SOIC-to-JEDEC TO Adapter FEATURES •8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. IC now available only in 8-position SOIC packages, can be readily mounted on boards having JEDEC TO thru-hole footprints without having to redesign the board. •Consult factory for mounting of consigned chips. GENERAL SPECIFICATIONS •ADAPTER BOARD: FR-4, 0.062 [1.58] thick, with 1-oz. Cu traces both sides •MALE PIN: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M •MALE PIN PLATING: 200µ [5.08µ] Sn/Pb 93/7 ASTM B579-73 over 100µ [2.54µ] Ni per SAE-AMS-QQ-N-290 •OPERATING TEMPERATURE: 221°F [105°C] MOUNTING CONSIDERATIONS •SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia. ALL DIMENSIONS: INCHES [MILLIMETERS] ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED DIP-to-TO ADAPTER ALSO AVAILABLE. CONSULT DATA SHEET 18012 CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. Special materials, platings, sizes, and configurations can be furnished, depending on the quantity. NOTE: Aries reserves the right to change product general specifications without notice. ORDERING INFORMATION P/N Dim “C” 1109814 0.200[5.08] 08-301296-10 0.300[7.62] 08-305479-10 0.270[6.85] CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS Bristol, PA 19007-6810 USA TEL (215) 781-9956 • FAX (215) 781-9845 WWW.ARIESELEC.COM • [email protected] PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED 18013 Rev. AA