TPS22912 www.ti.com SLVSB78 – APRIL 2012 Ultra-Small, Low on Resistance Load Switch with Controlled Turn-on Check for Samples: TPS22912 FEATURES DESCRIPTION • • The TPS22912 is a small, low rON load switch with controlled turn-on and contains a P-channel MOSFET that can operate over an input voltage range of 1.4 V to 5.5 V. The switch is controlled by a high input (ON), which is capable of interfacing directly with lowvoltage control signals. 1 • • • • • • • Integrated Single Load Switch Ultra Small CSP-4 Package 0.9mm × 0.9mm, 0.5mm Pitch Input Voltage Range: 1.4-V to 5.5-V Low ON-Resistance – rON = 60-mΩ at VIN = 5-V – rON = 61-mΩ at VIN = 3.3-V – rON = 74-mΩ at VIN = 1.8-V – rON = 84-mΩ at VIN = 1.5-V 2-A Maximum Continuous Switch Current Low Threshold Control Input Controlled Slew-rate Options Under-Voltage Lock Out Reverse Current Protection APPLICATIONS • • • • • • • Portable Industrial / Medical Equipment Portable Media Players Point of Sales Terminals GPS Navigation Devices Digital Cameras Portable Instrumentation Smartphones / Wireless Handsets The slew rate of the device is internally controlled in order to avoid inrush current. The TPS22912 family has various rise time options and is active high enable. (see Table 1). The TPS22912 provides circuit breaker functionality by latching off the power switch during reverse voltage situations. An internal reverse voltage comparator disables the power switch when the output voltage (VOUT) is higher than the input (VIN). This process quickly (10µs typical) stops the flow of current towards the input side of the switch. Reverse current protection is always active, even when the device is disabled. Additionally, under-voltage lockout (UVLO) protection turns the switch off if the input voltage is too low. The TPS22912 is available in a ultra-small, spacesaving 4-pin CSP package and is characterized for operation over the free-air temperature range of –40°C to 85°C. TYPICAL APPLICATION Power Supply VOUT VIN ON CIN CL ON RL OFF TPS22912 GND GND Table 1. Feature List QUICK OUTPUT DISCHARGE (1) MAXIMUM OUTPUT CURRENT ENABLE 61 mΩ 1 µs No 2-A Active High 61 mΩ 100 µs No 2-A Active High 61 mΩ 1000 µs No 2-A Active High 61 mΩ 4500 µs No 2-A Active High rON (typ) at 3.3 V TPS22912A (2) TPS22912B (2) TPS22912C TPS22912D (1) (2) RISE TIME at 3.3V (typ) DEVICE (2) This feature discharges the output of the switch to ground through a 150-Ω resistor, preventing the output from floating. Contact local sales/distributor or factory for availability. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2012, Texas Instruments Incorporated TPS22912 SLVSB78 – APRIL 2012 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION PACKAGE (1) TA (1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING/ STATUS (2) –40°C to 85°C YZV (0.5mm pitch) Tape and Reel TPS22912AYZVR Contact factory for availability –40°C to 85°C YZV (0.5mm pitch) Tape and Reel TPS22912BYZVR Contact factory for availability –40°C to 85°C YZV (0.5mm pitch) Tape and Reel TPS22912CYZVR _ _ _ _ 78 –40°C to 85°C YZV (0.5mm pitch) Tape and Reel TPS22912DYZVR Contact factory for availability Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Contact factory for details and availability for PREVIEW devices, minimum order quantities may apply. DEVICE INFORMATION YZV PACKAGE TERMINAL ASSIGNMENTS B ON GND A VIN VOUT 2 1 PIN FUNCTIONS TPS22912 YZV B1 2 PIN NAME GND B2 ON A1 VOUT A2 VIN DESCRIPTION Ground Switch control input, active high. Do not leave floating Switch output Switch input. Use ceramic capacitor to GND for bypass. Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s) :TPS22912 TPS22912 www.ti.com SLVSB78 – APRIL 2012 BLOCK DIAGRAM VIN Reverse Current Protection UVLO ON Control Logic GND VOUT Table 2. FUNCTION TABLE ON VIN to VOUT L OFF H ON ABSOLUTE MAXIMUM RATINGS VALUE UNIT VIN Input voltage range –0.3 to 6 V VOUT Output voltage range –0.3 to 6 V VON Input voltage range –0.3 to 6 V IMAX Maximum continuous switch current 2 A IPLS Maximum pulsed switch current, pulse ≤500 ms, 50% duty cycle 3 A TA Operating free-air temperature range –40 to 85 °C TJ Maximum junction temperature 125 °C TSTG Storage temperature range –65 to 150 °C TLEAD Maximum lead temperature (10-s soldering time) 300 °C ESD Electrostatic discharge protection Human-Body Model (HBM) (VIN, VOUT, GND pins) 2000 Charged-Device Model (CDM) (VIN, VOUT, ON, GND pins) 1000 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s) :TPS22912 V 3 TPS22912 SLVSB78 – APRIL 2012 www.ti.com THERMAL INFORMATION TPS22912 THERMAL METRIC (1) CSP UNITS 4 PINS θJA Junction-to-ambient thermal resistance θJCtop Junction-to-case (top) thermal resistance 1.9 θJB Junction-to-board thermal resistance 36.8 ψJT Junction-to-top characterization parameter 11.3 ψJB Junction-to-board characterization parameter 36.8 θJCbot Junction-to-case (bottom) thermal resistance N/A (1) 189.1 °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. RECOMMENDED OPERATING CONDITIONS VIN Input voltage range VON ON voltage range VOUT Output voltage range (Note: VOUT greater than VIN will cause the reverse current protection of this device to trigger. See application section.) VIH High-level input voltage, ON VIL Low-level input voltage, ON CIN Input Capacitor (1) 4 MIN MAX 1.4 5.5 V 0 5.5 V VIN UNIT (1) VIN = 3.61 V to 5.5 V 1.1 5.5 V VIN = 1.4 V to 3.6 V 1.1 5.5 V 0.6 V VIN = 3.61 V to 5.5 V VIN = 1.4 V to 3. 6V 0.4 1 (1) V µF Refer to the application section. Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s) :TPS22912 TPS22912 www.ti.com SLVSB78 – APRIL 2012 ELECTRICAL CHARACTERISTICS VIN = 1.4 V to 5.5 V, TA = –40ºC to 85ºC (unless otherwise noted) PARAMETER IIN Quiescent current IIN(off) (1) IIN(Leakage) Off supply current Leakage current TEST CONDITIONS TA MIN 2 10 IOUT = 0, VON = VIN = 4.2 V 2 7.0 IOUT = 0, VON = VIN = 3.6 V 2 7.0 IOUT = 0, VON = VIN = 2.5 V 0.9 5 IOUT = 0, VON = VIN = 1.5 V 0.7 5 RL = 1 MΩ, VIN = 5.25 V, VON = GND 1.2 10 RL = 1 MΩ, VIN = 4.2 V, VON = GND 0.2 7.0 RL = 1 MΩ, VIN = 3.6 V, VON = GND Full 0.1 7.0 RL = 1 MΩ, VIN = 2.5 V, VON = GND 0.1 5 RL = 1 MΩ, VIN = 1.5 V, VON = GND 0.1 5 VOUT = 0, VIN = 5.25 V, VON = GND 1.2 10 VOUT = 0, VIN = 4.2 V, VON = GND 0.2 7.0 0.1 7.0 0.1 5 VOUT = 0, VIN = 3.6 V, VON = GND Full Full VOUT = 0, VIN = 1.5 V, VON = GND VIN = 5.25 V, IOUT = –200 mA VIN = 5.0 V, IOUT = –200 mA VIN = 4.2 V, IOUT = –200 mA On-resistance VIN = 3.3 V, IOUT = –200 mA VIN = 2.5 V, IOUT = –200 mA VIN = 1.8 V, IOUT = –200 mA VIN = 1.5 V, IOUT = –200 mA UVLO Under voltage lockout MAX IOUT = 0, VON = VIN = 5.25 V VOUT = 0, VIN = 2.5 V, VON = GND rON TYP VIN increasing, VON = 3.6 V, IOUT = –100 mA VIN decreasing, VON = 3.6 V, IOUT = –100 mA 25°C 0.1 5 60 80 Full UNIT µA µA µA 110 25°C 60 Full 80 110 25°C 60 Full 80 110 25°C 60.7 Full 80 110 25°C 63.4 Full mΩ 90 120 25°C 74.2 Full 100 130 25°C 83.9 Full 120 150 1.2 Full V 0.50 ION ON input leakage current VON = 1.4 V to 5.25 V or GND Full VRCP Reverse Current Voltage Threshold VOUT > VIN 25°C 54 mV IRCP(leak) Reverse Current Protection Leakage after Reverse Current event VOUT – VIN > VRCP 25°C 0.3 µA tDELAY Reverse Current Response Delay VIN = 5V 10 µs (1) 1 µA Verified by characterization, not production tested. Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s) :TPS22912 5 TPS22912 SLVSB78 – APRIL 2012 www.ti.com SWITCHING CHARACTERISTICS PARAMETER TPS22912 TEST CONDITION TYP UNIT VIN = 5 V, TA = 25ºC (unless otherwise noted) tON Turn-ON time RL = 10 Ω, CL = 0.1 µF tOFF Turn-OFF time RL = 10 Ω, CL = 0.1 µF 6.6 tR VOUT rise time RL = 10 Ω, CL = 0.1 µF 912 tF VOUT fall time RL = 10 Ω, CL = 0.1 µF 3 840 µs VIN = 3.3 V, TA = 25ºC (unless otherwise noted) tON Turn-ON time RL = 10 Ω, CL = 0.1 µF 1147 tOFF Turn-OFF time RL = 10 Ω, CL = 0.1 µF 8.6 tR VOUT rise time RL = 10 Ω, CL = 0.1 µF 1030 tF VOUT fall time RL = 10 Ω, CL = 0.1 µF 3 µs VIN = 1.5 V, TA = 25ºC (unless otherwise noted) tON Turn-ON time RL = 10 Ω, CL = 0.1 µF tOFF Turn-OFF time RL = 10 Ω, CL = 0.1 µF 17.4 tR VOUT rise time RL = 10 Ω, CL = 0.1 µF 1970 tF VOUT fall time RL = 10 Ω, CL = 0.1 µF 6.5 2513 µs PARAMETRIC MEASUREMENT INFORMATION VOUT VIN CIN = 1µF ON + - (A) ON CL RL OFF GND TPS22912 GND GND TEST CIRCUIT VON 50% 50% tOFF tON VOUT 50% 50% tf tr 90% VOUT 90% 10% 10% tON /t OFF WAVEFORMS (A) Rise and fall times of the control signal is 100ns. A. Rise and fall times of the control signal are 100 ns. Figure 1. Test Circuit and tON/tOFF Waveforms 6 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s) :TPS22912 TPS22912 www.ti.com SLVSB78 – APRIL 2012 TYPICAL CHARACTERISTICS ON-STATE RESISTANCE vs INPUT VOLTAGE ON INPUT THRESHOLD 120 6 −40C 25C 85C 100 VIN = 5.0V VIN = 4.2V VIN = 3.3V VIN = 2.5V VIN = 1.8V VIN = 1.5V 5.5 5 4.5 4 VOUT (V) Ron (mΩ) 80 60 40 3.5 3 2.5 2 1.5 20 1 0.5 0 0 0.5 1 1.5 2 2.5 3 3.5 Voltage (V) 4 4.5 5 5.5 0 6 0 0.2 0.4 0.6 0.8 VON (V) 1 1.2 1.4 G000 G000 Figure 2. Figure 3. INPUT CURRENT, QUIESCENT vs INPUT VOLTAGE INPUT CURRENT, LEAK vs INPUT VOLTAGE 3000 3.5 −40C 25C 85C 3 −40C 25C 85C 2500 2.5 IIN_Leak (nA) IIN_Q (µA) 2000 2 1.5 1500 1000 1 500 0.5 0 0 1 2 3 Voltage (V) 4 5 6 0 0 0.5 1 1.5 2 2.5 3 3.5 Voltage (V) 4 4.5 5 5.5 G000 Figure 4. 6 G000 Figure 5. Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s) :TPS22912 7 TPS22912 SLVSB78 – APRIL 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) ON-STATE RESISTANCE vs TEMPERATURE INPUT CURRENT, OFF vs INPUT VOLTAGE 180 160 140 Ron (mΩ) 120 VIN = 1.4V VIN = 1.5V VIN = 1.8V VIN = 2.5V VIN = 3.3V VIN = 4.2V VIN= 5.0V VIN = 5.5V 100 80 60 40 20 0 −40 −15 10 35 Temperature (°C) 60 85 G000 Figure 6. Figure 7. Maximum Power Dissipation (W) 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 −40 −30 −20 −10 0 10 20 30 40 50 Ambient Temperature (°C) 60 70 G001 Figure 8. Allowable Power Dissipation 8 80 Figure 9. ULVO Response IOUT = -100mA Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s) :TPS22912 TPS22912 www.ti.com SLVSB78 – APRIL 2012 TYPICAL CHARACTERISTICS (continued) Figure 10. Reverse Current Protection VOUT = 3.3V, VIN = 3.3V Decreasing to 0V TYPICAL AC CHARACTERISTICS FOR TPS22912C RISE TIME vs TEMPERATURE FALL TIME vs TEMPERATURE 1200 4 VIN =5.0V, CL = 0.1 µF, RL = 10 Ohms 1000 3 tFall (µs) tRise (µs) 800 600 2 400 1 200 VIN =5V, CL = 0.1 µF, RL = 10 Ohms 0 −40 −15 10 35 Temperature (°C) 60 85 0 −40 −15 10 35 Temperature (°C) 60 G000 Figure 11. 