SLUS198C – FEBUARY 2000 - REVISED - JUNE 2001 D Integrated 0.15-Ω Power MOSFET D 7-V to 15-V Operation D Digital-Programmable Current Limit from D D D D D Thermal Shutdown D Fault-Output Indicator D Maximum-Output Current Can Be Set to 1 A 0 A to 3 A 100-µA ICC When Disabled Programmable On Time Programmable Start Delay Fixed 2% Duty Cycle Above the Programmed-Fault Level or to a Full 4 A Power SOIC and TSSOP, Low Thermal Resistance Packaging D description The UCC3915 programmable hot swap power manager provides complete power-management, hot-swap capability, and circuit breaker functions. The only external component required to operate the device, other than power supply bypassing, is the fault-timing capacitor, CT. All control and housekeeping functions are integrated, and externally programmable. These include the fault current level, maximum output sourcing current, maximum fault time, and startup delay. In the event of a constant fault, the internal fixed 2% duty cycle ratio limits average output power. The internal 4-bit DAC allows programming of the fault-level current from 0 A to 3 A with 0.25-A resolution. The IMAX control pin sets the maximum-sourcing current to 1 A above the trip level or to a full 4 A of output current for fast output capacitor charging. (continued) block diagram + MAX CURRENT LEVEL 4A 2 VIN 3 VIN 30 mV + CHARGE PUMP H=4A IMAX 10 REVERSE VOLTAGE COMPARATOR – VOUT CURRENT SENSE H = OPEN + – POWER FET * LINEAR CURRENT AMPLIFIER 1A ABOVE FAULT 14 VOUT OVER CURRENT COMPARATOR CURRENT FAULT LEVEL 0–3 A + – ON TIME CONTROL 15 VOUT 2% DUTY CYCLE THERMAL SHUTDOWN 0–3 A 0.25 RES 6 B3 INTERNAL BIAS 7 8 9 5 B2 B1 B0 GND 4 BIT DAC 4 13 12 HEAT SINK GND PINS 11 16 CT FAULT 1.5 V + – 1 SHTDWN UDG-99174 NOTE: Pin numbers refer to DIL-16 and SOIC-16 packages. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2000, Texas Instruments Incorporated !"#$ % &'!!($ #% )'*+&#$ ,#$(! ,'&$% & !" $ %)(&&#$ % )(! $.( $(!"% (/#% %$!'"($% %$#,#!, 0#!!#$1- ! ,'&$ )! &(%%2 , (% $ (&(%%#!+1 &+',( $(%$2 #++ )#!#"($(!%- POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SLUS198C – FEBUARY 2000 - REVISED - JUNE 2001 description (continued) When the output current is below the fault level, the output MOSFET is switched on with a nominal ON resistance of 0.15 Ω. When the output current exceeds the fault level, but is less than the maximum-sourcing level, the output remains switched on, but the fault timer starts, charging CT. Once CT charges to a preset threshold, the switch is turned off, and remains off for 50 times the programmed fault time. When the output current reaches the maximum sourcing level, the MOSFET transitions from a switch to a constant current source. The UCC3915 can be put into sleep mode, drawing only 100 µA of supply current. Other features include an open-drain fault-output indicator, thermal shutdown, undervoltage lockout, 7-V to 15-V operation, and low-thermal resistance SOIC and TSSOP power packages. absolute maximum ratings over operating free-air temperature (unless otherwise noted)† VIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15.5 V VOUT – VIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0.3 V FAULT sink current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA FAULT voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 8 V Output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Self limiting TTL input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 to VIN Storage temperature, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C Junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –55°C to 150°C Lead temperature (soldering, 10 sec.