TYPE SMV0805M□□□KRR MODEL CITATION Structure SUBJECT PAGE DATE Feb. 03, 2009 REV. C01 1. STRUCTURE NO. ITEM 1.1 Main Material 1.2 End termination 1.3 Packaging 1.4 Complies with Standard 1.5 1.6 1.7 1.8 DESCRIPTION Zinc Oxide Ag/Ni/Sn Reel IEC61000-4-5 Complies with RoHS Yes Standard Lead content < 1000ppm Reflow solder profile 250 ℃ temperature (Recommend) Dimensions 1/9 L 2.00 ± 0.20 W 1.25 ± 0.15 T(max.) 1.20 a 0.3 ±0.1 SMV0805M□□□KRR TYPE CITATION SUBJECT Electrical Characteristics MODEL PAGE DATE Feb. 03, 2009 REV. C01 2. ELECTRICAL CHARACTERISTICS N0. ITEM 2.0 Standard Conditions 2.1 Maximum Allowable Voltage AC : *(1) Vrms DC : *(1) V Varistor Voltage Varistor Voltage Temperature Coefficient Max. Clamping Voltage V0.1mA : *(1) V 2.2 2.3 2.4 PERFORMANCE TEST METHODS Unless otherwise specified, all tests are made under environmental conditions as given below: Temperature: 5~35°C Relative humidity: 45~85 % RH Maximum continuous sine wave(RMS) or DC voltage which may be applied. Voltage across the varistor measured at CmA DC. 0 ~ −0.05 %/°C *(1) V at 1 A Withstanding Surge 2.5 Current *(1) A 2.6 Energy *(1) Joule 2.7 Response time Trise < 1 nS 2.8 Leakage current 2.9 Capacitance I Vv I Vv <50μΑ <200μA *(1) pF. Peak voltage across the varistor with a specified peak impulse current of 8x20μs waveform. The max. current within the varistor voltage change of less than ±10% when one impulse current (8x20μs) applied. The max. energy absorbed with a varistor voltage change of less than ±10% when one impulse (10x1000μs) is applied. at V1mA×80% at V1mA×80% (After Reliability Test) Capacitance shall be measured at 1 kHz±10%,1 Vrms max.(1 MHz below 100 pF) 0V bias and 20±2℃ *(1) See table 2.1 Electrical Characteristics 2/9 TYPE SMV0805M□□□KRR MODEL CITATION SUBJECT Electrical Characteristics Table 2.1 Electrical Characteristics Maximum Part Varistor Allowable Number Voltage Voltage Max. Clamping Voltage PAGE 3/9 DATE Feb. 03, 2009 REV. C01 Withstanding Surge Current Energy Capacitance Symbol AC DC V（1mA） V(＊ 2) A(＊ 3) J PF(＊ 1)(kHz) 0805M080KRR 4 5.5 8( 7.5~10.5 ) ＜20 80 ＞0.1 1400 0805M120KRR 6 9 12( 10.2~13.8 ) ＜20 80 ＞0.1 650 0805M180KRR 11 14 18( 15.3~20.7 ) ＜30 100 ＞0.1 350 0805M240KRR 14 18 24( 21.6~26.4 ) ＜39 100 ＞0.2 300 0805M270KRR 17 22 27( 24.3~29.7 ) ＜44 100 ＞0.2 250 0805M330KRR 20 26 33( 29.7~36.3 ) ＜54 100 ＞0.3 220 0805M390KRR 25 30 39( 35.1~42.9 ) ＜65 100 ＞0.3 200 0805M470KRR 30 38 47( 42.3~51.7 ) ＜77 100 ＞0.3 150 0805M560KRR 35 45 56( 50.4~61.6 ) ＜90 80 ＞0.3 110 SMV0805M□□□KRR TYPE MODEL CITATION SUBJECT Reliability PAGE 4/9 DATE Feb. 03, 2009 REV. C01 3. ENVIRONMENTAL CHARACTERISTICS No. Test method and description Characteristic The specimen shall be subjected to 150 ± 2℃ for 1000 ± 12 hours in a thermostatic bath 3.1 High Temperature Storage without load and then stored at room temperature and humidity for 1 to 2 hours. The change of varistor voltage shall be within 10﹪. The temperature cycle of specified Step Temperature Period 1 -40±3℃ 30Min±3 2 Room Temperature 1~2 hours change of varistor voltage shall be within 3 125±2℃ 30Min±3 10﹪and mechanical damage shall be 4 Room Temperature 1~2 hours temperature shall be repeated five times and then stored at room temperature and 3.2 Temperature Cycle humidity for one or two hours. The 3.3 High Temperature Load After being continuously applied the maximum allowable voltage at 85 ± 2℃ For 1000± 2 hours, the specimen shall be stored at room temperature and humidity for one or two hours, the change of varistor voltage shall be within 10﹪. The specimen should be subjected to 40 ± 2℃, 90 to 95%RH environment, and the 3.4 Damp Heat Load/ Humidity Load maximum allowable voltage applied for 1000 hours, then stored at room temperature and humidity for one or two hours. The change of varistor voltage shall be within 10%. The specimen should be subjected to -40 ± 2℃, without load for 500 hours and then 3.5 Low Temperature Storage stored at room temperature for one or two hours. The change of varistor voltage shall be within 10﹪ 4. TECHNICAL TERM No. 4.1 4.2 4.3 Item Operating Temperature Range Storage Temperature Range Transient Response Time Specifications -40℃ to +85℃ -40℃ to +125℃ < 50 ns Description Operating temperature range without derating. Storage temperature range without voltage applied. Time lag between application of surge and varistor's "turn-on" conduction action. SMV0805M□□□KRR TYPE MODEL CITATION Soldering SUBJECT PAGE DATE Feb. 03, 2009 REV. C01 5. SOLDERING RECOMMENDATIONS 5.1 Recommended solder pad layout A B C D 1.0~1.5 2.6~3.2 1.2~1.5 1.1~1.8 （Unit：mm） 5.2 The SIR test of the solder paste shall be done（Based on JIS-Z-3284） 5.3 Steel plate and foot distance printing Foot distance printing (mm) Steel Plate thickness (mm) > 0.65mm 0.18mm 0.65mm~0.5mm 0.15mm 0.50mm~0.40mm 0.12mm <=0.40 mm 0.10mm 5.4 IR Soldering Rapid heating, partial heating or rapid cooling will easily cause defect of the component. So preheating and gradual cooling process is suggested. IR soldering has the highest yields due to controlled heating rates and solder liquids times. Make sure that the element is not 2.4 The IR reflow and temperature of Soldering for Pb Free subjected to a thermal gradient steeper than 4 degrees per second. 