APA4863 Stereo 2.2W Audio Power Amplifier Features • • • General Description The APA4863 is a stereo bridge-tied audio power amplifier in various power packages, including SOP, TSSOP, Depop Circuitry Integrated Thermal Shutdown Circuitry Integrated and TSSOP-P. When connecting to a 5V voltage supply, the APA4863 is capable of delivering 2.2W/1.8W/1.2W of Bridge-Tied Load (BTL) or Single-Ended (SE) Modes Operation • continuous RMS power per channel into 3Ω/4Ω/8Ω bridge-tied loads with less than 1% THD+N respectively. Output Power at 1% THD+N, VDD=5V - 2.2W/Ch (Typ.) into a 3Ω Load When APA4863 operates in the single-ended load, it is capable of delivering 90mW of continuous RMS power - 1.8W/Ch (Typ.) into a 4Ω Load - 1.2 W/Ch (Typ.) into a 8Ω Load • • per channel into 32Ω load. The APA4863 simplifies design and frees up board space for other features. Shutdown Control Mode, ISD= 0.5 µA T h e A PA4863 also served well in low-voltage applications, which provides 750mW (1% THD+N) per Output Power (SE) at 0.5% THD+N, VDD=5V - 90mΩ/Ch (Typ.) into a 32Ω Load • channel into 4Ω loads with a 3.3V supply voltage. Both of the depop circuitry and the thermal shutdown protection Various Power Packages Available SOP-16, TSSOP-20, and TSSOP-20P • circuitry are integrated in the APA4863, which reduces pops and clicks noise during power up and when using Lead Free and Green Devices Available (RoHS Compliant) the shutdown mode and protects the chip from being destroyed by over-temperature failure. To simplify the au- Applications • dio system design in notebook computer applications, the APA4863 combines a stereo bridge-tied loads mode Stereo Audio Power Amplifier for Notebook for speaker drive and a stereo single-end mode for headphone drive into a single chip, where both modes are Computer • • Portable Televisions easily switched by the HP-IN input control pin signal. For power sensitive applications, the APA4863 also features Portable and Desktop Computers a shutdown function which keeps the supply current only 0.5 µA (typ.). Ordering and Marking Information Package Code K : SOP-16 O : TSSOP-20 R : TSSOP-20P Operating Ambient Temperature Range I : -40 to 85 oC Handling Code TR : Tape & Reel Assembly Material G : Halogen and Lead Free Device APA4863 Assembly Material Handling Code Temperature Range Package Code APA4863 K/O/R : APA4863 XXXXX XXXXX - Date Code Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight). ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright ANPEC Electronics Corp. Rev. A.7 - Oct., 2009 1 www.anpec.com.tw APA4863 Pin Configuration SHUTDOWN GND + OUT A VDD - OUT A - IN A GND + IN A 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 SHUTDOWN GND + OUT A VDD - OUT A - IN A GND + IN A NC NC HP-IN GND + OUT B VDD - OUT B - IN B BYPASS + IN B SOP-16 (Top View) SHUTDOWN GND + OUT A VDD - OUT A - IN A GND + IN A GND GND 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 HP-IN GND + OUT B VDD - OUT B - IN B BYPASS + IN B NC NC TSSOP-20 (Top View) HP-IN GND + OUT B VDD - OUT B - IN B BYPASS + IN B