CYSTEKEC BTC2030A3

CYStech Electronics Corp.
Spec. No. : C316
Issued Date : 2005.12.21
Revised Date : 2006.04.03
Page No. : 1/9
General Purpose NPN Epitaxial Planar Transistor
BTC2030A3
Features
• High breakdown voltage, BVCEO≥ 200V
• Large continuous collector current capability
• Low collector saturation voltage
• Pb-free package
Symbol
Outline
BTC2030A3
TO-92
B:Base
C:Collector
E:Emitter
ECB
Absolute Maximum Ratings (Ta=25°C)
Parameter
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current
Base Current
Power Dissipation
Junction Temperature
Storage Temperature
BTC2030A3
Symbol
Limits
Unit
VCBO
VCEO
VEBO
IC
IB
Pd
Tj
Tstg
280
200
6
1
0.5
900
150
-55~+150
V
V
V
A
A
mW
°C
°C
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C316
Issued Date : 2005.12.21
Revised Date : 2006.04.03
Page No. : 2/9
Characteristics (Ta=25°C)
Symbol
BVCBO
BVCEO
BVEBO
ICBO
IEBO
*VCE(sat)
*VCE(sat)
*VBE(sat)
*VBE(on)
*hFE 1
*hFE 2
*hFE 3
fT
Cob
Min.
280
200
6
0.45
100
100
50
20
-
Typ.
0.2
100
-
Max.
100
100
0.5
1
0.9
0.75
320
20
Unit
V
V
V
nA
nA
V
V
V
V
MHz
pF
Test Conditions
IC=10µA
IC=10mA
IE=10µA
VCB=250V
VEB=6V
IC=500mA, IB=50mA
IC=1A, IB=50mA
IC=500mA, IB=50mA
VCE=5V, IC=5mA
VCE=5V, IC=50mA
VCE=5V, IC=200mA
VCE=5V, IC=1A
VCE=5V, IC=200mA
VCB=10V, IE=0A,f=1MHz
*Pulse Test: Pulse Width ≤380µs, Duty Cycle≤2%
Classification Of hFE 2
Rank
O
Y
Range
100~200
160~320
Ordering Information
Device
BTC2030A3
BTC2030A3
Package
TO-92
(Pb-free)
Shipping
Marking
2000 pcs / Tape & Box
C2030
CYStek Product Specification
Spec. No. : C316
Issued Date : 2005.12.21
Revised Date : 2006.04.03
Page No. : 3/9
CYStech Electronics Corp.
Characteristic Curves
Current Gain vs Collector Current
Saturation Voltage vs Collector Current
1000
Saturation Voltage---(mV)
1000
Current Gain---HFE
VCE=5V
100
VCE=2V
10
VCESAT
IC=50IB
100
VCE=1V
IC=10IB
1
IC=20IB
IC=30IB
10
1
10
100
1000
10000
1
10
100
1000
Collector Current---IC(mA)
Collector Current---IC(mA)
Saturation Voltage vs Collector Current
Power Derating Curve
10000
1.8
[email protected]=10IB
Power Dissipation---PD(W)
Saturation Voltage---(V)
10000
1000
1.5
1.2
0.9
0.6
0.3
0
100
1
BTC2030A3
10
100
1000
Collector Current---IC(mA)
10000
0
25
50
75
100
125
150
175
200
Ambient Temperature---TA(℃)
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C316
Issued Date : 2005.12.21
Revised Date : 2006.04.03
Page No. : 4/9
Characteristic Curves(Cont.)
