TI V62/04677-01XE

SCBS772 − NOVEMBER 2003
D Controlled Baseline
D
D
D
D
D
D
D
D Bus Hold on Data Inputs Eliminates the
− One Assembly/Test Site, One Fabrication
Site
Enhanced Diminishing Manufacturing
Sources (DMS) Support
Enhanced Product-Change Notification
Qualification Pedigree†
Supports Mixed-Mode Signal Operation
(5-V Input and Output Voltages With
3.3-V VCC )
Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
Supports Unregulated Battery Operation
Down to 2.7 V
Ioff and Power-Up 3-State Support Hot
Insertion
D
D
Need for External Pullup/Pulldown
Resistors
Latch-Up Performance Exceeds 500 mA Per
JESD 17
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
PW PACKAGE
(TOP VIEW)
LEBA
OEBA
A1
A2
A3
A4
A5
A6
A7
A8
CEAB
GND
† Component qualification in accordance with JEDEC and industry
standards to ensure reliable operation over an extended
temperature range. This includes, but is not limited to, Highly
Accelerated Stress Test (HAST) or biased 85/85, temperature
cycle, autoclave or unbiased HAST, electromigration, bond
intermetallic life, and mold compound life. Such qualification
testing should not be viewed as justifying use of this component
beyond specified performance and environmental limits.
1
24
2
23
3
22
4
21
5
20
6
19
7
18
8
17
9
16
10
15
11
14
12
13
VCC
CEBA
B1
B2
B3
B4
B5
B6
B7
B8
LEAB
OEAB
description/ordering information
This octal transceiver is designed specifically for low-voltage (3.3-V) VCC operation, but with the capability to
provide a TTL interface to a 5-V system environment.
The SN74LVTH543 contains two sets of D-type latches for temporary storage of data flowing in either direction.
Separate latch-enable (LEAB or LEBA) and output-enable (OEAB or OEBA) inputs are provided for each
register, to permit independent control in either direction of data flow.
The A-to-B enable (CEAB) input must be low to enter data from A or to output data from B. If CEAB is low and
LEAB is low, the A-to-B latches are transparent; a subsequent low-to-high transition of LEAB puts the A latches
in the storage mode. With CEAB and OEAB both low, the 3-state B outputs are active and reflect the data present
at the output of the A latches. Data flow from B to A is similar, but requires using the CEBA, LEBA, and OEBA
inputs.
Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors
with the bus-hold circuitry is not recommended.
ORDERING INFORMATION
TA
PACKAGE‡
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
−40°C to 85°C
TSSOP − PW
Tape and reel
SN74LVTH543IPWREP
LH543EP
‡ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2003, Texas Instruments Incorporated
! " #$%! " &$'(#! )!%
)$#!" # ! "&%##!" &% !*% !%" %+" "!$%!"
"!)) ,!- )$#! &#%"". )%" ! %#%""(- #($)%
!%"!. (( &%!%"
POST OFFICE BOX 655303
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1
SCBS772 − NOVEMBER 2003
description/ordering information (continued)
When VCC is between 0 and 1.5 V, the device is in the high-impedance state during power up or power down.
However, to ensure the high-impedance state above 1.5 V, OE should be tied to VCC through a pullup resistor;
the minimum value of the resistor is determined by the current-sinking capability of the driver.
This device is fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry
disables the outputs, preventing damaging current backflow through the device when it is powered down. The
power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down,
which prevents driver conflict.
FUNCTION TABLE†
INPUTS
OEAB
A
OUTPUT
B
X
X
X
Z
X
H
X
Z
L
H
L
X
L
L
L
L
B0‡
L
L
L
L
H
CEAB
LEAB
H
X
H
† A-to-B data flow is shown; B-to-A flow control is the
same, except that it uses CEBA, LEBA, and
OEBA.
