PHOTOCOUPLER PS2521-1,PS2521L-1 LARGE FORWARD INPUT TYPE HIGH ISOLATION VOLTAGE MULTI PHOTOCOUPLER SERIES −NEPOC Series− DESCRIPTION The PS2521-1 and PS2521L-1 are optically coupled isolators containing a GaAs light emitting diode and an NPN silicon phototransistor. The PS2521-1 is in a plastic DIP (Dual In-line Package) and the PS2521L-1 is lead bending type (Gull-wing) for surface mount. FEATURES • Large forward input current (IF = 150 mA) • High Isolation voltage (BV = 5 000 Vr.m.s.) • High collector to emitter voltage (VCEO = 80 V) • High-speed switching (tr = 3 µs TYP., tf = 5 µs TYP.) • Ordering number of tape product: PS2521L-1-E3, E4, F3, F4 • Safety standards • UL approved: File No. E72422 • CSA approved: No. CA 101391 APPLICATIONS • Exchange equipment • FAX/MODEM • LCR adapter Document No. PN10230EJ02V0DS (2nd edition) Date Published March 2006 CP(K) The mark shows major revised points. © NEC Compound Semiconductor Devices, Ltd. 1993, 2006 PS2521-1,PS2521L-1 PACKAGE DIMENSIONS (Unit : mm) DIP Type PS2521-1 4.6±0.5 3 6.5±0.5 1. Anode 2. Cathode 3. Emitter 4. Collector 1 2 7.62 3.5±0.3 3.3±0.5 4.15±0.4 TOP VIEW 4 0 to 15˚ +0.1 0.25 –0.05 1.25±0.15 0.50±0.10 0.25 M 2.54 Lead Bending Type PS2521L-1 TOP VIEW 4.6±0.5 4 6.5±0.5 1. Anode 2. Cathode 3. Emitter 4. Collector 2 0.1 +0.1 –0.05 3.5±0.3 0.25 +0.1 –0.05 1 0.9±0.25 9.60±0.4 1.25±0.15 0.25 M 2.54 2 3 0.15 Data Sheet PN10230EJ02V0DS PS2521-1,PS2521L-1 MARKING EXAMPLE No. 1 pin Mark 2521 NL601 N L Assembly Lot 6 01 Week Assembled Year Assembled (Last 1 Digit) In-house Code CTR Rank Code Package Standard PKG Made in Japan Made in Taiwan L New PKG Data Sheet PN10230EJ02V0DS 3 PS2521-1,PS2521L-1 ORDERING INFORMATION Part Number Order Number Solder Plating Packing Style Safety Standard Application Part Approval Number Specification PS2521-1 PS2521-1-A PS2521L-1 PS2521L-1-A PS2521L-1-E3 PS2521L-1-E3-A PS2521L-1-E4 PS2521L-1-E4-A PS2521L-1-F3 PS2521L-1-F3-A PS2521L-1-F4 PS2521L-1-F4-A Pb-Free Magazine case 100 pcs Standard products (UL, CSA Approved) Embossed Tape 1 000 pcs/reel Embossed Tape 2 000 pcs/reel *1 For the application of the Safety Standard, following part number should be used. ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified) Parameter Symbol Ratings Unit Forward Current (DC) IF 150 mA Reverse Voltage VR 6.0 V ∆PD/°C 2.5 mW/°C PD 250 mW IFP 1 A Collector to Emitter Voltage VCEO 80 V Emitter to Collector Voltage VECO 6 V IC 50 mA ∆PC/°C 1.5 mW/°C PC 150 mW BV 5 000 Vr.m.s. Operating Ambient Temperature TA −55 to +100 °C Storage Temperature Tstg −55 to +150 °C Diode Power Dissipation Derating Power Dissipation Peak Forward Current Transistor *1 Collector Current Power Dissipation Derating Power Dissipation Isolation Voltage *2 *1 PW = 100 µs, Duty Cycle = 1% *2 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output Pins 1-2 shorted together, 3-4 shorted together. 