CYStech Electronics Corp. Spec. No. : C316 Issued Date : 2005.12.21 Revised Date : 2006.04.03 Page No. : 1/9 General Purpose NPN Epitaxial Planar Transistor BTC2030A3 Features • High breakdown voltage, BVCEO≥ 200V • Large continuous collector current capability • Low collector saturation voltage • Pb-free package Symbol Outline BTC2030A3 TO-92 B：Base C：Collector E：Emitter ECB Absolute Maximum Ratings (Ta=25°C) Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current Base Current Power Dissipation Junction Temperature Storage Temperature BTC2030A3 Symbol Limits Unit VCBO VCEO VEBO IC IB Pd Tj Tstg 280 200 6 1 0.5 900 150 -55~+150 V V V A A mW °C °C CYStek Product Specification CYStech Electronics Corp. Spec. No. : C316 Issued Date : 2005.12.21 Revised Date : 2006.04.03 Page No. : 2/9 Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VCE(sat) *VBE(sat) *VBE(on) *hFE 1 *hFE 2 *hFE 3 fT Cob Min. 280 200 6 0.45 100 100 50 20 - Typ. 0.2 100 - Max. 100 100 0.5 1 0.9 0.75 320 20 Unit V V V nA nA V V V V MHz pF Test Conditions IC=10µA IC=10mA IE=10µA VCB=250V VEB=6V IC=500mA, IB=50mA IC=1A, IB=50mA IC=500mA, IB=50mA VCE=5V, IC=5mA VCE=5V, IC=50mA VCE=5V, IC=200mA VCE=5V, IC=1A VCE=5V, IC=200mA VCB=10V, IE=0A,f=1MHz *Pulse Test: Pulse Width ≤380µs, Duty Cycle≤2% Classification Of hFE 2 Rank O Y Range 100~200 160~320 Ordering Information Device BTC2030A3 BTC2030A3 Package TO-92 (Pb-free) Shipping Marking 2000 pcs / Tape & Box C2030 CYStek Product Specification Spec. No. : C316 Issued Date : 2005.12.21 Revised Date : 2006.04.03 Page No. : 3/9 CYStech Electronics Corp. Characteristic Curves Current Gain vs Collector Current Saturation Voltage vs Collector Current 1000 Saturation Voltage---(mV) 1000 Current Gain---HFE VCE=5V 100 VCE=2V 10 VCESAT IC=50IB 100 VCE=1V IC=10IB 1 IC=20IB IC=30IB 10 1 10 100 1000 10000 1 10 100 1000 Collector Current---IC(mA) Collector Current---IC(mA) Saturation Voltage vs Collector Current Power Derating Curve 10000 1.8 VBESAT@IC=10IB Power Dissipation---PD(W) Saturation Voltage---(V) 10000 1000 1.5 1.2 0.9 0.6 0.3 0 100 1 BTC2030A3 10 100 1000 Collector Current---IC(mA) 10000 0 25 50 75 100 125 150 175 200 Ambient Temperature---TA(℃) CYStek Product Specification CYStech Electronics Corp. Spec. No. : C316 Issued Date : 2005.12.21 Revised Date : 2006.04.03 Page No. : 4/9 Characteristic Curves(Cont.) Output Characteristics Output Characteristics 0.7 0.7 IB=10mA IB=10mA 0.6 IB=8m A 0.5 Collector Current---IC(A) Collector Current---IC(A) 0.6 IB=5mA 0.4 IB=3mA IB=2mA 0.3 IB=1mA 0.2 IB=6mA 0.5 IB=4mA IB=3mA IB=2.5mA IB=2mA 0.4 0.3 IB=1.5m IB=1mA 0.2 IB=500uA 0.1 0.1 IB=0 IB=0 0 0 0 1 2 3 4 5 Collector-to-Emitter Voltage---VCE(V) 0 6 1 2 3 4 5 Collector-to-Emitter Voltage---VCE(V) Output Capacitance vs Reverse Biased Voltage 6 Safe Operating Area 10 100 Forward Current---IC(A) Output Capacitance---Cob(pF) PT=1ms 1 PT=10ms PT=1s 0.1 PT=100ms 0.01 0.001 10 1 BTC2030A3 10 Reverse Biased Voltage---VCB(V) 100 1 10 100 Forward Voltage---VCE(V) 1000 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C316 Issued Date : 2005.12.21 Revised Date : 2006.04.03 Page No. : 5/9 Product Designation BTC2030A3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C316 Issued Date : 2005.12.21 Revised Date : 2006.04.03 Page No. : 6/9 Recommended IR reflow profile BTC2030A3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C316 Issued Date : 2005.12.21 Revised Date : 2006.04.03 Page No. : 7/9 Recommended temperature profile for wave soldering Recommendation: 1. Preheat temperature at solder side must be between 100 and 130 ℃ for 80 to 100 seconds. 2. Temperature ramp-up rate : 1~2 ℃/s 3. The temperature gradient between preheat and wave soldering must be smaller than +160℃. 4. Terminations must go through the wave simultaneously. 5. Travel through the wave from 255 to 260℃ for 2.5 to 3.5 seconds 6. Temperature ramp-down rate : 2~3 ℃/s BTC2030A3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C316 Issued Date : 2005.12.21 Revised Date : 2006.04.03 Page No. : 8/9 TO-92 Taping Outline DIM A D D1 D2 E F1,F2 F1,F2 H H1 H2 H2A H3 H4 L L1 P P1 P2 T T1 T2 W W1 - BTC2030A3 Item Component body height Tape Feed Diameter Lead Diameter Component Body Diameter Component Lead Pitch F1-F2 Height Of Seating Plane Feed Hole Location Front To Rear Deflection Deflection Left Or Right Component Height Feed Hole To Bottom Of Component Lead Length After Component Removal Lead Wire Enclosure Feed Hole Pitch Center Of Seating Plane Location 4 Feed Hole Pitch Over All Tape Thickness Total Taped Package Thickness Carrier Tape Thickness Tape Width Adhesive Tape Width 20 pcs Pitch Millimeters Min. 4.33 3.80 0.36 4.33 1.5 2.40 15.50 8.50 2.50 12.50 5.95 50.30 0.36 17.50 5.00 253 Max. 4.83 4.20 0.53 4.83 2.0 2.90 ±0.3 16.50 9.50 1 1 27 21 11 12.90 6.75 51.30 0.55 1.42 0.68 19.00 7.00 255 CYStek Product Specification Spec. No. : C316 Issued Date : 2005.12.21 Revised Date : 2006.04.03 Page No. : 9/9 CYStech Electronics Corp. TO-92 Dimension α2 A Marking: HFE Rank Product Name B 1 2 3 C2030 □ □□ α3 C Date Code: Year+Month Year: 4→2004, 5→2005 Month: 1→1, 2→2,‧‧‧ 9→9, A→10, B→11, C→12 D H I G α1 Style: Pin 1.Emitter 2.Collector 3.Base E F 3-Lead TO-92 Plastic Package CYStek Package Code: A3 *: Typical Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 DIM A B C D E F Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I α1 α2 α3 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5° *2° *2° Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5° *2° *2° Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: 42 Alloy ; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. BTC2030A3 CYStek Product Specification