltage Vin - 3.6 V Input current (latchup immunity) Iscr -100 100 mA Electrostatic discharge ESD - ±1 Package Thermal Resistance ΘJA - 30 Norm: MIL 883 E method 3015 Velocity=0, Multi Layer °C/W PCB; JEDEC Standard Testboard 36 mW 125 °C 260 °C 85 % Total power dissipation Pt Storage temperature Tstrg Package body temperature Tbody Humidity non-condensing www.austriamicrosystems.com -55 5 Revision 3.10 Norm: JEDEC 78 kV Norm: IPC/JEDEC J-STD020C 10 – 16 AS5011 Data Sheet 8.2 Operating conditions (operating conditions: Tamb = -20 to +80°C, VDD = 3.3V) Parameter Symbol Min Core Supply voltage VDD Peripheral Supply voltage VDDp Current consumption on core supply, Typ Max Unit 2.7 3.6 V 1.8 VDD +0.3 V IDDs 50 µA IDDl 200 µA pulsed current IDDf during tconv with period tP,A IDDf 8 mA continuous current pin VDD µA average current pin VDDp, 20ms i²C polling, 47k pullup resistor on SDA pulsed current IDDf during tconv with period tP,W average current pin VDD Low Power mode Current consumption on core supply, open drain outputs : SCL, SDA, INT/ average current pin VDD Shutdown mode Current consumption on core supply, Note Full Power mode Current consumption on IO supply IDDp 1 Polling clock rate, Shutdown mode tP,W 65.6 80 94.4 ms internal Polling clock rate, Low Power mode tP,A 16.4 20 23.6 ms internal Coordinate conversion time tconv 330 380 455 µs Full Power mode lateral movement radius dx dy ±1.8 2 ±2.3 mm vertical magnetic field at magnet centre, measured at the chip surface type of magnet d 2 3 mm cylindrical; axial magnetized Hall array diameter RH magnetic field strength BZ 30 120 mT Tamb -20 +80 °C Ambient temperature range 2.2 mm vertical magnetic field at magnet center; measured at chip surface Magnetic field measurement resolution 11 bit Internal Resolution of XY displacement 8 bit over 2*dx and 2*dy axis 100 nF Ceramic capacitor VDD - VSS 100 nF Ceramic capacitor VDDp - VSS IC package Power supply filtering capacitors www.austriamicrosystems.com QFN16 5x5x0.55mm Revision 3.10 11 – 16 AS5011 Data Sheet 8.3 Digital IO pads DC/AC characteristics Parameter Symbol Min Max Unit Note Inputs: SCL, SDA (receiver) High level input voltage 0.7 * VDDp VIH Low level input voltage 0.3 * VDDp VIL Input leakage current Capacitive load V 0.25 * VDDp VDDp ≥ 2.7V V ILEAK 1 µA CL 35 pF VDDp < 2.7V VDDp = 3.6V Outputs: INTn, SDA (transmitter) High level output voltage VOH Low level output voltage VOL www.austriamicrosystems.com Open drain Revision 3.10 VSS + 0.4 Leakage current 1 µA V -2mA 12 – 16 AS5011 Data Sheet 9 Package Drawings DIM (mm) A A1 b D E D1 E1 e L L1 MIN NOM 0.50 0.55 0.152 REF 0.35 0.40 5.00 BSC 5.00 BSC 3.5 3.6 3.15 3.25 0.80 BSC 0.35 0.40 0.00 www.austriamicrosystems.com MAX 0.60 0.45 3.7 3.35 0.45 0.10 Revision 3.10 13 – 16 AS5011 Data Sheet 10 Recommended footprint DIM (mm) C1 C2 E X1 X2 Y1 Y2 Typ 4.8 4.8 0.8 0.45 3.7 0.9 3.7 RED: Top layer (AS5011 side) BLUE: Bottom layer (mechanics side) YELLOW: Top overlay www.austriamicrosystems.com Revision 3.10 14 – 16 AS5011 Data Sheet Table of contents 1 2 3 4 5 6 General Description........................................................................................................................................ 1 Benefits.......................................................................................................................................................... 1 Key Features.................................................................................................................................................. 1 Applications ................................................................................................................................................... 1 Package and pinout........................................................................................................................................ 2 Operating the AS5011 .................................................................................................................................... 3 6.1 Typical application ..................................................................................................................................... 3 6.2 XY coordinates interpretation ..................................................................................................................... 3 6.3 Magnet-chip surface airgap range.............................................................................................................. 4 6.4 Power modes............................................................................................................................................. 5 7 I²C interface ................................................................................................................................................... 8 7.1 Interface operation..................................................................................................................................... 8 7.2 I²C Registers.............................................................................................................................................. 9 8 Device specifications.................................................................................................................................... 10 8.1 Absolute maximum ratings (non operating) .............................................................................................. 10 8.2 Operating conditions ................................................................................................................................ 11 8.3 Digital IO pads DC/AC characteristics ...................................................................................................... 12 9 Package Drawings ....................................................................................................................................... 13 10 Recommended footprint ............................................................................................................................... 14 Table of contents .................................................................................................................................................. 15 Revision History .................................................................................................................................................... 15 Revision History Revision Date 3.10 November.3.2009 Description • Added recommended footprint • Added 0x75 register description 3.6 July. 3. 2009 • Added AS5000-MA2H-1 Magnet reference 3.5 June. 8.2009 • QFN 5x5x0.55mm package • I²C @ 4MHz max. www.austriamicrosystems.com Revision 3.10 15 – 16 AS5011 Data Sheet Copyrights Copyright © 1997-2009, austriamicrosystems AG, Schloss Premstaetten, 8141 Unterpremstaetten, Austria-Europe. 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