GND GND Thermal Pad TSSOP-20P (Top View) TSSOP-20P (Bottom View) Absolute Maximum Ratings (Note 1) (Over operating free-air temperature range unless otherwise noted.) Symbol Parameter VDD Supply Voltage TA Operating Ambient Temperature Range TJ Maximum Junction Temperature TSTG TS Storage Temperature Range Maximum Lead Soldering Temperature, 10 Seconds Rating Unit 6 V -40 to 85 °C 150 °C -65 to +150 °C 260 °C Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Recommended Operating Conditions Symbol VDD TA VICM Range Parameter Supply Voltage Operating Free-Air Temperature Common Mode Input Voltage Copyright ANPEC Electronics Corp. Rev. A.7 - Oct., 2009 VDD=5V, 250mW/Ch average power 4-Ω stereo BTL drive, with proper PCB design VDD=5V, 1.8 W/Ch average power 4-Ω stereo BTL drive, with proper PCB design and 300 CFM forced-air cooling Unit Min. Typ. Max. 3 5 5.5 -20 - 85 °C -20 - 85 VDD=5 V 1.25 - 4.5 VDD=3.3V 1.25 - 2.7 2 V V www.anpec.com.tw APA4863 Dissipation Rating Table Thermal Resistance θJA(oC/W) TA≤25oC TA=70oC 0 80 1.6W 1.0W 0 200 0 200 73.2 66.6 37.6 32.3 1.7W 1.8W 3.3W 3.8W 1.1W 1.2W 2.1W 2.4W Packge Air Flow (CFM) SOP-16 (Note 2) TSSOP-20 (Note 3) TSSOP-20P (Note 3) Note 2 : The parameter is measured with the recommended copper heat sink pattern on an 2-layer PCB, 11.7 in2 3.0×2.4 in2 in PCB, 1oz. copper, 3.0×1.5 in2 in coverage at Top-layer and Bottom-layer at 100% coverage (7.2in2). Note 3 :The parameter is measured with the JEDEC standard test boards (multi-layer PCB). Electrical Characteristics Electrical Characteristics for Entire IC The following specifications apply for VDD= 5V unless otherwise noted. Limits apply for TA= 25°C Symbol Parameter APA4863 Test Conditions Min. VDD Supply Voltage Typ. Unit Max. 3 - 5.5 V - 9 5 13.5 7.5 mA 5 0.5 - µA IDD Quiescent Power Supply Current VIN=0V, IO=0A, HP-IN=0V VIN=0V, IO=0A, HP-IN=4V ISD Shutdown Current VPIN1= VDD VIH Headphone High Input Voltage 4 - - V VIL Headphone Low Input Voltage - - 0.8 V Electrical Characteristics for BTL Mode Operation The following specifications apply for VDD= 5V unless otherwise noted. Limits apply for TA= 25°C APA4863 Symbol VOS PO Parameter Output Offset Voltage Output Power THD+N Total Harmonic Distortion Plus Noise PSRR Power Supply Rejection Ratio XTALK Channel Separation SNR Signal-to-Noise Ratio Copyright ANPEC Electronics Corp. Rev. A.7 - Oct., 2009 Test Conditions VIN=0V THD+N=1%, fin=1kHz RL=3Ω RL=4Ω RL=8Ω THD+N=10%, fin=1kHz RL=3Ω RL=4Ω RL=8Ω AVD=2, fin=1kHz RL=4Ω, PO=1.8W RL=8Ω, PO=1W VDD=5V, VRIPPLE=200mVRMS, RL=8Ω, CB=2.2µF fin=1kHz, CB=2.2µF, PO=1W, RL=8Ω VDD=5V, PO=1.1W, RL=8Ω 3 Unit Min. Typ. Max. - 5 - - - 2.2 1.8 1.2 2.7 2.3 1.5 mV W - - 0.3 0.15 - % - 64 - dB - 90 - dB - 95 - dB www.anpec.com.tw APA4863 Electrical Characteristics (Cont.) Electrical Characteristics for SE Mode Operation The following specifications apply for VDD= 5V unless otherwise noted. Limits apply for TA= 25°C APA4863 Symbol Parameter Test Conditions Unit Min. VOS PO Output Offset Voltage Output Power THD+N Total Harmonic Distortion