‡ Output level before the indicated steady-state
input conditions were established
logic diagram (positive logic)
OEBA
CEBA
LEBA
OEAB
CEAB
LEAB
A1
2
23
1
13
11
14
C1
3
1D
C1
1D
To Seven Other Channels
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
22
B1
SCBS772 − NOVEMBER 2003
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range applied to any output in the high-impedance
or power-off state, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range applied to any output in the high state, VO (see Note 1) . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Current into any output in the low state, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
Current into any output in the high state, IO (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 mA
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Package thermal impedance, θJA (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. This current flows only when the output is in the high state and VO > VCC.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 4)
MIN
MAX
2.7
3.6
UNIT
VCC
VIH
Supply voltage
VIL
VI
Low-level input voltage
0.8
V
Input voltage
5.5
V
IOH
IOL
High-level output current
−32
mA
Low-level output current
64
mA
∆t /∆v
Input transition rise or fall rate
10
ns/V
∆t/∆VCC
TA
Power-up ramp rate
200
Operating free-air temperature
−40
High-level input voltage
2
Outputs enabled
V
V
µs/V
85
°C
NOTE 4: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SCBS772 − NOVEMBER 2003
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP†
MAX
UNIT
−1.2
V
VIK
VCC = 2.7 V,
VCC = 2.7 V to 3.6 V,
II = −18 mA
IOH = −100 µA
VOH
VCC = 2.7 V,
VCC = 3 V,
IOH = −8 mA
IOH = −32 mA
IOL = 100 µA
IOL = 24 mA
0.2
VCC = 2.7 V
IOL = 16 mA
IOL = 32 mA
0.4
VOL
VCC = 3 V
Control inputs
Ioff
II(hold)
A or B ports
V
2
0.5
VCC = 3.6 V,
VCC = 0 or 3.6 V,
0.55
±1
VI = 5.5 V
VI = 5.5 V
10
VCC = 3.6 V
VI = VCC
VI = 0
1
VCC = 0,
VI or VO = 0 to 4.5 V
VI = 0.8 V
VCC = 3 V
VI = 2 V
VI = 0 to 3.6 V
VCC = 3.6 V§
IOZPU
IOZPD
VCC = 0 to 1.5 V, VO = 0.5 to 3 V, OE = don’t care
VCC = 1.5 V to 0, VO = 0.5 to 3 V, OE = don’t care
ICC
VCC = 3.6 V, IO = 0, VI = VCC or GND
20
µA
±500
VI = 3 V or 0
VO = 3 V or 0
Cio
±100
µA
±100
µA
0.19
5
Outputs disabled
Ci
µA
75
−75
Outputs low
VCC = 3 V to 3.6 V, One input at VCC − 0.6 V, Other inputs at VCC or GND
µA
−5
±100
Outputs high
∆ICC¶
V
0.5
IOL = 64 mA
VI = VCC or GND
II
A or B ports‡
VCC−0.2
2.4
mA
0.19
0.2
4
pF
pF
† All typical values are at VCC = 3.3 V, TA = 25°C.
‡ Unused terminals are at VCC or GND.
§ This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to another.
¶ This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
4
9
mA
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SCBS772 − NOVEMBER 2003
timing requirements over recommended operating free-air temperature range (unless otherwise
noted) (see Figure 1)
VCC = 3.3 V
± 0.3 V
MIN
tw
tsu
th
Pulse duration,
LEAB or LEBA low
MAX
VCC = 2.7 V
MIN
3.3
3.3
0.4
0.4
1
1.5
A or B before
LEAB or LEBA↑
Data high
A or B before
CEAB or CEBA↑
Data high
0.2
0.2
Data low
0.7
1.2
A or B after
LEAB or LEBA↑
Data high
1.5
0.6
Data low
1.3
1.5
A or B after
CEAB or CEBA↑
Data high
1.6
0.5
Data low
1.4
1.6
Setup time
Hold time
Data low
UNIT
MAX
ns
ns
ns
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
A or B
B or A
tPLH
tPHL
LE
A or B
tPZH
tPZL
OE
A or B
tPHZ
tPLZ
OE
A or B
tPZH
tPZL
CE
A or B
tPHZ
tPLZ
CE
A or B
PARAMETER
VCC = 3.3 V
± 0.3 V
VCC = 2.7 V
MIN
TYP†
MAX
1.3
2.5
3.7
4.3
1.3
2.5
3.7
4.3
1.3
2.9
4.7
5.9
1.3
2.9
4.7
5.9
1.1
2.9
4.9
6.2
1.1
3.2
4.9
6.2
2
3.4
5.3
5.9
2
3.7
5.3
5.9
1.3
3.2
5.3
6.8
1.3
3.5
5.3
6.8
2.3
3.8
5.4
5.9
2.3
3.9
5.4
5.6
MIN
UNIT
MAX
ns
ns
ns
ns
ns
ns
† All typical values are at VCC = 3.3 V, TA = 25°C.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
SCBS772 − NOVEMBER 2003
PARAMETER MEASUREMENT INFORMATION
6V
S1
500 Ω
From Output
Under Test
Open
GND
CL = 50 pF
(see Note A)
500 Ω
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
6V
GND
2.7 V
LOAD CIRCUIT
1.5 V
Timing Input
0V
tw
tsu
2.7 V
Input
1.5 V
1.5 V
th
2.7 V
1.5 V
Data Input
1.5 V
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
2.7 V
1.5 V
Input
1.5 V
0V
tPHL
tPLH
VOH
1.5 V
Output
1.5 V
VOL
VOH
Output
1.5 V
Output
Waveform 1
S1 at 6 V
(see Note B)
1.5 V
1.5 V
VOL
1.5 V
0V
tPLZ
tPZL
3V
1.5 V
Output
Waveform 2
S1 at GND
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOL + 0.3 V
VOL
tPHZ
tPZH
tPLH
tPHL
2.7 V
Output
Control
1.5 V
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
E. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74LVTH543IPWREP
ACTIVE
TSSOP
PW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
V62/04677-01XE
ACTIVE
TSSOP
PW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74LVTH543-EP :
• Catalog: SN74LVTH543
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jul-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
SN74LVTH543IPWREP
Package Package Pins
Type Drawing
TSSOP
PW
24
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
2000
330.0
16.4
Pack Materials-Page 1
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
6.95
8.3
1.6
8.0
W
Pin1
(mm) Quadrant
16.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jul-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74LVTH543IPWREP
TSSOP
PW
24
2000
346.0
346.0
33.0
Pack Materials-Page 2
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