RoHs/WEEE-Compliant SOIC-to-JEDEC TO Adapter FEATURES •Pb-Free RoHs/WEEE-compliant •8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having JEDEC TO thru-hole footprints without having to redesign the board. •Consult factory for mounting of consigned chips. GENERAL SPECIFICATIONS •ADAPTER BOARD: 0.062 [1.58] thick FR-4 or IS410 per IPC 4101A/26 with 1-oz. Cu traces, both sides •MALE PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M •MALE PIN PLATING: 10µ [0.254µ] min. Au per MIL-G-45204 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290 •OPERATING TEMPERATURE: 221°F [105°C] MOUNTING CONSIDERATIONS •SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia. CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. Special materials, platings, sizes, and configurations can be furnished, depending on the quantity. NOTE: Aries reserves the right to change product general specifications without notice. ORDERING INFORMATION P/N Dim “C” 1109814-RC 0.200 [5.08] ALL DIMENSIONS: INCHES [MILLIMETERS] ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED DIP-to-TO ADAPTER ALSO AVAILABLE. CONSULT DATA SHEET 18012 CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS Bristol, PA 19007-6810 USA TEL (215) 781-9956 • FAX (215) 781-9845 WWW.ARIESELEC.COM • [email protected] PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED 18013RC Rev. AA