4 Data Sheet PN10230EJ02V0DS *1 PS2521-1 PS2521-1,PS2521L-1 ELECTRICAL CHARACTERISTICS (TA = 25°C) Parameter Diode Symbol Conditions Forward Voltage VF IF = 100 mA Reverse Current IR VR = 5 V Terminal Capacitance Ct V = 0 V, f = 1.0 MHz Transistor Collector to Emitter Dark Current ICEO VCE = 80 V, IF = 0 mA Coupled Current Transfer Ratio CTR IF = 100 mA, VCE = 3 V Collector Saturation Voltage VCE(sat) IF = 100 mA, IC = 4 mA Isolation Resistance RI-O VI-O = 1.0 kVDC Isolation Capacitance CI-O V = 0 V, f = 1.0 MHz MIN. TYP. MAX. Unit 1.3 1.7 V 5 µA 70 20 pF 100 nA 80 % 0.3 V (IC/IF) Rise Time Fall Time *1 tr *1 VCC = 10 V, IC = 2 mA, RL = 100 Ω tf 10 Ω 11 0.6 pF 3 µs 5 *1 Test circuit for switching time Pulse input VCC (PW = 100 µ s, Duty cycle = 1/10) IF 50 Ω VOUT RL = 100 Ω Data Sheet PN10230EJ02V0DS 5 PS2521-1,PS2521L-1 TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise specified) TRANSISTOR POWER DISSIPATION vs. AMBIENT TEMPERATURE DIODE POWER DISSIPATION vs. AMBIENT TEMPERATURE Transistor Power Dissipation PC (mW) Diode Power Dissipation PD (mW) 250 200 150 2.5 mW/˚C 100 50 25 0 50 75 100 125 150 100 1.5 mW/˚C 50 0 25 50 75 100 125 Ambient Temperature TA (˚C) Ambient Temperature TA (˚C) FORWARD CURRENT vs. FORWARD VOLTAGE COLLECTOR CURRENT vs. COLLECTOR TO EMITTER VOLTAGE 70 10 TA = +100 ˚C +75 ˚C +50 ˚C 60 Collector Current IC (mA) Forward Current IF (mA) 100 +25 ˚C 0 ˚C –25 ˚C –55 ˚C 1 0.1 50 40 30 A 0m A 5 = 0m IF 2 mA 10 5 mA 20 10 0.6 0.8 1.0 1.2 1.4 1.6 0 4 6 8 10 Collector to Emitter Voltage VCE (V) COLLECTOR TO EMITTER DARK CURRENT vs. AMBIENT TEMPERATURE COLLECTOR CURRENT vs. COLLECTOR SATURATION VOLTAGE 50 10 000 IF = 50 mA 1 000 100 VCE = 80 V 40 V 24 V 10 10 V 5V 1 0.1 –60 –40 –20 0 20 40 60 80 100 20 mA 10 mA 10 5 5 mA 2 mA 1 mA 1 0.5 0.1 0.05 0.01 0.0 0.2 0.4 0.6 0.8 Collector Saturation Voltage VCE (sat) (V) Ambient Temperature TA (˚C) Remark The graphs indicate nominal characteristics. 6 2 Forward Voltage VF (V) Collector Current IC (mA) Collector to Emitter Dark Current ICEO (nA) 0.01 0.4 Data Sheet PN10230EJ02V0DS 1.0 PS2521-1,PS2521L-1 CURRENT TRANSFER RATIO vs. FORWARD CURRENT ;;;;;;;;;;;;;;;; ;;;;;;;;;;;;;;;; ;;;;;;;;;;;;;;;; ;;;;;;;;;;;;;;;; ;;;;;;;;;;;;;;;; ;;;;;;;;;;;;;;;; 1.4 1.0 0.8 0.6 0.4 Normalized to 1.0 at TA = 25 ˚C, IF = 100 mA, VCE = 3 V 100 25 50 75 0.2 0.0 –50 –25 0 VCE = 3 V 200 Sample A B C 150 100 50 0 0.1 0.5 5 50 100 10 Forward Current IF (mA) SWITCHING TIME vs. LOAD RESISTANCE FREQUENCY RESPONSE VCC = 10 V, IC = 2 mA 50 ton toff 10 tf tr 5 0 –3 –6 –9 RL = 100 Ω 1 kΩ 50 Ω 100 200 500 2k 1k 100 RL Load Resistance RL (Ω) 500 1 k 500 Ω VCC = 5 V 330 µF –12 1 50 1 Ambient Temperature TA (˚C) 100 Switching Time t ( µ s) Current Transfer Ratio CTR (%) 1.2 250 Normalized Gain GV Normalized Current Transfer Ratio CTR NORMALIZED CURRENT TRANSFER RATIO vs. AMBIENT TEMPERATURE IC = 2 mA 5 k 10 k 50 k 100 k 500 k Frequency f (Hz) LONG TERM CTR DEGRADATION CTR (Relative Value) 1.2 1.0 IF = 5 mA 0.8 20 mA 0.6 40 mA 0.4 0.2 0.0 CTR Test condition IF = 5 mA, VCE = 5 V 1 102 103 104 105 106 Time (Hr) Remark The graphs indicate nominal characteristics. Data Sheet PN10230EJ02V0DS 7 PS2521-1,PS2521L-1 TAPING SPECIFICATIONS (Unit : mm) 1.55±0.1 4.5 MAX. 10.3±0.1 7.5±0.1 φ 1.5 +0.1 –0 16.0±0.3 2.0±0.1 4.0±0.1 1.75±0.1 Outline and Dimensions (Tape) 4.0±0.1 5.3±0.1 8.0±0.1 0.4 Tape Direction PS2521L-1-E3 PS2521L-1-E4 Outline and Dimensions (Reel) 2.0±0.5 φ 21.0±0.8 φ 80.0±1.0 R 1.0 φ 254±2.0 2.0±0.5 φ 13.0±0.2 17.5±1.0 21.5±1.0 Packing: 1 000 pcs/reel 8 Data Sheet PN10230EJ02V0DS 15.9 to 19.4 Outer edge of flange PS2521-1,PS2521L-1 