Plus Noise PSRR Power Supply Rejection Ratio XTALK Channel Separation SNR Signal-to-Noise Ratio VIN=0V THD+N=0.5%, fin=1kHz, RL=32Ω THD+N=1%, fin=1kHz, RL=8Ω THD+N=10%, fin=1kHz, RL=8Ω AV=-1, PO=75mW, fin=1kHz, RL=32Ω VRIPPLE=200mVRMS, fin=1kHz, CB=2.2µF, RL=8Ω, fin=1kHz, CB=2.2µF, PO=32mW, RL=32Ω VDD=5V, PO=340mW, RL=8Ω Typ. Max. - 5 - mV - 90 320 400 - mW - 0.02 - % - 49 - dB - 85 - dB - 95 - dB Truth Table for Logic Inputs Shutdown HP-IN APA4863 Mode Low Low Bridge-Tied Low High Single-Ended High Low APA4863 Shutdown High High APA4863 Shutdown Copyright ANPEC Electronics Corp. Rev. A.7 - Oct., 2009 4 www.anpec.com.tw APA4863 Typical Operating Characteristics THD+N vs. Frequency THD+N vs. Output Power 10 10 VDD=5V, RL=4Ω BW<80kHz VDD=5V, PO=1.8W RL=4Ω, BW<80kHz 20Hz THD+N (%) THD+N (%) 1 20kHz 1kHz 1 0.1 0.1 0.01 0.01 10m 100m 1 20 3 10k 20k 1k Output Power (W) Frequency (Hz) Power Dissipation vs. Output Power THD+N vs. Frequency 1.4 10 VDD=5V 1.2 VDD=5V, PO=1W RL=8Ω, BTL Mode RL=4Ω 1 THD+N (%) Power Dissipation (W) 100 0.8 0.6 RL= 8Ω 0.4 1 AVD=10 0.1 AVD=2 0.2 0 0 0.5 1 1.5 2 0.01 2.5 20 Output Power (W) THD+N vs. Frequency 10k 20k THD+N vs. Frequency 10 10 VDD=5V, PO=150mW RL=16Ω, SE Mode VDD=5V, PO=75mW RL=32Ω, SE Mode 1 0.1 THD+N (%) 1 THD+N (%) 100 1k Frequency (Hz) AV= -5 0.1 AV= -5 AV= -1 AV= -1 0.001 0.001 20 100 1k 10k 20 20k Frequency (Hz) Copyright ANPEC Electronics Corp. Rev. A.7 - Oct., 2009 100 1k 10k 20k Frequency (Hz) 5 www.anpec.com.tw APA4863 Typical Operating Characteristics (Cont.) THD+N vs. Output Power THD+N vs. Output Power 10 10 1 fin= 20Hz THD+N (%) THD+N (%) 1 fin= 20kHz 0.1 fin= 1kHz 10m 100m 1 fin= 20Hz fin= 1kHz VDD=5V, RL=8Ω AVD=2, BW< 80kHz BTL Mode 0.01 fin= 20kHz 0.1 0.001 10m 2 70m Output Power (W) 1 200m 500m Output Power (W) THD+N vs. Output Power 10 VDD=5V, RL=16Ω AV=-1, BW< 80kHz SE Mode THD+N vs. Output Power 10 VDD=5V, RL=32Ω AV=-1, BW< 80kHz SE Mode fin= 20kHz fin= 20Hz THD+N (%) THD+N (%) 1 fin= 20kHz 0.1 fin= 20Hz fin= 1kHz 0.1 fin= 1kHz VDD=3.3V, RL=4Ω AVD= 2 0.001 10m 50m 100m 0.01 200m 10m 100m 1 Output Power (W) Output Power (W) THD+N vs. Frequency THD+N vs. Output Power 2 10 10 VDD=3.3V, PO=700mW RL=4Ω, AVD=2 THD+N (%) THD+N (%) fin= 20kHz 1 1 fin= 20Hz fin= 1kHz 0.1 0.1 VDD=3.3V, RL=8Ω, AVD=2 0.01 0.01 20 100 1k 10k 10m 20k Frequency (Hz) Copyright ANPEC Electronics Corp. Rev. A.7 - Oct., 2009 100m 1 Output Power (W) 6 www.anpec.com.tw APA4863 Typical Operating Characteristics (Cont.) Output Power vs. Load Resistance THD+N vs. Frequency 0.2 10 VDD=3.3V, fin=1kHz AVD=2, BW<80kHz VDD=3.3V, PO=450mW RL=8Ω, AVD=2 0.15 Output Power (W) THD+N (%) 1 0.1 0.01 20 100 1k THD+N = 10% 0.1 THD+N = 1% 0.05 0 10k 20k 0 10 Power Dissipation vs. Output Power Output Power (W) Power Dissipation (W) 0.25 RL=8Ω 0.2 RL=16Ω 0.15 VDD=5V, fin=1kHz RL=8Ω, BW<80kHz BTL Mode 1.75 0.3 0.1 1.5 THD+N = 10% 1.25 1 0.75 0.5 0.05 THD+N = 1% 0.25 0.2 0.4 0.6 Output Power (W) 0 0 0.8 Output Power vs. Supply Voltage 2 150 VDD=5V, fin=1kHz RL=16Ω, BW<80kHz SE Mode 250 2.5 3 3.5 4 4.5 Supply Voltage (V) 5 5.5 Output Power vs. Supply Voltage 300 VDD=5V, fin=1kHz RL=32Ω, BW<80kHz SE Mode 130 110 200 Output Power Output Power 40 2 VDD=3.3V, SE Mode THD+N = 10% 150 100 90 THD+N = 10% 70 50 THD+N = 1% 30 THD+N = 1% 50 0 30 Output Power vs. Supply Voltage 0.35 0 20 Load Resistance (Ω) Frequency (Hz) 10 2 2.5 3 3.5 4 4.5 5 -10 5.5 Supply Voltage (V) Copyright ANPEC Electronics Corp. Rev. A.7 - Oct., 2009 2 2.5 3 3.5 4 4.5 5 5.5 Supply Voltage (V) 7 www.anpec.com.tw APA4863 Typical Operating Characteristics (Cont.) Output Power vs. Load Resistance Output Power vs. Load Resistance 1 1.75 VDD=5V, f in=1kHz AVD=2, BW<80kHz BTL Mode 1.25 1 10% THD+N 0.75 0.5 0.6 0.4 10% THD+N 0.2 0.25 1% THD+N 1% THD+N 0 0 8 18 28 38 48 58 68 0 20 30 40 50 60 70 Load Resistance (Ω) Power Dissipation vs. Output Power Power Dissipation vs. Output Power 0.18 0.16 RL=4Ω 1.2 RL=8Ω 0.14 0.8 Power Dissipation 1 RL=8Ω 0.6 0.4 RL=16Ω 0.2 RL=32Ω VDD=5V, fin=1kHz THD+N <1% BW<80kHz BTL Mode 0 0 0.5 1 0.12 RL=16Ω 0.1 0.08 0.06 RL=32Ω 0.04 0.02 0 1.5 0 Output Power (W) 0.1 0.2 VDD=5V, fin=1kHz THD+N <1% BW<80kHz SE Mode 0.3 0.4 0.5 Output Power (W) Noise Floor Channel Separation 100 +0 VO+ + VO- Channel Separation (dB) Output Noise Voltage (µV) 10 Load Resistance (Ω) 1.4 Power Dissipation VDD=5V, fin=1kHz AV=-1, BW<80kHz SE Mode 0.8 Output Power (W) Output Power (W) 1.5 VO10 VDD=5V, RL=8Ω AVD=2, CB=1µF 1 20 100 1k Frequency (Hz) Copyright ANPEC Electronics Corp. Rev. A.7 - Oct., 2009 -40 -60 -80 Channel A to B -100 -120 10k 20k VDD=5V, RL=8Ω AVD=2, PO=1W CB=1µF BTL Mode -20 Channel B to A 20 100 1k 10k 20k Frequency (Hz) 8 www.anpec.com.tw APA4863 Typical Operating Characteristics (Cont.) Channel Separation +0 VDD=5V, RL=32Ω AV=-1, PO=75mW CB=1µF SE Mode -20 +70 VDD=5V SE Mode +60 Gain -40 +50 Gain (dB) Channel Separation (dB) Open Loop Frequency Response +80 -60 Channel A to B -80 +40 +30 +20 -100 +10 Channel B to A -120 20 100 1k +0 10k 20k Frequency (Hz) 100 Phase 1k 10k 100k Frequency (Hz) 1M 10M Supply Current vs. Supply Voltage 10 Supply Current (mA) VIN=0V No Load 8 BTL Mode (HP-IN=GND) 6 4 SE Mode (HP-IN=VDD) 2 0 2 2.5 3 3.5 4 4.5 5 5.5 Supply Voltage(V) Copyright ANPEC Electronics Corp. Rev. A.7 - Oct., 2009 9 www.anpec.com.tw APA4863 Pin Description PIN NO. I/O FUNCTION NAME TSSOP-20 TSSOP-20P SOP-16 1 1 1 SHUTDOWN I Shutdown mode control pin input, places entire IC in shutdown mode when held high, IDD=0.5µA. 2,7,19 2,7,9,10,11, 12,19 2,7,15 GND - Ground connection of circuitry. 3 3 3 +OUT A O A channel + output in BTL mode, high impedance in SE mode. 4,17 4,17 4,13 VDD I Supply voltage input. 5 5 5 -OUT A O A channel - output in BTL mode, + output in SE mode. 6 6 6 -INA I Input pin of channel A. 8 8 8 +INA I Non-inverting input of channel A, connected to bypass pin inside the IC. 13 13 9 +IN B I Non-inverting input of channel B, connected to bypass pin inside the IC. 14 14 10 BYPASS - Connect to voltage divider for internal mid-supply bias. 15 15 11 -IN B I Input pin of channel B. 16 16 12 -OUT B O B channel - output in BTL mode, + output in SE mode. 18 18 14 +OUT B O B channel + output in BTL mode, high impedance in SE mode. 20 20 16 HP-IN I Headphone control pin input, hold high for single-ended mode operation. 