ATS ATS-56013-C3-R0

High Performance ASIC Cooling
Solutions w/Thermal Tape Attachment
ATS PART # ATS-56013-C3-R0
Features & Benefits
»
D
maxiFLOWâ„¢ design features a low profile, spread fin
array that maximizes surface area for more effective
convection (air) cooling
»
Designed specifically for ASIC package and their unique
cooling requirements
»
Comes preassembled with high performance thermal
interface material
C
B
Thermal Performance
A
*Image above is for illustration purposes only.
Air Velocity
Thermal Resistance
FT/MIN
M/S
°C/W (UNDUCTED FLOW)
°C/W (DUCTED FLOW)
200
1.0
2.2
1.2
300
1.5
1.8
400
2.0
1.4
500
2.5
1.2
600
3.0
1.1
700
3.5
0.96
800
4.0
0.87
Product Details
DIMENSION A
DIMENSION B
DIMENSION C
DIMENSION D
INTERFACE MATERIAL
FINISH
42 mm
42 mm
16 mm
77 mm
Saint-gobain C675
GOLD-ANODIZED
Notes:
1)
2)
3)
4)
Dimension C = heat sink height from bottom of the base to the top of the fin field.
Thermal performance data are provided for reference only. Actual performance may vary
by application.
ATS reserves the right to update or change its products without notice to improve the
design or performance.
Contact ATS to learn about custom options available.
For more information, to find a distributor or to place an order, visit www.qats.com or
call: 781.769.2800 (North America); +31 (0) 3569 84715 (Europe).
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