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. ‡ Currents are positive into, negative out of the specified terminal. Consult Packaging Section of the Interface Products Data Book (TI Literature Number SLUD002) for thermal limitations and considerations of packages. package information TSSOP-24, PWP Package (TOP VIEW) DIL-16, SOIC-16 N, DP Package (TOP VIEW) SHTDWN VIN VIN GND* EGND* 1 2 3 4 5 16 15 14 13 12 SHTDWN 1 24 FAULT VIN 2 23 VOUT VOUT VIN 3 22 VOUT VOUT N/C 4 21 N/C GND* 5 20 GND* GND* 6 19 GND* GND* 7 18 GND* GND* 8 17 GND* FAULT GND* GND* B3 6 11 CT B2 7 10 IMAX B1 8 9 B0 EGND* *Pin 5 serves as lowest impedance to the electrical ground; Pins 4, 12, and 13 serve as heat sink/ground. These pins should be connected to large etch areas to help dissipate heat. For N Package, pins 4, 12, and 13 are N/C. 2 POST OFFICE BOX 655303 9 16 N/C B3 10 15 CT B2 11 14 IMAX B1 12 13 B0 *Pin 9 serves as lowest impedance to the electrical ground; other GND pins serve as heat sink/ground. These pins should be connected to large etch areas to help dissipate heat. • DALLAS, TEXAS 75265 SLUS198C – FEBUARY 2000 - REVISED - JUNE 2001 electrical characteristics, these specifications apply for TA = –40°C to 85°C for the UCC2915 and 0°C to 70°C for the UCC3915, VIN = 12 V, IMAX = 0.4 V, SHTDWN = 2.4 V, TA = TJ, (unless otherwise stated) supply PARAMETER TEST CONDITIONS Voltage input range MIN TYP 7.0 Supply current Sleep mode current SHTDWN = 0.2 V, Output leakage SHTDWN = 0.2 V no load MAX UNITS 15.0 V 1.0 2.0 mA 100 150 µA 20 µA NOTE 1: All voltages are with respect to GND. Current is positive into and negative out of the specified terminal. output PARAMETER Voltage drop TEST CONDITIONS MIN TYP MAX UNITS IOUT = 1 A (10 V to 12 V) IOUT = 2 A (10 V to 12 V) 0.15 0.3 V 0.3 0.6 V IOUT = 3 A (10 V to 12 V) IOUT = 1 A, VIN = 7 V and 15 V 0.45 0.9 V 0.2 0.4 V 0.4 0.8 V 0.6 1.2 V IOUT = 2 A, IOUT = 3 A, VIN = 7 V and 15 V VIN = 7 V, 12 V MAX Initial startup time See Note 2 100 µs Short circuit response See Note 2 100 ns Thermal shutdown See Note 2 165 °C Thermal hysteresis See Note 2 10 °C NOTE 1: All voltages are with respect to GND. Current is positive into and negative out of the specified terminal. NOTE 2: Ensured by design. Not production tested. DAC PARAMETER TEST CONDITIONS MIN TYP MAX UNITS Code = 0000–0011 (device off) Trip current Tri Code = 0100 0.07 0.25 0.45 A Code = 0101 0.32 0.50 0.70 A Code = 0110 0.50 0.75 0.98 A Code = 0111 0.75 1.00 1.3 A Code = 1000 1.0 1.25 1.6 A Code = 1001 1.25 1.50 1.85 A Code = 1010 1.5 1.75 2.15 A Code = 1011 1.70 2.00 2.4 A Code = 1100 1.90 2.25 2.7 A Code = 1101 2.1 2.50 2.95 A NOTE 1: All voltages are with respect to GND. Current is positive into and negative out of the specified terminal. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SLUS198C – FEBUARY 2000 - REVISED - JUNE 2001 electrical characteristics, these specifications apply for TA = –40°C to 85°C for the UCC2915 and 0°C to 70°C for the UCC3915, VIN = 12 V, IMAX = 0.4 V, SHTDWN = 2.4 V, TA = TJ, (unless otherwise stated) DAC (continued) PARAMETER Trip current c rrent TEST CONDITIONS MIN TYP MAX UNITS Code = 1110 2.30 2.75 3.25 A Code = 1111 2.50 3.0 3.50 A 0.35 1.0 1.65 A 3.0 4.0 5.2 A Max output current over trip (current source mode) Code = 0100 to 1111, IMAX = 0 V Max output current (current source mode) Code = 0100 to 1111, IMAX = 2.4 V NOTE 1: All voltages are with respect to GND. Current is positive into and negative out of the specified terminal. fault timer PARAMETER CT charge current TEST CONDITIONS MIN TYP MAX UNITS –47 µA 1.2 1.8 µA 1.9% 3.3% –83 CT discharge current VCT = 1.0 V VCT = 1.0 V –62 0.8 Output duty cycle VOUT = 0 V 1.0% CT fault threshold 1.2 1.5 1.7 V CT reset threshold 0.4 0.5 0.6 V NOTE 1: All voltages are with respect to GND. Current is positive into and negative out of the specified terminal. shutdown PARAMETER TEST CONDITIONS Shutdown threshold MIN 1.1 TYP 1.5 Shutdown hysteresis 150 Input current 100 MAX 1.9 UNITS V mV 500 nA NOTE 1: All voltages are with respect to GND. Current is positive into and negative out of the specified terminal. open drain output (FAULT) PARAMETER High level output current TEST CONDITIONS MIN TYP FAULT = 5 V Low level output voltage IOUT = 5 mA NOTE 1: All voltages are with respect to GND. Current is positive into and negative out of the specified terminal. 