CYSTEKEC HBNP45S6R

CYStech Electronics Corp.
Spec. No. : C901S6R
Issued Date : 2004.04.19
Revised Date :
Page No. : 1/6
General Purpose NPN / PNP Epitaxial Planar Transistors
(dual transistors)
HBNP45S6R
Features
• Includes a BTC2412 chip and a BTA1037 chip in a SOT-363 package.
• Mounting possible with SOT-323 automatic mounting machines.
• Transistor elements are independent, eliminating interference.
• Mounting cost and area can be cut in half.
Equivalent Circuit
SOT-363R
HBNP45S6R
Absolute Maximum Ratings (Ta=25°C)
Parameter
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current
Power Dissipation
Junction Temperature
Storage Temperature
Symbol
VCBO
VCEO
VEBO
IC
Pd
Tj
Tstg
Limits
TR1 (NPN)
60
50
7
150
TR2 (PNP)
-60
-50
-6
-150
200(total)
*1
150
-55~+150
Unit
V
V
V
mA
mW
°C
°C
Note: *1 150mW per element must not be exceeded.
HBNP45S6R
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C901S6R
Issued Date : 2004.04.19
Revised Date :
Page No. : 2/6
Characteristics (Ta=25°C)
• TR1 (NPN)
Symbol
BVCBO
BVCEO
BVEBO
ICBO
IEBO
*VCE(sat)
*hFE
fT
Cob
Min.
60
50
7
200
80
-
Typ.
0.2
180
2
Max.
0.1
0.1
0.4
600
3.5
Unit
V
V
V
µA
µA
V
MHz
pF
Test Conditions
IC=100µA
IC=1mA
IE=50µA
VCB=60V
VEB=7V
IC=50mA, IB=5mA
VCE=6V, IC=1mA
VCE=12V, IC=2mA, f=100MHz
VCB=12V, f=1MHz
*Pulse Test: Pulse Width ≤380µs, Duty Cycle≤2%
• TR2 (PNP)
Symbol
BVCBO
BVCEO
BVEBO
ICBO
IEBO
*VCE(sat)
*hFE
fT
Cob
Min.
-60
-50
-6
200
60
-
Typ.
-0.25
140
4
Max.
-0.1
-0.1
-0.5
600
5
Unit
V
V
V
µA
µA
V
MHz
pF
Test Conditions
IC=-50µA
IC=-1mA
IE=-50µA
VCB=-60V
VEB=-6V
IC=-50mA, IB=-5mA
VCE=-6V, IC=-1mA
VCE=-12V, IC=-2mA, f=100MHz
VCB=-12V, f=1MHz
*Pulse Test: Pulse Width ≤380µs, Duty Cycle≤2%
HBNP45S6R
CYStek Product Specification
Spec. No. : C901S6R
Issued Date : 2004.04.19
CYStech Electronics Corp.
Revised Date :
Page No. : 3/6
Characteristic curves
• TR1 (NPN)
Current Gain vs Collector Current
Saturation Voltage vs Collector Current
1000
1000
Current Gain---HFE
Saturation Voltage-(mV)
[email protected]=6V
100
VCE(SAT)@IC=10IB
100
10
0.1
1
10
100
0.1
1000
10
100
1000
Collector Current--- IC(mA)
Collector Current--- IC(mA)
Saturation Voltage vs Collector Current
Cutoff Frequency vs Collector Current
Cutoff Frequency---FT(GHZ)
1
Saturation Voltage---(mV)
1000
VBE(SAT)@IC=10IB
100
[email protected]=12V
0.1
0.1
1
10
100
Collector Current ---IC(mA)
HBNP45S6R
1
1000
1
10
100
Collector Current---IC(mA)
CYStek Product Specification
Spec. No. : C901S6R
Issued Date : 2004.04.19
CYStech Electronics Corp.
Revised Date :
Page No. : 4/6
• TR2 (PNP)
Current Gain vs Collector Current
Saturation Voltage vs Collector Current
1000
1000
Saturation Voltage---(mV)
Current Gain---HFE
[email protected]=6V
100
10
VCE(SAT)@IC=10IB
100
10
0.1
1
10
100
1000
0.1
Collector Current---IC(mA)
1
10
100
1000
Collector Current---IC(mA)
Saturation Voltage vs Collector Current
Cutoff Frequency vs Collector Current
Cutoff Frequency---FT(GHZ)
1
Saturation Voltage---(mV)
1000
VBE(SAT)@IC=10IB
100
[email protected]=12V
0.1
0.1
1
10
100
1000
Collector Current---IC(mA)
1
10
100
Collector Current---IC(mA)
Power Derating Curves
Power Dissipation---PD(mW)
250
200
d ual
150
single
100
50
0
0
50
100
150
200
Ambient Temperature---TA(℃)
HBNP45S6R
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C901S6R
Issued Date : 2004.04.19
Revised Date :
Page No. : 5/6
Reel Dimension
Carrier Tape Dimension
HBNP45S6R
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C901S6R
Issued Date : 2004.04.19
Revised Date :
Page No. : 6/6
SOT-363R Dimension
Style:
Pin 1. Emitter1 (E1)
Pin 2. Base1 (B1)
Pin 3. Collector2 (C2)
Pin 4. Emitter2 (E2)
Pin 5. Base2 (B2)
Pin 6. Collector1 (C1)
Marking:
46
6-Lead SOT-363R Plastic
Surface Mounted Package
CYStek Package Code: S6R
*:Typical
Inches
Min.
Max.
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026BSC
0.004
DIM
A
B
C
D
G
H
Millimeters
Min.
Max.
1.8
2.2
1.15
1.35
0.8
1.1
0.1
0.3
0.65BSC
0.1
DIM
J
K
N
S
Y
Inches
Min.
Max.
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087
0.012
0.016
Millimeters
Min.
Max.
0.1
0.25
0.1
0.30
0.20 REF
2.00
2.20
0.30
0.40
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
HBNP45S6R
CYStek Product Specification