Output Characteristics
Output Characteristics
0.7
0.7
IB=10mA
IB=10mA
0.6
IB=8m
A
0.5
Collector Current---IC(A)
Collector Current---IC(A)
0.6
IB=5mA
0.4
IB=3mA
IB=2mA
0.3
IB=1mA
0.2
IB=6mA
0.5
IB=4mA
IB=3mA
IB=2.5mA
IB=2mA
0.4
0.3
IB=1.5m
IB=1mA
0.2
IB=500uA
0.1
0.1
IB=0
IB=0
0
0
0
1
2
3
4
5
Collector-to-Emitter Voltage---VCE(V)
0
6
1
2
3
4
5
Collector-to-Emitter Voltage---VCE(V)
Output Capacitance vs Reverse Biased Voltage
6
Safe Operating Area
10
100
Forward Current---IC(A)
Output Capacitance---Cob(pF)
PT=1ms
1
PT=10ms
PT=1s
0.1
PT=100ms
0.01
0.001
10
1
BTC2030A3
10
Reverse Biased Voltage---VCB(V)
100
1
10
100
Forward Voltage---VCE(V)
1000
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C316
Issued Date : 2005.12.21
Revised Date : 2006.04.03
Page No. : 5/9
Product Designation
BTC2030A3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C316
Issued Date : 2005.12.21
Revised Date : 2006.04.03
Page No. : 6/9
Recommended IR reflow profile
BTC2030A3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C316
Issued Date : 2005.12.21
Revised Date : 2006.04.03
Page No. : 7/9
Recommended temperature profile for wave soldering
Recommendation:
1. Preheat temperature at solder side must be between 100 and 130 ℃ for 80 to 100
seconds.
2. Temperature ramp-up rate : 1~2 ℃/s
3. The temperature gradient between preheat and wave soldering must be smaller than
+160℃.
4. Terminations must go through the wave simultaneously.
5. Travel through the wave from 255 to 260℃ for 2.5 to 3.5 seconds
6. Temperature ramp-down rate : 2~3 ℃/s
BTC2030A3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C316
Issued Date : 2005.12.21
Revised Date : 2006.04.03
Page No. : 8/9
TO-92 Taping Outline
DIM
A
D
D1
D2
E
F1,F2
F1,F2
H
H1
H2
H2A
H3
H4
L
L1
P
P1
P2
T
T1
T2
W
W1
-
BTC2030A3
Item
Component body height
Tape Feed Diameter
Lead Diameter
Component Body Diameter
Component Lead Pitch
F1-F2
Height Of Seating Plane
Feed Hole Location
Front To Rear Deflection
Deflection Left Or Right
Component Height
Feed Hole To Bottom Of Component
Lead Length After Component Removal
Lead Wire Enclosure
Feed Hole Pitch
Center Of Seating Plane Location
4 Feed Hole Pitch
Over All Tape Thickness
Total Taped Package Thickness
Carrier Tape Thickness
Tape Width
Adhesive Tape Width
20 pcs Pitch
Millimeters
Min.
4.33
3.80
0.36
4.33
1.5
2.40
15.50
8.50
2.50
12.50
5.95
50.30
0.36
17.50
5.00
253
Max.
4.83
4.20
0.53
4.83
2.0
2.90
±0.3
16.50
9.50
1
1
27
21
11
12.90
6.75
51.30
0.55
1.42
0.68
19.00
7.00
255
CYStek Product Specification
Spec. No. : C316
Issued Date : 2005.12.21
Revised Date : 2006.04.03
Page No. : 9/9
CYStech Electronics Corp.
TO-92 Dimension
α2
A
Marking:
HFE
Rank
Product Name
B
1
2
3
C2030 □
□□
α3
C
Date Code: Year+Month
Year: 4→2004, 5→2005
Month: 1→1, 2→2,‧‧‧
9→9, A→10, B→11, C→12
D
H
I
G
α1
Style: Pin 1.Emitter 2.Collector 3.Base
E
F
3-Lead TO-92 Plastic Package
CYStek Package Code: A3
*: Typical
Inches
Min.
Max.
0.1704 0.1902
0.1704 0.1902
0.5000
0.0142 0.0220
*0.0500
0.1323 0.1480
DIM
A
B
C
D
E
F
Millimeters
Min.
Max.
4.33
4.83
4.33
4.83
12.70
0.36
0.56
*1.27
3.36
3.76
DIM
G
H
I
α1
α2
α3
Inches
Min.
Max.
0.0142 0.0220
*0.1000
*0.0500
*5°
*2°
*2°
Millimeters
Min.
Max.
0.36
0.56
*2.54
*1.27
*5°
*2°
*2°
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: 42 Alloy ; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTC2030A3
CYStek Product Specification