0.2 MAX UNITS 250 µA 0.8 V TTL input dc characteristics PARAMETER TEST CONDITIONS TTL input voltage high MIN TYP TTL input low current VIH = 2.4 V VIL = 0.4 V 3 NOTE 1: All voltages are with respect to GND. Current is positive into and negative out of the specified terminal. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 UNITS V TTL input voltage low TTL input high current MAX 2.0 0.8 V 10 µA 1 µA SLUS198C – FEBUARY 2000 - REVISED - JUNE 2001 pin descriptions B0 – B3: These pins provide digital input to the DAC, which sets the fault-current threshold. They can be used to provide a digital soft-start and adaptive-current limiting. CT: A capacitor connected to ground sets the maximum-fault time. The maximum-fault time must be more than the time required to charge the external capacitance in one cycle. The maximum-fault time is defined as TFAULT = 16.1 × 103 × CT. Once the fault time is reached the output will shutdown for a time given by TSD = 833 × 103 × CT, this equates to a 1.9% duty cycle. FAULT: Open-drain output, which pulls low upon any fault or interrupt condition, or thermal shutdown. IMAX: When this pin is set to a logic low, the maximum-sourcing current will always be 1 A above the programmed-fault level. When set to a logic high, the maximum-sourcing current will be a constant 4 A for applications which require fast charging of load capacitance. SHTDWN: When this pin is brought to a logic low, the IC is put into a sleep mode drawing typically less than 100 µA of ICC.The input threshold is hysteretic, allowing the user to program a startup delay with an external RC circuit. VIN: Input voltage to the UCC3915. The recommended voltage range is 7 V to 15 V. Both VIN pins should be connected together and connected to the power source. VOUT: Output voltage from the UCC3915. Both VOUT pins should be connected together and connected to the load. When switched the output voltage will be approximately VIN – (0.15 Ω × IOUT). VOUT must not exceed VIN by greater than 0.3 V. APPLICATION INFORMATION 4 VIN 12 13 HEAT SINK GND PINS 2 VIN CIN VOUT 14 VOUT 3 D1 5 GND 15 RL COUT UCC3915 5V R1 S6 LED SHTDWN 16 FAULT 11 CT CT B3 B2 B1 B0 IMAX 6 7 8 9 10 RSD VIN 1 CSD VIN S1 S2 S3 S4 S5 DIP SWITCH UDG-99175 Figure 1. Evaluation Circuit POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 SLUS198C – FEBUARY 2000 - REVISED - JUNE 2001 APPLICATION INFORMATION protecting the UCC3915 from voltage transients The parasitic inductance associated with the power distribution can cause a voltage spike at VIN if the load current is suddenly interrupted by the UCC3915. It is important to limit the peak of this spike to less than 15 V to prevent damage to the UCC3915. This voltage spike can be minimized by: D Reducing the power distribution inductance (e.g., twist the positive (+) and negative (–) leads of the power supply feeding VIN, locate the power supply close to the UCC3915 or use PCB power and ground planes). D Decoupling VIN with a capacitor, CIN (refer to Figure 1), located close to the VIN pins. This capacitor is typically 1 µF or less to limit the inrush current. D Clamping the voltage at VIN below 15 V with a Zener diode, D1(refer to Figure 1), located close to the VIN pins. Figure 2. Load Current, Timing-Capacitor Voltage, and Output Voltage of the UCC3915 Under Fault Conditions estimating maximum load capacitance For hot-swap applications, the rate at which the total output capacitance can be charged depends on the maximum-output current available and the nature of the load. For a constant-current, current-limited application, the output will come up if the load asks for less than the maximum available short-circuit current. To ensure recovery of a duty cycle from a short-circuited load condition, there is a maximum total output capacitance which can be charged for a given unit on time (fault time). The design value of on or fault time can be adjusted by changing the timing capacitor CT. 