ASB APM2600-P29

plerowTM APM2600-P29
Low Noise & High OIP3
Medium Power Amplifier Module
Features
Description
· S21 = 28.7 dB @ 2500 MHz
= 27.3 dB @ 2700 MHz
· NF fo 2.5 dB over Frequency
· Unconditionally Stable
· Single 5V Supply
· High OIP3 @ Low Current
The plerowTM APM-Series is an internally matched
amplifier mini-module for such application band in
SMD package with the output P1dB of 29 dBm. It is
compactly designed for low current consumption and
high OIP3. Integrating all the components for biasing
and matching within the module enhances production
yield and throughput as well. It passes through the
stringent DC, RF, and reliability tests. Not sample test
but 100% quality control test is made before packing.
Specifications (in Production)
Typ. @ T = 25°C, Vs = 5 V, Freq. = 2600 MHz, Zo.sys = 50 ohm
Parameter
Unit
Frequency Range
Min
MHz
2500
Gain
dB
27
Gain Flatness
dB
Noise Figure
Output IP3
S11 / S22
Typ
dBm
(2)
28
44
± 0.7
± 0.8
2.5
2.6
dBm
(3)
Website: www.asb.co.kr
E-mail: sales@asb.co.kr
Tel: (82) 42-528-7223
Fax: (82) 42-528-7222
-18 / -12
28
29
µsec
-
1
Supply Current
mA
460
500
Supply Voltage
V
5
Impedance
Ω
50
Switching Time
More Information
47
dB
Output P1dB
Max
2700
dB
(1)
2-stage Single Type
Specifications
Max. RF Input Power
dBm
C.W 23 ~ 25 (before fail)
Package Type & Size
mm
Surface Mount Type, 13Wx13Lx3.8H
ASB Inc., 4th Fl. Venture Town
Bldg., 367-17 Goijeong-Dong,
Seo-Gu, Daejon 302-716, Korea
Operating temperature is -40°C to +85°C.
1) OIP3 is measured with two tones at an output power of 15 dBm / tone separated by 1 MHz.
2) S11/S22 (max) is the worst value within the frequency band.
3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to VS.
Outline Drawing (Unit: mm)
plerow
Pin Number
Function
APM2600-P29
3
RF In
ASB Inc.
8
RF Out
10
Vs
Others
Ground
(Top View)
(Bottom View)
Solder Stencil Area
Note: 1. The number and size of ground via holes in
a circuit board is critical for thermal RF
grounding considerations.
2. We recommend that the ground via holes be
placed on the bottom of all ground pins for
better RF and thermal performance, as
shown in the drawing at the left side.
(Side View)
Ø0.3 plated thru holes to ground plane
2 x Ø2.0 plated thru holes to screw on heat sinker
(Recommended Footprint)
1/5
www.asb.co.kr
February 2009
plerowTM APM2600-P29
Low Noise & High OIP3
Medium Power Amplifier Module
S-parameters
Typical Performance
(Measured)
WiMax
2500~2700
+5 V
Stability Factor (K)
Noise Figure
OIP3
2/5
P1dB
www.asb.co.kr
February 2009
plerowTM APM2600-P29
Low Noise & High OIP3
Medium Power Amplifier Module
Output Channel Power
(@ ACLR=-45dBc, +/-5MHz Offset)
ACLR vs Channel Power
OIP3 vs Output Power
(@ 1MHz offset, 1-tone power)
** Test Source : Agilent E4433B (3GPP W-CDMA Test Model-1 64DPCH)
3/5
www.asb.co.kr
February 2009
plerowTM APM2600-P29
Low Noise & High OIP3
Medium Power Amplifier Module
Application Circuit
VS
+
-
Tantal or MLC (Multi Layer Ceramic)
Capacitor
C1
C2
APM
IN
OUT
1)
The tantal or MLC (Multi Layer Ceramic) capacitor is optional and for bypassing the AC noise introduced
from the DC supply. The capacitance value may be determined by customer’s DC supply status. The capacitor should be placed as close as possible to Vs pin and be connected directly to the ground plane for
the best electrical performance.
2)
DC blocking capacitors are always necessarily placed at the input and output port for allowing only the
RF signal to pass and blocking the DC component in the signal. The DC blocking capacitors are included inside the APM module. Therefore, C1 & C2 capacitors may not be necessary, but can be added
just in case that the customer wants. The value of C1 & C2 is determined by considering the application
frequency.
Evaluation Board Layout
Recommended Soldering Reflow Process
Vs
20~40 sec
260°C
Ramp-up
(3˚C/sec)
200°C
Ramp-down
(6°C/sec)
OUT
IN
150°C
60~180 sec
4/5
Size 40x40mm
(for APM Series – 13x13mm)
www.asb.co.kr
February 2009
plerowTM APM2600-P29
Low Noise & High OIP3
Medium Power Amplifier Module
Channel Power vs. ACLR Test Configuration
APM2600
– P29
Evaluation Board attached with Heat Sink
Evaluation Board
* In order to prevent damage of D.U.T (APM-Series) from heating, you must to use a properly sized heat
sink for testing a module.
5/5
www.asb.co.kr
February 2009