85 G000 Figure 12. Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s) :TPS22912 9 TPS22912 SLVSB78 – APRIL 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) RISE TIME vs TEMPERATURE FALL TIME vs TEMPERATURE 3000 10 VIN =1.5V, CL = 0.1 µF, RL = 10 Ohms 9 2500 8 7 2000 tFall (µs) tRise (µs) 6 1500 5 4 1000 3 2 500 1 VIN = 1.5V, CL = 0.1 µF, RL = 10 Ohms 0 −40 −15 10 35 Temperature (°C) 60 0 −40 85 −15 10 35 Temperature (°C) 60 G000 85 G000 Figure 13. Figure 14. TURN-ON TIME vs TEMPERATURE TURN-OFF TIME vs TEMPERATURE 1200 10 VIN = 5.0V, CL = 0.1 µF, RL = 10 Ohms 1000 8 800 tOff (µs) tOn (µs) 6 600 4 400 2 200 VIN = 5.0V, CL = 0.1 µF, RL = 10 Ohms 0 −40 −15 10 35 Temperature (°C) 60 85 0 −40 −15 10 35 Temperature (°C) G000 Figure 15. 10 60 85 G000 Figure 16. Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s) :TPS22912 TPS22912 www.ti.com SLVSB78 – APRIL 2012 TYPICAL CHARACTERISTICS (continued) TURN-ON TIME vs TEMPERATURE TURN-OFF TIME vs TEMPERATURE 25 4000 VIN = 1.5V, CL = 0.1 µF, RL = 10 Ohms 3500 20 3000 15 tOff (µs) tOn (µs) 2500 2000 10 1500 1000 5 500 VIN = 1.5V, CL = 0.1 µF, RL = 10 Ohms 0 −40 −15 10 35 Temperature (°C) 60 0 −40 85 −15 10 35 Temperature (°C) 60 G000 85 G000 Figure 17. Figure 18. RISE TIME vs INPUT VOLTAGE 3500 3000 tRise (µs) 2500 2000 1500 1000 500 −40C 25C 85C CL = 1 µF, RL = 10 Ohms, VON = 1.8V 0 0 0.5 1 1.5 2 2.5 3 3.5 VIN (V) 4 4.5 5 5.5 6 G000 Figure 19. Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s) :TPS22912 11 TPS22912 SLVSB78 – APRIL 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) 12 TURN-ON RESPONSE VIN = 5V, TA = 25°C, CIN = 1µF, CL = 0.1µF, RL = 10Ω TURN-OFF RESPONSE VIN = 5V, TA = 25°C, CIN = 1µF, CL = 0.1µF, RL = 10Ω Figure 20. Figure 21. TURN-ON RESPONSE TIME VIN = 5V, TA = 25°C, CIN =10µF, CL = 1µF, RL = 10Ω TURN-OFF RESPONSE TIME VIN = 5V, TA = 25°C, CIN = 10µF, CL = 1µF, RL = 10Ω Figure 22. Figure 23. TURN-ON RESPONSE TIME VIN = 1.5V, TA = 25°C, CIN = 1µF, CL = 0.1µF, RL = 10Ω TURN-OFF RESPONSE TIME VIN = 1.5V, TA = 25°C, CIN = 1µF, CL = 0.1µF, RL = 10Ω Figure 24. Figure 25. Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s) :TPS22912 TPS22912 www.ti.com SLVSB78 – APRIL 2012 TYPICAL CHARACTERISTICS (continued) VIN TURN-ON RESPONSE TIME = 1.5V, TA = 25°C, CIN = 10µF, CL = 1µF, RL = 10Ω TURN-OFF RESPONSE TIME VIN = 1.5V, TA = 25°C, CIN = 10µF, CL = 1µF, RL = 10Ω Figure 26. Figure 27. Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s) :TPS22912 13 TPS22912 SLVSB78 – APRIL 2012 www.ti.com APPLICATION INFORMATION On/Off Control The ON pin controls the state of the switch. Asserting ON high enables the switch. ON is active high and has a low threshold, making the pin capable of interfacing with low-voltage signals. The ON pin is compatible with standard GPIO logic threshold. It can be used with any microcontroller with 1.2-V, 1.8-V, 2.5-V or 3.3-V GPIO. Input Capacitor To limit the voltage drop on the input supply caused by transient inrush currents, a capacitor needs to be placed between VIN and GND. A 1-μF ceramic capacitor, CIN, placed close to the pins is usually sufficient. Higher values of CIN can be