2 degrees per second is the ideal gradient. During the soldering process, pre- heating to within 100 degrees of the solders peak temperature is essential to minimize thermal shock. 5/9 TYPE SMV0805M□□□KRR MODEL CITATION SUBJECT Soldering PAGE 6/9 DATE Feb. 03, 2009 REV. C01 ☆ IR reflow Pb Free Process suggestion profile (1) The solder recommend is Sn96.5/Ag 3.5 of 120 to 150μm (2) Ramp-up rate (217℃ to Peak) + 3℃/second max (3) Temp. maintain at 175 +/-25℃ 180 seconds max (4) Temp. maintain above 217 ℃ 60-150 seconds (5) Peak temperature range 245℃ +20℃/ -10 ℃ time within 5 ℃of actually peak temperature (tp) 10~20 seconds (6) Ramp down rate +6 ℃/second max. ※Perform adequate test in advance as the reflow temperature profile will vary according to the conditions of the manufacturing process, and the specification of the reflow furnace. 5.5 Resistance to soldering heat-High Temperature Resistance:260℃,10sec-3times. 5.6 Hand Soldering In hand soldering of the Varistors. Large temperature gradient between preheated the Varistors and the tip of soldering iron may cause electrical failures and mechanical damages such as crackings or breakings of the devices. The soldering shall be carefully controlled and carried out so that the temperature gradient is kept minimum with following recommended conditions for hand soldering. 5.6.1 Recommended Soldering Condition 1 （1） Solder ： 0.12~0.18mm Thread solder (Sn96.5:Ag3.5) with soldering flux in the core. Rosin-based and non-activated flux is recommended. （2） Preheating The Varistors shall be preheated so that Temperature Gradient between the devices and the tip of soldering iron is 150℃ or below. TYPE SMV0805M□□□KRR MODEL CITATION SUBJECT Soldering PAGE 7/9 DATE Feb. 03, 2009 REV. C01 （3）Soldering Iron Rated Power of 20w max with 3mm soldering tip in diameter. Temperature of soldering iron tip 380℃max,3-5sec ( The required amount of solder shall be melted in advance on the soldering tip.) （4）Cooling After soldering. The Varistors shall be cooled gradually at room ambient temperature. 5.6.2 Recommended Soldering Condition 2（Without preheating） （1）Solder iron tip shall not directly touch to ceramic dielectrics. （2）Solder iron tip shall be fully preheated before soldering while soldering iron tip to the external electrode of Varistors. 5.7 Post Soldering Cleaning 5.7.1 Residues of corrosive soldering fluxes on the PC board after cleaning may greatly have influences on the electrical characteristic and the reliability (such as humidity resistance)of the Varistors which have been mounted on the board. It shall be confirmed that the characteristic and the reliability of the devices are not affected by the applied cleaning conditions. 5.7.2. When an ultrasonic cleaning is applied to the mounted Varistors on PC Boards. Following conditions are recommended for preventing failures or damages of the devices due to the large vibration energy and the resonance caused by the ultrasonic waves. （1）Frequency 29MHz max （2）Radiated Power 20w/lithr max （3）Period 5minuets max SMV0805M□□□KRR TYPE MODEL CITATION Packaging Specification SUBJECT PAGE 8/9 DATE Feb. 03, 2009 REV. C01 6. PACKAGING SPECIFICATION 6.1 Carrier tape and transparent cover tape should be heat-sealed to carry the products, and the reel should be used to reel the carrier tape. 6.2 The adhesion of the heat-sealed cover tape shall be 40 +20/ -15grams. 6.3 Both the head and the end portion of the taping shall be empty for reel package and SMT auto-pickup machine. And a normal paper tape shall be connected in the head of taping for the operator to handle K0 A0 B0 Symbol ±0.10 ±0.10 ±0.10 mm 1.42 2.30 1.04 T ±0.05 0.22 D0 T2 +0.10 ±0.05 -0.00 1.26 1.50 D1 ±0.05 1.00 W E P1 P2 P0 ±0.10 ±0.05 ±0.05 ±0.20 ±0.10 4.00 2.00 4.00 8.00 1.75 F ±0.05 3.50 TYPE SMV0805M□□□KRR MODEL CITATION Reel Dimension SUBJECT PAGE DATE Feb. 03, 2009 REV. C01 7. REEL DIMENSION E C B D W1 W A Symbol A B C D E W W1 Unit(mm) 178±1 60±0.5 13±0.2 21±0.2 2.0±0.5 9.0±0.5 1.5±0.15 Standard packaging：1000 pcs/Reel. 9/9