ASMT-QTB0-0xxxx PLCC-4 Surface Mount Tricolor LED Data Sheet Description Features This family of SMT LEDs is packaged in the industry standard PLCC-4 package with additional heat sinking capability enabling it to be driven at even higher current. These SMT LEDs have high brightness and reliability performance and are designed to work under a wide range of environmental conditions. This high reliability feature makes them ideally suited to be used under exterior and interior full color signs application conditions. • Industry Standard PLCC-4 package (Plastic Leaded Chip Carrier) with additional heat sinking capability To facilitate easy pick & place assembly, the LEDs are packed in EIA-compliant tape and reel. Every reel will be shipped in single intensity and color bin; except red color to provide close uniformity. • JEDEC MSL 2a • High reliability LED package with silicone encapsulation • High brightness using AlInGaP and InGaN dice technologies • Wide viewing angle at 120º • Compatible with reflow soldering process Applications • Indoor and outdoor full color display These LEDs are compatible with reflow soldering process. This super wide viewing angle at 120° together with the built in reflector pushing up the intensity of the light output makes these LED suitable to be used in the interior electronics signs. The black top surface of the LED provides better contrast enhancement especially in the full color sign application. CAUTION: LEDs are Class 1C ESD sensitive. Please observe appropriate precautions during handling and processing. Please refer to Avago Application Note AN-1142 for additional details. Package Dimensions 2.00 ± 0.20 3.40 ± 0.20 2.50 ± 0.20 2.50 ± 0.20 0.15 ± 0.20 0.70 ± 0.20 0.97 ± 0.20 0.80 ± 0.10 1.34 ± 0.20 0.80 ± 0.20 Package Marking 1.76 ± 0.20 3.60 ± 0.20 0.5 ± 0.1 3.20 ± 0.20 2.90 Notes: 1. All Dimensions are in millimeters 2. Tolerance = ±0.2 mm unless otherwise specified 3. Terminal Finish: Ag plating Lead Configuration 1 Cathode Red 2 Common Anode 3 Cathode Blue 4 Cathode Green Circuit Diagram Figure 1. Package drawing. Table 1. Device Selection Guide Part Number ASMT-QTB0-0xxxx Color 1 Color 2 Color 3 AlInGaP Red InGaN Green InGaN Blue Color 1 - Red Min. Iv @20mA Part Number ASMT-QTB0-0AA02 Color 2 - Green Typ. Iv @20mA Min. Iv @ 20mA Color 3 - Blue Typ. Iv @ 20mA Min. Iv @ 20mA Typ. Iv @ 20mA Bin ID (mcd) (mcd) Bin ID (mcd) (mcd) Bin ID (mcd) (mcd) U1 450 620 V2 900 1200 S2 224 280 Notes: 1. The luminous intensity IV, is measured at the mechanical axis of the LED package. The actual peak of the spatial radiation pattern may not be aligned with this axis. 2. Tolerance = ± 12 % Part Numbering System A S M T –Q T B 0– X1 X2 X3 X4 X5 Packaging Option Color Bin Selection Intensity Bin Limit Intensity Bin Selection Device Specification Configuration Table 2. Absolute Maximum Ratings (TA = 25°C) Parameter Red Green & Blue Unit DC forward current [1] 50 30 mA Peak forward current [2] 100 100 mA Power dissipation 120 117 mW 4V [3] V 125 °C - 40 to + 110 [4] °C - 40 to + 110 °C Reverse voltage Maximum junction temperature Tj max Operating temperature range Storage temperature range Notes: 1. Derate linearly as shown in Figure 5a & 5b. 2 Duty Factor = 0.5%, Frequency = 500Hz 3. Driving the LED in reverse bias condition is suitable for short term only 4 Refer to Figure 5a and figure 5b for more information Table 3. Optical Characteristics (TA = 25°C) Dominant Wavelength, λd (nm) [1] Peak Wavelength, λp (nm) Viewing Angle 2θ½ [2] (Degrees) Luminous Efficacy ηV [3] (lm/W) Luminous Efficiency ηe (lm/W) Total Flux / Luminous Intensity [4] ΦV / IV (lm/cd) Color Min Typ. Max Typ. Typ. Typ. Typ. Typ. Red 618 621 628 629 120 200 43 2.70 Green 525 528 535 521 120 530 50 2.70 Blue 465 470 475 465 120 70 12 2.70 Notes: 1. The dominant wavelength is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 2. θ½ is the off axis angle where the luminous intensity is ½ the peak intensity 3. Radiant intensity, Ie in watts / steradian, may be calculated from the equation Ie = IV / ηV, where IV is the luminous intensity in candelas and ηV is the luminous efficacy in lumens / watt. 4. ΦV is the total luminous flux output as measured with an integrating sphere at mono pulse condition. Table 4. Electrical Characteristics (TA = 25°C) Forward Voltage, VF (V) [1] Reverse Voltage VR @ 100µA Reverse Voltage VR @ 10µA Thermal Resistance RθJ-P (°C/W) Color Min Typ. Max. Min. Min. Typ. Red 1.80 2.10 2.40 4 - 95 Green 2.80 3.20 3.90 - 4 70 Blue 2.80 3.20 3.90 - 4 60 InGaN Gree AlInGaP Red RELATIVE INTENSITY RELATIVE INTENSITY 1.0 1.0 0.8 0.8 0.6 InGaN Blue InGaN Gree InGaN Blue FORWARD CURRENT - mA - mA FORWARD CURRENT Note: 1. Tolerance ± 0.1V AlInGaP Red 0.6 0.4 0.4 0.2 0.2 0.0 380 430 480 530 580 630 680 730 780 WAVELENGTH - nm 380 430 480 530 580 630 680 730 780 WAVELENGTH - nm Figure 2. Relative intensity vs. wavelength 0.0 RELATIVE LUMINOUS INTENSITY (NORMALIZTION AT 20 mA) 3.00 2.50 AlInGaP 2.00 1.50 InGaN 1.00 0.50 0.00 0 10 20 30 40 DC FORWARD CURRENT - mA Figure 4. Relative Intensity vs. forward current 50 60 50 45 50 40 45 35 40 30 35 25 30 20 25 15 20 10 155 100 5 0 0 0 AlInGaP AlInGaP InGaN InGaN 1 2 3 FORWARD VOLTAGE - V 1 2 3 FORWARD VOLTAGE - V Figure 3. Forward current vs. forward voltage 4 4 AlInGaP 50 40 30 InGaN 20 10 0 0 60 MAX. ALLOWABLE DC CURRENT (mA) MAX. ALLOWABLE DC CURRENT (mA) 60 20 40 60 80 100 AMBIENT TEMPERATURE (°C) 40 30 InGaN 20 10 0 120 Figure 5a. Maximum forward current vs. ambient temperature. Derated based on TJMAX = 125°C.(3 chips) DOMINANT WAVELENGTH SHIFT (NORMALIZED AT 20mA) - nm NORMALIZED INTENSITY 1 -90 -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES 90 Figure 6. Radiation pattern. 120 7 6 5 4 Green 3 2 1 0 -1 0 -2 -3 Blue Red 10 20 30 40 50 0.30 Red Green Blue 1 -25 0 25 50 75 Figure 8. Relative Intensity Shift vs Junction Temperature 100 Green Red Blue 0.20 FORWARD VOLTAGE SHIFT - V NORMALIZED LUMINOUS INTENSITY 40 60 80 100 AMBIENT TEMPERATURE (°C) Figure 7. Dominant wavelength shift (normalized at 20mA) vs. forward current TJ - JUNCTION TEMPERATURE - °C 20 FORWARD CURRENT - mA 10 0.1 -50 0 Figure 5b. Maximum forward current vs. ambient temperature. Derated based on TJMAX = 125°C. (single chip) 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 AlInGaP 50 125 0.10 0.00 -0.10 -0.20 -0.30 -0.40 -50 -25 0 25 50 75 TJ - JUNCTION TEMPERATURE - °C Figure 9. Forward Voltage Shift vs Junction Temperature 100 125 0.8 (2) 0.80 x 4 0.90 x 4 (3) C A Package Marking 1.1 (1) A A C C 7. 0 1.2 x 2 0. 4 3.8 0. 4 (4) Solder Mask A C Anode 1.2 Cathode 0.75 x 2 7. 0 Figure 10. Recommended soldering land pattern. 20 SEC. MAX. 183°C 100-150°C -6°C/SEC. MAX. 3°C/SEC. MAX. 120 SEC. MAX. 60-150 SEC. TIME Figure 11. Recommended leaded reflow soldering profile TEMPERATURE TEMPERATURE 10 to 30 SEC. 240°C MAX. 3°C/SEC. MAX. 217°C 200°C 255 - 260 °C 3°C/SEC. MAX. 6°C/SEC. MAX. 150°C 3 °C/SEC. MAX. 100 SEC. MAX. 60 - 120 SEC. TIME Figure 12. Recommended Pb-free reflow soldering profile. Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN 1060 Surface Mounting SMT LED Indicator Components 2.00 ± 0.05 2.00 ± 0.05 8.00 ± 0.10 4.00 ±8.00 0.10± 0.10 1.50 1.50 + 0.10 - 0 + 0.10 - 0 1.75 ± 0.10 1.75 ± 0.10 5.50 ± 0.05 5.50 ± 0.05 2.20 ± 0.10 2.20 ± 0.10 4.00 ± 0.10 C 12.00 12.00 C +- 0.10 0.30 - 0.10 0.279 ± 0.10 0.279 ± 0.10 2.20 ± 0.10 2.20 ± 0.10 Figure 13. Carrier Tape Dimension 1.4 1.4 Label Area Label Area Figure 14. Reel Dimension USER FEED DIRECTION PIN 1 PRINTED LABEL Figure 15. Reeling Orientation C + 0.30 1.50 ± 0.25 1.50 ± 0.25 ∅ 180 ± 1 ∅ 180 ± 1 C ∅ 60.0 ± 0.5 ∅ 60.0 ± 0.5 13.4 ± 0.5 16.2 13.4 ± ± 0.5 0.5 16.2 ± 0.5 A A Intensity Bin Select (X2, X3) Intensity Bin Limits Individual reel will contain parts from 1 half bin only Bin ID Min Iv Bin (Minimum Intensity Bin) Min (mcd) Max (mcd) S2 224.0 285.0 X2 Red Green Blue T1 285.0 355.0 0 0 0 0 T2 355.0 450.0 A U1 V2 S2 U1 450.0 560.0 U2 560.0 715.0 V1 715.0 900.0 Number of Half bin from X2 X3 Red Green Blue V2 900.0 1125.0 0 0 0 0 W1 1125.0 1400.0 A 4 4 4 W2 1400.0 1800.0 X1 1800.0 2240.0 Note: 0 represents no maximum bin limit Tolerance of each bin limit ± 12% Color Bin Select (X4) Individual Reel will contain part from 1 full bin only Color Bin Combinations Color Bin Limits Red X4 Red Green Blue 0 Full distribution C&D B&C Min (nm) Max (nm) 618.0 628.0 Min (nm) Max (nm) C 525.0 530.0 D 530.0 535.0 Min (nm) Max (nm) B 465.0 470.0 C 470.0 475.0 Full distribution Green Blue Tolerance of each bin limit is ± 1 nm Packaging Option (X5) Option Test Current Package Type Reel Size 2 20mA Top mount 7 inch CIE 1931 - Chromaticity Diagram 0.90 0.80 C D 0.70 Green Y - COORDINATE 0.60 0.50 0.40 Red 0.30 0.20 Blue 0.10 0.00 C 0.00 0.10 B 0.20 0.30 0.40 0.50 X-COORDINATE 0.60 0.70 0.80 Handling Precaution B. Control after opening the MBB The encapsulation material of the product is made of silicone for better reliability of the product. As silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. These might damage the product and cause premature failure. During assembly of handling, the unit should be held on the body only. Please refer to Avago Application Note AN 5288 for detail information. • The humidity indicator card (HIC) shall be read immediately upon opening of MBB. Moisture Sensitivity • For any unuse LEDs, they need to be stored in sealed MBB with desiccant or desiccator at <5%RH. This product is qualified as Moisture Sensitive Level 2a per Jedec J-STD-020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305 Handling of Moisture Sensitive Surface Mount Devices for details. A. Storage before use • Unopen moisture barrier bag (MBB) can be stored at <40°C/90%RH for 12 months. If the actual shelf life has exceeded 12 months and the HIC indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. • It is not recommended to open the MBB prior to assembly (e.g. for IQC). For product information and a complete list of distributors, please go to our web site: • The LEDs must be kept at <30°C / 60%RH at all time and all high temperature related process including soldering, curing or rework need to be completed within 672 hours. C. Control for unfinished reel D. Control of assembled boards • If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB need to be stored in sealed MBB with desiccant or desiccator at <5%RH to ensure no LEDs have exceeded their floor life of 672 hours E. Baking is required if: • “10%” or “15%” HIC indicator turns pink • The LEDs are exposed to condition of >30°C / 60% RH at any time. • The Led floor life exceeded 672hrs. Recommended baking condition: 60±5ºC for 20hrs www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright © 2008 Avago Technologies Limited. All rights reserved. AV02-1033EN - March 10, 2008