9,10,11,12 - - NC - No connection. Block Diagram VDD CS 0.1µF RF 20kΩ - IN A + IN A* - OUT A 20kΩ 20kΩ 20kΩ Bypass 50kΩ - VDD / 2 CB 2.2µF 100µF 1kΩ Control Pin RL 8Ω Ring To HP-IN Circuit 50kΩ Tip C1 1 µF - IN B 20kΩ + IN B* RF 20kΩ + R1 - Audio Input - OUT B 20kΩ Headphone Jack CO 100µF RL 8Ω 1kΩ + OUT B + 100kΩ Sleeve + 20kΩ 20kΩ VDD To Control Pin on Headphone Jack + OUT A CO + + C1 1 µF 20kΩ - R1 + Audio Input Shutdown HP-IN 100kΩ GND Note : * +INA and +INB pins are connected to Bypass pin inside the IC. Copyright ANPEC Electronics Corp. Rev. A.7 - Oct., 2009 10 www.anpec.com.tw APA4863 Package Information SOP-16 (300 mil) D h x 45o A 0.25 c GAUGE PLANE SEATING PLANE A1 A2 b L θ e E E1 SEE VIEW A VIEW A S Y M B O L SOP-16 (300mil) MILLIMETERS MIN. MIN. MAX. A A1 INCHES MAX. 0.104 2.65 0.012 0.004 0.30 0.10 0.081 A2 2.05 b 0.31 0.51 0.012 0.020 c 0.20 0.33 0.008 0.013 D 10.10 10.50 0.396 0.413 E 10.10 10.50 0.398 0.413 E1 7.40 7.60 0.291 0.299 0.030 0.050 e 1.27 BSC 0.050 BSC h 0.25 0.75 0.010 L 0.40 1.27 0.016 0 0o 8o 0o 8o Note : 1. Followed from JEDEC MS-013 AA. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "E" does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 10 mil per side. Copyright ANPEC Electronics Corp. Rev. A.7 - Oct., 2009 11 www.anpec.com.tw APA4863 Package Information TSSOP-20 SEE VIEW A c A 0.25 b A2 e E E1 D S Y M B O L VIEW A 0 A1 GAUGE PLANE L SEATING PLANE TSSOP-20 MILLIMETERS MIN. INCHES MAX. A MIN. MAX. 1.20 0.047 A1 0.05 0.15 0.002 0.006 A2 0.80 1.05 0.031 0.041 b 0.19 0.30 0.007 0.012 c 0.09 0.20 0.004 0.008 D 6.40 6.60 0.252 0.260 E 6.20 6.60 0.244 0.260 E1 4.30 4.50 0.169 0.177 e L θ 0.026 BSC 0.65 BSC 0.45 0.75 0o 8o 0.018 0.030 0o 8o Note : 1. Follow JEDEC MO-153 AC. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "E1" does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 10 mil per side. Copyright ANPEC Electronics Corp. Rev. A.7 - Oct., 2009 12 www.anpec.com.tw APA4863 Package Information TSSOP-20P D SEE VIEW A b A 0.25 c GAUGE PLANE SEATING PLANE A1 A2 e VIEW A S Y M B O L L 0 EXPOSE D PAD E E2 E1 D1 TSSOP-20P MILLIMETERS MIN. INCHES MIN. MAX. MAX. 0.047 A 1.20 A1 0.05 0.15 0.002 0.006 A2 0.80 1.05 0.031 0.041 b 0.19 0.30 0.007 0.012 c 0.09 0.20 0.004 0.008 D 6.40 6.60 0.252 0.260 D1 3.00 4.50 0.118 0.177 E 6.20 6.40 0.244 0.260 E1 4.30 4.50 0.169 0.177 3.50 0.098 0.138 0.75 0.018 8o 0o E2 2.50 e L 0 0.026 BSC 0.65 BSC 0.45 0o 0.030 8o Note : 1. Follow JEDEC MO-153 ACT. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension "E1" does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 10 mil per side. Copyright ANPEC Electronics Corp. Rev. A.7 - Oct., 2009 13 www.anpec.com.tw APA4863 Carrier Tape & Reel Dimensions P0 P2 P1 A B0 W F E1 OD0 K0 A0 A OD1 B B T SECTION A-A SECTION B-B H A d T1 Application SOP-16 Application TSSOP-20 Application TSSOP-20P A H T1 C d D W E1 F 330.0±2.00 50 MIN. 16.4+2.00 -0.00 13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. 