Custom High Performance Cooling Solutions w/ maxiGRIP™ Attachment ATS PART # ATS-59002-C2-R0 D Features & Benefits » Designed for flip-chip processors such as Freescale MPCs » maxiGRIP™ attachment applies steady, even pressure to the component and does not require holes in the PCB » Comes preassembled with high performance, phase changing, thermal interface material C B Thermal Performance A *Image above is for illustration purposes only. AIR VELOCITY THERMAL RESISTANCE FT/MIN M/S °C/W (UNDUCTED FLOW) °C/W (DUCTED FLOW) 200 1.0 6.5 3.8 300 1.5 5 400 2.0 4.1 500 2.5 3.6 600 3.0 3.2 700 3.5 3 800 4.0 2.7 Product Details DIMENSION A DIMENSION B DIMENSION C DIMENSION D INTERFACE MATERIAL FINISH 25 mm 32 mm 13 mm 46.5 mm SAINT-GOBAIN C1100F BLACK-ANODIZED NOTES: 1) 2) 3) 4) 5) Dimension C = heat sink height from bottom of the base to the top of the fin field. ATS-59002-C1-R0 is a subsitute item available utilizing an equivalent phase change material (Chomerics T766). Thermal performance data are provided for reference only. Actual performance may vary by application. ATS reserves the right to update or change its products without notice to improve the design or performance. Contact ATS to learn about custom options available. For more information, to find a distributor or to place an order, visit www.qats.com or call: 781.769.2800 (North America); +31 (0) 3569 84715 (Europe). REV2_111108