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SLUS198C – FEBUARY 2000 - REVISED - JUNE 2001 APPLICATION INFORMATION For worst-case constant-current load of value just less than the trip limit; COUT(max) can be estimated from: C OUT(max) ǒ MAX * ILOADǓ [ I ǒ 10 3 16.1 V OUT C T Ǔ Where VOUT is the output voltage. For a resistive load of value RL, the value of COUT(max) can be estimated from: ȡ ȣ ȧ ȧ ȧ ȧ ȧ ȧ ȧ 16.1 103 C ȧ ȧ T ȧ C [ ȧ OUT(max) ȧ ȧ ȱ ȳȧ ȧ ȧ ȧR ȏnȧ 1 ȧȧ ȧL ȧ V ȧ ȧ ȧ ȧ OUT 1 I R Ȳ MAX LȴȤ Ȣ * Long CT times must consider the maximum temperature. Thermal shutdown protection may be the limiting fault time. safety recommendations Although the UCC3915 is designed to provide system protection for all fault conditions, all integrated circuits can ultimately fail short. For this reason, if the UCC3915 is intended for use in safety-critical applications where UL or some other safety rating is required, a redundant safety device such as a fuse should be placed in series with the device. The UCC3915 will prevent the fuse from blowing for virtually all fault conditions, increasing system reliability and reducing maintenance cost, in addition to providing the hot-swap benefits of the device. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 PACKAGE OPTION ADDENDUM www.ti.com 21-Mar-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Qty Drawing Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) UCC2915DP ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 UCC2915DP UCC2915DPG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 UCC2915DP UCC2915DP UCC2915DPTR OBSOLETE SOIC D 16 TBD Call TI Call TI -40 to 85 UCC2915DPTRG4 OBSOLETE SOIC D 16 TBD Call TI Call TI -40 to 85 UCC3915DP ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UCC3915DP UCC3915DPG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UCC3915DP UCC3915DPTR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UCC3915DP UCC3915DPTRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UCC3915DP UCC3915N UCC3915N OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 UCC3915NG4 OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 UCC3915PWP ACTIVE TSSOP PW 24 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UCC3915PWP UCC3915PWPG4 ACTIVE TSSOP PW 24 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UCC3915PWP UCC3915PWPTR ACTIVE TSSOP PW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UCC3915PWP UCC3915PWPTRG4 ACTIVE TSSOP PW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UCC3915PWP (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 21-Mar-2013 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Only one of markings shown within the brackets will appear on the physical device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 17-Aug-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant UCC3915DPTR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 UCC3915PWPTR TSSOP PW 24 2000 330.0 16.4 6.95 8.3 1.6 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 17-Aug-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) UCC3915DPTR SOIC D 16 2500 367.0 367.0 38.0 UCC3915PWPTR TSSOP PW 24 2000 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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