16.0±0.30 1.75±0.10 7.5±0.10 P0 P1 P2 D0 D1 T A0 B0 K0 4.0±0.10 8.0±0.10 2.0±0.10 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00 -0.40 A H T1 C d D W E1 F 330.0±2.00 50 MIN. 16.4+2.00 -0.00 13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. 16.0±0.30 1.75±0.10 7.50±0.10 P0 P1 P2 D0 D1 T A0 B0 K0 2.00±0.10 1.5+0.10 -0.00 1.5 MIN. 0.30±0.05 6.9±0.20 6.90±0.20 1.60±0.20 6.40±0.20 10.30±0.20 2.10±0.20 4.00±0.10 8.00±0.10 A H T1 C d D W E1 F 330.0±2.00 50 MIN. 16.4+2.00 -0.00 13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. 16.0±0.30 1.75±0.10 7.50±0.10 P0 P1 P2 D0 D1 T A0 B0 K0 4.00±0.10 8.00±0.10 2.00±0.10 1.5+0.10 -0.00 1.5 MIN. 0.30±0.05 6.9±0.20 6.90±0.20 1.60±0.20 (mm) Copyright ANPEC Electronics Corp. Rev. A.7 - Oct., 2009 14 www.anpec.com.tw APA4863 Devices Per Unit Package Type SOP- 16 TSSOP- 20 TSSOP- 20P Unit Tape & Reel Tape & Reel Tape & Reel Quantity 1000 2000 2000 Taping Direction Information SOP-16 USER DIRECTION OF FEED TSSOP-20(P) USER DIRECTION OF FEED Copyright ANPEC Electronics Corp. Rev. A.7 - Oct., 2009 15 www.anpec.com.tw APA4863 Classification Profile Classification Reflow Profiles Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly 100 °C 150 °C 60-120 seconds 150 °C 200 °C 60-120 seconds 3 °C/second max. 3°C/second max. 183 °C 60-150 seconds 217 °C 60-150 seconds See Classification Temp in table 1 See Classification Temp in table 2 Time (tP)** within 5°C of the specified classification temperature (Tc) 20** seconds 30** seconds Average ramp-down rate (Tp to Tsmax) 6 °C/second max. 6 °C/second max. 6 minutes max. 8 minutes max. Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts) Average ramp-up rate (Tsmax to TP) Liquidous temperature (TL) Time at liquidous (tL) Peak package body Temperature (Tp)* Time 25°C to peak temperature * Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Copyright ANPEC Electronics Corp. Rev. A.7 - Oct., 2009 16 www.anpec.com.tw APA4863 Classification Reflow Profiles (Cont.) Table 1. SnPb Eutectic Process – Classification Temperatures (Tc) 3 Package Thickness <2.5 mm Volume mm <350 235 °C Volume mm ≥350 220 °C ≥2.5 mm 220 °C 220 °C 3 Table 2. Pb-free Process – Classification Temperatures (Tc) Package Thickness <1.6 mm 1.6 mm – 2.5 mm ≥2.5 mm Volume mm <350 260 °C 260 °C 250 °C 3 Volume mm 350-2000 260 °C 250 °C 245 °C 3 Volume mm >2000 260 °C 245 °C 245 °C 3 Reliability Test Program Test item SOLDERABILITY HOLT PCT TCT HBM MM Latch-Up Method JESD-22, B102 JESD-22, A108 JESD-22, A102 JESD-22, A104 MIL-STD-883-3015.7 JESD-22, A115 JESD 78 Description 5 Sec, 245°C 1000 Hrs, Bias @ 125°C 168 Hrs, 100%RH, 2atm, 121°C 500 Cycles, -65°C~150°C VHBM≧2KV VMM≧200V 10ms, 1tr≧100mA Customer Service Anpec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 2F, No. 11, Lane 218, Sec 2 Jhongsing Rd., Sindian City, Taipei County 23146, Taiwan Tel : 886-2-2910-3838 Fax : 886-2-2917-3838 Copyright ANPEC Electronics Corp. Rev. A.7 - Oct., 2009 17 www.anpec.com.tw