used to further reduce the voltage drop. Output Capacitor A CIN to CL ratio of 10 to 1 is recommended for minimizing VIN dip caused by inrush currents during startup. Devices with faster rise times may require a larger ratio to minimize VIN dip. Under-Voltage Lockout Under-voltage lockout protection turns off the switch if the input voltage is below the under-voltage lockout threshold. During under-voltage lockout (UVLO), if the voltage level at VOUT exceeds the voltage level at VIN by the Reverse Current Voltage Threshold (VRVP), the body diode will be disengaged to prevent any current flow to VIN. With the ON pin active, the input voltage rising above the under-voltage lockout threshold will cause a controlled turn-on of the switch to limit current over-shoot. 14 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s) :TPS22912 TPS22912 www.ti.com SLVSB78 – APRIL 2012 Reverse Current Protection In a scenario where VOUT is greater than VIN, there is potential for reverse current to flow through the pass FET or the body diode. The TPS22912 monitors VIN and VOUT voltage levels. When the reverse current voltage threshold (VRCP) is exceeded, the switch is disabled (within 10μs typ). Additionally, the body diode is disengaged so as to prevent any reverse current flow to VIN. The FET, and the output (VOUT), will resume normal operation when the reverse current scenario is no longer present. The peak instantaneous reverse current is the current it takes to trip the reverse current protection. After the reverse current protection has tripped due to the peak instantaneous reverse current, the DC (off-state) leakage current from VOUT and VIN is referred to as IRCP(leak) (see figure below). Use the following formula to calculate the amount of peak instantaneous reverse current for a particular application: IRC = VRCP RON( VIN) Where, IRC is the amount of reverse current, RON(VIN) is the on-resistance at the VIN of the reverse current condition. VOUT VRCP I RC VIN I REVERSE _CURRENT IRCP (LEAK) Figure 28. Reverse Current Board Layout For best performance, all traces should be as short as possible. The input and output capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have on normal operation. Using wide traces for VIN, VOUT, and GND helps minimize the parasitic electrical effects along with minimizing the case to ambient thermal impedance. Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s) :TPS22912 15 PACKAGE OPTION ADDENDUM www.ti.com 30-May-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) TPS22912CYZVR ACTIVE DSBGA YZV 4 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM TPS22912CYZVT ACTIVE DSBGA YZV 4 250 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 18-Apr-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) TPS22912CYZVR DSBGA YZV 4 3000 178.0 9.2 TPS22912CYZVT DSBGA YZV 4 250 178.0 9.2 Pack Materials-Page 1 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 1.0 1.0 0.63 4.0 8.0 Q1 1.0 1.0 0.63 4.0 8.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 18-Apr-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS22912CYZVR DSBGA YZV 4 3000 220.0 220.0 35.0 TPS22912CYZVT DSBGA YZV 4 250 220.0 220.0 35.0 Pack Materials-Page 2 D: Max = 0.918 mm, Min =0.858 mm E: Max = 0.918 mm, Min =0.858 mm IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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