ARIES 20-353000-10

Series 352000 and 353000
PLCC-to-DIP Adapter
FEATURES
•Converts PLCC packaged IC-to-DIP footprints
•Ideal for prototyping and testing/evaluation
•Available with PLCC sockets or PLCC pads on top side
•Consult factory for Panelized Form or for mounting of consigned ICs
GENERAL SPECIFICATIONS
•ADAPTER BODY: 0.062 [1.58] thick, FR-4 with 1-oz. Cu traces
•PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
•PIN PLATING: Sn/Pb 93/7 per ASTM B579-73 over 100µ [2.54µ] Ni per SAEAMS-QQ-N-290
•OPTIONAL PLCC SOCKETS: UL 94V-0 PPS
•SOCKET CONTACTS: Phosphor Bronze
•SOCKET CONTACT PLATING: 200µ [5.08µ] Sn/Pb 93/7 per ASTM B579-73
over 50µ [1.27µ] Ni per SAE AMS-QQ-290
•CURRENT RATING: 1 amp
•OPERATING TEMPERATURE: 221°F [105°C]
ORDERING INFORMATION
XX-35X000-10
MOUNTING CONSIDERATIONS
•SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia.
•Will plug into standard IC socket
•See Table for Pad Layout when mounting PLCC socket
CUSTOMIZATION: In addition to the standard products shown
on this page, Aries specializes in custom design and production.
Special materials, platings, sizes, and configurations can be
furnished, depending on the quantity. NOTE: Aries reserves the
right to change product general specifications without notice.
No. of Pins
20, 28
Series
352000: without socket
353000: with socket
Sn-plated Solder
Tail Pin
ALL DIMENSIONS: INCHES [MILLIMETERS]
ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED
CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS
Pins
Dim. “A”
Dim. “B”
Dim. “C”
Dim. “D”
20
28
1.000 [25.4]
1.400 [35.56]
0.900 [22.86]
1.300 [33.02]
0.500 [12.7]
0.705 [17.91]
0.500 [12.7]
0.705 [17.91]
Dim. “W”
±0.003 [0.08]
non-cumulative
0.200 [5.08]
0.300 [7.62]
Dim. “X”
±0.003 [0.08]
non-cumulative
0.200 [5.08]
0.300 [7.62]
Dim “Y”
±0.003 [0.08]
Dim. “Z”
±0.003 [0.08]
Pad Size
0.350 [8.89]
0.549 [13.95]
0.350 [8.89]
0.449 [11.41]
0.024 x 0.076 [ 0.61 x 1.93]
0.024 x 0.076 [0.61 x 1.93]
Bristol, PA 19007-6810 USA
TEL (215) 781-9956 • FAX (215) 781-9845
WWW.ARIESELEC.COM • INFO@ARIESELEC.COM
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
18015
Rev. AA