1.55±0.1 4.5 MAX. 10.3±0.1 7.5±0.1 1.5 +0.1 –0 16.0±0.3 2.0±0.1 4.0±0.1 1.75±0.1 Outline and Dimensions (Tape) 4.0±0.1 5.3±0.1 8.0±0.1 0.4 Tape Direction PS2521L-1-F3 PS2521L-1-F4 Outline and Dimensions (Reel) 2.0±0.5 φ 21.0±0.8 φ 100±1.0 R 1.0 φ 330±2.0 2.0±0.5 φ 13.0±0.2 17.5±1.0 21.5±1.0 Packing: 2 000 pcs/reel Data Sheet PN10230EJ02V0DS 15.9 to 19.4 Outer edge of flange 9 PS2521-1,PS2521L-1 NOTES ON HANDLING 1. Recommended soldering conditions (1) Infrared reflow soldering • Peak reflow temperature 260°C or below (package surface temperature) • Time of peak reflow temperature 10 seconds or less • Time of temperature higher than 220°C 60 seconds or less • Time to preheat temperature from 120 to 180°C 120±30 s • Number of reflows Three • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) Package Surface Temperature T (˚C) Recommended Temperature Profile of Infrared Reflow (heating) to 10 s 260˚C MAX. 220˚C to 60 s 180˚C 120˚C 120±30 s (preheating) Time (s) (2) Wave soldering • Temperature 260°C or below (molten solder temperature) • Time 10 seconds or less • Preheating conditions 120°C or below (package surface temperature) • Number of times One (Allowed to be dipped in solder including plastic mold portion.) • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (3) Soldering by soldering iron • Peak temperature (lead part temperature) 350°C or below • Time (each pins) 3 seconds or less • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead. (b) Please be sure that the temperature of the package would not be heated over 100°C. 10 Data Sheet PN10230EJ02V0DS PS2521-1,PS2521L-1 (4) Cautions • Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. 2. Cautions regarding noise Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between collector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute maximum ratings. 3. Measurement conditions of current transfer ratios (CTR), which differ according to photocoupler Check the setting values before use, since the forward current conditions at CTR measurement differ according to product. When using products other than at the specified forward current, the characteristics curves may differ from the standard curves due to CTR value variations or the like. Therefore, check the characteristics under the actual operating conditions and thoroughly take variations or the like into consideration before use. USAGE CAUTIONS 1. Protect against static electricity when handling. 2. Avoid storage at a high temperature and high humidity. Data Sheet PN10230EJ02V0DS 11 PS2521-1,PS2521L-1 When the product(s) listed in this document is subject to any applicable import or export control laws and regulation of the authority having competent jurisdiction, such product(s) shall not be imported or exported without obtaining the import or export license. • The information in this document is current as of March, 2006. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. 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Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. • Do not burn, destroy, cut, crush, or chemically dissolve the product. • Do not lick the product or in any way allow it to enter the mouth. 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